Die cutting device for nanocrystalline film

Abstract

The utility model discloses a nanocrystalline film die cutting device which comprises a working plate and a slitting mechanism, a supporting frame is fixedly installed at the bottom of the working plate, a slitting table is fixedly installed at the top of the working plate, and tensioning mechanisms for tensioning a nanocrystalline film are arranged on the top of the working plate and located on the two sides of the slitting table. A driving mechanism for driving the slitting mechanism to move up and down is arranged at the position, corresponding to the slitting table, of the top of the working plate, and the slitting mechanism is fixedly installed above the driving mechanism. A nanocrystalline film needing die cutting can be placed on the surface of the slitting table through the arrangement of the slitting table, then the arranged tensioning mechanism can enable the nanocrystalline film to be in a tensioning state all the time, and then the driving mechanism drives the slitting mechanism to descend so that the slitting mechanism can make contact with the surface of the nanocrystalline film. And then the die cutting position of the slitting mechanism can be adjusted according to the size of a product needing to be subjected to die cutting, so that the die cutting accuracy can be ensured.

Description

Technical Field

[0001] This utility model relates to the field of nanocrystalline film processing technology, specifically a nanocrystalline film die-cutting device. Background Technology

[0002] Nanocrystalline films are thin film materials composed of nanoscale crystalline particles. Due to their unique physical and chemical properties, these materials have demonstrated significant application value in many high-tech fields.

[0003] After the nanocrystalline film is manufactured, a certain amount of space is usually reserved at its edge. After the nanocrystalline film is manufactured, the waste material at the edge needs to be die-cut and removed. In the existing technology, if the nanocrystalline film is not properly attached or becomes loose when the waste material at the edge is removed, it is very easy to cause damage to the nanocrystalline film. Therefore, we propose a nanocrystalline film die-cutting device. Utility Model Content

[0004] The purpose of this invention is to provide a nanocrystalline film die-cutting device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a nanocrystalline film die-cutting device, comprising a working plate and a slitting mechanism, wherein a support frame is fixedly installed at the bottom of the working plate, a slitting table is fixedly installed at the top of the working plate, a tensioning mechanism for tensioning the nanocrystalline film is provided at the top of the working plate and on both sides of the slitting table, and a driving mechanism for driving the slitting mechanism to move up and down is provided at the top of the working plate and at the position corresponding to the slitting table, wherein the slitting mechanism is fixedly installed above the driving mechanism.

[0006] Furthermore, the tensioning mechanism includes a first mounting frame, a first limiting sleeve, a first limiting rod, a second mounting frame, and a pressure roller. The first mounting frame is fixedly mounted on the top of the working plate. Two sets of first limiting sleeves are fixedly mounted on the top of the first mounting frame. A first limiting rod is slidably connected inside the first limiting sleeve. A second mounting frame is fixedly mounted on the bottom of the first limiting rod. A pressure roller is rotatably mounted on the second mounting frame. A spring is fixedly mounted on the top of the second mounting frame and outside the first limiting rod. The top of the spring is fixedly connected to the first mounting frame.

[0007] Furthermore, the driving mechanism includes a second limiting sleeve, a second limiting rod, a mounting plate, and a driving cylinder. Two sets of second limiting sleeves are fixedly installed on the bottom of the working plate. A second limiting rod is slidably connected inside the second limiting sleeve. A mounting plate is fixedly installed on the bottom of the second limiting rod. A driving cylinder is fixedly installed on the mounting plate. The output end of the driving cylinder is fixedly connected to the working plate.

[0008] Furthermore, the slitting mechanism includes a third mounting bracket, a mounting base, a fixing bracket, and a slitting blade. The third mounting bracket is fixedly mounted on the top of the second limiting rod. Two sets of mounting bases are sleeved on the third mounting bracket. A fixing bracket is fixedly mounted on the bottom of the mounting base. A slitting blade is rotatably connected to the fixing bracket. A threaded sleeve is fixedly mounted on the top of the mounting base. A threaded rod is threadedly connected inside the threaded sleeve. A knob is fixedly connected to the top of the threaded rod.

[0009] Furthermore, a limiting groove is provided at the top of the third mounting bracket, and a limiting block that is slidably connected to the limiting groove is fixedly installed at the top of the inner wall of the mounting base.

[0010] Furthermore, both sides of the slitting table are fixedly connected with arc-shaped transition blocks.

[0011] Compared with the prior art, the present invention has the following advantages: The present invention can place the nanocrystalline film to be die-cut on its surface by setting a slitting table, and the tensioning mechanism can keep the nanocrystalline film in a taut state. Then, the driving mechanism drives the slitting mechanism to descend, so that the slitting mechanism contacts the surface of the nanocrystalline film. Then, the die-cutting position of the slitting mechanism can be adjusted according to the size of the product to be die-cut, thereby ensuring the accuracy of die-cutting. Attached Figure Description

[0012] Figure 1 This is a first perspective structural diagram of the present invention;

[0013] Figure 2 This is a second perspective view of the structure of this utility model;

[0014] Figure 3 This is an enlarged schematic diagram of structure A of this utility model.

[0015] In the diagram: 1. Working plate, 2. Support frame, 3. Cutting table, 4. Tensioning mechanism, 5. Drive mechanism, 6. Cutting mechanism, 7. First mounting frame, 8. First limiting sleeve, 9. First limiting rod, 10. Second mounting frame, 11. Pressure roller, 12. Spring, 13. Second limiting sleeve, 14. Second limiting rod, 15. Mounting plate, 16. Drive cylinder, 17. Third mounting frame, 18. Mounting seat, 19. Fixing frame, 20. Cutting knife, 21. Threaded sleeve, 22. Threaded rod, 23. Knob, 24. Limiting groove, 25. Limiting block, 26. Transition block. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figures 1-3 This utility model provides a technical solution: a nanocrystalline film die-cutting device, including a working plate 1 and a slitting mechanism 6. A support frame 2 is fixedly installed at the bottom of the working plate 1, and a slitting table 3 is fixedly installed at the top of the working plate 1. Tensioning mechanisms 4 for tensioning the nanocrystalline film are provided on the top of the working plate 1 and on both sides of the slitting table 3. A driving mechanism 5 for driving the slitting mechanism 6 to move up and down is provided on the top of the working plate 1 and at the position corresponding to the slitting table 3. The slitting mechanism 6 is fixedly installed above the driving mechanism 5.

[0018] The slitting table 3 allows the nanocrystalline film to be die-cut to be placed on its surface. The tensioning mechanism 4 ensures that the nanocrystalline film remains taut. The drive mechanism 5 then lowers the slitting mechanism 6, bringing it into contact with the surface of the nanocrystalline film. The die-cutting position of the slitting mechanism 6 can then be adjusted according to the size of the product to be die-cut, thus ensuring the accuracy of the die-cutting.

[0019] Please see Figure 1 The tensioning mechanism 4 includes a first mounting frame 7, a first limiting sleeve 8, a first limiting rod 9, a second mounting frame 10, and a pressure roller 11. The first mounting frame 7 is fixedly mounted on the top of the working plate 1. Two sets of first limiting sleeves 8 are fixedly mounted on the top of the first mounting frame 7. The first limiting rod 9 is slidably connected inside the first limiting sleeve 8. The second mounting frame 10 is fixedly mounted on the bottom of the first limiting rod 9. The pressure roller 11 is rotatably mounted on the second mounting frame 10. A spring 12 is fixedly mounted on the top of the second mounting frame 10 and outside the first limiting rod 9. The top of the spring 12 is fixedly connected to the first mounting frame 7.

[0020] First, the nanocrystalline film to be die-cut is passed under the two sets of tensioning mechanisms 4 and connected to the external take-up roller. Then, under the action of the spring 12, the second mounting frame 10 and the pressure roller 11 can exert downward pressure on the nanocrystalline film, so that the nanocrystalline film to be die-cut can be tensioned, so that the nanocrystalline film to be die-cut can always be attached to the top of the slitting table 3.

[0021] Please see Figure 1 , Figure 2 and Figure 3The slitting mechanism 6 includes a third mounting frame 17, a mounting base 18, a fixing frame 19, and a slitting blade 20. The third mounting frame 17 is fixedly mounted on the top of the second limiting rod 14. Two sets of mounting bases 18 are sleeved on the third mounting frame 17. The fixing frame 19 is fixedly mounted on the bottom of the mounting base 18. The slitting blade 20 is rotatably connected to the fixing frame 19. A threaded sleeve 21 is fixedly mounted on the top of the mounting base 18. A threaded rod 22 is threadedly connected inside the threaded sleeve 21. A knob 23 is fixedly connected to the top of the threaded rod 22.

[0022] The position of the slitting blade 20 is adjusted according to the required size of the nanocrystalline film to be die-cut. When adjusting the position of the slitting blade 20, the knob 23 and the threaded rod 22 are rotated to move the threaded rod 22 away from the inside of the mounting base 18. Then the mounting base 18 can be pushed to move left and right along the third mounting bracket 17. This allows the position of the slitting blade 20 to be adjusted. After the adjustment is completed, the threaded rod 22 is tightened again to fix the position of the slitting blade 20.

[0023] Please see Figure 1 , Figure 2 and Figure 3 The driving mechanism 5 includes a second limiting sleeve 13, a second limiting rod 14, a mounting plate 15, and a driving cylinder 16. Two sets of second limiting sleeves 13 are fixedly installed at the bottom of the working plate 1. The second limiting rod 14 is slidably connected inside the second limiting sleeve 13. The mounting plate 15 is fixedly installed at the bottom of the second limiting rod 14. The driving cylinder 16 is fixedly installed on the mounting plate 15. The output end of the driving cylinder 16 is fixedly connected to the working plate 1.

[0024] Once the slitting blade 20 is positioned, the drive cylinder 16 operates, causing the mounting plate 15 and the second limiting rod 14 to move downwards along the second limiting sleeve 13. This allows the slitting blade 20 to contact the nanocrystalline film, thus completing the slitting step when the nanocrystalline film is wound up.

[0025] Please see Figure 1 and Figure 3 The top of the third mounting bracket 17 is provided with a limiting groove 24, and the top of the inner wall of the mounting base 18 is fixedly installed with a limiting block 25 that is slidably connected to the limiting groove 24.

[0026] The limiting groove 24 and the limiting block 25 can limit the mounting base 18, so that the slitting blade 20 will not be deflected when the mounting base 18 drives the slitting blade 20 to move.

[0027] Please see Figure 1Both sides of the slitting table 3 are fixedly connected with arc-shaped transition blocks 26. The arc-shaped transition blocks 26 can prevent the nanocrystalline film from directly contacting the edge of the slitting table 3 during winding, thus preventing scratches and damage.

[0028] In use, first, the nanocrystalline film to be die-cut is passed under the two sets of tensioning mechanisms 4 and connected to the external take-up roller. Then, under the action of spring 12, the second mounting bracket 10 and the pressure roller 11 can exert downward pressure on the nanocrystalline film, thus tensioning the nanocrystalline film to be die-cut. This ensures that the nanocrystalline film to be die-cut is always in contact with the top of the slitting table 3. The position of the slitting blade 20 is adjusted according to the required size of the nanocrystalline film to be die-cut. When adjusting the position of the slitting blade 20, the knob 23 and the threaded rod 22 are rotated to adjust the threaded rod 2... 2. Move away from the interior of the mounting base 18, and then push the mounting base 18 to move left and right along the third mounting bracket 17. This will adjust the position of the slitting blade 20. After the adjustment is completed, tighten the threaded rod 22 again to fix the position of the slitting blade 20. After the position of the slitting blade 20 is adjusted, the drive cylinder 16 operates. The drive cylinder 16 drives the mounting plate 15 and the second limit rod 14 to move downward along the second limit sleeve 13. This will allow the slitting blade 20 to contact the nanocrystalline film, thus completing the slitting step when the nanocrystalline film is rolled up.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A nanocrystalline film die-cutting device, comprising a working plate (1) and a slitting mechanism (6), wherein a support frame (2) is fixedly installed at the bottom of the working plate (1), characterized in that: A slitting table (3) is fixedly installed on the top of the working plate (1). A tensioning mechanism (4) for tensioning the nanocrystalline film is provided on the top of the working plate (1) and on both sides of the slitting table (3). A driving mechanism (5) for driving the slitting mechanism (6) to move up and down is provided on the top of the working plate (1) and at the position corresponding to the slitting table (3). The slitting mechanism (6) is fixedly installed above the driving mechanism (5). The tensioning mechanism (4) includes a first mounting frame (7), a first limiting sleeve (8), a first limiting rod (9), a second mounting frame (10), and a pressure roller (11). The first mounting frame (7) is fixedly mounted on the top of the working plate (1). Two sets of first limiting sleeves (8) are fixedly mounted on the top of the first mounting frame (7). The first limiting rod (9) is slidably connected inside the first limiting sleeve (8). The second mounting frame (10) is fixedly mounted at the bottom of the first limiting rod (9). The pressure roller (11) is rotatably mounted on the second mounting frame (10). A spring (12) is fixedly mounted on the top of the second mounting frame (10) and outside the first limiting rod (9). The top of the spring (12) is fixedly connected to the first mounting frame (7). The driving mechanism (5) includes a second limiting sleeve (13), a second limiting rod (14), a mounting plate (15), and a driving cylinder (16). Two sets of second limiting sleeves (13) are fixedly installed at the bottom of the working plate (1). The second limiting rod (14) is slidably connected inside the second limiting sleeve (13). The mounting plate (15) is fixedly installed at the bottom of the second limiting rod (14). The driving cylinder (16) is fixedly installed on the mounting plate (15). The output end of the driving cylinder (16) is fixedly connected to the working plate (1). The slitting mechanism (6) includes a third mounting bracket (17), a mounting base (18), a fixing bracket (19), and a slitting blade (20). The third mounting bracket (17) is fixedly mounted on the top of the second limiting rod (14). Two sets of mounting bases (18) are sleeved on the third mounting bracket (17). The fixing bracket (19) is fixedly mounted on the bottom of the mounting base (18). The slitting blade (20) is rotatably connected to the fixing bracket (19). A threaded sleeve (21) is fixedly mounted on the top of the mounting base (18). A threaded rod (22) is threadedly connected inside the threaded sleeve (21). A knob (23) is fixedly connected to the top of the threaded rod (22).

2. The nanocrystalline film die-cutting device according to claim 1, characterized in that: The top of the third mounting bracket (17) has a limiting groove (24), and the top of the inner wall of the mounting base (18) is fixedly installed with a limiting block (25) that is slidably connected to the limiting groove (24).

3. The nanocrystalline film die-cutting device according to claim 2, characterized in that: Both sides of the slitting table (3) are fixedly connected to transition blocks (26) that are set in an arc shape.

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