Stable field effect transistor with good moisture resistance

Abstract

The utility model relates to the technical field of field effect transistors, and particularly discloses a stable field effect transistor with good moisture resistance, which comprises a packaging shell, a groove arranged on the lower surface of the packaging shell, a support positioning plate arranged in the groove on the lower surface of the packaging shell, and a chip body fixedly connected on the upper surface of the support positioning plate. A mounting sliding groove is formed in the upper surface of the packaging shell, first heat dissipation holes are formed in the bottom surface of the mounting sliding groove, and a protective sliding plate is mounted on the side wall of the mounting sliding groove. According to the stable field effect transistor with the good humidity resistance, the dehumidification connecting groove and the dehumidification connecting plate are arranged, the dehumidification connecting groove can be conveniently exposed through sliding extension of the protection sliding plate, the dehumidification connecting plate is fixedly installed in the dehumidification connecting groove, after the protection sliding plate is reset, flowing air is dehumidified through the dehumidification connecting plate, and the dehumidification effect of the dehumidification connecting plate is improved. Therefore, the moisture is reduced, the moisture-proof effect is improved, and the practicability of the device is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to field effect transistor technical field, concretely is a stable field effect transistor with good moisture-proof performance. BACKGROUND

[0002] Field effect transistor is abbreviated as FET, is an electronic component that utilizes electric field effect to control current in a semiconductor, is a new generation of amplifying element developed according to the principle of triode, has 3 polarities, respectively gate, drain and source, junction field effect transistor is taken n channel junction field effect transistor as an example, two electrodes of drain d and source s are led out at both ends of n type silicon rod, and p region is formed on both sides of the silicon rod, forms two pn junctions, an electrode is led out in the p region and is connected as gate g, when drain power voltage is certain, if gate voltage is more negative, the depletion layer formed at the junction of pn is thicker, then the channel between drain and source is narrower, and drain current id is smaller, on the contrary, the channel is wider, and id is larger, so the change of drain current can be controlled by gate voltage, insulated gate field effect transistor is taken p type substrate as an example, two n type regions with high impurities are diffused on the substrate as source s and drain d, then a layer of insulation is covered on the silicon wafer surface, and then a metal aluminum electrode g is led out as gate, when the gate voltage is zero, the p type semiconductor substrate between the source and the drain forms an inversion layer, thereby forming a conductive channel, so that the current can flow from the source to the drain, when the gate applies a positive voltage, the conductivity of the inversion layer is enhanced, and the drain current is increased, when the gate applies a negative voltage, the conductivity of the inversion layer is weakened, and the drain current is reduced until cut-off.

[0003] The structure of the existing field effect transistor, such as the field effect transistor disclosed in publication No. "CN213816130U", is rotated to the upper side of the pin, and the pin is shielded in the protection space formed by the L-shaped heat sink body, but in actual use, the L-shaped heat sink body does not have a locking mechanism, which is easy to deviate and rotate after collision, thereby affecting the protection performance and practicability. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a stable field effect transistor with good moisture-proof performance to solve the problem that the L-shaped heat sink body does not have a locking mechanism, which is easy to deviate and rotate after collision, thereby affecting the protection performance and practicability.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a stable field-effect transistor with good moisture resistance, comprising a package shell with a groove on its lower surface, a support positioning plate in the groove on the lower surface of the package shell, a chip body fixedly connected to the upper surface of the support positioning plate, a mounting groove on the upper surface of the package shell, a first heat dissipation hole on the bottom surface of the mounting groove, a protective sliding plate installed on the side wall of the mounting groove, a second heat dissipation hole on the upper surface of the protective sliding plate, a dehumidification connection groove on the lower surface of the protective sliding plate, a dehumidification connection plate connected to the inner wall of the dehumidification connection groove, a protective positioning mechanism on the side surface of one end of the protective sliding plate, which is fixedly connected to two protective side plates on the side surface of one end of the protective sliding plate and secured by a limiting block engaging the positioning groove for easy fixation, and connection pins fixedly connected to the side surface of the package shell.

[0006] Preferably, the first heat dissipation holes are evenly distributed on the surface of the mounting groove, and the first heat dissipation holes penetrate the mounting groove, and the protective sliding plate and the mounting groove form a sliding connection.

[0007] By adopting the above technical solution, the first heat dissipation holes are evenly distributed on the surface of the mounting slide, thereby venting the hot air in the cavity of the encapsulation shell. Furthermore, the protective sliding plate is slidably connected to the mounting slide, which facilitates the adjustment of the protective sliding plate.

[0008] Preferably, the second heat dissipation holes are evenly distributed on the surface of the protective sliding plate, and the second heat dissipation holes penetrate the protective sliding plate, and the second heat dissipation holes are corresponding to the first heat dissipation holes.

[0009] By adopting the above technical solution, hot air is circulated through the second heat dissipation hole in conjunction with the first heat dissipation hole, thereby increasing the heat dissipation effect.

[0010] Preferably, the dehumidification connecting groove is connected to the second heat dissipation hole, the dehumidification connecting groove is glued to the dehumidification connecting plate, and the dehumidification connecting plate is a multi-layer structure plate made of montmorillonite.

[0011] By adopting the above technical solution, the dehumidification connection plate is installed through the dehumidification connection slot, which facilitates the replacement of the dehumidification connection plate for maintenance. The dehumidification connection plate and the second heat dissipation hole facilitate the dehumidification of the flowing air.

[0012] Preferably, the protective positioning mechanism includes a protective side plate, which is fixedly connected to the side surface of one end of the protective sliding plate. The surface of the protective side plate is provided with an opening, and a limit block is installed on the inner wall of the opening of the protective side plate. One end of the limit block is fixedly connected to an unlocking handle, and a positioning groove is provided on the outer surface of the encapsulation shell.

[0013] The above technical solution provides protection for the sides of the connecting pins through two protective side plates, and also provides protection for the top of the connecting pins through a protective sliding plate.

[0014] Preferably, the two protective side plates are symmetrically arranged relative to the protective sliding plate, and the protective side plates are slidably connected to the outer surface of the encapsulation shell.

[0015] By adopting the above technical solution, the protective side plate is symmetrically arranged relative to the protective sliding plate to increase the protective effect. At the same time, the sliding connection between the protective side plate and the encapsulation shell can increase the stability of sliding.

[0016] Preferably, the protective side plate and the limiting block are slidably connected, one end of the unlocking handle is provided with a disc-shaped baffle, and a spring is connected between the baffle of the unlocking handle and the protective side plate, and the limiting block and the positioning slot are engaged.

[0017] Using the above technical solution, the movement of the limit block is controlled by the unlocking handle, so that the limit block engages with the positioning slot and is thus fixed.

[0018] Compared with the prior art, the beneficial effects of this utility model are: a stable field-effect transistor with good moisture resistance:

[0019] 1. The device is equipped with a dehumidification connection slot and a dehumidification connection plate. When the device is working, the dehumidification connection slot is exposed by the sliding extension of the protective sliding plate. The dehumidification connection plate is fixedly installed in the dehumidification connection slot. After the protective sliding plate is reset, the dehumidification connection plate dehumidifies the flowing air, thereby reducing moisture and increasing the moisture-proof effect, thus increasing the practicality of the device.

[0020] 2. The device is equipped with a first heat dissipation hole and a second heat dissipation hole. When the device is working, the first heat dissipation hole is connected to the dehumidification connection groove, and the second heat dissipation hole is also connected to the dehumidification connection groove. This facilitates the corresponding setting of the first heat dissipation hole and the second heat dissipation hole, thereby improving the heat dissipation effect of the device. It also facilitates the dehumidification of the flowing air by the dehumidification connection plate, increases the cooling performance of the device, and prevents the chip body from being damaged by high temperature.

[0021] 3. A limit block and an unlocking handle are provided. When the device is working, the spring on the surface of the unlocking handle baffle moves the limit block, causing it to lock into the positioning slot. This facilitates the fixation of the limit block on the encapsulation shell and protective side plate, improving the stability of the device and enhancing the protection of the connecting pins by the protective side plate and protective sliding plate. Furthermore, pulling the unlocking handle allows the limit block to slide and unlock easily, improving the ease of adjustment of the device. Attached Figure Description

[0022] Figure 1This is a three-dimensional structural diagram of the connection between the outer casing and the support positioning plate of this utility model;

[0023] Figure 2 This is a three-dimensional structural diagram of the connection between the packaging shell and the connecting pins of this utility model;

[0024] Figure 3 This is a three-dimensional structural diagram of the connection between the mounting groove and the first heat dissipation hole of this utility model;

[0025] Figure 4 This is a three-dimensional structural diagram of the connection between the support positioning plate and the chip body of this utility model;

[0026] Figure 5 This is a three-dimensional structural diagram of the connection between the protective sliding plate and the dehumidification connecting groove of this utility model;

[0027] Figure 6 This is a three-dimensional structural diagram of the connection between the limiting block and the unlocking handle of this utility model.

[0028] In the diagram: 1. Encapsulation shell; 2. Support positioning plate; 3. Chip body; 4. Mounting slide; 5. First heat dissipation hole; 6. Protective sliding plate; 7. Second heat dissipation hole; 8. Dehumidification connection slot; 9. Dehumidification connection plate; 10. Protective side plate; 11. Limiting block; 12. Unlocking handle; 13. Positioning slot; 14. Connecting pin. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Please see Figures 1-6This utility model provides a technical solution: a stable field-effect transistor with good moisture resistance, including a package shell 1, a support positioning plate 2, a chip body 3, a mounting groove 4, a first heat dissipation hole 5, a protective sliding plate 6, a second heat dissipation hole 7, a dehumidification connection groove 8, a dehumidification connection plate 9, a protective side plate 10, a limiting block 11, an unlocking handle 12, a positioning slot 13, and a connecting pin 14. The package shell 1 has a groove on its lower surface, and the support positioning plate 2 is disposed in the groove on the lower surface of the package shell 1. The chip body 3 is fixedly connected to the upper surface of the support positioning plate 2. The first heat dissipation holes 5 are evenly distributed on the surface of the mounting groove 4 and penetrate through the mounting groove 4. The protective sliding plate 6 is slidably connected to the mounting groove 4. When using this device, the chip body 3 is first fixedly mounted on the lower surface of the support positioning plate 2, and then the package shell 1 is fixedly connected to the support positioning plate 2 to facilitate the encapsulation of the chip body 3, and the connection is made through the connecting pin 14.

[0031] The upper surface of the enclosure 1 is provided with a mounting groove 4, the bottom surface of the mounting groove 4 is provided with a first heat dissipation hole 5, a protective sliding plate 6 is installed on the side wall of the mounting groove 4, and a second heat dissipation hole 7 is evenly distributed on the surface of the protective sliding plate 6 and penetrates the protective sliding plate 6. The second heat dissipation hole 7 is correspondingly set with the first heat dissipation hole 5. The dehumidification connecting groove 8 is connected to the second heat dissipation hole 7. The dehumidification connecting groove 8 is glued to the dehumidification connecting plate 9. The dehumidification connecting plate 9 is a multi-layer structure plate made of montmorillonite. When the device needs to be transported, the protective sliding plate 6 is slid to facilitate the movement of the two protective side plates 10, so that the protective side plates 10 and the protective sliding plate 6 protect the connecting pin 14, thereby improving the protective performance of the device during transportation.

[0032] The upper surface of the protective sliding plate 6 is provided with a second heat dissipation hole 7, and the lower surface of the protective sliding plate 6 is provided with a dehumidification connection groove 8. The inner wall of the dehumidification connection groove 8 is connected to a dehumidification connection plate 9. The protective positioning mechanism includes a protective side plate 10, which is fixedly connected to the side surface of one end of the protective sliding plate 6. The surface of the protective side plate 10 is provided with an opening, and a limit block 11 is installed on the inner wall of the opening of the protective side plate 10. One end of the limit block 11 is fixedly connected to an unlocking pull handle 12. The outer surface of the encapsulation shell 1 is provided with a positioning groove 13. After the protective sliding plate 6 slides out, it is easy to expose the dehumidification connection groove 8 on the lower surface of the protective sliding plate 6. Then, the dehumidification connection plate 9 is glued and fixed in the dehumidification connection groove 8, which improves the convenience of replacing the dehumidification connection plate 9 for maintenance.

[0033] A protective positioning mechanism is provided on the side surface of one end of the protective sliding plate 6. This mechanism is secured by two protective side plates 10 fixedly connected to the side surface of one end of the protective sliding plate 6 and engaging with the positioning slot 13 via a limiting block 11. A connecting pin 14 is fixedly connected to the side surface of the encapsulation shell 1. The two protective side plates 10 are symmetrically arranged relative to the protective sliding plate 6. The protective side plates 10 are slidably connected to the outer surface of the encapsulation shell 1, and the protective side plates 10 and the limiting block 11 form a slidable connection. A disc-shaped baffle is provided at one end of the unlocking handle 12, and a spring connects the baffle of the unlocking handle 12 to the protective side plate 10. The limiting block 11 and the positioning slot 13 form an engaging connection. The spring on the surface of the baffle plate facilitates its sliding with the limiting block 11, allowing the limiting block 11 to engage with the positioning slot 13 on the surface of the encapsulation shell 1. This facilitates the fixation of the encapsulation shell 1 and the protective side plate 10, increasing the stability of the protective sliding plate 6 and the protective side plate 10 and improving the protective effect. During operation, the protective sliding plate 6 is slid back to its original position, aligning the first heat dissipation hole 5 with the second heat dissipation hole 7. This allows for the flow of internal and external air through the first heat dissipation hole 5 and the second heat dissipation hole 7, thereby reducing the heat inside the device. Simultaneously, the air passes through the dehumidification connecting plate 9, which dehumidifies the air, reducing moisture and preventing damage to the internal components of the device.

[0034] Working principle: When using this stable field-effect transistor with good moisture resistance, the chip body 3 is installed by the support positioning plate 2 and the support positioning plate 2 is fixed to the package shell 1. The sliding of the protective sliding plate 6 drives the protective side plate 10 to move, thereby facilitating the protection of the connection pin 14. The unlocking pull handle 12 drives the limit block 11, which engages with the positioning slot 13 to fix the protective side plate 10 and the package shell 1. The sliding protective sliding plate 6 is reset, which facilitates the alignment of the first heat dissipation hole 5 and the second heat dissipation hole 7, thereby facilitating air circulation and heat dissipation. At the same time, the dehumidification connection plate 9 dehumidifies the air to prevent moisture from damaging the internal components, increasing the overall practicality.

[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A stable field-effect transistor with good moisture resistance, comprising a package shell (1) having a groove on its lower surface, a support positioning plate (2) being disposed in the groove on the lower surface of the package shell (1), and a chip body (3) being fixedly connected to the upper surface of the support positioning plate (2), characterized in that: The upper surface of the encapsulation shell (1) is provided with an installation groove (4), the bottom surface of the installation groove (4) is provided with a first heat dissipation hole (5), the side wall of the installation groove (4) is provided with a protective sliding plate (6), the upper surface of the protective sliding plate (6) is provided with a second heat dissipation hole (7), the lower surface of the protective sliding plate (6) is provided with a dehumidification connection groove (8), the inner wall of the dehumidification connection groove (8) is connected with a dehumidification connection plate (9), a protective positioning mechanism is provided on the side surface of one end of the protective sliding plate (6), which is fixedly connected to two protective side plates (10) and engaged with the positioning groove (13) by a limiting block (11) for easy fixation, and a connection pin (14) is fixedly connected to the side surface of the encapsulation shell (1).

2. The stable field-effect transistor with good moisture resistance according to claim 1, characterized in that: The first heat dissipation hole (5) is evenly distributed on the surface of the mounting slide (4), and the first heat dissipation hole (5) penetrates the mounting slide (4). The protective sliding plate (6) and the mounting slide (4) form a sliding connection.

3. A stable field-effect transistor with good moisture resistance according to claim 1, characterized in that: The second heat dissipation hole (7) is evenly distributed on the surface of the protective sliding plate (6), and the second heat dissipation hole (7) penetrates the protective sliding plate (6). The second heat dissipation hole (7) is correspondingly set with the first heat dissipation hole (5).

4. A stable field-effect transistor with good moisture resistance according to claim 1, characterized in that: The dehumidification connecting groove (8) is connected to the second heat dissipation hole (7), and the dehumidification connecting groove (8) is glued to the dehumidification connecting plate (9). The dehumidification connecting plate (9) is a multi-layer structure plate made of montmorillonite.

5. A stable field-effect transistor with good moisture resistance according to claim 1, characterized in that: The protective positioning mechanism includes a protective side plate (10), which is fixedly connected to the side surface of one end of the protective sliding plate (6). The surface of the protective side plate (10) is provided with an opening, and a limit block (11) is installed on the inner wall of the opening of the protective side plate (10). One end of the limit block (11) is fixedly connected to an unlocking handle (12), and a positioning slot (13) is opened on the outer surface of the encapsulation shell (1).

6. A stable field-effect transistor with good moisture resistance according to claim 5, characterized in that: The two protective side plates (10) are symmetrically arranged relative to the protective sliding plate (6), and the protective side plates (10) are slidably connected to the outer surface of the encapsulation shell (1).

7. A stable field-effect transistor with good moisture resistance according to claim 5, characterized in that: The protective side plate (10) and the limiting block (11) are slidably connected. One end of the unlocking handle (12) is provided with a disc-shaped baffle, and a spring is connected between the baffle of the unlocking handle (12) and the protective side plate (10). The limiting block (11) and the positioning slot (13) are engaged.

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