High-vacuum eutectic reflow soldering furnace

Abstract

The utility model discloses a high vacuum eutectic reflow soldering furnace, which comprises a furnace body, a low vacuum system and a high vacuum system, the furnace body is communicated with the high vacuum system, the high vacuum system comprises a high vacuum pipeline, the high vacuum pipeline is connected with a high vacuum gate valve and a molecular pump, and the molecular pump is communicated with the low vacuum system; the low vacuum system comprises a low vacuum pipeline, the low vacuum pipeline is sequentially connected with an exhaust one-way valve, a second low vacuum gauge and a third vacuum baffle valve, the third vacuum baffle valve is communicated with the vacuum pump, and one end, far away from the vacuum pump, of the low vacuum pipeline is communicated with the molecular pump. According to the high-vacuum eutectic reflow soldering furnace, the furnace body can be in a high-vacuum environment under the action of the molecular pump, oxygen and other oxidizing gases hardly exist in the high-vacuum environment, and products and solder can be effectively prevented from being oxidized.

Description

Technical Field

[0001] This utility model belongs to the technical field of vacuum eutectic reflow ovens, specifically relating to a high-vacuum eutectic reflow oven. Background Technology

[0002] As semiconductor technology advances towards smaller sizes and higher integration, the requirements for chip packaging and soldering quality are extremely high. Traditional soldering techniques in atmospheric environments are prone to oxidation and voids, affecting chip performance and reliability. While low-vacuum environments can remove some air bubbles, many remain, resulting in a relatively high soldering void rate. Furthermore, low vacuum environments still contain a certain amount of oxidizing gases such as oxygen, posing a risk of oxidation to the product and solder during the soldering process. Soldering in low-vacuum environments also easily leads to solder paste splattering and the formation of solder balls.

[0003] For example, in the manufacturing of 5G communication chips and artificial intelligence chips, a vacuum eutectic reflow oven is required to provide a high vacuum environment, which, together with a molecular pump, enables oxidation-free and low-voidity welding, ensuring a high-quality connection between the chip and the packaging substrate. Utility Model Content

[0004] To address the aforementioned technical problems in the existing technology, this utility model provides a high-vacuum eutectic reflow oven. Under the action of a molecular pump, the oven body can be placed in a high-vacuum environment. In a high-vacuum environment, there are almost no oxidizing gases such as oxygen, which can effectively prevent the product and solder from being oxidized.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] A high-vacuum eutectic reflow oven includes an oven body, a low-vacuum system, and a high-vacuum system. The oven body is connected to the high-vacuum system. The high-vacuum system includes a high-vacuum pipeline. The high-vacuum pipeline is connected to a high-vacuum gate valve and a molecular pump. The molecular pump is connected to the low-vacuum system.

[0007] The low vacuum system includes a low vacuum pipeline, which is sequentially connected to an exhaust check valve, a second low vacuum gauge, and a third vacuum baffle valve. The third vacuum baffle valve is connected to a vacuum pump, and the end of the low vacuum pipeline away from the vacuum pump is connected to the molecular pump.

[0008] Furthermore, the low vacuum pipeline is also connected to a water cooling system, which includes a water cooling pipeline, and the end of the water cooling pipeline is connected to a first vacuum baffle valve.

[0009] Furthermore, the furnace body is also connected to a pressure detection system, which includes a pressure detection pipeline connected to a pressure relief valve, a positive pressure detector, and a first low vacuum gauge. The pressure detection pipeline is connected to the first vacuum baffle valve of the water-cooling pipeline.

[0010] Furthermore, the molecular pump is connected to a second vacuum baffle valve, which is connected to the end of the water-cooling pipeline away from the first vacuum baffle valve.

[0011] Furthermore, a water-cooled flange is connected to the lower part of the furnace body, the pressure detection system is connected to the side of the water-cooled flange, and a high vacuum gauge is also connected to the water-cooled flange.

[0012] Compared with existing technologies, the beneficial effects of this solution are:

[0013] 1. The high-vacuum eutectic reflow oven of this utility model can be kept in a high-vacuum environment under the action of a molecular pump. In a high-vacuum environment, there are almost no oxidizing gases such as oxygen, which can effectively prevent the product and solder from being oxidized. The high-vacuum environment makes it easier for gases and impurities in the solder to escape. The high-vacuum eutectic reflow oven can introduce reducing gases to enhance the wettability of the solder, allowing the solder to spread better on the welding surface and form a good weld joint. By utilizing the changing vacuum degree, large air bubbles can be gradually moved to the outer edge of the solder pad, effectively preventing spatter from the solder joint due to air bubble rupture during the welding process.

[0014] 2. Secondly, the high-vacuum eutectic reflow oven of this utility model... 高真空环境最大限度地减少了氧气等氧化性气体的存在，能有效防止焊接过程中金属表面和焊料的氧化，在高真空和适当的气体保护下，无需使用助焊剂即可实现良好的焊接效 果，降低了后续清洗工艺的成本和难度，减少产品污染，优化焊料与焊接表面的相互作用，使焊料能够更均匀地铺展在焊接表面，加装了分子泵后设备炉体真空能够达到≤5×10- 5Pa。 Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the high-vacuum eutectic reflow oven structure of this utility model;

[0016] Figure 2 This is a front view of a high-vacuum eutectic reflow oven.

[0017] The reference numerals in the attached drawings are as follows: Furnace body 1, Water-cooled flange 11, High vacuum gauge 12, Low vacuum system 2, Low vacuum pipeline 21, Exhaust check valve 22, Second low vacuum gauge 23, Third vacuum baffle valve 24, High vacuum system 3, High vacuum pipeline 31, High vacuum gate valve 32, Molecular pump 33, Second vacuum baffle valve 34, Water cooling system 4, Water cooling pipeline 41, Cooling water inlet 411, Cooling water outlet 412, First vacuum baffle valve 42, Pressure detection system 5, Pressure detection pipeline 51, Pressure relief valve 52, Positive pressure detector 53, First low vacuum gauge 54. Detailed Implementation

[0018] The present invention will now be described in further detail with reference to the accompanying drawings.

[0019] A high-vacuum eutectic reflow oven, such as Figure 1 and Figure 2 As shown, it includes a furnace body 1, a low vacuum system 2 and a high vacuum system 3. The furnace body 1 is connected to the high vacuum system 3. The high vacuum system 3 includes a high vacuum pipeline 31. The high vacuum pipeline 31 is connected to a high vacuum gate valve 32 and a molecular pump 33. The molecular pump 33 is connected to the low vacuum system 2.

[0020] The low vacuum system 2 includes a low vacuum pipeline 21, which is sequentially connected to an exhaust check valve 22, a second low vacuum gauge 23, and a third vacuum baffle valve 24. The third vacuum baffle valve 24 is connected to a vacuum pump, and the end of the low vacuum pipeline 21 away from the vacuum pump is connected to the molecular pump 33.

[0021] 本实施例中，低真空系统2和高真空系统3独立工作，低真空系统2作用：一是可以保证高真空共晶回流焊炉设备低真空状态正常使用，二是可以使腔体真空能达到5Pa,保证分子泵 33 能够正常使用。高真空系统3作用：使炉体1真空能够达到≤5×10-5Pa。利用真空泵可以为分子泵33的提供开启条件，排气单向阀22的作用是炉体1充入氮气后使其自动排气。 本实施例的真空规(Vacuum Gauge),又称真空计,是测量真空度或气压的仪器。一般利用不同气压下的某种物理效应的变化进行气压的测量。真空规主要部件为热阴极，其工 作时所产生的热发射电子会将气体电离，此离子流正比于气体分子数密度，当其它所有参数包括温度恒定时，离子流的大小便和气压成正比，通过测量离子流就可以得到气压值。

[0022] This utility model's high-vacuum eutectic reflow oven, under the action of molecular pump 33, can keep the furnace body 1 in a high-vacuum environment. In a high-vacuum environment, there are almost no oxidizing gases such as oxygen, which can effectively prevent the product and solder from being oxidized. The high-vacuum environment makes it easier for gases and impurities in the solder to escape. The high-vacuum eutectic reflow oven can introduce reducing gases to enhance the wettability of the solder, allowing the solder to spread better on the welding surface and form a good weld joint. By utilizing the changing vacuum degree, large air bubbles can be gradually moved to the outer edge of the solder pad, effectively preventing spatter from the solder joint due to air bubble rupture during the welding process.

[0023] 其次，本实用新型的高真空共晶回流焊炉，高真空环境最大限度地减少了氧气等氧化性气体的存在，能有效防止焊接过程中金属表面和焊料的氧化，在高真空和适当的气体保护下， 无需使用助焊剂即可实现良好的焊接效果，降低了后续清洗工艺的成本和难度，减少产品污染，优化焊料与焊接表面的相互作用，使焊料能够更均匀地铺展在焊接表面，加装了分子 泵33（高真空泵）后设备炉体1真空能够达到≤5×10-5Pa。

[0024] Furthermore, the low-vacuum pipeline 21 is also connected to a water-cooling system 4, which includes a water-cooling pipeline 41, the end of which is connected to a first vacuum baffle valve 42. When the vacuum pump is drawing a vacuum, the gas inside the furnace body 1 is at a high temperature. The function of the water-cooling system 4 is to cool the high-temperature gas inside the furnace body 1 when the vacuum pump is drawing a vacuum.

[0025] The working principle of a vacuum baffle valve is that the valve plate achieves a seal by moving up and down through the valve stem. The transmission components that drive the valve stem can be manual, manual / electric, or pneumatic. This embodiment uses a cylinder-driven valve plate structure to achieve the seal.

[0026] The water-cooled pipeline 41 has a cooling water inlet 411 and a cooling water outlet 412. The function of the water-cooled pipeline 41 is to cool the low vacuum pipeline 21, protect the sealing ring on the low vacuum pipeline 21, and reduce the gas temperature when the furnace body 1 is evacuated.

[0027] Furthermore, the furnace body 1 is also connected to a pressure detection system 5. The pressure detection system 5 includes a pressure detection pipeline 51, which is connected to a pressure relief valve 52, a positive pressure detector 53, and a first low vacuum gauge 54. The pressure detection pipeline 51 is connected to the first vacuum baffle valve 42 of the water-cooling pipeline 41. The pressure relief valve 52 is designed to ensure that the positive pressure inside the furnace body 1 does not exceed a set value. The positive pressure detector 53 is designed to detect the pressure inside the furnace body 1 and output a signal to determine whether the furnace body 1 should automatically open.

[0028] Furthermore, the molecular pump 33 is connected to a second vacuum baffle valve 34, which is connected to the end of the water-cooled pipeline 41 away from the first vacuum baffle valve 42.

[0029] Furthermore, a water-cooled flange 11 is connected to the lower part of the furnace body 1, and the pressure detection system 5 is connected to the side of the water-cooled flange 11. A high vacuum gauge 12 is also connected to the water-cooled flange 11.

[0030] The function of the water-cooled flange 11 is to cool the high-vacuum pipeline 31, protect the molecular pump 33 and the high-vacuum gate valve 32, and reduce the gas temperature during pumping.

[0031] The working process of the high-vacuum eutectic reflow oven of this utility model is as follows:

[0032] S1. First, start the molecular pump 33 for initialization, allowing the molecular pump 33 to rotate at high speed, and wait for it to be connected to the furnace body 1.

[0033] S2. Start the vacuum pump, open the third vacuum baffle valve 24 and the first vacuum baffle valve 42, start evacuating the vacuum inside the furnace body 1, wait for the value displayed by the second low vacuum gauge 23 to be lower than 5Pa, and then open the second vacuum baffle valve 34.

[0034] S3 、第一低真空规54显示数值低于5Pa，打开高真空插板阀32，同时关闭第一真空挡板阀42，分子泵33开始抽炉体1真空，极限真空值能达到≤5×10-5Pa，通过高真空规12读取 数值；

[0035] S4. After the furnace body 1 has been evacuated, the high vacuum gate valve 32 should be closed first, and then the second low vacuum gauge 23 should be closed after it drops below 5 Pa. At this time, the molecular pump 33 should be turned off.

[0036] Finally, it should be noted that in the description of this utility model, the terms "vertical," "upper," "lower," "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0037] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0038] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high-vacuum eutectic reflow oven, characterized in that: The system includes a furnace body, a low vacuum system, and a high vacuum system. The furnace body is connected to the high vacuum system. The high vacuum system includes a high vacuum pipeline, which is connected to a high vacuum gate valve and a molecular pump. The molecular pump is connected to the low vacuum system. The low vacuum system includes a low vacuum pipeline, which is sequentially connected to an exhaust check valve, a second low vacuum gauge, and a third vacuum baffle valve. The third vacuum baffle valve is connected to a vacuum pump, and the end of the low vacuum pipeline away from the vacuum pump is connected to the molecular pump.

2. The high-vacuum eutectic reflow oven according to claim 1, characterized in that: The low vacuum pipeline is also connected to a water cooling system, which includes a water cooling pipeline and a first vacuum baffle valve at the end of the water cooling pipeline.

3. A high-vacuum eutectic reflow oven according to claim 2, characterized in that: The furnace body is also connected to a pressure detection system, which includes a pressure detection pipeline connected to a pressure relief valve, a positive pressure detector, and a first low vacuum gauge. The pressure detection pipeline is connected to the first vacuum baffle valve of the water-cooled pipeline.

4. A high-vacuum eutectic reflow oven according to claim 3, characterized in that: The molecular pump is connected to a second vacuum baffle valve, which is connected to the end of the water-cooled pipeline away from the first vacuum baffle valve.

5. A high-vacuum eutectic reflow oven according to claim 4, characterized in that: The lower part of the furnace body is connected to a water-cooled flange, the side of which is connected to the pressure detection system, and a high vacuum gauge is also connected to the water-cooled flange.

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