Cleaning device

Abstract

The utility model relates to the technical field of semiconductors, in particular to a cleaning device. The cleaning device is used for cleaning a cleaned piece, the cleaned piece comprises a wafer and / or a mechanical arm, and the cleaning device comprises a support assembly; the cleaning assembly is rotationally connected to the support assembly, the cleaning assembly is used for cleaning a cleaned part, the face, facing the cleaned part, of the cleaning assembly is provided with a spraying hole, and the end, away from the cleaned part, of the spraying hole is used for being connected with cleaning medium supply equipment so as to spray a cleaning medium to the cleaned part; the rotary driving assembly is connected to the cleaning assembly, and the rotary driving assembly can drive the cleaning assembly to rotate around the rotating axis of the cleaning assembly so as to clean the cleaned part, and a cleaning medium can be sprayed to the cleaned part while the cleaning assembly is used for cleaning in the cleaning process of the cleaned part; pollutants on the surface of the cleaned part are more effectively removed, the cleaning time is shortened, the cleaning efficiency is improved, and the risk of scratching the wafer can be reduced.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more particularly to a cleaning apparatus. Background Technology

[0002] Semiconductor technology is the foundation of the modern electronics industry, encompassing the entire industry chain from semiconductor material preparation to the design, manufacturing, and application of semiconductor devices. Semiconductor devices are core components of electronic products, widely used in computers, communications, consumer electronics, automobiles, industrial control, and other fields. With the rapid development of semiconductor technology, wafer thinning technology has become an important means to improve chip integration and performance. Wafer thinning removes excess material from the back side of the wafer through mechanical grinding to achieve the required thickness. However, during the wafer thinning process, grinding residues inevitably accumulate on the wafer surface and back side. These residues pose a serious threat to the yield and reliability of subsequent chip manufacturing processes.

[0003] The cleaning of wafers during wafer thinning mainly involves two stages. First, a cleaning unit is integrated into the grinding station to clean the wafer's surface after processing. Then, another cleaning unit is used during wafer transport to clean the chip surface. However, this process typically only uses cleaning components, which not only makes it difficult to completely remove contaminants from the wafer surface but may also scratch the surface during cleaning. Therefore, there is an urgent need for more efficient and safer methods to promptly clean contaminants from the wafer surface. Utility Model Content

[0004] This application discloses a cleaning device that can spray cleaning medium onto the part being cleaned while using cleaning components during the cleaning process, thereby more effectively removing contaminants from the surface of the part being cleaned, shortening the cleaning time and improving the cleaning efficiency, and reducing the risk of scratching the wafer.

[0005] To achieve the above objectives, embodiments of this application disclose a cleaning apparatus for cleaning a component to be cleaned, the component to be cleaned including a wafer and / or a robotic arm, comprising:

[0006] Support assembly;

[0007] A cleaning assembly is rotatably connected to the support assembly. The cleaning assembly is used to clean the part to be cleaned. The side of the cleaning assembly facing the part to be cleaned is provided with a spray hole. The end of the spray hole away from the part to be cleaned is used to connect to a cleaning medium supply device to spray cleaning medium onto the part to be cleaned.

[0008] A rotary drive assembly is connected to the cleaning assembly and is capable of driving the cleaning assembly to rotate about its rotation axis to clean the object being cleaned.

[0009] As an optional implementation, the cleaning assembly includes a first cleaning element and a second cleaning element, the first cleaning element being used to clean the wafer, the second cleaning element being used to clean the robotic arm, and the spraying orifice including a first spraying orifice and a second spraying orifice, the first spraying orifice being disposed on the side of the first cleaning element facing the wafer, and the second spraying orifice being disposed on the side of the second cleaning element facing the robotic arm;

[0010] Both the first cleaning component and the second cleaning component are rotatably connected to the bracket assembly, and the rotation drive assembly is connected to the first cleaning component and the second cleaning component to drive the first cleaning component and the second cleaning component to rotate.

[0011] As an optional implementation, the cleaning device further includes a lifting drive assembly connected to the first cleaning component and / or the second cleaning component. The lifting drive assembly is configured to drive the first cleaning component and / or the second cleaning component to lift and lower, so as to create a height difference between the first cleaning component and the second cleaning component.

[0012] As an optional implementation, the second cleaning component is fixed relative to the bracket assembly, and the lifting drive assembly is connected to the first cleaning component to drive the first cleaning component to move up and down between a first position and a second position. When the first cleaning component is in the first position, the cleaning surface of the first cleaning component is higher than the cleaning surface of the second cleaning component. When the first cleaning component is in the second position, the cleaning surface of the first cleaning component is lower than the cleaning surface of the second cleaning component.

[0013] As an optional implementation, the lifting drive assembly includes a lifting drive component and a push rod. The push rod is slidably connected to the bracket assembly in a vertical direction. The lifting drive component is used to drive the push rod to lift. The first cleaning component is connected to the push rod. The push rod has a medium flow channel inside. The side wall of the push rod has a first connecting hole and a second connecting hole communicating with the medium flow channel. The first connecting hole and the second connecting hole are arranged in a vertical direction.

[0014] The cleaning device further includes a flow guide disposed between the push rod and the cleaning assembly. The flow guide is configured such that when the first cleaning assembly is in the first position, the flow guide enables the first connecting hole to communicate with the first spray hole and disconnects the second connecting hole from the second spray hole; when the first cleaning assembly is in the second position, the flow guide enables the first connecting hole to disconnect from the first spray hole and communicates the second connecting hole with the second spray hole.

[0015] As an optional implementation, the first spray hole includes a plurality of first spray holes, and the interior of the first cleaning component is provided with a first diversion channel, which is respectively connected to the plurality of first spray holes;

[0016] The second spray hole includes multiple types, and the interior of the second cleaning component is provided with a second diversion channel, which is respectively connected to multiple second spray holes;

[0017] The flow guide is fixed relative to the support assembly. The flow guide has a first flow channel and a second flow channel. The first flow channel and the second flow channel are arranged at intervals in the vertical direction. The second flow channel is connected to the second diversion channel. The first flow channel and the second flow channel are configured such that when the first cleaning component is in the first position, one end of the first flow channel is connected to the first connecting hole, and the other end is connected to the first diversion channel, and the second flow channel is disconnected from the second connecting hole; when the first cleaning component is in the second position, the first flow channel is disconnected from at least one of the first connecting hole and the first diversion channel, and the second flow channel is connected to the second connecting hole.

[0018] As an optional implementation, the distance between the inlet of the first flow channel and the inlet of the second flow channel is greater than the distance between the first connecting hole and the second connecting hole in the vertical direction.

[0019] As an optional implementation, the lifting drive assembly further includes a toggle member. The lifting drive assembly is mounted on the bracket assembly, and the toggle member is connected to the lifting drive assembly. The toggle member can abut against the push rod to drive the push rod to lift or lower.

[0020] As an optional implementation, the rotary drive assembly includes a rotary drive component and a transmission module. The rotary drive component is connected to the bracket assembly, and the transmission module is connected between the rotary drive component and the push rod to drive the push rod to rotate around its own vertical axis, thereby causing the cleaning assembly to rotate around its rotation axis.

[0021] As an optional implementation, the second cleaning component includes a disc and a cleaning part. The disc is sleeved on the push rod, and the cleaning part is disposed on the upper surface of the disc. The center of the disc is located on the vertical axis of the push rod. The first cleaning component is fixedly connected to the push rod and is located above the disc. The rotation axis of the first cleaning component and the rotation axis of the second cleaning component are both collinear with the vertical axis of the push rod.

[0022] As an optional implementation, the transmission module includes a first transmission wheel, a second transmission wheel, and a transmission belt. The first transmission wheel is connected to the rotary drive member, the second transmission wheel is connected to the push rod, and the transmission belt is connected between the first transmission wheel and the second transmission wheel.

[0023] As an optional implementation, the cleaning device further includes a bearing housing, a bearing, and a bushing. The bearing housing is disposed on the support assembly, the bushing is sleeved on the push rod and connected to the second cleaning component, the bearing is disposed between the bearing housing and the bushing, the push rod is capable of moving vertically within the bushing, and the rotation drive assembly is connected to the bushing to drive the bushing to rotate and cause the push rod to rotate about its own vertical axis.

[0024] As an optional implementation, the cleaning device further includes a rotating connector, which includes a connecting part and a rotating part. The connecting part is connected to the bracket assembly, and the rotating part is rotatably connected to the connecting part and fixedly connected to the push rod.

[0025] The connecting part has a first channel, and the rotating part has a second channel. The first channel is connected to the cleaning medium supply device, and the second channel is connected between the first channel and the medium flow channel.

[0026] As an alternative implementation, the first cleaning component includes a sponge, and the second cleaning component includes a brush.

[0027] Compared with the prior art, the beneficial effects of this application are:

[0028] The cleaning apparatus provided in this application embodiment is used to clean a component, including a wafer and / or a robotic arm. While cleaning the component (wafer and / or robotic arm), the cleaning assembly sprays a cleaning medium through its nozzles, more effectively removing contaminants from the surface of the component, shortening cleaning time and improving cleaning efficiency, and reducing the risk of scratching the wafer. For the robotic arm, it reduces the possibility of contaminants carried by the suction cups, ensuring that as few abrasive particles as possible remain on the suction cups during handling, further minimizing the possibility of mechanical cleaning scratching the wafer, thereby improving the overall efficiency and yield of the equipment. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the cleaning device disclosed in the embodiments of this application;

[0031] Figure 2 This is a schematic diagram of the cleaning device when the first cleaning component is in the first position, as disclosed in the embodiments of this application.

[0032] Figure 3 for Figure 2 Sectional view at point AA;

[0033] Figure 4 for Figure 3 A magnified view of a section at point B in the middle;

[0034] Figure 5 for Figure 3 A magnified view of a section at point C;

[0035] Figure 6 This is a schematic diagram of the push rod and actuating element disclosed in the embodiments of this application;

[0036] Figure 7 This is a schematic diagram of the cleaning device when the first cleaning component is in the second position, as disclosed in the embodiments of this application.

[0037] Figure 8 for Figure 7 Sectional view at point DD;

[0038] Figure 9 for Figure 8 A magnified view of a section at point E in the middle.

[0039] Explanation of reference numerals in the attached figures:

[0040] 100-Cleaning device; 1-Support assembly; 11-Top plate; 12-Bottom plate; 13-Support column; 14-First mounting plate; 15-Second mounting plate; 16-Connecting column; 2-Cleaning component; 2a-Spray nozzle; 21-First cleaning element; 21a-First spray nozzle; 21b-First diversion channel; 22-Second cleaning element; 22a-Second spray nozzle; 22b-Second diversion channel; 221-Disc; 222-Cleaning section; 3-Rotary drive assembly; 31-Rotary drive element; 32-Transmission module; 321- 322-Second transmission wheel; 323-Transmission belt; 4-Lifting drive assembly; 41-Lifting drive component; 42-Push rod; 421-Medium flow channel; 422-Matching part; 42a-First connecting hole; 42b-Second connecting hole; 43-Actuating component; 43a-Matching hole; 5-Flow guide component; 5a-First flow guide channel; 5b-Second flow guide channel; 6-Bearing seat; 61-Bearing; 62-Busset; 63-Flange; 7-Rotary connector; 71-Rotating part; 72-Connecting part; N-Rotation axis. Detailed Implementation

[0041] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0042] In this application, the terms "upper," "lower," "top," "bottom," "inner," and "vertical," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0043] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0044] Furthermore, the terms "installation," "setup," "equipped with," and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0045] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0046] Semiconductor technology is the foundation of the modern electronics industry, encompassing the entire industry chain from semiconductor material preparation to the design, manufacturing, and application of semiconductor devices. Semiconductor devices are core components of electronic products, widely used in computers, communications, consumer electronics, automobiles, industrial control, and other fields. With the rapid development of semiconductor technology, wafer thinning technology has become an important means to improve chip integration and performance. Wafer thinning removes excess material from the back side of the wafer through mechanical grinding to achieve the required thickness. However, during the wafer thinning process, grinding residues inevitably accumulate on the wafer surface and back side. These residues pose a serious threat to the yield and reliability of subsequent chip manufacturing processes.

[0047] The cleaning of wafers during wafer thinning mainly involves two stages. First, a cleaning unit is integrated into the grinding station to clean the wafer's surface after processing. Then, another cleaning unit is used during wafer transport to clean the chip surface. However, this process typically only uses cleaning components, which not only makes it difficult to completely remove contaminants from the wafer surface but may also scratch the surface during cleaning. Therefore, there is an urgent need for more efficient and safer methods to promptly clean contaminants from the wafer surface.

[0048] Based on this, the present application discloses a cleaning device. The cleaning component has a spray hole on the side facing the part to be cleaned. During the cleaning process of the part to be cleaned, the spray hole sprays cleaning medium onto the part to be cleaned at the same time as the cleaning component is used to clean it. This can more effectively remove contaminants from the surface of the part to be cleaned, shorten the cleaning time and improve the cleaning efficiency. It can also reduce the risk of scratching the wafer.

[0049] The technical solution of this application will be further described below with reference to the embodiments and accompanying drawings.

[0050] Please see Figure 1 , Figure 1 This is a schematic diagram of the cleaning apparatus 100 disclosed in an embodiment of this application. This application discloses a cleaning apparatus 100 for cleaning a workpiece, the workpiece including a wafer and / or a robotic arm. The cleaning apparatus 100 includes:

[0051] Support assembly 1;

[0052] Cleaning component 2 is rotatably connected to bracket assembly 1. Cleaning component 2 is used to clean the part to be cleaned. The side of cleaning component 2 facing the part to be cleaned is provided with a spray hole 2a. The end of the spray hole 2a away from the part to be cleaned is used to connect to a cleaning medium supply device to spray cleaning medium onto the part to be cleaned.

[0053] Rotary drive assembly 3 is connected to cleaning assembly 2 and can drive cleaning assembly 2 to rotate around its rotation axis N to clean the part to be cleaned.

[0054] It is understood that in the first possible implementation, the cleaning component 2 is used to clean the chip surface of the wafer; in the second possible implementation, the cleaning component 2 is used to clean the suction cup of the robotic arm; and in the third possible implementation, the cleaning component 2 can clean both the chip surface of the wafer and the suction cup of the robotic arm simultaneously.

[0055] While cleaning the workpiece (wafer and / or robot), the cleaning component 2 sprays cleaning medium through the spray nozzle 2a. This allows the cleaning medium to effectively remove contaminants from the surface of the workpiece, shortening cleaning time and improving cleaning efficiency, while also reducing the risk of scratching the wafer. For the robot, during wafer processing, the suction cups on the robot are used to pick up the wafer. If the suction cups carry contaminants, these contaminants may be transferred to the wafer during handling, or grinding particles may remain on the suction cups after grinding, potentially scratching the wafer during mechanical cleaning. Cleaning the robot and spraying cleaning medium reduces the possibility of contaminants on the robot's suction cups, ensuring that as few grinding particles remain on the suction cups as possible during handling, further minimizing the possibility of mechanical cleaning scratching the wafer, thereby improving the overall efficiency and yield of the equipment.

[0056] In some embodiments, the cleaning medium may include liquid and / or gas. For liquid cleaning media, after being sprayed onto the surface of the part to be cleaned, some soluble contaminants can be dissolved and then removed by cleaning; for gaseous cleaning media, the sprayed gas can be dried quickly after cleaning, avoiding subsequent contamination that may be caused by residual moisture after cleaning, and ensuring the cleanliness of the part after cleaning.

[0057] It should be noted that the bracket assembly 1 can be a single integrated structure or composed of sub-installation structures spliced ​​together; this embodiment does not limit this.

[0058] As an optional implementation method, combined with Figure 1 The cleaning component 2 includes a first cleaning element 21 and a second cleaning element 22. The first cleaning element 21 is used to clean the wafer, and the second cleaning element 22 is used to clean the robot arm. The spray hole 2a includes a first spray hole 21a and a second spray hole 22a. The first spray hole 21a is disposed on the side of the first cleaning element 21 facing the wafer, and the second spray hole 22a is disposed on the side of the second cleaning element 22 facing the robot arm.

[0059] The first cleaning component 21 and the second cleaning component 22 are both rotatably connected to the bracket assembly 1. The rotation drive assembly 3 is connected to the first cleaning component 21 and the second cleaning component 22 to drive the first cleaning component 21 and the second cleaning component 22 to rotate.

[0060] In this way, different cleaning components are designed for different components being cleaned (wafers and robotic arms), and the first cleaning component 21 and the second cleaning component 22 are each equipped with a spray hole 2a, allowing for simultaneous cleaning of both types of components and thus improving cleaning efficiency. Using different cleaning components for different components allows for better adaptation to their surface characteristics, thereby enhancing the cleaning effect. For example, the surface of a wafer may be smoother and requires a softer cleaning material, while the surface of a robotic arm may be rougher and require a cleaning material with higher friction.

[0061] By equipping the robotic arm with a dedicated second cleaning component 22, it can be ensured that the robotic arm does not transfer contaminants to the wafer during wafer handling, thereby reducing the risk of wafer contamination. The first cleaning component 21, in conjunction with the first spray hole 21a, sprays cleaning media to clean the wafer, reducing scratches and damage to the wafer surface and extending its lifespan. Simultaneously, the second cleaning component 22, in conjunction with the second spray hole 22a, sprays cleaning media to clean the robotic arm, reducing wear caused by contamination and extending its lifespan. By reducing scratches and contamination on the wafer surface, wafer production yield can be improved, thereby increasing the economic efficiency of the entire production process.

[0062] Optionally, combined Figure 1 and Figure 2 , Figure 2 This is a schematic diagram of the cleaning device 100 when the first cleaning component 21 is in the first position, as disclosed in the embodiments of this application. The cleaning device 100 also includes a lifting drive assembly 4, which is connected to the first cleaning component 21 and / or the second cleaning component 22. The lifting drive assembly 4 is configured to drive the first cleaning component 21 and / or the second cleaning component 22 to rise and fall, so that a height difference is formed between the first cleaning component 21 and the second cleaning component 22.

[0063] Understandably, the robotic arm picks up the wafer above the cleaning device 100. The lifting drive assembly 4 can be connected to one of the first cleaning component 21 and the second cleaning component 22, and drive one of them to move up and down. Alternatively, it can be connected to both the first cleaning component 21 and the second cleaning component 22, so that both the first cleaning component 21 and the second cleaning component 22 can move up and down. When cleaning the wafer, the first cleaning component 21 is higher than the second cleaning component 22, and the first cleaning component 21 rotates and cleans the wafer. When cleaning the robotic arm, the second cleaning component 22 is higher than the first cleaning component 21, and the second cleaning component 22 rotates and cleans the robotic arm.

[0064] In this way, the first cleaning component 21 and the second cleaning component 22 will not interfere with each other, allowing them to move more smoothly up and down during the cleaning process, correspondingly cleaning the parts being cleaned, thus further improving the cleaning efficiency and adaptability of the cleaning device 100. In addition, by adjusting the height of the cleaning components, a closer contact between the cleaning components and the surface of the parts being cleaned can be ensured, thereby enhancing the cleaning effect. Especially for parts with uneven surfaces or protrusions, this design can better remove contaminants, reduce equipment wear and damage caused by incomplete cleaning, and thus extend the service life of the equipment.

[0065] Combination Figure 1 , Figure 2 and Figure 7 , Figure 7 This is a schematic diagram of the cleaning device 100 when the first cleaning component 21 is in the second position, as disclosed in an embodiment of this application. In some optional embodiments, the second cleaning component 22 is fixed relative to the support assembly 1, and the lifting drive assembly 4 is connected to the first cleaning component 21 to drive the first cleaning component 21 to move up and down between the first position and the second position. When the first cleaning component 21 is in the first position, the cleaning surface of the first cleaning component 21 is higher than the cleaning surface of the second cleaning component 22. When the first cleaning component 21 is in the second position, the cleaning surface of the first cleaning component 21 is lower than the cleaning surface of the second cleaning component 22.

[0066] In this way, switching between the first cleaning component 21 and the second cleaning component 22 can be achieved simply by adjusting the height of the first cleaning component 21. When the first cleaning component 21 is in the first position, its cleaning surface is higher than that of the second cleaning component 22, allowing the first cleaning component 21 to clean the chip surface of the wafer first. When the first cleaning component 21 is in the second position, its cleaning surface is lower than that of the second cleaning component 22, allowing the second cleaning component 22 to clean the suction cup of the robotic arm. This design ensures that both the wafer and the robotic arm are thoroughly cleaned, thereby enhancing the cleaning effect.

[0067] In some embodiments, combined with Figure 2 The support assembly 1 includes a top plate 11, a bottom plate 12, and a support column 13 connecting the bottom plate 12 and the top plate 11, providing a more stable support structure.

[0068] In some embodiments, combined with Figures 2 to 4 and Figures 7 to 9 , Figure 3 for Figure 2 Sectional view at point AA. Figure 4 for Figure 3 A magnified view of a section at point B. Figure 8 for Figure 7 Sectional view at DD in the middle. Figure 9 for Figure 8 A partial enlarged view at point E. The lifting drive assembly 4 includes a lifting drive component 41 and a push rod 42. The push rod 42 is slidably connected to the top plate 11 of the support assembly 1 in the vertical direction. The lifting drive component 41 is used to drive the push rod 42 to lift. The first cleaning component 21 is connected to the push rod 42. The push rod 42 has a medium flow channel 421 inside. The side wall of the push rod 42 has a first connecting hole 42a and a second connecting hole 42b communicating with the medium flow channel 421. The first connecting hole 42a and the second connecting hole 42b are arranged in the vertical direction.

[0069] The cleaning device 100 also includes a flow guide 5, which is disposed between the push rod 42 and the cleaning assembly 2. The flow guide 5 is configured such that when the first cleaning assembly 21 is in the first position, the flow guide 5 enables the first connecting hole 42a to communicate with the first spray hole 21a and disconnects the second connecting hole 42b from the second spray hole 22a; when the first cleaning assembly 21 is in the second position, the flow guide 5 enables the first connecting hole 42a to disconnect from the first spray hole 21a and communicates the second connecting hole 42b with the second spray hole 22a.

[0070] In this way, when the first cleaning component 21 is in the first position, its cleaning surface is higher than that of the second cleaning component 22. The first cleaning component 21 can spray cleaning medium to clean and wash the chip surface of the wafer, while the second cleaning component 22 does not spray cleaning medium. This ensures that the cleaning medium is accurately supplied to the first cleaning component 21 that is cleaning the wafer, and does not waste cleaning medium on the second cleaning component 22 that is not being cleaned. When the first cleaning component 21 is in the second position, its cleaning surface is lower than that of the second cleaning component 22. The second cleaning component 22 can spray cleaning medium to clean and wash the suction cup of the robot arm, while the first cleaning component 21 does not spray cleaning medium. This ensures that the cleaning medium is accurately supplied to the second cleaning component 22 that is cleaning the robot arm, and does not waste cleaning medium on the first cleaning component 21 that is not being cleaned. This avoids waste of cleaning medium, makes more efficient use of cleaning medium, and reduces the cost of using cleaning medium.

[0071] Through the coordinated action of the lifting drive assembly 4, the flow guide 5, and other structures, the working state of the cleaning device 100 can be adjusted according to different cleaning requirements. This improves the adaptability of the cleaning device 100 in different cleaning states, and whether cleaning wafers alone or working in conjunction with a robotic arm, it can efficiently and accurately meet the requirements, thereby increasing the versatility of the cleaning device 100.

[0072] It should be noted that the lifting drive component 41 can be a motor, cylinder, etc. In the first possible implementation, the motor is driven by a servo motor or frequency converter, which can be adjusted in real time through feedback signals and has higher precision. In the second possible implementation, the cylinder mainly relies on the pressure generated by compressed air to push the piston, thereby achieving linear motion. It has a simple structure and is easy to maintain. This embodiment does not limit this.

[0073] In some embodiments, the bracket assembly 1 further includes a first mounting plate 14, which is connected to the top plate 11 via a connecting column 16. The lifting drive component 41 is mounted on the first mounting plate 14. This structure provides a stable mounting platform for the lifting drive component 41, making the lifting movement of the first cleaning component 21 smoother and enhancing the stability of the cleaning device 100 structure.

[0074] In some embodiments, combined with Figure 1 , Figure 4 and Figure 9 The first spray hole 21a includes multiple first spray holes, and the interior of the first cleaning component 21 is provided with a first diversion channel 21b, which is connected to multiple first spray holes 21a respectively. The second spray hole 22a includes multiple second spray holes, and the interior of the second cleaning component 22 is provided with a second diversion channel 22b, which is connected to multiple second spray holes 22a respectively.

[0075] In some embodiments, the flow guide 5 is fixed relative to the support assembly 1. The flow guide 5 has a first flow guide channel 5a and a second flow guide channel 5b, which are arranged at intervals in the vertical direction. The second flow guide channel 5b is connected to the second diversion channel 22b. The first flow guide channel 5a and the second flow guide channel 5b are configured such that when the first cleaning member 21 is in the first position, one end of the first flow guide channel 5a is connected to the first connecting hole 42a and the other end is connected to the first diversion channel 21b, and the second flow guide channel 5b is disconnected from the second connecting hole 42b. When the first cleaning member 21 is in the second position, the first flow guide channel 5a is disconnected from at least one of the first connecting hole 42a and the first diversion channel 21b, and the second flow guide channel 5b is connected to the second connecting hole 42b.

[0076] Optionally, the inner wall surface of the guide member 5 may be provided with a seal (not shown in the figure) to seal the gap between the first connecting hole 42a and the second connecting hole 42b and the guide member 5, so as to prevent the cleaning medium from flowing out of the connecting hole during the movement of the push rod 42.

[0077] When the lifting drive 41 drives the push rod 42 to raise the first cleaning component 21 to the first position to clean the wafer, the first diversion channel 21b in the first cleaning component 21 will connect with the first connection hole 42a through the first guide channel 5a, and the first cleaning component 21 will spray cleaning medium. When the lifting drive 41 drives the push rod 42 to lower the first cleaning component 21 to the second position to clean the robot, the second diversion channel 22b in the second cleaning component 22 will connect with the second connection hole 42b through the second guide channel 5b, and the second cleaning component 22 will spray cleaning medium. Through the design of the first guide channel 5a and the second guide channel 5b in the guide component 5, the cleaning medium can be selectively supplied to the first cleaning component 21 or the second cleaning component 22 according to the position change of the first cleaning component 21.

[0078] In some possible implementations, combined Figure 4 and Figure 9 In the vertical direction, the distance between the inlet of the first flow channel 5a and the inlet of the second flow channel 5b is greater than the distance between the first connecting hole 42a and the second connecting hole 42b.

[0079] During the process of the first cleaning component 21 rising from the second position to the first position, the height of the second connecting hole 42b is higher than the height of the inlet of the second flow channel 5b, so that the second connecting hole 42b will not communicate with the second flow channel 5b; during the process of the first cleaning component 21 falling from the first position to the second position, the height of the first connecting hole 42a is lower than the height of the inlet of the first flow channel 5a, so that the first connecting hole 42a will not communicate with the first flow channel 5a. By precisely designing the spacing between the flow channel and the connecting hole, the flow path of the cleaning medium can be controlled more effectively, allowing the cleaning medium to be supplied more accurately to the required cleaning component, thereby improving the utilization efficiency of the cleaning medium.

[0080] In addition, the difference between the distance between the inlet of the first flow channel 5a and the inlet of the second flow channel 5b and the distance between the first connecting hole 42a and the second connecting hole 42b is the maximum moving distance of the first cleaning component 21. Under the premise of ensuring the precise connection between the flow channel and the connecting hole, the moving distance of the first cleaning component 21 is further reduced.

[0081] As an optional implementation method, combined with Figure 2The lifting drive assembly 4 also includes a toggle member 43. The lifting drive assembly 41 is mounted on the bracket assembly 1, and the toggle member 43 is connected to the lifting drive assembly 41. The toggle member 43 can abut against the push rod 42 to drive the push rod 42 to lift.

[0082] In this way, compared to the lifting drive component 41 directly driving the push rod 42 to rise and fall, the drive force is transmitted to the push rod 42 through the actuating component 43, which drives the push rod 42 to move up and down. This can prevent the lifting drive component 41 from having too large a driving force or malfunctioning, which could directly generate a large impact force on the push rod 42 and other structures, causing structural damage, and thus ensure the safety of the device.

[0083] Specifically, in combination Figure 6 , Figure 6 This is a schematic diagram of the structure of the push rod 42 and the actuating member 43 disclosed in the embodiments of this application. The lifting drive member 41 is a cylinder. The push rod 42 has a mating part 422. The diameter of the mating part 422 is smaller than the diameter of other parts of the push rod 42. The actuating member 43 is sleeved on the mating part 422. The actuating member 43 has a mating hole 43a inside. The diameter of the mating hole 43a is larger than the diameter of the mating part 422 but smaller than the diameter of other parts of the push rod 42. When the lifting drive member 41 drives the actuating member 43 to rise, the actuating member 43 can abut against the push rod 42. When the push rod 42 drives the first cleaning member 21 to rotate, the push rod 42 will not interfere with the actuating member 43.

[0084] Optionally, combined Figure 3 and Figure 5 , Figure 5 for Figure 3 The enlarged view at point C shows that the rotary drive assembly 3 includes a rotary drive component 31 and a transmission module 32. The rotary drive component 31 is connected to the bracket assembly 1, and the transmission module 32 is connected between the rotary drive component 31 and the push rod 42 to drive the push rod 42 to rotate around its own vertical axis, so that the cleaning assembly 2 rotates around its rotation axis N.

[0085] The transmission module 32 transmits driving force from a rotary drive component 31 to the push rod 42, ensuring the normal operation of the mechanical system. The transmission module 32 enables the rotary drive component 31 to more precisely control the rotational movement of the cleaning component, ensuring that the cleaning medium acts more effectively on the surface of the cleaned component, thereby improving cleaning efficiency. It also effectively reduces noise and vibration generated during mechanical system operation, improving the comfort of the working environment and the stability of the equipment. Furthermore, the transmission module 32 typically features standardized design and manufacturing processes, facilitating maintenance and replacement, effectively improving system performance, reliability, and safety, while reducing maintenance costs and increasing work efficiency.

[0086] It should be noted that the lifting drive component 41 can be a motor, cylinder, etc. In the first possible implementation, the motor is driven by a servo motor or frequency converter, which can be adjusted in real time through feedback signals and has higher precision. In the second possible implementation, the cylinder mainly relies on the pressure generated by compressed air to push the piston, thereby achieving linear motion. It has a simple structure and is easy to maintain. This embodiment does not limit this.

[0087] In some embodiments, the bracket assembly 1 further includes a second mounting plate 15, on which the rotation drive 31 is mounted. The second mounting plate 15 is fixedly connected to the lower surface of the top plate 11, providing a stable support structure for the rotation drive 31.

[0088] In some embodiments, combined with Figure 7 and Figure 8 The second cleaning component 22 includes a disc 221 and a cleaning part 222. The disc 221 is sleeved on the push rod 42, and the cleaning part 222 is disposed on the upper surface of the disc 221. The center of the disc 221 is located on the vertical axis of the push rod 42. The first cleaning component 21 is fixedly connected to the push rod 42 and is located above the disc 221. The rotation axis N of the first cleaning component 21 and the rotation axis N of the second cleaning component 22 are both on the same straight line as the vertical axis of the push rod 42.

[0089] In this way, on the one hand, the first cleaning component 21 and the second cleaning component 22 can rotate synchronously, eliminating the need for separate rotation control operations for the first cleaning component 21 used for cleaning wafers and the second cleaning component 22 used for cleaning the robotic arm, greatly simplifying the control process and improving the convenience and accuracy of operation. On the other hand, it minimizes the space occupied by the cleaning component 2 during rotation, eliminating the need to reserve additional space for the different rotation axes N of the two cleaning components, avoiding potential spatial interference problems, and contributing to the miniaturization design of the entire cleaning device 100. More functional modules can be accommodated within a limited space, improving space utilization.

[0090] During the cleaning process, the spraying of the cleaning medium, the rotation and lifting of the cleaning components need to be coordinated. Coaxially rotating cleaning components are easier to coordinate with other parts (such as the lifting drive assembly 4 and the flow guide 5) in terms of space and movement. When the lifting drive assembly 4 drives the first cleaning component 21 to rise or fall, because it can rotate coaxially and synchronously with the second cleaning component 22, its relative positional relationship with other components remains stable at different heights. This ensures the stability and reliability of the cleaning effect and reduces the risk of cleaning failure or equipment malfunction due to incoordination between components.

[0091] The rotary drive component 31 and the push rod 42 can be connected by a gear and rack transmission. While the structure is simple, it occupies a large space. As an optional implementation method, it is combined with... Figure 3 and Figure 5 The transmission module 32 includes a first transmission wheel 321, a second transmission wheel 322, and a transmission belt 323. The first transmission wheel 321 is connected to the rotary drive member 31, the second transmission wheel 322 is connected to the push rod 42, and the transmission belt 323 is connected between the first transmission wheel 321 and the second transmission wheel 322.

[0092] This transmission method effectively transmits the power of the rotating drive component 31 to the push rod 42, thereby driving the cleaning component 2 to rotate around its rotation axis N. The use of the transmission belt 323 can reduce energy loss during transmission while maintaining efficient power transmission, thus improving the overall working efficiency of the cleaning device 100. Through the design of the transmission module 32, the rotational movement of the cleaning component 2 can be precisely controlled. The dimensions of the first transmission wheel 321 and the second transmission wheel 322, as well as the tension of the transmission belt 323, can be adjusted according to actual needs to achieve different rotational speeds and torque outputs, improving the versatility and flexibility of the equipment.

[0093] In some alternative implementations, combined with Figure 3 and Figure 5 The cleaning device 100 also includes a bearing seat 6, a bearing 61, and a bushing 62. The bearing seat 6 is disposed on the bracket assembly 1. The bushing 62 is sleeved on the push rod 42 and connected to the second cleaning component 22. The bearing 61 is disposed between the bearing seat 6 and the bushing 62. The push rod 42 can move vertically within the bushing 62. The rotation drive assembly 3 is connected to the bushing 62 to drive the bushing 62 to rotate and drive the push rod 42 to rotate around its own vertical axis.

[0094] This design allows the push rod 42 to move vertically within the bushing 62, while simultaneously ensuring that the rotary drive assembly 3 can drive the bushing 62 to rotate, thereby causing the push rod 42 to rotate around its own vertical axis. The use of the bearing 61 reduces friction during rotation, resulting in smoother rotation and improved cleaning performance of the cleaning assembly 2. Through the cooperation of the bearing 61 and the bushing 62, the push rod 42 can move precisely in the vertical direction, enabling adjustment of the first cleaning component 21 at different heights. Furthermore, the design of the bearing 61 and the bushing 62 facilitates the installation and removal of the push rod 42 and the second cleaning component 22, making routine inspection, repair, and replacement easier for maintenance personnel.

[0095] It is understandable that the bushing 62 may have a pin or groove structure inside, which cooperates with the push rod 42 so that the bushing 62 can drive the push rod 42 to rotate, and allows the push rod 42 to move up and down inside the bushing 62.

[0096] In one embodiment, combined with Figure 3 and Figure 4 The cleaning device 100 also includes a flange 63, which is fixedly connected to the bushing 62 and the second cleaning component 22. The flange 63 has a connecting channel inside, which is connected to the second diversion channel 22b and the second guide channel 5b. The flange 63 provides a more stable structure for the connection of the second cleaning component 22.

[0097] In some embodiments, the cleaning device 100 further includes a rotating connector 7, which includes a connecting portion 72 and a rotating portion 71. The connecting portion 72 is connected to the first mounting plate 14, and the rotating portion 71 is rotatably connected to the connecting portion 72 and fixedly connected to the push rod 42. The connecting portion 72 has a first channel, and the rotating portion 71 has a second channel. The first channel is connected to the cleaning medium supply device, and the second channel is connected between the first channel and the medium flow channel 421.

[0098] The rotating connector 7 allows the cleaning medium to pass through the medium flow channel 421 during the rotation of the push rod 42, ensuring a continuous supply of cleaning medium. When cleaning wafers or robotic arms, an interruption in the cleaning medium supply may result in residue or uneven cleaning. The rotating connector ensures that even when the push rod 42 rotates, the rotating part 71 of the connector rotates accordingly, and the second channel within the rotating part 71 remains connected to the first channel within the connecting part 72. This allows the cleaning medium to continue flowing smoothly through the medium flow channel 421 to the cleaning assembly 2, ensuring the continuity of the cleaning process and improving cleaning quality and efficiency.

[0099] As an alternative implementation, the first cleaning component 21 includes a sponge, and the second cleaning component 22 includes a brush.

[0100] The sponge, with its excellent absorbency and softness, effectively absorbs and removes stains while avoiding scratches or other damage to the wafer surface. The brush, on the other hand, has strong cleaning power, reaching deep into the crevices and corners of the robotic arm's suction cups to remove stubborn stains. Therefore, this material selection ensures that the cleaning device 100 achieves highly efficient cleaning results when cleaning both the wafers and the robotic arm.

[0101] While cleaning the wafer and / or the robotic arm, the cleaning component 2 sprays cleaning medium through the spray nozzle 2a onto the workpiece. This allows the cleaning medium to effectively remove contaminants from the surface of the workpiece, shortening cleaning time and improving cleaning efficiency, while also reducing the risk of scratching the wafer. In wafer processing systems, if the suction cups of the robotic arm carry contaminants (such as abrasive particles) during wafer handling, they may scratch the wafer during mechanical cleaning. Cleaning the robotic arm's suction cups by the cleaning device 100 can prevent this from happening, thereby improving the overall efficiency and yield of the equipment. On the one hand, it reduces the need for reprocessing or product scrap due to incomplete cleaning or wafer scratches; on the other hand, it ensures wafer quality and increases the proportion of qualified products. Cleaning the robotic arm and spraying cleaning medium reduces the possibility of contaminants carried by the robotic arm's suction cups, ensuring that as few abrasive particles remain on the suction cups during handling as possible, further minimizing the possibility of mechanical cleaning scratching the wafer.

[0102] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A cleaning apparatus for cleaning a workpiece, said workpiece comprising a wafer and / or a robotic arm, characterized in that, The cleaning device includes: Support assembly; A cleaning assembly is rotatably connected to the support assembly. The cleaning assembly is used to clean the part to be cleaned. The side of the cleaning assembly facing the part to be cleaned is provided with a spray hole. The end of the spray hole away from the part to be cleaned is used to connect to a cleaning medium supply device to spray cleaning medium onto the part to be cleaned. A rotary drive assembly is connected to the cleaning assembly and is capable of driving the cleaning assembly to rotate about its rotation axis to clean the object being cleaned.

2. The cleaning device according to claim 1, characterized in that, The cleaning assembly includes a first cleaning component and a second cleaning component. The first cleaning component is used to clean the wafer, and the second cleaning component is used to clean the robotic arm. The spraying orifice includes a first spraying orifice and a second spraying orifice. The first spraying orifice is disposed on the side of the first cleaning component facing the wafer, and the second spraying orifice is disposed on the side of the second cleaning component facing the robotic arm. Both the first cleaning component and the second cleaning component are rotatably connected to the bracket assembly, and the rotation drive assembly is connected to the first cleaning component and the second cleaning component to drive the first cleaning component and the second cleaning component to rotate; The cleaning device further includes a lifting drive assembly, which is connected to the first cleaning component and / or the second cleaning component. The lifting drive assembly is configured to drive the first cleaning component and / or the second cleaning component to lift and lower, so as to create a height difference between the first cleaning component and the second cleaning component.

3. The cleaning device according to claim 2, characterized in that, The second cleaning component is fixed relative to the bracket assembly. The lifting drive assembly is connected to the first cleaning component to drive the first cleaning component to rise and fall between a first position and a second position. When the first cleaning component is in the first position, the cleaning surface of the first cleaning component is higher than the cleaning surface of the second cleaning component. When the first cleaning component is in the second position, the cleaning surface of the first cleaning component is lower than the cleaning surface of the second cleaning component.

4. The cleaning device according to claim 3, characterized in that, The lifting drive assembly includes a lifting drive component and a push rod. The push rod is slidably connected to the bracket assembly in the vertical direction. The lifting drive component is used to drive the push rod to lift. The first cleaning component is connected to the push rod. The push rod has a medium flow channel inside. The side wall of the push rod has a first connection hole and a second connection hole communicating with the medium flow channel. The first connection hole and the second connection hole are arranged in the vertical direction. The cleaning device further includes a flow guide disposed between the push rod and the cleaning assembly. The flow guide is configured such that when the first cleaning assembly is in the first position, the flow guide enables the first connecting hole to communicate with the first spray hole and disconnects the second connecting hole from the second spray hole; when the first cleaning assembly is in the second position, the flow guide enables the first connecting hole to disconnect from the first spray hole and communicates the second connecting hole with the second spray hole.

5. The cleaning device according to claim 4, characterized in that, The first spray hole includes multiple ones, and the first cleaning component has a first diversion channel inside, which is connected to multiple first spray holes respectively; The second spray hole includes multiple types, and the interior of the second cleaning component is provided with a second diversion channel, which is respectively connected to multiple second spray holes; The flow guide is fixed relative to the support assembly. The flow guide has a first flow channel and a second flow channel. The first flow channel and the second flow channel are arranged at intervals in the vertical direction. The second flow channel is connected to the second diversion channel. The first flow channel and the second flow channel are configured such that when the first cleaning component is in the first position, one end of the first flow channel is connected to the first connecting hole, and the other end is connected to the first diversion channel, and the second flow channel is disconnected from the second connecting hole; when the first cleaning component is in the second position, the first flow channel is disconnected from at least one of the first connecting hole and the first diversion channel, and the second flow channel is connected to the second connecting hole.

6. The cleaning apparatus according to claim 5, characterized in that, In the vertical direction, the distance between the inlet of the first flow channel and the inlet of the second flow channel is greater than the distance between the first connecting hole and the second connecting hole.

7. The cleaning apparatus according to claim 4, characterized in that, The rotary drive assembly includes a rotary drive component and a transmission module. The rotary drive component is connected to the bracket assembly, and the transmission module is connected between the rotary drive component and the push rod to drive the push rod to rotate around its own vertical axis, thereby causing the cleaning assembly to rotate around its rotation axis.

8. The cleaning apparatus according to claim 7, characterized in that, The second cleaning component includes a disc and a cleaning part. The disc is sleeved on the push rod, and the cleaning part is disposed on the upper surface of the disc. The center of the disc is located on the vertical axis of the push rod. The first cleaning component is fixedly connected to the push rod and is located above the disc. The rotation axis of the first cleaning component and the rotation axis of the second cleaning component are both collinear with the vertical axis of the push rod.

9. The cleaning apparatus according to claim 7, characterized in that, The cleaning device further includes a bearing housing, a bearing, and a bushing. The bearing housing is disposed on the bracket assembly, the bushing is sleeved on the push rod and connected to the second cleaning component, the bearing is disposed between the bearing housing and the bushing, the push rod is capable of moving vertically within the bushing, and the rotation drive assembly is connected to the bushing to drive the bushing to rotate and cause the push rod to rotate around its own vertical axis.

10. The cleaning apparatus according to any one of claims 7-9, characterized in that, The cleaning device further includes a rotating connector, which includes a connecting part and a rotating part. The connecting part is connected to the bracket assembly, and the rotating part is rotatably connected to the connecting part and fixedly connected to the push rod. The connecting part has a first channel, and the rotating part has a second channel. The first channel is connected to the cleaning medium supply device, and the second channel is connected between the first channel and the medium flow channel.

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