Smart phone mainboard welding and clamping device

Abstract

The utility model discloses an intelligent mobile phone mainboard welding clamping device which comprises a base, a guide rod is fixedly connected to the top of the base, a sliding plate is slidably connected to the outer side of the guide rod, a first positioning bolt is in threaded connection with one side in the sliding plate, and a fixing base is fixedly connected to the top of the base and located at one end of the guide rod. A second stand column and a first stand column are fixedly connected to the tops of the fixed seat and the sliding plate correspondingly; a second rotating shaft and a first rotating shaft are rotationally connected into the second stand column and the first stand column correspondingly; clamping plates are installed at the opposite ends of the first rotating shaft and the second rotating shaft correspondingly, and U-shaped positioning grooves are formed in the clamping plates correspondingly. By means of the structure, the welding device can adapt to main boards of different sizes and various specifications, higher flexibility is provided, the inclination angle of the main board can be adjusted, the welding point of the main board can be conveniently located at the optimal welding position, welding personnel can efficiently and accurately complete welding work while keeping the comfortable posture, and the welding efficiency is improved. Therefore, the welding quality and efficiency are improved.

Description

Technical Field

[0001] This utility model relates to the field of mobile phone motherboard processing technology, and in particular to a smartphone motherboard welding clamping device. Background Technology

[0002] With the rapid development of smartphone technology, the complexity and integration of smartphone motherboards are constantly increasing, leading to increasingly stringent requirements for precision and stability in the soldering process. To improve soldering efficiency and quality, a soldering clamping device is needed to accurately position and securely hold the motherboard.

[0003] In the prior art, a search revealed a Chinese patent entitled "A Fixing Device for Welding Mobile Phone Motherboards," application number "202120778208.1." This patent mainly includes a motherboard welding fixing device body and a servo motor. A support column is mounted at the top of the motherboard welding fixing device body, and a servo motor is installed inside the body. The output shaft of the servo motor is connected to a first ordinary gear, and a support base is mounted at the bottom of a second threaded rod. While this utility model allows for height adjustment of the motherboard welding fixing device body and can clamp and fix the mobile phone motherboard using clamping blocks with equal clamping force at both ends, the overall structure of the servo motor, first threaded rod, second threaded rod, internal threaded sleeve, and gears is relatively complex, resulting in high operating costs. Furthermore, the fixed distance between the clamping blocks makes it difficult to adapt to motherboards of different specifications, lacking flexibility and adaptability. Additionally, placing the motherboard on the welding table during welding requires the welder to bend over for extended periods, leading to fatigue and hindering a more comfortable welding posture, resulting in poor performance. This invention provides a smartphone motherboard soldering clamping device to solve the problems mentioned in the background art. Utility Model Content

[0004] The purpose of this invention is to provide a smartphone motherboard welding clamping device that can adapt to motherboards of different sizes and specifications, providing greater flexibility. It can also adjust the tilt angle of the motherboard to place the welding points in the optimal welding position, allowing welding personnel to complete the welding work efficiently and accurately while maintaining a comfortable posture, thereby improving welding quality and efficiency.

[0005] To achieve the above objectives, a smartphone motherboard welding clamping device is provided, including a base, a guide rod fixedly connected to the top of the base, a slide plate slidably connected to the outside of the guide rod, a first positioning bolt threadedly connected to one side of the slide plate, a fixed seat fixedly connected to the top of the base and one end of the guide rod, a second column and a first column fixedly connected to the top of the fixed seat and the slide plate respectively, and a second rotating shaft and a first rotating shaft rotatably connected inside the second column and the first column respectively;

[0006] Both the first and second rotating shafts have clamping plates installed at their opposite ends. Each clamping plate has a U-shaped positioning groove. The first column has an arc-shaped positioning plate inside and on one side of the first rotating shaft. The first column has a second positioning bolt threadedly connected to the positioning plate inside and on one side of the positioning plate. The second positioning bolt is rotatably connected to the positioning plate.

[0007] According to the aforementioned smartphone motherboard welding clamping device, the positioning grooves inside the two clamping plates are each equally spaced multiple, and the opening sizes of the positioning grooves are different.

[0008] According to the aforementioned smartphone motherboard welding clamping device, a limiting plate and a sliding rod are slidably connected inside the first rotating shaft. The sliding rod is fixedly connected between the limiting plate and the clamping plate, and a spring is sleeved on the outside of the sliding rod. The clamping plate near the second rotating shaft is fixedly connected to the second rotating shaft.

[0009] According to the aforementioned smartphone motherboard welding clamping device, multiple anti-slip seats are evenly fixedly connected to the bottom of the base.

[0010] According to the aforementioned smartphone motherboard welding clamping device, each of the positioning grooves is fixedly connected with a soft pad.

[0011] According to the aforementioned smartphone motherboard welding clamping device, an anti-slip pad is fixedly connected to the side of the positioning plate near the first rotating shaft, and the positioning plate is slidably connected to the inner surface of the first column.

[0012] This utility model has the following beneficial effects:

[0013] 1. Compared with the prior art, this smartphone motherboard welding clamping device has a simple overall structure. By setting a slider and a first positioning bolt, the distance between the clamping plates can be easily adjusted to adapt to smartphone motherboards of different sizes. In addition, the clamping plates are provided with positioning grooves of various specifications to adapt to motherboards of various sizes, providing greater flexibility.

[0014] 2. Compared with the prior art, the tilt angle of the clamping plate of this smartphone motherboard welding clamping device can be adjusted by rotating the first and second rotating shafts. Adjusting the tilt angle of the motherboard makes it easier to place the welding points of the motherboard in the optimal welding position. Welders can complete the welding work efficiently and accurately while maintaining a comfortable posture, thereby improving welding quality and efficiency.

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0017] Figure 1 This is a schematic diagram of the first overall structure of a smartphone motherboard welding clamping device according to the present invention;

[0018] Figure 2 This is a schematic diagram of the second overall structure of a smartphone motherboard welding clamping device according to the present invention;

[0019] Figure 3 This is a schematic diagram of the slide plate, first column, and first positioning bolt structure of a smartphone motherboard welding clamping device according to the present invention;

[0020] Figure 4 This is a schematic diagram of the first column, clamping plate, first rotating shaft, positioning groove and soft pad structure of a smartphone motherboard welding clamping device according to the present invention.

[0021] Figure 5 This utility model relates to a smartphone motherboard welding clamping device. Figure 4 First sectional view of the structure;

[0022] Figure 6 This utility model relates to a smartphone motherboard welding clamping device. Figure 4 Second sectional view of the structure.

[0023] Legend:

[0024] 1. Base; 2. Guide rod; 3. Slide plate; 4. First column; 5. Fixing seat; 6. Second column; 7. First pivot; 8. First positioning bolt; 9. Clamping plate; 10. Anti-slip seat; 11. Second positioning bolt; 12. Positioning groove; 13. Soft pad; 14. Second pivot; 15. Slide rod; 16. Limiting plate; 17. Spring; 18. Positioning plate; 19. Anti-slip pad. Detailed Implementation

[0025] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0026] Reference Figure 1-6 This utility model discloses a smartphone motherboard welding clamping device, comprising a base 1, a guide rod 2 fixedly connected to the top of the base 1, a slide plate 3 slidably connected to the outer side of the guide rod 2, and a first positioning bolt 8 threadedly connected to one side of the slide plate 3 to achieve lateral position adjustment of the slide plate 3. A fixing seat 5 is fixedly connected to the top of the base 1 and one end of the guide rod 2. A second column 6 and a first column 4 are fixedly connected to the top of the fixing seat 5 and the slide plate 3, respectively. A second rotating shaft 14 and a first rotating shaft 7 are rotatably connected inside the second column 6 and the first column 4, respectively. Clamping plates 9 are installed at opposite ends of the first rotating shaft 7 and the second rotating shaft 14 for clamping the smartphone motherboard. Each clamping plate 9 has a U-shaped positioning groove 12 inside. Multiple positioning grooves 12 are evenly spaced inside the two clamping plates 9, and the opening size of the positioning grooves 12 is different.

[0027] The guide rod 2 allows the slide plate 3 to slide smoothly on it, thereby controlling the distance between the clamping plates 9. By adjusting the first positioning bolt 8, the operator can easily set the position of the slide plate 3 to accommodate smartphone motherboards of different sizes. The clamping plates 9 are equipped with positioning grooves 12 to effectively fix the motherboard, and different sizes of positioning grooves 12 can accommodate various motherboard sizes, providing greater flexibility. Furthermore, the tilt angle of the clamping plates 9 can be adjusted by rotating the first rotating shaft 7 and the second rotating shaft 14, facilitating the adjustment of the motherboard's tilt angle to ensure the solder joints are in the optimal soldering position. This allows the welder to maintain a comfortable posture while efficiently and accurately completing the soldering work, improving soldering quality and efficiency.

[0028] An arc-shaped positioning plate 18 is provided inside the first column 4 and on one side of the first rotating shaft 7. A second positioning bolt 11 is threadedly connected inside the first column 4 and on one side of the positioning plate 18. The second positioning bolt 11 is rotatably connected to the positioning plate 18.

[0029] After adjusting the tilt angle of the motherboard, rotate the second positioning bolt 11 to push the positioning plate 18 to fit tightly against the first rotating shaft 7, thereby fixing the rotation angle of the first rotating shaft 7 to ensure the stability of the motherboard during the welding process.

[0030] The first rotating shaft 7 is internally connected to a limiting plate 16 and a sliding rod 15. The sliding rod 15 is fixedly connected between the limiting plate 16 and the clamping plate 9, and a spring 17 is sleeved on the outside of the sliding rod 15. The clamping plate 9 near the second rotating shaft 14 is fixedly connected to the second rotating shaft 14.

[0031] During the clamping process, the cooperation between the limiting plate 16 and the slide bar 15 ensures the stability of the clamping plate 9 during clamping, while the spring 17 provides appropriate rebound force to avoid excessive clamping of the main board and damage.

[0032] Multiple anti-slip seats 10 are evenly fixedly connected to the bottom of the base 1 to increase the stability of the entire clamping device during use. Soft pads 13, which may be made of rubber, are fixedly connected inside the positioning grooves 12 to prevent damage to the main board during clamping and to increase the tightness of the fit between the main board and the positioning grooves 12. Anti-slip pads 19 are fixedly connected to the side of the positioning plate 18 closest to the first rotating shaft 7 to increase the friction between the positioning plate 18 and the first rotating shaft 7. The positioning plate 18 is also slidably connected to the inner surface of the first column 4 to ensure the stability of the positioning plate 18 during movement.

[0033] Working principle: The guide rod 2 allows the slide plate 3 to slide smoothly on it, thereby controlling the distance between the clamping plates 9. By adjusting the first positioning bolt 8, the operator can easily set the position of the slide plate 3 to accommodate smartphone motherboards of different sizes. The clamping plate 9 is provided with a positioning groove 12, which effectively fixes the motherboard, and different specifications of the positioning groove 12 can accommodate motherboards of various sizes, providing greater flexibility.

[0034] The tilt angle of the clamping plate 9 can be adjusted by rotating the first rotating shaft 7 and the second rotating shaft 14. After adjusting the tilt angle according to the motherboard, rotating the second positioning bolt 11 pushes the positioning plate 18 tightly against the first rotating shaft 7, thereby fixing the rotation angle of the first rotating shaft 7 to ensure the stability of the motherboard during welding. By adjusting the tilt angle of the motherboard, the welding points of the motherboard can be placed in the optimal welding position, allowing the welder to complete the welding work efficiently and accurately while maintaining a comfortable posture, thus improving welding quality and efficiency.

[0035] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A smartphone motherboard soldering clamping device, characterized in that, Includes a base (1), a guide rod (2) is fixedly connected to the top of the base (1), a slide plate (3) is slidably connected to the outside of the guide rod (2), a first positioning bolt (8) is threadedly connected to one side of the slide plate (3), a fixed seat (5) is fixedly connected to the top of the base (1) and one end of the guide rod (2), a second column (6) and a first column (4) are fixedly connected to the top of the fixed seat (5) and the slide plate (3), respectively, and a second rotating shaft (14) and a first rotating shaft (7) are rotatably connected inside the second column (6) and the first column (4), respectively. A clamping plate (9) is installed at one end of the first rotating shaft (7) and the second rotating shaft (14) facing each other. The clamping plate (9) has a U-shaped positioning groove (12) inside. An arc-shaped positioning plate (18) is provided inside the first column (4) and on one side of the first rotating shaft (7). A second positioning bolt (11) is threaded inside the first column (4) and on one side of the positioning plate (18). The second positioning bolt (11) is rotatably connected to the positioning plate (18).

2. The smartphone motherboard welding clamping device according to claim 1, characterized in that, The positioning grooves (12) inside the two clamping plates (9) are all equally spaced and the opening sizes of the positioning grooves (12) are different.

3. The smartphone motherboard welding clamping device according to claim 2, characterized in that, The first rotating shaft (7) has a limiting plate (16) and a slide rod (15) slidably connected inside. The slide rod (15) is fixedly connected between the limiting plate (16) and the clamping plate (9), and a spring (17) is sleeved on the outside of the slide rod (15). The clamping plate (9) near the second rotating shaft (14) is fixedly connected to the second rotating shaft (14).

4. The smartphone motherboard welding clamping device according to claim 3, characterized in that, The base (1) has multiple anti-slip seats (10) evenly fixedly connected to its bottom.

5. A smartphone motherboard welding clamping device according to claim 4, characterized in that, Each of the positioning grooves (12) is fixedly connected with a soft pad (13).

6. The smartphone motherboard welding clamping device according to claim 1, characterized in that, The positioning plate (18) is fixedly connected to an anti-slip pad (19) on the side near the first rotating shaft (7), and the positioning plate (18) is slidably connected to the inner surface of the first column (4).

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