Semiconductor dehumidification device

Abstract

The utility model discloses a semiconductor dehumidification device, which belongs to the technical field of dehumidification devices and comprises a semiconductor chilling plate, a heat exchanger, a heat exchanger and a heat exchanger. The number of the water cooling plates is two, each water cooling plate is internally provided with a cavity, and the two water cooling plates are attached to the refrigerating face and the heating face of the semiconductor refrigerating sheet in parallel. The evaporator is fixedly arranged beside the semiconductor chilling plate, and liquid circulation is achieved through a first water circulation pipeline assembly and the interior of the water cooling plate on the refrigeration face side; the condenser is fixedly arranged beside the semiconductor chilling plate, and liquid circulation is achieved in the water cooling plate on the heating face side through a second water circulation pipeline assembly. Compared with a traditional semiconductor dehumidifier purely depending on a semiconductor refrigeration plate, the double-liquid circulation mode is adopted, the air contact area of the evaporator and the condenser is larger, the temperature is more uniform, and the dehumidification efficiency is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of dehumidification device technology, and in particular to a semiconductor dehumidification device. Background Technology

[0002] In today's society, people have an increasing demand for humidity control in their living and working environments. As a key device for humidity regulation, the performance of dehumidifiers is of great concern. In the field of semiconductor dehumidification, traditional semiconductor dehumidifiers have many problems.

[0003] Traditional semiconductor dehumidifiers primarily rely on semiconductor cooling plates, which are generally quite small. In actual operation, this results in insufficient contact between the air and the heat exchange surface, affecting dehumidification efficiency.

[0004] Meanwhile, in traditional designs, when the cooling surface of the semiconductor refrigeration plate is too cold and the surrounding air humidity is high, frost will quickly form. This is mainly because the plate is too small and the surrounding cold air cannot be effectively and promptly dissipated. Currently, the frost can only be removed manually by the user or maintenance personnel. Frost not only affects the heat exchange efficiency of the evaporator, resulting in a significant reduction in dehumidification effect, but long-term accumulation can also damage related components of the equipment, greatly shortening its service life. Utility Model Content

[0005] This invention provides a semiconductor dehumidification device to solve the problems in the prior art.

[0006] The present invention adopts the following technical solution: a semiconductor dehumidification device, comprising: a semiconductor refrigeration chip, one side of which is a cooling surface and the other opposite side is a heating surface; two water-cooled plates, each having a cavity inside, the two water-cooled plates being respectively mounted parallel to the cooling surface and the heating surface of the semiconductor refrigeration chip; an evaporator, fixedly disposed beside the semiconductor refrigeration chip, and achieving liquid circulation with the interior of the water-cooled plate on the cooling surface side through a first water circulation pipeline assembly; and a condenser, fixedly disposed beside the semiconductor refrigeration chip, and achieving liquid circulation with the interior of the water-cooled plate on the heating surface side through a second water circulation pipeline assembly.

[0007] Preferably, the evaporator and condenser are arranged adjacent to each other.

[0008] Preferably, both the evaporator and the condenser are composed of a number of parallel fins and copper tubes evenly inserted between the fins, with gaps between adjacent fins, and the copper tubes have an inlet end and an outlet end.

[0009] Preferably, the first water circulation pipeline assembly includes: a first water pipe, one end of which is connected to the water inlet of the evaporator and the other end of which is connected to the interior of the corresponding water-cooled plate; a water pump, located in the middle section of the first water pipe, for discharging the liquid inside the water-cooled plate through the first water pipe to the water inlet; and a second water pipe, one end of which is connected to the water outlet of the evaporator and the other end of which is connected to the interior of the corresponding water-cooled plate.

[0010] Preferably, the second water circulation pipeline assembly has the same structure as the first water circulation pipeline assembly, and achieves internal liquid circulation between the condenser and its corresponding water-cooled plate in the same way.

[0011] Preferably, it also includes a wind-driven airflow system for drawing in air and discharging it after it passes sequentially through the evaporator and condenser.

[0012] Preferably, it also includes a housing, in which the condenser, evaporator, semiconductor cooling chip, water-cooled plate and wind-driven airflow system are all disposed.

[0013] Preferably, the outer casing is equipped with an air inlet grille and an air outlet grille, and the airflow guiding system is configured as a fan, which is installed inside the outer casing on the side of the air outlet grille; wherein, the evaporator is located on the side of the air inlet grille, and the condenser is located on the side of the air outlet grille.

[0014] Preferably, the interior of the outer casing is further equipped with a retractable water tank, which is located below the condenser and evaporator, and the upper end of the water tank is open.

[0015] Preferably, the condenser and evaporator are located at the same height, and the left and right sides of the water storage tank have upwardly extending extension plates. The outer shell is provided with sliding grooves corresponding to the extension plates. When the water storage tank is located inside the outer shell, the two extension plates abut against the outer ends of the evaporator and condenser, respectively.

[0016] The above-mentioned technical solutions adopted in the embodiments of this utility model can achieve the following beneficial effects:

[0017] Employing a dual-liquid circulation system, compared to traditional semiconductor dehumidifiers that rely solely on semiconductor cooling plates, this system allows for a larger direct contact area between the evaporator and condenser, resulting in more uniform temperature distribution and significantly improved dehumidification efficiency. It can reduce air humidity more quickly and effectively. Furthermore, the first water circulation piping assembly evenly distributes cooling energy to the evaporator, preventing frost buildup on the cooling surface of the semiconductor cooling plates. This ensures stable and continuous dehumidification performance and extends the equipment's lifespan. Attached Figure Description

[0018] The accompanying drawings, which are included to provide a further understanding of the present invention and constitute a part of this invention, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0019] Figure 1 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 1 ;

[0020] Figure 2 This is an assembly diagram of the evaporator and the first water circulation pipeline assembly of this utility model;

[0021] Figure 3 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 2 ;

[0022] Figure 4 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 3 ;

[0023] Figure 5 This is a sectional view of the present invention;

[0024] Figure 6 This is a schematic diagram showing the installation location of the water storage tank of this utility model.

[0025] Figure Labels

[0026] 1-Semiconductor cooling chip; 11-Cooling surface; 12-Heating surface; 2-Water-cooled plate; 3-Evaporator; 31-Fins; 32-Copper pipe; 33-Water inlet; 34-Water outlet; 4-First water circulation pipeline assembly; 41-First water pipe; 42-Water pump; 43-Second water pipe; 5-Condenser; 6-Second water circulation pipeline assembly; 7-Outer shell; 71-Air inlet grille; 72-Exhaust grille; 73-Water storage tank; 731-Extension plate; 74-Slide groove; 8-Fan. Detailed Implementation

[0027] To further illustrate the technical means and effects adopted by this utility model in order to achieve the intended utility model purpose, the following detailed description of the specific implementation methods, structure, features and effects of this utility model is provided in conjunction with the accompanying drawings and preferred embodiments.

[0028] The technical solutions provided by the various embodiments of this utility model are described in detail below with reference to the accompanying drawings.

[0029] Reference Figures 1 to 6 As shown, this utility model embodiment provides a semiconductor dehumidification device, which mainly includes a semiconductor cooling chip 1, a water-cooled plate 2, an evaporator 3, and a condenser 5.

[0030] The semiconductor refrigeration chip 1 has a cooling surface 11 on one side and a heating surface 12 on the other opposite side; two water-cooled plates 2 are configured, each water-cooled plate 2 has a cavity inside, and the two water-cooled plates 2 are respectively attached in parallel to the cooling surface 11 and the heating surface 12 of the semiconductor refrigeration chip 1.

[0031] The evaporator 3 is fixedly installed on the side of the semiconductor cooling chip 1, and achieves liquid circulation with the water-cooled plate 2 on the cooling surface 11 side through the first water circulation pipeline assembly 4; the condenser 5 is fixedly installed on the side of the semiconductor cooling chip 1, and achieves liquid circulation with the water-cooled plate 2 on the heating surface 12 side through the second water circulation pipeline assembly 6.

[0032] As a prior art technology, the semiconductor cooling chip 1, after being activated, has one side serving as a cooling surface 11 and the other side as a heating surface 12, utilizing the Peltier effect to achieve both cooling and heating functions. The cooling surface 11 absorbs heat, lowering its temperature; the heating surface 12 releases heat, raising its temperature. Two water-cooled plates 2, each with an internal cavity, are respectively mounted parallel to the cooling surface 11 and the heating surface 12 of the semiconductor cooling chip 1. The water-cooled plate 2 on the cooling surface 11 side absorbs the cooling energy from the cooling surface 11, and the water-cooled plate 2 on the heating surface 12 side absorbs the heat from the heating surface 12, achieving rapid heat transfer.

[0033] The evaporator 3 is fixed beside the thermoelectric cooler 1 and circulates liquid with the water-cooled plate 2 on the cooling surface 11 through the first water circulation pipe assembly 4. The circulating liquid carries the cooling energy of the water-cooled plate 2 to the evaporator 3, lowering the surface temperature of the evaporator 3. When humid air flows through the evaporator 3, the water vapor in it condenses into water droplets upon cooling, thus dehumidifying the air. The condenser 5 is also fixed beside the thermoelectric cooler 1 and circulates liquid with the water-cooled plate 2 on the heating surface 12 through the second water circulation pipe assembly 6. The circulating liquid carries the heat from the water-cooled plate 2 on the heating surface 12 to the condenser 5, which dissipates the heat to the surrounding environment, maintaining the thermal balance of the entire system.

[0034] Therefore, in this embodiment, a dual liquid circulation method is adopted. Compared with traditional semiconductor dehumidifiers that rely solely on semiconductor cooling plates, the evaporator 3 and condenser 5 have a larger direct contact area with the air, resulting in a more uniform temperature and greatly improving dehumidification efficiency. This allows for a faster and more effective reduction of air humidity.

[0035] In addition, compared with traditional dehumidifiers that use compressors, this semiconductor dehumidifier does not require complex and expensive components such as compressors, thus reducing equipment costs. At the same time, although it adds water-cooled plate 2 and water circulation pipeline components compared with traditional semiconductor dehumidifiers, the significantly improved dehumidification efficiency makes up for the slight increase in cost, making it more advantageous.

[0036] The semiconductor refrigeration chip 1 does not require the addition of refrigerant during operation, thus avoiding air pollution caused by traditional refrigerants and the potential explosion risk of new refrigerants, making it more environmentally friendly and safer. Furthermore, the working principle of the semiconductor refrigeration chip 1 determines its relatively low energy consumption, achieving energy-saving effects.

[0037] The cooling capacity is evenly transferred to the evaporator 3 through the first water circulation pipeline assembly 4, which avoids the cold temperature from concentrating on the cooling surface 11 of the semiconductor cooling chip 1, thus preventing frost formation and ensuring the stability and continuity of the dehumidification effect, and extending the service life of the equipment.

[0038] In some practical applications, refer to Figure 1 As shown, considering that the evaporator 3 may still frost under some extreme conditions, the evaporator 3 and the condenser 5 are arranged close to each other. By balancing the heat between the evaporator 3 and the condenser 5, frost can be avoided on the evaporator 3.

[0039] In some practical applications, refer to Figure 2 As shown, the evaporator 3 and the condenser 5 are both composed of a number of parallel fins 31 and copper tubes 32 evenly inserted between the fins 31. There are gaps between adjacent fins 31. The copper tubes 32 have a water inlet end 33 and a water outlet end 34.

[0040] Specifically, each of the first water circulation pipeline components 4 includes a first water pipe 41, one end of which is connected to the water inlet 33 of the evaporator 3, and the other end of which is connected to the interior of the corresponding water-cooled plate 2; a water pump 42 is located in the middle section of the first water pipe 41 to discharge the liquid inside the water-cooled plate 2 to the water inlet 33 through the first water pipe 41; and a second water pipe 43, one end of which is connected to the water outlet 34 of the evaporator 3, and the other end of which is connected to the interior of the corresponding water-cooled plate 2.

[0041] Similarly, the second water circulation pipeline assembly 6 has the same structure as the first water circulation pipeline assembly 4, and achieves the internal liquid circulation of the condenser 5 and its corresponding water cooling plate 2 in the same way.

[0042] After the water pump 42 starts, the liquid that has absorbed the cooling energy inside the water-cooled plate 2 on the cooling surface 11 is transported to the water inlet 33 of the evaporator 3 through the first water pipe 41 (it should be noted that antifreeze is generally added to this circulation pipeline). The liquid flows inside the copper pipe 32, transferring the cooling energy to the copper pipe 32, thereby lowering the temperature of the fins 31 that are in close contact with it. When humid air flows through the evaporator 3, the water vapor in the air encounters the cooling and liquefies on the low-temperature surface of the fins 31, condensing into water droplets that fall from the gaps between the fins 31, thus dehumidifying the air. The liquid that has absorbed heat inside the evaporator 3 flows out from the water outlet 34 and returns to the water-cooled plate 2 on the cooling surface 11 through the second water pipe 43, completing one cycle and continuously providing cooling energy to the evaporator 3.

[0043] The condenser 5 has a similar structure to the evaporator 3, consisting of several parallel-arranged fins 31 and copper tubes 32 evenly interspersed within them. The second water circulation piping assembly 6 has the same structure as the first water circulation piping assembly 4. One end of its first water pipe 41 is connected to the water inlet 33 of the condenser 5, and the other end is connected to the interior of the water-cooled plate 2 on the heating surface 12 side. A water pump 42 is installed in the middle section. The water pump 42 transports the heat absorbed by the water-cooled plate 2 on the heating surface 12 side to the water inlet 33 of the condenser 5 through the internal liquid via the first water pipe 41. The liquid flows inside the copper tubes 32 of the condenser 5, transferring heat to the copper tubes 32 and fins 31, and the condenser 5 dissipates the heat to the surrounding environment. Afterward, the liquid flows back from the water outlet 34 of the condenser 5 to the interior of the water-cooled plate 2 on the heating surface 12 side via the second water pipe 43, maintaining the thermal balance of the entire system and ensuring the continuous and stable operation of the semiconductor cooling chip 1.

[0044] The unique finned 31 and copper tube 32 structure of the evaporator 3 and condenser 5 increases the contact area with air and circulating liquid. This structure, combined with the dual liquid circulation method, allows the evaporator 3 to absorb moisture from the air more efficiently, and the condenser 5 to dissipate heat more quickly.

[0045] In some practical applications, based on any of the above embodiments, the dehumidification device further includes an airflow guiding system, which is used to draw in air and allow the air to pass sequentially through the evaporator 3 and the condenser 5 before being discharged.

[0046] In other practical applications, refer to Figures 2 to 6 As shown, the dehumidification device can be applied to different usage scenarios. It also includes a housing 7, in which the condenser 5, evaporator 3, semiconductor cooling chip 1, water-cooled plate 2 and wind-driven airflow system are all housed.

[0047] Specifically, the outer casing 7 is equipped with an air inlet grille 71 and an air outlet grille 72, and the airflow guiding system is configured as a fan 8, which is installed inside the outer casing 7 on the side of the air outlet grille 72; wherein, the evaporator 3 is located on the side of the air inlet grille 71, and the condenser 5 is located on the side of the air outlet grille 72.

[0048] In operation, the fan 8 located on the side of the air inlet grille 71 of the outer casing 7 is activated, drawing air through the air inlet grille 71 into the interior of the outer casing 7. When the humid air flows through the low-temperature evaporator 3, the water vapor in it condenses into water droplets upon cooling, thus dehumidifying the air. The condenser 5 is also fixed beside the semiconductor cooling chip 1, and achieves liquid circulation with the water-cooled plate 2 on the heating surface 12 side through the second water circulation pipe assembly 6. The circulating liquid carries the heat from the water-cooled plate 2 on the heating surface 12 side to the condenser 5. The air, dehumidified by the evaporator 3, continues to flow and reaches the condenser 5 located on the side of the exhaust grille 72. The condenser 5 transfers heat to the passing air, and then the air, carrying heat, is discharged from the outer casing 7 through the exhaust grille 72 (the hot air discharged here is generally adapted to room temperature).

[0049] In some practical applications, refer to Figures 3 to 6 As shown, a pull-out water tank 73 is also installed inside the outer casing 7. The water tank 73 is located below the condenser 5 and the evaporator 3, and the upper end of the water tank 73 is open.

[0050] Specifically, the condenser 5 and the evaporator 3 are located at the same height, and the left and right sides of the water storage tank 73 have upwardly extending extension plates 731. The outer shell 7 is provided with a sliding groove 74 corresponding to the extension plates 731. When the water storage tank 73 is located inside the outer shell 7, the two extension plates 731 respectively abut against the outer ends of the evaporator 3 and the condenser 5.

[0051] After the dehumidification process is completed in evaporator 3, the humid air cools and liquefies on the surface of evaporator 3, forming water droplets. Due to gravity, the water droplets fall downwards. At this time, the pull-out water tank 73, located below condenser 5 and evaporator 3 and open at the top, plays a collecting role. Because condenser 5 and evaporator 3 are at the same height, the extension plates 731 extending upwards on both sides of the water tank 73 abut against the outer ends of evaporator 3 and condenser 5, respectively. This design ensures that the water droplets dripping from evaporator 3 can accurately fall into the water tank 73, achieving effective collection of moisture generated during the dehumidification process.

[0052] In summary, this dehumidification device can be applied to a variety of scenarios. For example, the fan can be placed on the evaporator side, and the overall casing can be divided into indoor and outdoor units, which can then be used as a small kitchen semiconductor air conditioner.

[0053] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A semiconductor dehumidification device, characterized in that, include: A semiconductor cooling chip (1) has a cooling surface (11) on one side and a heating surface (12) on the opposite side. Two water-cooled plates (2) are configured. Each water-cooled plate (2) has a cavity inside. The two water-cooled plates (2) are respectively attached in parallel to the cooling surface (11) and the heating surface (12) of the semiconductor cooling chip (1). The evaporator (3) is fixedly installed on the side of the semiconductor cooling chip (1) and achieves liquid circulation with the water-cooled plate (2) on the side of the cooling surface (11) through the first water circulation pipeline assembly (4); The condenser (5) is fixedly installed on the side of the semiconductor cooling chip (1) and achieves liquid circulation through the second water circulation pipeline assembly (6) and the water cooling plate (2) on the side of the heating surface (12).

2. The semiconductor dehumidification device according to claim 1, characterized in that, The evaporator (3) and the condenser (5) are arranged adjacent to each other.

3. The semiconductor dehumidification device according to claim 1, characterized in that, The evaporator (3) and condenser (5) are both composed of several parallel fins (31) and copper tubes (32) evenly inserted between the several fins (31). There are gaps between adjacent fins (31), and the copper tubes (32) have a water inlet (33) and a water outlet (34).

4. The semiconductor dehumidification device according to claim 3, characterized in that, The first water circulation pipeline assembly (4) includes: The first water pipe (41) has one end connected to the water inlet (33) of the evaporator (3) and the other end connected to the interior of the corresponding water-cooled plate (2); A water pump (42) is installed in the middle section of the first water pipe (41) to discharge the liquid inside the water-cooled plate (2) to the water inlet (33) through the first water pipe (41). The second water pipe (43) has one end connected to the water outlet (34) of the evaporator (3) and the other end connected to the interior of the corresponding water-cooled plate (2).

5. A semiconductor dehumidification device according to claim 4, characterized in that, The second water circulation pipeline assembly (6) has the same structure as the first water circulation pipeline assembly (4) and achieves the internal liquid circulation of the condenser (5) and its corresponding water cooling plate (2) in the same way.

6. The semiconductor dehumidification device according to claim 1, characterized in that, It also includes a wind-driven airflow system, which draws in air and causes it to pass through the evaporator (3) and condenser (5) in sequence before being discharged.

7. A semiconductor dehumidification device according to claim 6, characterized in that, It also includes a housing (7), in which the condenser (5), evaporator (3), semiconductor cooling chip (1), water cooling plate (2) and wind-driven airflow system are all housed.

8. A semiconductor dehumidification device according to claim 7, characterized in that, The outer casing (7) is equipped with an air inlet grille (71) and an air outlet grille (72). The wind-driven airflow system is configured as a fan (8), which is installed inside the outer casing (7) on the side of the air outlet grille (72). The evaporator (3) is located on the side of the air inlet grille (71), and the condenser (5) is located on the side of the air outlet grille (72).

9. A semiconductor dehumidification device according to claim 8, characterized in that, The interior of the outer shell (7) is also equipped with a pull-out water tank (73), which is located below the condenser (5) and the evaporator (3), and the upper end of the water tank (73) is open.

10. A semiconductor dehumidification device according to claim 9, characterized in that, The condenser (5) and evaporator (3) are at the same height. The left and right sides of the water tank (73) have upwardly extending extension plates (731). The outer shell (7) is provided with a sliding groove (74) corresponding to the extension plates (731). When the water tank (73) is inside the outer shell (7), the two extension plates (731) abut against the outer ends of the evaporator (3) and condenser (5) respectively.

Images