Tray for plasma cleaning machine

Abstract

The utility model discloses a tray for a plasma cleaning machine, which belongs to the technical field of trays and comprises a tray body, the tray body is a titanium metal structural body, and a containing cavity is arranged on the tray body. The clamp is installed in the containing cavity, a containing groove is formed in the clamp so as to contain a wafer, and at least one inclined opening is formed in the side face of the containing groove so that the wafer located in the containing groove can be taken out conveniently. According to the tray for the plasma cleaning machine, rapid taking and placing of wafers are achieved, and compared with a traditional drawing type tray, metal scrap particles are effectively prevented from falling into the bottom of a process cavity or the surfaces of the wafers, so that the internal environment of an equipment cavity and the cleanliness of the surfaces of the wafers are not affected, and the service life of the wafers is prolonged. And the plasma cleaning effect on the wafer is improved.

Description

Technical Field

[0001] This utility model belongs to the field of tray technology, and in particular relates to a tray for a plasma cleaner. Background Technology

[0002] Plasma cleaning, as a common wafer surface treatment technology, is widely used in semiconductor processing. Its main function is to clean oil, oxide layers, organic matter, etc. from the surface of substrates or metals, thereby improving their surface physicochemical properties.

[0003] Before coating processes such as PVD and CVD, wafers are treated with a plasma cleaner to obtain a completely clean substrate environment, which enhances film adhesion, optimizes product performance, and improves product quality.

[0004] Currently, some plasma cleaning machines on the market use pull-out trays to place wafers inside the chamber. Because the trays are coated with an Al metal layer, the Al metal coating on the trays will be rubbed off due to friction during repeated pulling and placing of wafers in the process. Metal debris particles will fall directly to the bottom of the process chamber and the surface of the wafers, which will have a great impact on the internal environment of the equipment chamber and the cleanliness of the wafer surface, resulting in poor cleaning effect on the wafers. Utility Model Content

[0005] This utility model overcomes the shortcomings of the prior art and provides a tray for a plasma cleaner to solve the problems existing in the prior art.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is: a tray for a plasma cleaner, comprising...

[0007] The tray body is a titanium metal structure and has a receiving cavity.

[0008] A fixture is installed in the receiving cavity and has a receiving groove to receive the wafer. The receiving groove has at least one oblique opening on its side to facilitate the removal of the wafer located in the receiving groove.

[0009] In a preferred embodiment of this utility model, the tray body is a square structure.

[0010] In a preferred embodiment of this utility model, the receiving cavity is a sunken structure on the tray body, and its sunken depth is 1cm-3cm.

[0011] In a preferred embodiment of this utility model, the clamp is provided with a fixed base, and the clamp is separated from the tray body by the fixed base.

[0012] In a preferred embodiment of this utility model, the fixed base is installed on the back of the clamp by a number of screws.

[0013] In a preferred embodiment of this utility model, the fixed base is a Teflon base.

[0014] In a preferred embodiment of this utility model, there are two fixed base supports, located on both sides of the clamp.

[0015] In a preferred embodiment of this invention, the opening angle of the oblique opening is 30°-50°.

[0016] This utility model solves the defects existing in the background technology, and has the following beneficial effects:

[0017] The plasma cleaning machine tray of this invention enables rapid loading and unloading of wafers. Compared with traditional pull-out trays, it effectively prevents metal debris from falling into the bottom of the process chamber or onto the wafer surface, thus avoiding any impact on the internal environment of the equipment chamber and the cleanliness of the wafer surface, and improving the plasma cleaning effect on the wafer. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0019] Figure 1 This is a schematic diagram of the overall structure of a preferred embodiment of the present utility model;

[0020] Figure 2 This is a top view of a preferred embodiment of the present invention;

[0021] Figure 3 This is a partial structural schematic diagram of a preferred embodiment of the present invention;

[0022] In the diagram: 10, tray body; 11, receiving cavity; 20, clamp; 21, receiving groove; 211, slanted opening; 30, fixed base; 40, screw. Detailed Implementation

[0023] The following drawings will disclose several embodiments of this utility model. For clarity, many physical details will be described in the following description. However, it should be understood that these physical details should not be used to limit this utility model. That is, in some embodiments of this utility model, these physical details are not essential. In addition, for the sake of simplicity, some conventional structures and components will be shown in the drawings in a simple schematic manner.

[0024] Furthermore, in this utility model, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the utility model. They are merely used to distinguish components or operations described with the same technical terms and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If a combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0025] This embodiment provides a tray for a plasma cleaner, which enables rapid loading and unloading of wafers. Compared with traditional pull-out trays, it effectively prevents metal debris from falling into the bottom of the process chamber or onto the wafer surface, thus avoiding any impact on the internal environment of the equipment chamber and the cleanliness of the wafer surface, and improving the plasma cleaning effect on the wafer.

[0026] Combination Figures 1 to 3 As shown, the plasma cleaner tray in this embodiment includes a tray body 10 and a clamp 20. The clamp 20 is located inside the tray body 10, and the wafer is located inside the clamp 20. The tray body 10 is placed into the plasma cleaner to achieve plasma cleaning of the wafer.

[0027] In this embodiment, the tray body 10 is a titanium metal structure, and the tray body 10 is provided with a receiving cavity 11. The clamp 20 is installed in the receiving cavity 11, and the clamp 20 is provided with a receiving groove 21 to receive the wafer. The receiving groove 21 has at least one oblique opening 211 on its side to facilitate the removal of the wafer located in the receiving groove 21. Using titanium metal as the tray body 10, titanium metal has an excellent strength-to-weight ratio and is a lightweight material. Compared with steel, titanium has only about half the density of steel, but its strength can be comparable to that of some steels, thus achieving the lightweight of the tray body 10. The oblique opening 211 on the side of the receiving groove 21 can create an oblique groove on the side of the receiving groove 21, so that the operator can use tools such as tweezers to quickly pick up and put in the wafer located in the receiving groove 21, improving efficiency.

[0028] Combination Figure 1 and Figure 2 As shown, the tray body 10 in this embodiment is a square structure, and the receiving cavity 11 is a sunken structure on the tray body 10 with a sunken depth of 1cm-3cm. Using a square structure as the tray body 10 has better adaptability and is more convenient for use with plasma cleaners.

[0029] In this embodiment, the opening angle of the oblique opening 211 is 30°-50°. Within this angle range, it is convenient for the operator to quickly pick up and put in the wafer located in the receiving groove 21, while effectively avoiding damage to the wafer.

[0030] Combination Figure 1 and Figure 3 As shown, the clamp 20 in this embodiment is provided with a fixed base 30. The clamp 20 is separated from the pallet body 10 by the fixed base 30. The fixed base 30 is installed on the back of the clamp 20 by several screws 40. The fixed base 30 separates the clamp 20 from the pallet body 10, effectively reducing the friction between the clamp 20 and the pallet body 10, so as to avoid the clamp 20 from falling debris.

[0031] In this embodiment, the fixed base 30 is a Teflon base, and there are two fixed bases 30 located on both sides of the clamp 20. Teflon bases are used as fixed bases 30. Teflon is a high molecular polymer polymerized with tetrafluoroethylene as monomer. It has excellent heat and cold resistance, and is resistant to acids, alkalis and various organic solvents. It is almost insoluble in all solvents. In addition, polytetrafluoroethylene has the characteristics of high temperature resistance and its coefficient of friction is extremely low. Therefore, it can effectively reduce the friction between the clamp 20 and the tray body 10.

[0032] In this embodiment, the plasma cleaner tray uses titanium metal as the tray body 10 and Teflon base as the fixed base 30. While enabling rapid loading and unloading of wafers, compared with traditional pull-out trays, it effectively prevents metal debris particles from falling into the bottom of the process chamber or the wafer surface, thus avoiding any impact on the internal environment of the equipment chamber and the cleanliness of the wafer surface, and improving the plasma cleaning effect on the wafer.

[0033] While the present invention has been described above with reference to various embodiments, it should be understood that many changes and modifications can be made without departing from the scope of the present invention. That is, the methods, systems, or devices discussed above are merely examples. Various configurations can be appropriately omitted, substituted, or added to various processes or components. For example, in alternative configurations, methods can be performed in a different order than described, and / or various stages can be added, omitted, and / or combined. Moreover, features described with respect to certain configurations can be combined in various other configurations. Different aspects and elements of the configuration can be combined in a similar manner. Furthermore, as technology develops, many elements are merely examples and do not limit the scope of this disclosure or the claims.

[0034] Specific details are provided in the specification to offer a thorough understanding of exemplary configurations, including implementations. However, configurations can be practiced without these specific details; for example, well-known circuits, processes, algorithms, structures, and techniques have been shown without unnecessary detail to avoid obscuring the configuration. This description provides only exemplary configurations and does not limit the scope, applicability, or configuration of the claims. Rather, the foregoing description of the configurations will provide those skilled in the art with an enabling description for implementing the described techniques. Various changes can be made to the function and arrangement of the elements without departing from the spirit or scope of this disclosure.

[0035] Furthermore, although each operation can be described as a sequential process, many operations can be executed in parallel or simultaneously. Additionally, the order of operations can be rearranged. A process may have additional steps. Moreover, examples of methods can be implemented using hardware, software, firmware, middleware, code, hardware description languages, or any combination thereof. When implemented in software, firmware, middleware, or code, the program code or code segments used to perform the necessary tasks can be stored in a non-transitory computer-readable medium such as a storage medium and executed by a processor.

[0036] In summary, the above detailed description is intended to be illustrative rather than restrictive, and it should be understood that the claims (including all equivalents) are intended to define the spirit and scope of this invention. These embodiments should be understood as illustrative only and not as limiting the scope of protection of this invention. After reading the description of this invention, those skilled in the art can make various alterations or modifications to this invention, and these equivalent changes and modifications also fall within the scope defined by the claims of this invention.

Claims

1. A tray for a plasma cleaner, characterized in that, include The tray body (10) is a titanium metal structure and has a receiving cavity (11) on it; A clamp (20) is installed in the receiving cavity (11), and the clamp (20) is provided with a receiving groove (21) to receive the wafer. The receiving groove (21) has at least one oblique opening (211) on its side to facilitate the removal of the wafer located in the receiving groove (21). The opening angle of the oblique opening (211) is 30°-50°.

2. The tray for a plasma cleaner according to claim 1, characterized in that, The tray body (10) is a square structure.

3. The tray for a plasma cleaner according to claim 1, characterized in that, The receiving cavity (11) is a sunken structure on the tray body (10), and its sunken depth is 1cm-3cm.

4. A tray for a plasma cleaner according to claim 1, characterized in that, The clamp (20) is provided with a fixed base (30), and the clamp (20) is separated from the tray body (10) by the fixed base (30).

5. A tray for a plasma cleaner according to claim 4, characterized in that, The fixed base (30) is mounted on the back of the clamp (20) by a number of screws (40).

6. A tray for a plasma cleaner according to claim 4, characterized in that, The fixed base (30) is a Teflon base.

7. A tray for a plasma cleaner according to claim 6, characterized in that, There are two fixed base supports (30), located on both sides of the clamp (20).

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