Heat dissipation tray base

Abstract

The utility model discloses a heat dissipation tray base which comprises a loading cavity and a base body, the loading cavity is provided with a planar placing area, the center of the placing area is provided with a cylindrical protruding part, the bottom of the base body is provided with a blind hole, and the blind hole is provided with a through hole. The base body is arranged in the containing area, the protruding part is inserted into the blind hole so that the base body can be rotationally connected with the protruding part, an annular groove and a plurality of straight grooves are formed in the upper surface of the base body, the annular groove and the base body are coaxial, the straight grooves intersect at the axis of the base body and evenly divide the upper surface of the base body, and the base body is arranged in the containing area. And the annular groove is communicated with the straight groove. The heat dissipation tray base is easy to rotate, high in cooling efficiency and convenient to wipe or clean, the service life of a sealing ring does not need to be considered after the sealing ring is not used, the situation that particles are generated due to aging of the sealing ring is eradicated, the wafer manufacturing technological process is effectively improved, and the production efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of chemical vapor deposition technology, and in particular to a heat dissipation tray base. Background Technology

[0002] With the development of technology, high-temperature CVD applications are becoming increasingly common. Silicon carbide epitaxial growth is one such high-temperature CVD technology. Its operating temperature can reach 1600℃ or even higher. As the temperature rises, cooling efficiency becomes particularly critical, because for enterprises, time is money.

[0003] Most of the process flow involves loading wafers into a loading chamber. A vacuum robot inside the transfer chamber retrieves the wafer from the loading chamber and places it into the reaction chamber for growth. After growth is complete, the wafer is removed from the reaction chamber and placed back into the loading chamber, where it is then removed by the operator to proceed to the next step. When the loading chamber is opened, airborne particles can easily enter. If these particles adhere to the substrate, they can easily cause defects during epitaxial growth as they enter the reaction chamber. Furthermore, the wafer exiting the reaction chamber may also carry particles, thus affecting the growth of the next wafer.

[0004] The base 2' within the loading cavity 1' needs to be rotated during use to position the wafer 6 placed on it, as shown in the attached diagram. Figure 1 As shown, when placing the common base 2', it is necessary to locate the positioning edge 11' inside the loading cavity 1'. Since the base 2' is a moving part, particles often get trapped in the gaps. The positioning method for the base 2' is limited by the positioning edge 11'. The bushing 3' is placed inside the base 2' and the loading cavity 1', and the bushing 3' can rotate relative to the base 2' and the loading cavity 1'. The sealing ring 4' contacts the base 2' and is placed inside the base 2'. The screw 5' presses down on the sealing ring 4' and locks it onto the loading cavity 1'. This connection method has significant friction, making it difficult for the base to rotate. Each time the gaps under the base are cleaned, the screws need to be removed, which is very troublesome. As the number of transfers increases, the sealing ring is prone to aging due to sudden temperature changes, producing particles. Utility Model Content

[0005] To address the aforementioned technical problems, the purpose of this utility model is to provide a heat dissipation tray base that improves the cooling efficiency of the base and reduces particle generation.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A heat dissipation tray base includes a loading cavity and a base body. The loading cavity has a planar placement area, and a cylindrical protrusion is provided at the center of the placement area. The bottom of the base body has a blind hole. The base body is placed in the placement area and the protrusion is inserted into the blind hole, so that the base body and the protrusion are rotatably connected. The upper surface of the base body has an annular groove and a plurality of straight grooves. The annular groove is coaxial with the base body, and the straight grooves intersect at the axis of the base body and divide the upper surface of the base body equally. The annular groove and the straight grooves are interconnected.

[0008] Preferably, the protrusion is clearance-fitted with the blind hole.

[0009] Preferably, the width of the straight groove gradually increases from the center to the edge.

[0010] Preferably, the straight groove has four grooves, the widest part of the straight groove is 8.9 mm and the narrowest part is 5.6 mm, the outer diameter of the annular groove is 105 mm and the inner diameter is 90 mm, and the depth of both the straight groove and the annular groove is 5 mm.

[0011] Preferably, the center of the placement area is provided with a stepped hole, the stepped hole including a first hole segment near the surface of the placement area and a second hole segment away from the surface of the placement area. A positioning member is provided in the second hole segment. The positioning member includes a base that fits against the bottom of the second hole segment and a support column located at the center of the base and extending upward. An mounting member is fitted on the support column. The mounting member includes an edge portion that is embedded in the first hole segment and a center portion that is embedded in the second hole segment. The mounting member is connected to the loading cavity by a screw passing through the edge portion. The portion of the support column that protrudes from the upper surface of the mounting member forms the protrusion.

[0012] Preferably, the base body includes a cylindrical base platform, a boss is provided on the base platform, an annular groove and a straight groove are provided on the surface of the boss, and the straight groove horizontally penetrates the boss.

[0013] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art:

[0014] This utility model's heat dissipation tray base includes a loading cavity and a base body. The loading cavity has a flat placement area, and a cylindrical protrusion is located at the center of the placement area. A blind hole is located at the bottom of the base body. The base body is placed in the placement area, and the protrusion is inserted into the blind hole, allowing the base body and the protrusion to rotate and connect. The upper surface of the base body has an annular groove and several straight grooves. The annular groove is coaxial with the base body, and the straight grooves converge at the axis of the base body, dividing the upper surface of the base body evenly. The annular groove and the straight grooves are interconnected. This utility model's heat dissipation tray base rotates easily, has high cooling efficiency, is easy to clean, and eliminates the need to consider the lifespan of the sealing ring after its use, thus preventing the formation of particles due to sealing ring aging. This effectively improves the wafer manufacturing process and increases production efficiency. Attached Figure Description

[0015] The technical solution of this utility model will be further described below with reference to the accompanying drawings:

[0016] Appendix Figure 1 This is a schematic diagram of a heat dissipation tray base in the prior art;

[0017] Appendix Figure 2 This is a schematic diagram of the heat dissipation tray base of this utility model;

[0018] Appendix Figure 3 For the appendix Figure 2 A magnified view of part A;

[0019] Appendix Figure 4 This is a top view of the base body of the heat dissipation tray base of this utility model.

[0020] Wherein: 1', loading cavity; 11', positioning edge; 2', base; 3', bushing; 4', sealing ring; 5', screw; 1, loading cavity; 11, placement area; 12, protrusion; 13, stepped hole; 131, first hole section; 132, second hole section; 2, base body; 21, blind hole; 22, annular groove; 23, straight groove; 24, base platform; 25, boss; 3, positioning component; 31, base; 32, support column; 4, mounting component; 41, edge; 42, center; 5, screw; 6, wafer. Detailed Implementation

[0021] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the scope of protection of the present invention.

[0022] It should be noted that when a component is described as "fixed to" another component, it can be directly on the other component or may have a component in between. When a component is considered "connected to" another component, it can be directly connected to the other component or may have a component in between. When a component is considered "set on" another component, it can be directly set on the other component or may have a component in between. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0023] As attached Figure 2 Appendix Figure 3 The diagram shows the heat dissipation tray base of this utility model, which includes a loading cavity 1 and a base body 2. The loading cavity 1 has a flat placement area 11, and the center of the placement area 11 has a cylindrical protrusion 12. The bottom of the base body 2 is machined with a blind hole 21. The base body 2 is placed in the placement area 11 and the protrusion 12 is inserted into the blind hole 21, so that the base body 2 and the protrusion 12 are rotatably connected. The protrusion 12 and the blind hole 21 are in clearance fit, which makes the base body 2 rotate more easily without jamming, and makes it easier to remove the base body 2 for cleaning.

[0024] As attached Figure 4 As shown, the upper surface of the base body 2 is machined with an annular groove 22 and several straight grooves 23. The annular groove 22 is coaxial with the base body 2, and the straight grooves 23 intersect at the axis of the base body 2, dividing the upper surface of the base body 2 evenly. The annular groove 22 and the straight grooves 23 are interconnected, improving heat dissipation and reducing the adhesion of particles on the back of the wafer 6 to the base body 2. The width of the straight grooves 23 gradually increases from the center to the edge. In this embodiment, there are four straight grooves 23, with the widest part being 8.9 mm and the narrowest part being 5.6 mm. The outer diameter of the annular groove 22 is 105 mm, and the inner diameter is 90 mm. The depth of both the straight grooves 23 and the annular groove 22 is 5 mm, making the base body 2 easier to clean.

[0025] The base body 2 includes a cylindrical base 24, on which a boss 25 is formed. An annular groove 22 and a straight groove 23 are located on the surface of the boss 25. The straight groove 23 horizontally penetrates the boss 25 to facilitate gas flow. In other embodiments, more groove types can also be machined on the base body 2, such as square grooves, honeycomb grooves, spiral grooves, etc.

[0026] A stepped hole 13 is machined in the center of the placement area 11. The stepped hole 13 includes a first hole segment 131 near the surface of the placement area 11 and a second hole segment 132 away from the surface of the placement area 11. A positioning member 3 is placed in the second hole segment 132. The positioning member 3 includes a base 31 that fits against the bottom of the second hole segment 132 and a support column 32 located at the center of the base 31 and extending upward. A mounting member 4 is fitted on the support column 32. The mounting member 4 includes an edge portion 41 that is embedded in the first hole segment 131 and a center portion 42 that is embedded in the second hole segment 132. The mounting member 4 is connected to the loading cavity 1 by a screw 5 that passes through the edge portion 41. The portion of the support column 32 that protrudes from the upper surface of the mounting member 4 forms a protrusion 12.

[0027] Using existing heat dissipation tray base technology, when wafer 6 is cooled to 900°C after the previous process is completed, it is transferred from the reaction chamber to the loading chamber 1' and purged with argon gas at 15L / min for 6 minutes. The surface temperature measured by a temperature measuring gun is greater than 40°C. However, using the heat dissipation tray base of this utility model, the same effect can be achieved by purging with argon gas at 15L / min for 3 minutes, which greatly improves the heat dissipation efficiency.

[0028] This utility model's heat dissipation tray base rotates easily, has high cooling efficiency, is easy to clean, and eliminates the need to consider the lifespan of the sealing ring after its use, thus preventing the formation of particles due to sealing ring aging. It effectively improves the wafer manufacturing process and increases production efficiency.

[0029] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A heat dissipation tray base, characterized in that: The device includes a loading cavity and a base body. The loading cavity has a planar placement area with a cylindrical protrusion at its center. The base body has a blind hole at its bottom. The base body is placed in the placement area, and the protrusion is inserted into the blind hole, making the base body and the protrusion rotatably connected. The upper surface of the base body has an annular groove and several straight grooves. The annular groove is coaxial with the base body, and the straight grooves intersect at the axis of the base body and divide the upper surface of the base body equally. The annular groove and the straight grooves are interconnected.

2. The heat dissipation tray base according to claim 1, characterized in that: The protrusion is fitted with the blind hole with a clearance.

3. The heat dissipation tray base according to claim 1, characterized in that: The width of the straight groove gradually increases from the center to the edge.

4. The heat dissipation tray base according to claim 3, characterized in that: The straight groove has four sections, with the widest part being 8.9 mm and the narrowest part being 5.6 mm. The outer diameter of the annular groove is 105 mm and the inner diameter is 90 mm. The depth of both the straight groove and the annular groove is 5 mm.

5. The heat dissipation tray base according to claim 1, characterized in that: A stepped hole is provided at the center of the placement area. The stepped hole includes a first hole segment near the surface of the placement area and a second hole segment away from the surface of the placement area. A positioning member is provided in the second hole segment. The positioning member includes a base that fits against the bottom of the second hole segment and a support column located at the center of the base and extending upward. An mounting member is fitted on the support column. The mounting member includes an edge portion that is embedded in the first hole segment and a center portion that is embedded in the second hole segment. The mounting member is connected to the loading cavity by a screw passing through the edge portion. The portion of the support column that protrudes from the upper surface of the mounting member forms the protrusion.

6. The heat dissipation tray base according to claim 1, characterized in that: The base body includes a cylindrical base platform with a boss on the base platform. The annular groove and the straight groove are provided on the surface of the boss, and the straight groove horizontally penetrates the boss.

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