Wafer lifting device and electron beam detection equipment with same

Abstract

The utility model relates to the field of semiconductor equipment, in particular to a wafer lifting device and electron beam detection equipment with the same. The wafer lifting device aims at solving the problems that an existing wafer lifting device is prone to sliding blockage, too low in lifting speed and low in transmission efficiency. Therefore, a plurality of guide columns extending upwards from the top surface of the bottom plate are inserted into corresponding guide holes in the base plate. The fulcrum piece is arranged on the bottom plate and provided with a rotating shaft parallel to the top face of the bottom plate in a spaced mode, the middle of the driving plate is rotationally connected with the rotating shaft and provided with a first end located below the center of the base plate and a second end opposite to the first end, and the driving plate rotates around the rotating shaft when the second end is pressed so that the base plate can be jacked through the first end. The driving plate is of a lever structure, the lifting speed of the substrate can be increased by shortening the distance between the first end of the driving plate and the rotating shaft, the wafer conveying efficiency is improved, upward pressure and stress on the center position of the substrate are uniform, lateral torque does not exist, and clamping cannot happen. According to the utility model, the technical problems are solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor equipment, in particular to a wafer lifting device and electron beam detection equipment with same. BACKGROUND

[0002] The electron beam detection equipment is a key equipment for detecting wafer performance and defects in a semiconductor manufacturing process. Wafer detection is generally carried out in a vacuum environment. A robot first places a wafer on a lifting device, and the lifting device falls to place the wafer on an electrostatic chuck of a workbench for adsorption to be detected.

[0003] The existing lifting device includes a support mechanism and a driving mechanism. The support mechanism is used to support the wafer, and the driving mechanism is used to drive the support mechanism to move up and down. Specifically, the support mechanism includes a base and a plurality of support columns extending upward from the top surface of the base to support the wafer. The driving mechanism includes a connecting rod body, an L-shaped connecting rod adapter plate, and a guide block. The one end of the connecting rod body is connected to the center of the bottom surface of the base. The bottom plate part of the connecting rod adapter plate is fixedly arranged on the connecting rod body. The back plate part of the connecting rod adapter plate is slidably connected to the guide block. When the other end of the connecting rod body is driven by a driving force, the connecting rod adapter plate, the connecting rod body, and the base move vertically along the guide block.

[0004] Based on the overall structure of the existing lifting device, the guide block is prone to uneven force, which causes problems such as sliding jam, slow lifting speed, and impact on transmission efficiency. UTILITY MODEL CONTENTS

[0005] The utility model aims to provide a wafer lifting device with high transmission efficiency.

[0006] In particular, the utility model provides a wafer lifting device, which includes:

[0007] a bottom plate, the top surface of which extends upward a plurality of guide columns;

[0008] a base plate for carrying the wafer, and the base plate is provided with a plurality of guide holes corresponding to the guide columns one by one. Each guide column is inserted into the corresponding guide hole to allow the base plate to move relative to the bottom plate in the up-down direction;

[0009] a driving mechanism, which includes:

[0010] a fulcrum part arranged on the bottom plate, which is provided with a rotating shaft parallel and spaced apart from the base plate;

[0011] a driving plate, the middle part of which is rotatably connected to the rotating shaft and has a first end located below the center of the base plate and a second end opposite to the first end, so that the driving plate is allowed to rotate around the rotating shaft when the second end is pressed to lift the base plate from the first end.

[0012] Optionally, the substrate is composed of a body portion and a plurality of lug portions equidistantly arranged along the circumference of the body portion, wherein a plurality of guide holes are arranged on the plurality of lug portions respectively.

[0013] Optionally, a pressure bearing member is arranged at the center of the bottom surface of the body portion; and

[0014] The first end of the driving plate is provided with a ball corresponding to the pressure bearing member, and the pressure bearing member cooperates with the ball to avoid the generation of side moment.

[0015] Optionally, a plurality of notches are arranged around the pressure bearing member on the body portion to reduce the deformation pressure and / or weight cost of the substrate.

[0016] Optionally, the ball is made of stainless steel material.

[0017] Optionally, a plurality of load-bearing columns for carrying the wafer are equidistantly extended upward along the circumference of the top surface of the body portion, and the plurality of load-bearing columns are distributed between the plurality of lug portions.

[0018] Optionally, a guide column base for fixing the guide column to the bottom plate is arranged between the bottom plate and the guide column, and the guide column base and the lug portion correspond one-to-one, wherein,

[0019] A plurality of springs are arranged between the lug portion and the corresponding guide column base, so that the substrate can accelerate downward under the action of the spring recovery deformation.

[0020] Optionally, the fulcrum member includes a first support member and a second support member arranged oppositely on the bottom plate, and the rotating shaft is arranged between the first support member and the second support member, wherein,

[0021] The first support member is composed of a first fixed plate and a first support plate, the first fixed plate is parallel to the bottom plate and is used to fix the first support member on the bottom plate, and the first support plate extends upward from one end of the first fixed plate close to the second support member to form and is used to arrange one end of the rotating shaft; the second support member is composed of a second fixed plate and a second support plate, the second fixed plate is parallel to the bottom plate and is used to fix the second support member on the bottom plate, and the second support plate extends upward from one end of the second fixed plate close to the first support member to form and is used to arrange the other end of the rotating shaft.

[0022] Optionally, the top surface of the first end of the driving plate is provided with a downwardly recessed pressure bearing area configured to receive external pressure.

[0023] According to another aspect of the utility model, still provide a kind of electron beam detection equipment, it includes the wafer lifting device as described in one of above.

[0024] The utility model discloses a plurality of guide columns are extended upwards from the top surface of the bottom plate, each guide column is inserted into the corresponding guide hole on the substrate, and the fulcrum piece is arranged on the bottom plate, the fulcrum piece is provided with a rotating shaft parallel to the top surface of the bottom plate, the middle part of the driving plate is rotatably connected with the rotating shaft and has a first end below the substrate and a second end opposite to the first end, so that the driving plate rotates around the rotating shaft when the second end is pressed to lift the substrate from the first end.

[0025] Further, the substrate is composed of a body part and a plurality of lug parts equally spaced along the circumference of the body part, and the plurality of guide holes are arranged on the plurality of lug parts, so that the weight cost of the substrate is reduced.

[0026] Further, the pressure receiving part is arranged at the center of the bottom surface of the body part, and the ball corresponding to the pressure receiving part is arranged at the first end of the driving plate, so that the generation of side torque is avoided by the cooperation of the pressure receiving part and the ball, and the pushing force received by the substrate is always vertical upward.

[0027] Further, a plurality of notches are arranged around the pressure receiving point on the body part of the substrate, so that the deformation pressure and / or weight cost of the substrate are reduced.

[0028] Further, the ball is made of stainless steel material, so that the wear resistance of the ball is enhanced.

[0029] Further, a plurality of bearing columns for bearing the wafer are extended upwards from the top surface of the body part along the circumference, and the plurality of bearing columns are distributed between the plurality of lug parts, so that each bearing column is uniformly stressed, and the wafer is smoothly lifted.

[0030] Further, a guide column base for fixing the guide column to the bottom plate is arranged between the bottom plate and the guide column, the guide column base and the lug part are one-to-one corresponding, and a plurality of springs are arranged between any lug part and the corresponding guide column base, so that the substrate can accelerate downward under the action force of the spring restoring deformation.

[0031] Further, the first end of the driving plate is provided with a downwardly recessed pressure receiving area, so that the first end of the driving plate is convenient to receive external pressure through the pressure receiving area.

[0032] The above description is only a summary of the technical scheme of the present application. In order to more clearly understand the technical means of the present application, the content of the specification can be implemented, and in order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described below.

[0033] The above and other objects, advantages and features of the present application will become more apparent from the following detailed description of the embodiments of the present application taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0034] Some specific embodiments of the present application will be described in detail below with reference to the accompanying drawings, which are exemplary and not limiting. The same reference signs in the drawings indicate the same or similar components or parts. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0035] Figure 1 is a schematic structural diagram of a wafer lifting device according to an embodiment of the present application;

[0036] Figure 2 is Figure 1 is an exploded view of the wafer lifting device shown in FIG. 1;

[0037] Figure 3 is Figure 2 is an enlarged view of portion A in FIG. 1;

[0038] Figure 4 is Figure 1 is a bottom view of the wafer lifting device shown in FIG. 1;

[0039] Figure 5 is Figure 4 is an enlarged view of portion B in FIG. 1;

[0040] Figure 6 is a schematic structural diagram of an electron beam inspection apparatus according to an embodiment of the present application.

[0041] BRIEF DESCRIPTION OF DRAWINGS

[0042] 10, electron beam inspection apparatus;

[0043] 100, wafer lifting device;

[0044] 110, base plate;

[0045] 120, guide post;

[0046] 130, base plate; 131, guide hole; 132, body portion; 1321, notch; 133, lug portion;

[0047] 140. Drive mechanism; 141. Pivot component; 1411. First support component; 14111. First fixed plate; 14112. First support plate; 1412. Second support component; 14121. Second fixed plate; 14122. Second support plate; 142. Rotating shaft; 143. Drive plate; 1431. First end; 14311. Pressure bearing area; 1432. Second end;

[0048] 150. Pressure-bearing components;

[0049] 160. Ball bearing;

[0050] 170. Load-bearing column;

[0051] 180. Guide column base;

[0052] 190. Spring. Detailed Implementation

[0053] The following reference Figures 1 to 6 This description pertains to a wafer lifting device and an electron beam inspection device having the same. The terms "upper," "lower," etc., indicating orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings and are used solely for the purpose of facilitating and simplifying the description of this utility model. They do not imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0054] The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first," "second," etc., may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically described, this indicates that other features are not excluded and may be further included.

[0055] In the description of this embodiment, the reference to terms such as "one embodiment," "some embodiments," etc., means that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0056] Unless otherwise defined, all terms (including technical and scientific terms) used in the description of the embodiments of the present application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

[0057] Figure 1 is the overall structure diagram of the wafer lifting device 100 according to an embodiment of the present application; Figure 2 is Figure 1 is the exploded view of the wafer lifting device 100 shown in the figure; Figure 4 is Figure 1 is the bottom view of the wafer lifting device 100 shown in the figure. Referring to Figure 1 、 2 , 4, the wafer lifting device 100 provided by the present application comprises a bottom plate 110, a base plate 130 and a driving mechanism 140. Among them, the top surface of the bottom plate 110 extends upwards a plurality of guide columns 120, the guide columns 120 can be three, the three guide columns 120 can be distributed in triangle on the bottom plate; the base plate 130 is arranged parallel to the bottom plate 110 and is used for carrying the wafer, and the base plate 130 is provided with a plurality of guide holes 131 corresponding to the guide columns 120 one by one, each guide column 120 is inserted into the corresponding guide hole 131, so as to allow the base plate 130 to move relative to the bottom plate 110 in the up-down direction; the driving mechanism 140 comprises a fulcrum piece 141 and a driving plate 143, the fulcrum piece 141 is arranged on the bottom plate 110, and is provided with a rotating shaft 142 parallel and spaced apart from the base plate 130; the middle part of the driving plate 143 is rotationally connected with the rotating shaft 142, and has a first end 1431 located below the center of the base plate 130 and a second end 1432 opposite to the first end 1431, so as to allow the driving plate 143 to rotate around the rotating shaft 142 when the second end 1432 is pressed, and the base plate 130 is lifted by the first end 1431; when the driving plate 143 loses pressure at the second end 1432, it rotates around the rotating shaft 142, and the first end 1431 descends, so that the base plate 130 loses the lifting force and descends.

[0058] The person skilled in the art can understand that by extending the top surface of the bottom plate 110 upwardly to form a plurality of guide columns 120, each of which is inserted into a corresponding guide hole 131 on the base plate 130, and by arranging a fulcrum piece 141 on the bottom plate 110, the fulcrum piece 141 is arranged with a rotating shaft 142 parallel and spaced apart from the top surface of the bottom plate 110, and the middle part of the driving plate 143 is rotationally connected with the rotating shaft 142 and has a first end 1431 located below the center of the base plate 130 and a second end 1432 opposite to the first end 1431, so that the driving plate 143 rotates around the rotating shaft 142 when the second end 1432 is pressed and lifts the base plate 130 from the first end 1431. Wherein, the driving plate 143 is a lever structure, by shortening the distance between the first end 1431 of the driving plate 143 and the rotating shaft 142, it can become a labor-saving lever, thereby accelerating the lifting speed of the base plate 130, and further improving the wafer transfer efficiency, and by locating the first end 1431 of the driving plate 143 below the center of the base plate 130, the center of the base plate 130 is subjected to upward pressure and is relatively uniform in stress, without lateral torque and jamming. Based on the overall structure, the wafer transfer efficiency is improved.

[0059] Still referring to Figure 1 、 2 , 4, in some embodiments of the present application, the base plate 130 is composed of a body portion 132 and a plurality of lug portions 133 arranged at equal intervals along the circumferential direction of the body portion 132, wherein a plurality of guide holes 131 are arranged on the plurality of lug portions 133, respectively.

[0060] The person skilled in the art can understand that by making the base plate 130 composed of a body portion 132 and a plurality of lug portions 133 arranged at equal intervals along the circumferential direction of the body portion 132, and arranging a plurality of guide holes 131 on the lug portions 133, respectively, the weight cost of the base plate 130 is reduced.

[0061] Figure 3 is an enlarged view of A in FIG. Figure 2 Figure 5 is an enlarged view of B in FIG. Figure 4 Referring to Figures 2-5 , in some embodiments of the present application, a pressure receiving piece 150 is arranged at the center of the bottom surface of the body portion 132, which can be columnar with a planar bottom surface, and the first end 1431 of the driving plate 143 is provided with a ball 160 corresponding to the pressure receiving piece 150.

[0062] The person skilled in the art can understand that by arranging the pressure receiving piece 150 at the center of the bottom surface of the body portion 132, and arranging the ball 160 corresponding to the pressure receiving piece 150 at the first end 1431 of the driving plate 143, the cooperation of the pressure receiving piece 150 and the ball 160 can avoid the generation of lateral torque, so that the pushing force received by the base plate 130 is always vertically upward.​

[0063] Referring to Figure 1 , 2 , 4, in some embodiments of the utility model, the plurality of notches 1321 are arranged on the body part 132 around the pressure bearing part 150.

[0064] Optionally, the plurality of notches 1321 are four; and / or

[0065] The plurality of notches 1321 are circular holes.

[0066] It should be noted that the number and shape of the plurality of notches 1321 can be determined according to actual conditions, and the utility model does not make too many limitations thereon.

[0067] As can be understood by those skilled in the art, by arranging the plurality of notches 1321 on the body part 132 around the pressure bearing part 150, not only can the risk of deformation of the substrate 130 due to thermal expansion and contraction caused by temperature changes be reduced, but also the weight cost of the substrate 130 can be reduced.

[0068] In some embodiments of the utility model, the plurality of balls 160 are balls 160 made of stainless steel material.

[0069] As can be understood by those skilled in the art, by making the plurality of balls 160 of stainless steel material, the wear resistance of the plurality of balls 160 is enhanced.

[0070] Referring to Figure 1 , 2 , 4, in some embodiments of the utility model, the plurality of load-bearing columns 170 for carrying wafers are upwardly extended at equal intervals in the circumferential direction from the top surface of the body part 132, and the plurality of load-bearing columns 170 are distributed between the plurality of lug parts 133.

[0071] Among them, the plurality of load-bearing columns 170 can be three, and the three load-bearing columns 170 are respectively located in the three intervals formed by the three lug parts 133.

[0072] As can be understood by those skilled in the art, by making the plurality of load-bearing columns 170 for carrying wafers be upwardly extended at equal intervals in the circumferential direction from the top surface of the body part 132, and the plurality of load-bearing columns 170 be distributed between the plurality of lug parts 133, the force on each load-bearing column 170 is uniform, and the wafer is stably lifted.

[0073] Referring to Figure 1 , 2 , 4, in some embodiments of the utility model, the guide column base 180 for fixing the guide column 120 to the bottom plate 110 is arranged between the bottom plate 110 and the guide column 120, and the guide column base 180 and the lug part 133 one-to-one correspond, wherein,

[0074] A plurality of springs 190 are arranged between the lug 133 and the corresponding guide column base 180, so that the substrate 130 can accelerate downward under the action force of the spring 190 recovering deformation.

[0075] The two springs 190 arranged between the lug 133 and the corresponding guide column base 180 can be symmetrical to the axis of the guide column 120.

[0076] As can be understood by those skilled in the art, when the substrate 130 is jacked up, the distance between the substrate 130 and the guide column base 180 increases, and the spring 190 is stretched and in a stretched state; when the substrate 130 loses the jacking force, the action force generated by the spring 190 recovering deformation can pull the substrate 130 to accelerate downward.

[0077] Referring to Figure 1 , 2 In some embodiments of the utility model, the fulcrum piece 141 includes a first support piece 1411 and a second support piece 1412 arranged opposite on the bottom plate 110, and the rotating shaft 142 is arranged between the first support piece 1411 and the second support piece 1412.

[0078] The first support piece 1411 is composed of a first fixed plate 14111 and a first support plate 14112, the first fixed plate 14111 is parallel to the bottom plate 110 and is used for fixing the first support piece 1411 on the bottom plate 110, and the first support plate 14112 extends upward from one end of the first fixed plate 14111 close to the second support piece 1412 to form and is used for arranging one end of the rotating shaft 142; the second support piece 1412 is composed of a second fixed plate 14121 and a second support plate 14122, the second fixed plate 14121 is parallel to the bottom plate 110 and is used for fixing the second support piece 1412 on the bottom plate 110, and the second support plate 14122 extends upward from one end of the second fixed plate 14121 close to the first support piece 1411 to form and is used for arranging the other end of the rotating shaft 142.

[0079] The first fixed plate 14111 and the second fixed plate 14121 can be fixedly connected with the bottom plate 110 by a threaded connection mode, and the first support piece 1411 and the second support piece 1412 can be provided with position corresponding through holes for the two ends of the rotating shaft 142 to pass through respectively.

[0080] As can be understood by those skilled in the art, by arranging the opposite first support piece 1411 and second support piece 1412 on the bottom plate 110, the rotating shaft 142 can be arranged on the bottom plate 110 and parallel to the top surface of the bottom plate 110.

[0081] Still referring to Figure 1 , 2As shown, in some embodiments of the present application, the first end 1431 of the driving plate 143 is provided with a downwardly recessed pressure receiving area 14311 on the top surface.

[0082] The pressure receiving area 14311 can be rectangular in shape.

[0083] As understood by those skilled in the art, the downwardly recessed pressure receiving area 14311 on the top surface of the first end 1431 of the driving plate 143 allows the first end 1431 of the driving plate 143 to receive external pressure through the pressure receiving area 14311.

[0084] Figure 6 is a schematic structural block diagram of an electron beam detection device 10 according to an embodiment of the present application. Referring to Figure 6 As shown, based on the same inventive concept, the present application further provides an electron beam detection device 10, which comprises the wafer lifting device 100 in any of the above embodiments.

[0085] The electron beam detection device 10 is widely used in the semiconductor industry. For example, the electron beam detection device 10 can be a scanning electron microscope, which is usually used for defect detection of production objects such as chips. The main principle of the scanning electron microscope is to use a charged particle beam to bombard the surface of the measured object, and to detect the secondary electron signal generated in the bombarded area to obtain various physical and chemical information of the measured sample itself, such as topography, composition, feature distribution, etc. Typical applications of the electron beam detection device 10 are usually based on electron beams in a vacuum to detect micro patterns on semiconductor silicon wafers and mask plates, measure critical dimensions, and detect open defects and short circuit defects in CMOS integrated circuits.

[0086] At this point, those skilled in the art should realize that, although the present application has been shown and described in detail in the above embodiments, many other variants or modifications can be determined or deduced directly according to the disclosure of the present application without departing from the spirit and scope of the present application. Therefore, the scope of the present application should be understood and recognized as covering all these other variants or modifications.

Claims

1. A wafer lifting device, characterized in that, include: The base plate has multiple guide columns extending upwards from its top surface; A substrate for supporting the wafer, and the substrate is provided with a plurality of guide holes corresponding one-to-one with the guide posts, each guide post being inserted into the corresponding guide hole to allow the substrate to move relative to the base plate in the vertical direction; The drive mechanism includes: A fulcrum component is disposed on the base plate and has a rotating shaft that is parallel and spaced apart from the base plate; A drive plate, the middle of which is rotatably connected to the rotating shaft, and having a first end located below the center of the substrate and a second end opposite to the first end, thereby allowing the drive plate to rotate about the rotating shaft when the second end is pressed, thereby lifting the substrate by the first end.

2. The wafer lifting device according to claim 1, characterized in that, The substrate is composed of a main body and a plurality of lugs that are equally spaced along the outer circumferential direction of the main body, wherein the plurality of guide holes are respectively disposed on the plurality of lugs.

3. The wafer lifting device according to claim 2, characterized in that, A pressure-bearing component is provided at the center of the bottom surface of the main body; and The first end of the drive plate is provided with a ball bearing corresponding to the pressure bearing member. The pressure bearing member cooperates with the ball bearing to avoid the generation of lateral torque.

4. The wafer lifting device according to claim 3, characterized in that, The body portion has multiple notches surrounding the pressure-bearing member to reduce the deformation pressure and / or weight cost of the substrate.

5. The wafer lifting device according to claim 3, characterized in that, The ball bearings are made of stainless steel.

6. The wafer lifting device according to claim 2, characterized in that, The top surface of the main body extends upward along the circumferential direction with multiple support pillars for supporting the wafer, and the multiple support pillars are distributed between the multiple lugs.

7. The wafer lifting device according to claim 2, characterized in that, A guide post base is provided between the base plate and the guide post for fixing the guide post to the base plate. The guide post base and the lug correspond one-to-one. Multiple springs are provided between the lug and the corresponding guide post base, so that the substrate can descend faster under the restoring force of the spring.

8. The wafer lifting device according to claim 1, characterized in that, The fulcrum component includes a first support and a second support disposed opposite to each other on the base plate, and the pivot is disposed between the first support and the second support. The first support member is composed of a first fixing plate and a first support plate. The first fixing plate is parallel to the base plate and is used to fix the first support member on the base plate. The first support plate extends upward from the end of the first fixing plate near the second support member and is used to set one end of the rotating shaft. The second support member is composed of a second fixing plate and a second support plate. The second fixing plate is parallel to the base plate and is used to fix the second support member on the base plate. The second support plate extends upward from the end of the second fixing plate near the first support member and is used to set the other end of the rotating shaft.

9. The wafer lifting device according to claim 1, characterized in that, The top surface of the first end of the drive plate is provided with a downwardly recessed pressure-bearing area, which is configured to receive external pressure.

10. An electron beam detection device, characterized in that, Includes the wafer lifting device as described in any one of claims 1-9.

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