Silicon wafer thickness detection mechanism for sorting machine

Abstract

The utility model discloses a silicon wafer thickness detection mechanism for a sorting machine, which comprises a frame body, a first conveyor belt, a second conveyor belt, a third conveyor belt and an ultrasonic probe, the top of the frame body is fixedly connected with a plurality of fixed seats, and the first conveyor belt and the third conveyor belt are respectively arranged at the tops of two adjacent fixed seats. The top of the frame body is rotationally connected with a lead screw, the outer side of the lead screw is in threaded connection with a sliding block, the ultrasonic probe is fixedly connected to the bottom of the sliding block, the top of the frame body is provided with a guide part enabling the sliding block to move vertically, the top of the frame body is fixedly connected with a supporting frame, and the second conveying belt is installed in the supporting frame. According to the utility model, silicon wafers can be sorted conveniently, the speed of a production line does not need to be reduced, the silicon wafer sorting efficiency is improved, a worker can check the conveying position of the silicon wafers conveniently, and the use effect of the detection mechanism is improved.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer production technology, and in particular to a silicon wafer thickness detection mechanism for sorting machines. Background Technology

[0002] Silicon wafers are thin sheets or sheet-like substrates made of high-purity silicon material. They are mainly used in the photovoltaic and semiconductor fields. In silicon wafer processing, the thickness of silicon wafers is detected by a silicon wafer thickness detection mechanism, and then silicon wafers with unqualified thickness are picked out by a sorting machine.

[0003] However, most current sorting machines use telescopic sorters to push wafers with thicknesses exceeding the specified range to the waste bin. Due to the limited flexibility of the telescopic sorter, when defective wafers are found, the production line speed needs to be reduced to ensure that the telescopic sorter pushes the defective wafers to the waste bin. This method is inefficient and complex. Therefore, it is necessary to improve the existing technology to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a silicon wafer thickness detection mechanism for sorting machines.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A silicon wafer thickness detection mechanism for a sorting machine includes a frame, a first conveyor belt, a second conveyor belt, a third conveyor belt, and an ultrasonic probe. Multiple fixed seats are fixedly connected to the top of the frame. The first and third conveyor belts are respectively mounted on the tops of two adjacent fixed seats. A lead screw is rotatably connected to the top of the frame, and a slider is threaded onto the outer side of the lead screw. The ultrasonic probe is fixedly connected to the bottom of the slider. A guide component for vertical movement of the slider is provided on the top of the frame. A support frame is fixedly connected to the top of the frame. The second conveyor belt is installed inside the support frame and is located above the first and third conveyor belts. Multiple suction cups are provided on the outer side of the second conveyor belt. A fixed frame is fixedly connected to the upper surface of the frame near the second conveyor belt. A limit plate is fixedly connected inside the fixed frame. An electric push rod is fixedly connected to the top of the frame between the first and third conveyor belts. A waste box is fixedly connected to one end of the telescopic part of the electric push rod. A protrusion is integrally formed on the top of the waste box. The electric push rod is electrically connected to the ultrasonic probe.

[0007] As a further embodiment of this utility model, the guiding component is a first guide rod, which is fixedly connected to the top of the frame and passes through the slider. The first guide rod and the lead screw are located on both sides of the first conveyor belt.

[0008] As a further improvement of this utility model, baffles are fixedly connected to the bottom of the slider near the lead screw and the first guide rod.

[0009] As a further embodiment of this utility model, the third conveyor belt passes through the fixed frame, a gap is left between the limiting plate and the third conveyor belt, and the waste box is located directly below the second conveyor belt.

[0010] As a further improvement of this utility model, a collection box is placed on the upper surface of the frame near the third conveyor belt.

[0011] As a further embodiment of this utility model, two second guide rods are fixedly connected to the top of the frame, and the second guide rods pass through the waste box.

[0012] As a further embodiment of this invention, a handwheel for rotating the lead screw is fixedly connected to the top end of the lead screw.

[0013] The beneficial effects of this utility model are as follows:

[0014] 1. By using the waste box and suction cups in combination, silicon wafers with acceptable thickness detected by the ultrasonic probe are transported through the first, second, and third conveyor belts. If unqualified silicon wafers are detected, the electric push rod will push the waste box upward, so that the protrusions on the waste box will block the silicon wafers adsorbed by the suction cups, causing the unqualified silicon wafers to fall into the waste box, thereby sorting the silicon wafers without reducing the speed of the production line, thus improving the efficiency of silicon wafer sorting.

[0015] 2. By setting up baffles, during the process of conveying silicon wafers on the first conveyor belt, the baffles will block and limit the silicon wafers, so that only silicon wafers located in the center of the first conveyor belt can be conveyed. This makes it easier for staff to check the position of the silicon wafers and improves the effectiveness of the testing mechanism. Attached Figure Description

[0016] Figure 1 This is a front structural diagram of the silicon wafer thickness detection mechanism for the sorting machine proposed in this utility model;

[0017] Figure 2 This is a schematic diagram of the back structure of the silicon wafer thickness detection mechanism for the sorting machine proposed in this utility model;

[0018] Figure 3 This is a side view of the silicon wafer thickness detection mechanism for the sorting machine proposed in this utility model.

[0019] Figure 4 This is a schematic diagram of the waste box structure of the silicon wafer thickness detection mechanism for the sorting machine proposed in this utility model.

[0020] In the diagram: 1. Frame; 2. First conveyor belt; 3. Baffle; 4. Handwheel; 5. Slider; 6. Ultrasonic probe; 7. Second conveyor belt; 8. Suction cup; 9. Support frame; 10. Collection box; 11. Third conveyor belt; 12. Waste box; 13. First guide rod; 14. Lead screw; 15. Fixing frame; 16. Fixing seat; 17. Limiting plate; 18. Electric push rod; 19. Second guide rod. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. The described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0022] Reference Figures 1-4 The silicon wafer thickness detection mechanism for the sorting machine includes a frame 1, a first conveyor belt 2, a second conveyor belt 7, a third conveyor belt 11, and an ultrasonic probe 6. The ultrasonic probe 6 is model FP-TTV. Multiple mounting seats 16 are bolted to the top of the frame 1. The first and third conveyor belts 2 and 11 are respectively mounted on the tops of two adjacent mounting seats 16. A lead screw 14 is rotatably connected to the top of the frame 1, and a slider 5 is threaded onto the outer side of the lead screw 14. The ultrasonic probe 6 is bolted to the bottom of the slider 5. A guide component for vertical movement of the slider 5 is provided on the top of the frame 1. A support frame 9 is bolted to the top of the frame 1. The second conveyor belt 7 is installed inside the support frame 9 and is located above the first and third conveyor belts 2 and 11. Multiple suction cups 8 are provided on the outer side of the second conveyor belt 7. The upper surface of the frame 1 is close to the second conveyor belt. Position 7 is fixed with a fixing frame 15 by bolts. The fixing frame 15 is fixed with a limiting plate 17 by bolts. The silicon wafer is placed on the first conveyor belt 2, and the first conveyor belt 2 transports the silicon wafer. During the transport of the silicon wafer, the silicon wafer will pass under the ultrasonic probe 6, so that the ultrasonic probe 6 can detect the thickness of the silicon wafer. If the thickness of the silicon wafer is found to be qualified, the first conveyor belt 2 will transport the silicon wafer to the bottom of the second conveyor belt 7. At this time, the suction cup 8 on the second conveyor belt 7 will adsorb the silicon wafer, so that the second conveyor belt 7 will continue to transport the silicon wafer. When the silicon wafer is transported to the top of the third conveyor belt 11, the limiting plate 17 will block the silicon wafer on the suction cup 8. Since the second conveyor belt 7 is in operation, the silicon wafer will detach from the suction cup 8 and fall onto the third conveyor belt 11 under the obstruction of the limiting plate 17, so that the third conveyor belt 11 will transport the silicon wafer.

[0023] An electric push rod 18 is bolted to the top of the frame 1, located between the first conveyor belt 2 and the third conveyor belt 11. One end of the telescopic part of the electric push rod 18 is bolted to a waste box 12. The top of the waste box 12 has an integrally formed protrusion. The electric push rod 18 is electrically connected to the ultrasonic probe 6. If the thickness of the silicon wafer is found to be unqualified, the ultrasonic probe 6 will transmit a signal to the terminal. After receiving the signal, the terminal will activate the electric push rod 18, which will push the waste box 12 upward, so that the protrusion of the waste box 12 moves to a position that blocks the silicon wafer on the suction cup 8. At this time, when the second conveyor belt 7 picks up and transports the silicon wafer through the suction cup 8, the protrusion on the waste box 12 will block the silicon wafer on the suction cup 8, so that the silicon wafer falls into the waste box 12 for collection, thereby sorting the silicon wafer without reducing the speed of the production line and improving the efficiency of silicon wafer sorting.

[0024] In this invention, the guiding component is a first guide rod 13, which is fixed to the top of the frame 1 by bolts. The first guide rod 13 passes through the slider 5. Rotating the lead screw 14 causes the slider 5 to move horizontally downward along the first guide rod 13 through threaded engagement with the slider 5, thereby changing the distance between the ultrasonic probe 6 and the silicon wafer. This facilitates more accurate detection of the silicon wafer by the ultrasonic probe 6. The first guide rod 13 and the lead screw 14 are located on both sides of the first conveyor belt 2. Baffles 3 are welded to the bottom of the slider 5 near the lead screw 14 and the first guide rod 13. During the process of conveying the silicon wafer by the first conveyor belt 2... The baffle 3 will block and limit the silicon wafer, so that the silicon wafer located in the center of the first conveyor belt 2 can be transported, which makes it easier for the staff to check the position of the silicon wafer transport and improves the use effect of the inspection mechanism. The third conveyor belt 11 passes through the fixed frame 15. There is a gap between the limiting plate 17 and the third conveyor belt 11. The waste box 12 is located directly below the second conveyor belt 7. The collection box 10 is placed on the upper surface of the frame 1 near the third conveyor belt 11. Two second guide rods 19 are fixed to the top of the frame 1 by bolts, and the second guide rods 19 pass through the waste box 12. The top of the lead screw 14 is fixed with a handwheel 4 for rotating the lead screw 14 by bolts.

[0025] Working principle: When needed, the silicon wafer is placed on the first conveyor belt 2, which transports the wafer. During transport, the wafer passes under the ultrasonic probe 6, allowing the probe to detect its thickness. If the thickness is within acceptable limits, the first conveyor belt 2 transports the wafer to the bottom of the second conveyor belt 7. At this point, the suction cups 8 on the second conveyor belt 7 adhere to the wafer, allowing the belt to continue transporting it. When the wafer reaches the top of the third conveyor belt 11, the limiting plate 17 blocks the wafer from the suction cups 8. Since the second conveyor belt 7 is running, the limiting plate 17 prevents the wafer from contacting the suction cups 8. The tray 8 detaches and falls onto the third conveyor belt 11, which then transports the silicon wafers to the collection box 10 for collection. If the thickness of the silicon wafer is found to be unqualified, the ultrasonic probe 6 will transmit a signal to the terminal. After receiving the signal, the terminal will activate the electric push rod 18, which will push the waste box 12 upward, causing the protrusion of the waste box 12 to move to a position that blocks the silicon wafer on the suction cup 8. At this time, when the second conveyor belt 7 picks up and transports the silicon wafers through the suction cup 8, the protrusion on the waste box 12 will block the silicon wafer on the suction cup 8, causing the silicon wafer to fall into the waste box 12 for collection. This sorting of silicon wafers does not require reducing the speed of the production line and improves the efficiency of silicon wafer sorting.

[0026] Furthermore, although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer thickness detection mechanism for a sorting machine, comprising a frame (1), a first conveyor belt (2), a second conveyor belt (7), a third conveyor belt (11), and an ultrasonic probe (6), characterized in that, The top of the frame (1) is fixedly connected to multiple fixed seats (16). The first conveyor belt (2) and the third conveyor belt (11) are respectively installed on the top of two adjacent fixed seats (16). The top of the frame (1) is rotatably connected to a lead screw (14). A slider (5) is threadedly connected to the outside of the lead screw (14). The ultrasonic probe (6) is fixedly connected to the bottom of the slider (5). The top of the frame (1) is provided with a guide component to make the slider (5) move vertically. The top of the frame (1) is fixedly connected to a support frame (9). The second conveyor belt (7) is installed in the support frame (9), and the second conveyor belt (7) is located at the top of the first conveyor belt. Above the conveyor belt (2) and the third conveyor belt (11), a plurality of suction cups (8) are provided on the outer side of the second conveyor belt (7). A fixed frame (15) is fixedly connected to the upper surface of the frame (1) near the second conveyor belt (7). A limit plate (17) is fixedly connected inside the fixed frame (15). An electric push rod (18) is fixedly connected to the top of the frame (1) between the first conveyor belt (2) and the third conveyor belt (11). A waste box (12) is fixedly connected to one end of the telescopic part of the electric push rod (18). A protrusion is integrally formed on the top of the waste box (12). The electric push rod (18) is electrically connected to the ultrasonic probe (6).

2. The silicon wafer thickness detection mechanism for a sorting machine according to claim 1, characterized in that, The guiding component is a first guide rod (13), which is fixedly connected to the top of the frame (1) and passes through the slider (5). The first guide rod (13) and the lead screw (14) are located on both sides of the first conveyor belt (2).

3. The silicon wafer thickness detection mechanism for a sorting machine according to claim 2, characterized in that, The bottom of the slider (5) is fixedly connected to a baffle (3) near the lead screw (14) and the first guide rod (13).

4. The silicon wafer thickness detection mechanism for a sorting machine according to claim 1, characterized in that, The third conveyor belt (11) passes through the fixed frame (15), and there is a gap between the limiting plate (17) and the third conveyor belt (11). The waste box (12) is located directly below the second conveyor belt (7).

5. The silicon wafer thickness detection mechanism for a sorting machine according to claim 4, characterized in that, A collection box (10) is placed on the upper surface of the frame (1) near the third conveyor belt (11).

6. The silicon wafer thickness detection mechanism for a sorting machine according to claim 1, characterized in that, Two second guide rods (19) are fixedly connected to the top of the frame (1), and the second guide rods (19) pass through the waste box (12).

7. The silicon wafer thickness detection mechanism for a sorting machine according to claim 1, characterized in that, The top end of the lead screw (14) is fixedly connected to a handwheel (4) for rotating the lead screw (14).

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