High-speed serial bus slot detection device and server system
By integrating a power module and a light-emitting module into the PCIe slot testing device, intuitive connectivity testing without the need for individual pin testing is achieved. This solves the problems of low efficiency and misjudgment in existing technologies, improves the accuracy of testing, and simplifies operation.
Patent Information
- Application Number
- CN202522254076.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-24
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-10-24
AI Technical Summary
In existing technologies, PCIe slot connectivity detection is inefficient, complex to operate, prone to misjudgment, and cannot accurately determine connectivity when AIC card design information is lacking.
A high-speed serial bus slot detection device was designed, including a detection card, a power supply module, and a light-emitting module. The device precisely aligns with the high-speed serial bus slot through contacts integrated on the substrate, and uses the on/off state of the light-emitting module to intuitively display the connectivity, avoiding the need to test each pin individually.
It improves the accuracy and efficiency of detection, reduces the possibility of misjudgment, simplifies the operation process, and reduces reliance on professional skills and maintenance costs.
Smart Images
Figure CN223842105U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of computer hardware technology, and in particular to a high-speed serial bus slot detection device and server system. Background Technology
[0002] PCIe (Peripheral Component Interconnect Express) slots play an increasingly important role as a crucial bridge connecting the host computer and peripherals. PCIe AIC cards (Add-In Cards, which are hardware devices that can be inserted into specific slots on a computer motherboard, such as PCIe slots) support the connection of various high-performance devices, such as graphics cards, storage devices, and network adapters, through their compatibility with the PCIe slots on the motherboard. However, in actual use, problems such as bent or broken PCIe slot pins frequently occur. This not only affects the normal recognition and operation of PCIe AIC cards but may also lead to a decrease in data transfer rates, seriously impacting the stability and performance of the computer system.
[0003] Currently, the common method for testing PCIe slot connectivity issues is to use a multimeter to test the impedance between each AIC card and the PCIe slot. This process is not only time-consuming but also complex, requiring a high level of experience and skill from the testing personnel. This is especially true for high-bandwidth x16 PCIe slots, which have up to 168 pins, making individual testing an extremely challenging task, highly susceptible to human error. Furthermore, the internal signal routing of AIC cards is often complex and lacks clearly defined test points, further complicating the testing process. Even if a resistor or capacitor on the signal path can be found as a test point, the solder mask needs to be removed, a tedious and potentially damaging operation that increases maintenance costs. More importantly, without access to detailed AIC card design schematics, repair personnel are unable to perform effective impedance testing.
[0004] In summary, traditional manual detection methods have the following main shortcomings:
[0005] 1. Inefficient: For PCIe (high-speed serial bus) slots with high-density pins, testing the impedance of each pin is time-consuming and prone to misjudgment due to incorrect operation.
[0006] 2. Complex operation: It requires professional tools to remove the green oil layer on the AIC card, which requires a high level of skill from the operator and may damage the AIC card.
[0007] 3. Limited by AIC card design information: Without the internal design data of the AIC card, it is almost impossible to accurately find the test points, thus making it impossible to determine connectivity. Utility Model Content
[0008] This application provides a high-speed serial bus slot testing device and server system to at least solve the problems of existing solutions where testing the impedance of each pin of a high-density pin high-speed serial bus slot is time-consuming and prone to misjudgment due to operation errors.
[0009] This application provides a high-speed serial bus slot detection device, comprising: a detection card, including a power module, a light-emitting module, and a substrate, wherein the bottom end of the substrate is provided with multiple contacts, the power module and the light-emitting module are mounted on the substrate, the positive terminal of the power module is electrically connected to a first end of the light-emitting module, and the second end of the light-emitting module is electrically connected to each contact; a high-speed serial bus connector, provided with a high-speed serial bus slot for electrical connection to each contact, and the high-speed serial bus connector is provided with multiple pads; and a detection card connector, wherein each contact of the detection card connector is electrically connected to a pad of the high-speed serial bus connector and the negative terminal of the power module.
[0010] This application also provides a server system, including: a server and any high-speed serial bus slot detection device.
[0011] This application integrates the power supply module and the light-emitting module on the test card onto a substrate. The positive terminal of the power supply module is directly connected to the first end of the light-emitting module, while the second end of the light-emitting module is connected to multiple contacts at the bottom of the substrate. This design allows the connectivity to be visually displayed through the status of the light-emitting module when the test card is inserted into the high-speed serial bus slot, eliminating the need for pin-by-pin impedance testing. The contacts at the bottom of the substrate are designed for precise alignment with the pins in the high-speed serial bus slot. When the test card is inserted, the contacts make contact with the pins in the slot, forming part of the detection circuit. This precisely matched contact design ensures the accuracy and consistency of the test, avoiding potential errors in manual testing. The contacts of the test card connector are connected to the pads of the high-speed serial bus connector and the negative terminal of the power supply module, forming a complete circuit. When the test card is inserted, the test card connector ensures a reliable electrical connection with the pads of the high-speed serial bus slot, while simultaneously connecting to the power supply module on the test card via a cable, forming a closed circuit. This allows the light-emitting module to emit light according to the connectivity, and the brightness of the light-emitting module directly reflects the connectivity status of the pins in the high-speed serial bus slot. This solves the problem that existing solutions for high-density pin high-speed serial bus slots require time-consuming impedance testing of each pin and are prone to misjudgment due to operational errors. Attached Figure Description
[0012] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0013] Figure 1 This is a schematic diagram of an existing high-speed serial bus slot detection device.
[0014] Figure 2 This is a first schematic diagram of a high-speed serial bus slot detection device provided in an embodiment of this application;
[0015] Figure 3 A second schematic diagram of a high-speed serial bus slot detection device provided in an embodiment of this application;
[0016] Figure 4 A schematic diagram of another high-speed serial bus slot detection device provided in an embodiment of this application.
[0017] The above figures include the following reference numerals:
[0018] 100, Detection card; 110, Power supply module; 120, Light-emitting module; 130, Substrate; 131, Contact; 200, High-speed serial bus connector; 300, Detection card connector; 310, First latch; 320, Second latch. Detailed Implementation
[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.
[0020] It should be noted that, in the description of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., in this application are used to distinguish similar objects and are not used to describe a specific order or sequence.
[0021] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0022] Currently, the common method for testing PCIe slot connectivity issues is to use a multimeter to test the impedance between each AIC card and the PCIe slot. This process is not only time-consuming but also complex, requiring a high level of experience and skill from the testing personnel. This is especially true for high-bandwidth x16 PCIe slots, which have up to 168 pins, making individual testing an extremely challenging task, highly susceptible to human error. Furthermore, the internal signal routing of AIC cards is often complex and lacks clearly defined test points, further complicating the testing process. Even if a resistor or capacitor on the signal path can be found as a test point, the solder mask needs to be removed, a tedious and potentially damaging operation that increases maintenance costs. More importantly, without access to detailed AIC card design schematics, repair personnel are unable to perform effective impedance testing.
[0023] In summary, traditional manual detection methods have the following main shortcomings:
[0024] 1. Inefficient: For PCIe (high-speed serial bus) slots with high-density pins, testing the impedance of each pin is time-consuming and prone to misjudgment due to incorrect operation.
[0025] 2. Complex operation: It requires professional tools to remove the green oil layer on the AIC card, which requires a high level of skill from the operator and may damage the AIC card.
[0026] 3. Limited by AIC card design information: Without the internal design data of the AIC card, it is almost impossible to accurately find the test points, thus making it impossible to determine connectivity.
[0027] like Figure 1 As shown, when existing solutions encounter problems such as AIC card (i.e., external expansion card) not being recognized or bandwidth reduction, the first step should be to check the connectivity between the AIC card and the PCIe slot (high-speed serial bus slot). The current technical solution involves using a multimeter to measure the impedance between each AIC card and the PCIe slot. Specific methods are detailed in the attached diagram. Figure 1 As shown, set the multimeter to the impedance range, place the red probe on the PCIe slot pad, and place the black probe on the corresponding test point on the AIC card at the same PCIe slot pad. Measure the impedance between the two to determine if it is normal, thus determining the connectivity between the AIC card and the PCIe slot.
[0028] This application provides a high-speed serial bus slot detection device, such as... Figure 2 As shown, it includes:
[0029] The test card 100 includes: a power module 110, a light-emitting module 120 and a substrate 130. The bottom end of the substrate is provided with multiple contacts 131. The power module and the light-emitting module are mounted on the substrate. The positive terminal of the power module is electrically connected to the first end of the light-emitting module, and the second end of the light-emitting module is electrically connected to each contact.
[0030] The contacts are metal contacts.
[0031] The high-speed serial bus connector 200 is provided with a high-speed serial bus slot for electrical connection with each contact, and the high-speed serial bus connector is provided with multiple pads.
[0032] The test card connector 300 has each contact electrically connected to a pad of the high-speed serial bus connector and the negative terminal of the power module.
[0033] Specifically, the power supply module and the light-emitting module on the test card are integrated on the substrate. The positive terminal of the power supply module is directly connected to the first end of the light-emitting module, while the second end of the light-emitting module is connected to multiple contacts at the bottom of the substrate. This design allows the connectivity to be visually displayed through the status of the light-emitting module when the test card is inserted into the high-speed serial bus slot, without the need for impedance testing pin by pin. The contacts at the bottom of the substrate are designed for precise alignment with the pins in the high-speed serial bus slot. When the test card is inserted, the contacts make contact with the pins in the slot, forming part of the detection circuit. This precisely matched contact design ensures the accuracy and consistency of the test, avoiding possible errors in manual testing. The contacts of the test card connector are connected to the pads of the high-speed serial bus connector and the negative terminal of the power supply module, forming a complete loop. When the test card is inserted, the test card connector ensures a reliable electrical connection with the pads of the high-speed serial bus slot, and simultaneously connects to the power supply module on the test card via a cable, forming a closed circuit. This allows the light-emitting module to emit light according to the connectivity, and the on / off state of the light-emitting module directly reflects the connectivity status of the pins in the high-speed serial bus slot. This solves the problem that existing solutions for high-density pin high-speed serial bus slots require time-consuming impedance testing of each pin and are prone to misjudgment due to operational errors.
[0034] In one embodiment of this application, the light-emitting module further includes: a plurality of light-emitting components, the first end of each light-emitting component being electrically connected to the positive electrode of the power supply module, and the second end of each light-emitting component being electrically connected to a contact.
[0035] Specifically, each light-emitting component corresponds to one or a set of specific contacts. By observing which LED (Light-Emitting Diode, a semiconductor device that converts electrical energy into light energy) is not lit, the continuity problem in the PCIe slot can be immediately located without the need for point-by-point measurements, greatly improving diagnostic efficiency and accuracy. Compared to using a multimeter to measure impedance, visual signals (the on / off state of the LEDs) are easier for repair personnel to understand, and the operation is more intuitive and simple, reducing reliance on professional skills and the possibility of misoperation. Since there is no need to search for test points or scrape off the solder mask on the AIC card, this solution avoids physical damage to the AIC card and also saves maintenance costs.
[0036] In one embodiment of this application, the light-emitting component includes a voltage limiting module and a light-emitting module. The first end of the voltage limiting module is electrically connected to the positive terminal of the power supply module, the first end of the light-emitting module is electrically connected to the second end of the voltage limiting module, and the second end of the light-emitting module is electrically connected to a contact.
[0037] The voltage limiting module is a resistor module, and the light-emitting module is a light-emitting diode.
[0038] Specifically, the voltage limiting module ensures that the voltage applied to the light-emitting module (such as an LED) remains within a safe range. This prevents damage to the light-emitting module due to excessive voltage, improving the reliability and durability of the entire detection system. By precisely controlling the voltage of the light-emitting module, its operating status can be effectively managed, avoiding damage caused by overheating and voltage fluctuations. This not only extends the lifespan of the light-emitting module but also ensures its stable performance after long-term use; the voltage limiting module guarantees that each light-emitting module emits light at a consistent brightness during the detection process. This makes the test results clearer and more precise, reduces misjudgments caused by brightness changes, and improves the accuracy of PCIe slot connectivity testing. The status of the light-emitting module visually reflects the connectivity situation, eliminating the need for complex impedance measurements or specialized equipment. Operators can determine the pin status simply by observing the LED's on / off state, greatly simplifying the testing process and improving efficiency. The visual feedback mechanism of the light-emitting component enhances the user experience during testing, enabling even non-professionals to quickly master how to use the testing tools, lowering the technical barrier. The voltage limiting module protects the light-emitting module through a simple and effective circuit design. Compared to using expensive impedance testing equipment, this design is more economical and helps reduce overall testing costs. The independence and standardized design of each module in the light-emitting component make it easier for on-site maintenance and replacement, and also facilitates subsequent upgrades and optimizations, such as replacing with higher-brightness LEDs or adjusting the parameters of the voltage limiting module.
[0039] In one embodiment of this application, a ring-shaped backlight cover is mounted on the outside of the light-emitting module.
[0040] Specifically, the ring-shaped backlight cover provides a uniform background light source, making the indicator effect of the light-emitting diodes (LEDs) more obvious. Even in low-light environments, the on / off state of the LEDs can be clearly seen, thereby improving the accuracy of detection. The cover provides physical protection for the LEDs, preventing damage caused by collisions or scratches during use or transportation, ensuring their long-term stable performance. The ring-shaped backlight design reduces interference from external light on LED brightness judgment, especially in complex or brightly lit environments. The ring-shaped backlight helps focus the LED signal, making the detection results more reliable. The cover design enhances the overall appearance of the test card, making it more professional to use, while also avoiding discomfort or glare from direct contact with the LEDs. The ring-shaped backlight design allows the indicator light to be seen not only from the front but also from the sides of the light-emitting module, making it easier for users conducting tests in confined spaces to observe the LED status from different angles.
[0041] In one embodiment of this application, each light-emitting component further includes a screen printing plate, which is mounted on a substrate and corresponds one-to-one with the light-emitting module.
[0042] Specifically, the silkscreen directly associates each LED module with a specific pin in the PCIe slot, allowing users to quickly identify which pin has a connectivity problem. This significantly improves the speed and accuracy of fault diagnosis, reducing the time spent searching for problems. For users without professional knowledge or under time pressure, observing the LED's status (on or off) and referring to the corresponding silkscreen allows for intuitive judgment of connectivity, eliminating the need for complex instruments or in-depth electronics knowledge, thus lowering the barrier to entry. The silkscreen, as a visual identifier, maintains consistency with the hardware design, ensuring standardized communication during the testing process. Even in collaborative environments, it ensures clarity and consistency in information transmission. Since each pin has a dedicated LED and corresponding silkscreen marking, it avoids potential misreading or misjudgment when using tools like multimeters, improving the reliability of test results. In the absence of design documents or signal routing diagrams, the silkscreen provides a direct and effective means of fault location, simplifying maintenance and repair processes. This simple and direct approach is particularly important in field service.
[0043] In one embodiment of this application, the high-speed serial bus slot detection device further includes a switch module, which is electrically connected between the power supply module and the light-emitting module.
[0044] Specifically, the switch module allows users to selectively turn specific detection loops on or off as needed. This means that the connectivity of each pin or group of pins can be tested individually, improving the accuracy and flexibility of the test. Users do not need to test all pins at once; they can perform selective testing, saving time and resources. By controlling the power output through the switch, the circuit can be disconnected when testing is not in progress, preventing unnecessary power consumption and reducing the risk of short circuits or other circuit failures, thus improving the safety and durability of the entire testing device. In complex PCIe slot fault diagnosis, the switch module can assist in step-by-step debugging. For example, if an LED on a certain pin is not lit, the influence of other pins can be isolated by turning on the switches in the switch module one by one, thereby more accurately identifying the fault point. The switch module enhances the user's operating experience, allowing them to intuitively see which detection loops are active, which helps in understanding the testing process and results, lowering the barrier to entry, and making it easy for even technicians without professional electronic engineering knowledge to operate. Due to the presence of the switch module, if a light-emitting module (such as an LED) is found to be unresponsive during testing, the switch can be checked first to see if it is working properly before further troubleshooting the circuit problem, which helps to quickly locate the cause of the fault and simplify the maintenance process.
[0045] In one embodiment of this application, the high-speed serial bus slot detection device includes a snap-fit structure, and the high-speed serial bus connector and the detection card connector are fixed together by the snap-fit structure.
[0046] Specifically, the snap-fit design allows for quick installation and removal of the test card without tools, significantly saving testing time and improving efficiency. The snap-fit ensures the test card is securely connected to the high-speed serial bus slot during testing, preventing mistests due to loose connections and ensuring accurate results. The snap-fit structure, typically designed to fit the slot's shape and size, precisely positions the test card, ensuring accurate alignment of the gold fingers with the slot pins, thus improving connectivity testing accuracy. While securing the test card, the snap-fit structure also prevents the slot from experiencing additional physical pressure during testing, avoiding damage to the slot or test card due to improper operation. The well-designed snap-fit system can accommodate PCIe slots of different sizes and specifications, ensuring the test device's versatility and allowing the same test card to perform connectivity testing on various devices.
[0047] In one embodiment of this application, such as Figure 3 As shown, the snap-fit structure includes a first snap-fit 310 and a second snap-fit 320. One end of the high-speed serial bus connector and one end of the detection card connector are fixed together by the first snap-fit, and the other end of the high-speed serial bus connector and the other end of the detection card connector are fixed together by the second snap-fit.
[0048] Specifically, the snap-fit structure ensures the connector is firmly fixed during the testing process, preventing poor contact caused by slight movement or vibration, thus guaranteeing the integrity of the signal path and improving the accuracy of the test results. The snap-fit design allows users to quickly assemble and disassemble the test card and target connector without additional tools, greatly simplifying the operation process, saving time, and reducing operating costs. The snap-fit structure facilitates repeated installation and removal of the test card, meaning it can be reused across different devices or slots without worrying about damage to the test card or target slot caused by the fixing method, improving the flexibility and economy of the entire testing system. The snap-fit design often considers connectors of different sizes and shapes, making the test card compatible with various PCIe slot specifications, enhancing the versatility and compatibility of the testing method and reducing the need for customization for specific devices or slots. The snap-fit can be designed with a certain degree of reverse connection protection to prevent short circuits or damage caused by incorrect insertion of the test card, further improving operational safety.
[0049] In one embodiment of this application, the substrate is a double-sided circuit board structure, and the power supply module and the light-emitting module are mounted on the first side or the second side of the double-sided circuit board structure.
[0050] Specifically, double-sided PCBs can utilize space more effectively. By mounting power modules and light-emitting modules on opposite sides of the PCB, the physical distance between modules can be reduced, resulting in a more compact circuit board design, which is especially important for devices requiring miniaturization and high-density integration. Layout on a double-sided PCB allows for better control of signal traces, avoiding interference between signal and power lines. Typically, power and ground lines can be designed on one side of the PCB, while signal lines are designed on the other, improving signal integrity and system stability. Power modules often generate significant heat. In a double-sided PCB design, power modules can be mounted on the side closest to the heatsink or ventilation holes, while light-emitting modules are mounted on the other side. This facilitates heat dissipation and management, improving system cooling efficiency and ensuring the modules operate at normal operating temperatures. Compared to single-sided PCBs, double-sided PCBs offer greater routing flexibility, reducing the number of circuit board layers and thus lowering manufacturing costs. Furthermore, a well-planned layout reduces the use of additional connectors and cables, further saving costs. Separating modules with different functions on opposite sides makes circuit board maintenance and inspection more convenient. For example, when it is necessary to inspect or replace the light-emitting module, there is no need to interfere with the power supply module, and it can be operated directly, improving maintenance efficiency.
[0051] Embodiments of this application also provide a server system, including: a server and any high-speed serial bus slot detection device. The power module and light-emitting module on the detection card are integrated on a substrate. The positive terminal of the power module is directly connected to a first end of the light-emitting module, and the second end of the light-emitting module is connected to multiple contacts at the bottom of the substrate. This design allows the connectivity to be visually displayed through the status of the light-emitting module when the detection card is inserted into the high-speed serial bus slot, without requiring impedance testing pin by pin. The contacts at the bottom of the substrate are designed for precise alignment with the pins in the high-speed serial bus slot. When the detection card is inserted, the contacts contact the pins in the slot, forming part of the detection circuit. This precisely matched contact design ensures the accuracy and consistency of the test, avoiding possible errors in manual testing. The contacts of the detection card connector are connected to the pads of the high-speed serial bus connector and the negative terminal of the power module, forming a complete circuit. When the test card is inserted, the test card connector ensures a reliable electrical connection with the pads of the high-speed serial bus slot. Simultaneously, it connects to the power module on the test card via a cable, forming a closed circuit. This allows the light-emitting module to illuminate based on connectivity, and the brightness of the light-emitting module directly reflects the connectivity status of the pins in the high-speed serial bus slot. This solves the problem of existing solutions where testing the impedance pin by pin in high-density high-speed serial bus slots is time-consuming and prone to misjudgment due to operational errors.
[0052] Example 1:
[0053] like Figure 3 As shown, the high-speed serial bus slot testing device includes a test card 100, a PCIe slot (i.e., a high-speed serial bus connector 200), a test card slot A (i.e., a test card connector 300), and a cable (the cable is...). Figure 3 The connection cable connects the negative terminal of the power module 110 to the test card connector 300. The test card includes battery A, switch Q_A, resistors R_A1, R_A2, R_AN, and light-emitting diodes LED_A1, LED_A2, and LED_AN. Test card slot A includes latch A1 (i.e., first latch 310) and latch A2 (i.e., second latch 320).
[0054] 1) Battery A (i.e., power module 110) is a 3V button cell battery that provides power to the LED;
[0055] 2) Resistors R_A1, R_A2, and R_AN are connected in series between the positive terminal of the button battery and the anode of the LEDs LED_A1, LED_A2, and LED_AN to limit the current in the circuit and control the brightness of the LEDs.
[0056] 3) The anodes of LEDs LED_A1, LED_A2, and LED_AN are connected to resistors R_A1, R_A2, and R_AN respectively, and the cathodes are connected to pins A1, A2, and AN on the gold fingers A side of the test card respectively;
[0057] 4) The gold fingers of the test card can be inserted into the PCIe slot. At this time, pins A1, A2, and AN on side A of the gold fingers are respectively connected to pins A1, A2, and AN on side A of the PCIe slot.
[0058] 5) Pins A1, A2, and AN of test slot A are connected to the negative terminal of the battery on the test card via cables. Test slot A includes two latches: latch A1 and latch A2, which can be latched onto both ends of the PCIe slot. Pins A1, A2, and AN of the test slot should contact the pads A1, A2, and AN of the PCIe slot, respectively.
[0059] 6) During connectivity testing, insert the gold fingers of the test card into the PCIe slot. At this time, the pins A1, A2, ..., AN on side A of the test card's gold fingers correspond one-to-one with the pins A1, A2, ..., AN on side A of the PCIe slot. Simultaneously, fix the test card slot A to side A of the PCIe slot. At this time, the pins A1, A2, ..., AN of the test card slot A correspond one-to-one with the pads A1, A2, ..., AN on side A of the PCIe slot.
[0060] 7) If pin A1 of the PCIe slot is normal, when switch Q_A is pressed and turned on, a complete circuit will be formed between the positive terminal of the battery, switch Q_A, resistor R_A1, LED_A1, pin A1 of the PCIe slot, pad A1 of the PCIe slot, and the negative terminal of the battery, and LED1 will light up. Similarly, if pin A2 of the PCIe slot is normal, LED_A2 will light up when switch Q_A is pressed and turned on. If pin AN of the PCIe slot is normal, LED_AN will light up when switch Q_A is pressed and turned on. Conversely, if pin AM of the PCIe slot is abnormal, its corresponding LED_AM will not light up when switch Q_A is pressed.
[0061] 8) Each LED has a silkscreen marking at its corresponding location on the PCB board. LED_A1 is silkscreened as A1, LED_A2 as A2, and so on, with LED_AN as AN. When switch Q_A is pressed, the connectivity of the PCIe slot can be determined by the on / off state of the LEDs. If an LED is not lit, its silkscreen marking indicates a pin disconnection in the corresponding PCIe slot.
[0062] Example 2:
[0063] like Figure 4 As shown, the high-speed serial bus slot testing device includes a testing card, a PCIe slot (i.e., high-speed serial bus connector 200), a test card slot B (i.e., testing card connector 300), and a cable (the cable is...). Figure 4 The connection cable connects the negative terminal of the power module 110 to the test card connector 300. The test card includes a battery B, a switch Q_B, resistors R_B1, R_B2, and R_BN, and light-emitting diodes LED_B1, LED_B2, and LED_BN. The test card slot B includes a latch B1 (i.e., the first latch 310) and a latch B2 (i.e., the second latch 320).
[0064] 1) Battery B (i.e. power module 110) is a 3V button cell battery that provides power to the LED;
[0065] 2) Resistors R_B1, R_B2, and R_BN are connected in series between the positive terminal of the button battery and the anode of the LEDs LED_B1, LED_B2, and LED_BN to limit the current in the circuit and control the brightness of the LEDs.
[0066] 3) The anodes of LEDs LED_B1, LED_B2, and LED_BN are connected to resistors R_B1, R_B2, and R_BN respectively, and the cathodes are connected to pins B1, B2, and BN on the gold finger A side of the test card respectively.
[0067] 4) The gold fingers of the test card can be inserted into the PCIe slot. At this time, the pins B1, B2, and BN on the A side of the gold fingers are respectively the pins B1, B2, and BN on the B side of the PCIe slot.
[0068] 5) Pins B1, B2, and BN of test card slot B are connected to the negative terminal of the battery on the test card via cables. Test card slot B includes two latches: latch B1 and latch B2, which can be latched onto both ends of the PCIe slot respectively. Pins B1, B2, and BN of the test card slot are in contact with the pads B1, B2, and BN of the PCIe slot respectively.
[0069] 6) During connectivity testing, insert the gold fingers of the test card into the PCIe slot. At this time, the pins B1, B2, ..., BN on side A of the test card's gold fingers correspond one-to-one with the pins B1, B2, ..., BN on side B of the PCIe slot. Simultaneously, fix test card slot A to side B of the PCIe slot. At this time, the pins B1, B2, ..., BN of test card slot B correspond one-to-one with the pads B1, B2, ..., BN on side A of the PCIe slot.
[0070] 7) If pin B1 of the PCIe slot is normal, when switch Q_B1 is pressed and turned on, a complete circuit will be formed between the positive terminal of the battery, switch Q_B1, resistor R_B1, LED_B1, pin B1 of the PCIe slot, pad B1 of the PCIe slot, and the negative terminal of the battery, and LED_B1 will light up. Similarly, if pin B2 of the PCIe slot is normal, LED_B2 will light up when switch Q_B1 is pressed and turned on. If pin BN of the PCIe slot is normal, LED_BN will light up when switch Q_B is pressed and turned on. Conversely, if a pin BM of the PCIe slot is abnormal, its corresponding LED_BM will not light up when switch Q_B is pressed.
[0071] Each LED has a silkscreen marking at its corresponding location on the PCB board. LED_B1 is silkscreened as B1, LED_B2 as B2, and so on, with LED_BN as BN. When switch Q_B is pressed, the connectivity of the PCIe slot can be determined by the on / off state of the LEDs. If an LED is not lit, its silkscreen marking indicates a pin disconnection in the corresponding PCIe slot.
[0072] The power supply module and light-emitting module on the test card are integrated on the substrate. The positive terminal of the power supply module is directly connected to the first end of the light-emitting module, while the second end of the light-emitting module is connected to multiple contacts at the bottom of the substrate. This design allows the connectivity to be visually displayed through the status of the light-emitting module when the test card is inserted into the high-speed serial bus slot, without the need for pin-by-pin impedance testing. The contacts at the bottom of the substrate are designed for precise alignment with the pins in the high-speed serial bus slot. When the test card is inserted, the contacts make contact with the pins in the slot, forming part of the detection circuit. This precisely matched contact design ensures the accuracy and consistency of the test, avoiding potential errors in manual testing. The contacts of the test card connector are connected to the pads of the high-speed serial bus connector and the negative terminal of the power supply module, forming a complete circuit. When the test card is inserted, the test card connector ensures a reliable electrical connection with the pads of the high-speed serial bus slot, while simultaneously connecting to the power supply module on the test card via a cable, forming a closed circuit. This allows the light-emitting module to emit light according to the connectivity, and the on / off state of the light-emitting module directly reflects the connectivity status of the pins in the high-speed serial bus slot. This solves the problem that existing solutions for high-density pin high-speed serial bus slots require time-consuming impedance testing of each pin and are prone to misjudgment due to operational errors.
[0073] The voltage limiting module ensures that the voltage applied to the light-emitting module (such as an LED) remains within a safe range. This prevents damage to the light-emitting module due to excessive voltage, improving the reliability and durability of the entire detection system. By precisely controlling the voltage of the light-emitting module, its operating status can be effectively managed, avoiding damage caused by overheating and voltage fluctuations. This not only extends the lifespan of the light-emitting module but also ensures its stable performance after long-term use; the voltage limiting module guarantees that each light-emitting module emits light at a consistent brightness during the detection process. This makes the test results clearer and more precise, reducing misjudgments caused by brightness changes and improving the accuracy of PCIe slot connectivity testing. The status of the light-emitting module visually reflects the connectivity, eliminating the need for complex impedance measurements or specialized equipment. Operators can determine pin status simply by observing the LED's on / off state, greatly simplifying the testing process and improving efficiency. The visual feedback mechanism of the light-emitting component enhances the user experience during testing, allowing even non-professionals to quickly master how to use the testing tools, lowering the technical barrier. The voltage limiting module protects the light-emitting module through a simple yet effective circuit design, which is more economical than using expensive impedance testing equipment, helping to reduce overall testing costs. The independence and standardized design of each module within the light-emitting component make it easier for on-site maintenance and replacement, and also facilitates subsequent upgrades and optimizations, such as replacing with higher-brightness LEDs or adjusting the voltage limiting module parameters. The ring-shaped backlight provides a uniform background light source, making the indicator effect of the light-emitting diodes (LEDs) more obvious, even in low-light environments, allowing for clear visibility of the LED's on / off state, thereby improving testing accuracy. The lampshade provides physical protection for the LEDs, preventing damage from collisions or scratches during use or transportation, ensuring their long-term stable performance. The ring-shaped backlight design reduces interference from external light on LED brightness judgment, especially in complex or brightly lit environments. The ring backlight helps focus the LED signal, making the test results more reliable. The lampshade design enhances the overall appearance of the test card, making it more professional to use, while also avoiding discomfort or glare from direct contact with the LEDs. The ring backlight design allows the indicator light to be seen not only from the front but also from the sides of the light-emitting module, making it easier for users conducting tests in confined spaces to observe the LED status from different angles. The silkscreen markings directly associate each LED module with a specific pin in the PCIe slot, allowing users to quickly identify which pin has a connectivity problem. This significantly improves the speed and accuracy of fault diagnosis, reducing the time spent troubleshooting.For users lacking specialized knowledge or under time constraints, connectivity can be intuitively determined by observing the LED's status (on or off) and referring to the corresponding silkscreen markings. This eliminates the need for complex instruments or in-depth electronics knowledge, lowering the barrier to entry. Silkscreen markings, as visual identifiers, are consistent with the hardware design, ensuring standardized communication during the testing process. Even in collaborative environments, this ensures clarity and consistency in information transmission. Since each pin has a dedicated LED and corresponding silkscreen marking, misreading or misjudgment that might occur when using tools like multimeters is avoided, improving the reliability of test results. In the absence of design documentation or signal routing diagrams, silkscreen markings provide a direct and effective means of fault location, simplifying maintenance and repair processes. This simple and direct approach is particularly important in field service.
[0074] The high-speed serial bus slot detection device and server system provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.
Claims
1. A high-speed serial bus slot detection device, characterized in that, include: The test card includes: a power module, a light-emitting module, and a substrate. The bottom end of the substrate is provided with multiple contacts. The power module and the light-emitting module are mounted on the substrate. The positive terminal of the power module is electrically connected to the first terminal of the light-emitting module, and the second terminal of the light-emitting module is electrically connected to each of the contacts. A high-speed serial bus connector is provided with a high-speed serial bus slot for electrical connection with each of the contacts, and the high-speed serial bus connector is provided with a plurality of pads. The test card connector has each contact electrically connected to a pad of the high-speed serial bus connector and the negative terminal of the power module.
2. The high-speed serial bus slot detection device according to claim 1, characterized in that, The light-emitting module also includes: Multiple light-emitting components are provided, with the first end of each light-emitting component electrically connected to the positive terminal of the power module, and the second end of each light-emitting component electrically connected to a contact point.
3. The high-speed serial bus slot detection device according to claim 2, characterized in that, The light-emitting component includes: The voltage limiting module and the light-emitting module are provided. The first end of the voltage limiting module is electrically connected to the positive terminal of the power supply module. The first end of the light-emitting module is electrically connected to the second end of the voltage limiting module. The second end of the light-emitting module is electrically connected to one of the contacts.
4. The high-speed serial bus slot detection device according to claim 3, characterized in that, The light-emitting module is externally fitted with a ring-shaped backlight cover.
5. The high-speed serial bus slot detection device according to claim 3, characterized in that, Each of the light-emitting components also includes a screen printing plate, which is mounted on the substrate and corresponds one-to-one with the light-emitting module.
6. The high-speed serial bus slot detection device according to claim 1, characterized in that, The high-speed serial bus slot detection device also includes a switch module, which is electrically connected between the power supply module and the light-emitting module.
7. The high-speed serial bus slot detection device according to claim 1, characterized in that, The high-speed serial bus slot detection device includes a snap-fit structure, and the high-speed serial bus connector and the detection card connector are fixed together by the snap-fit structure.
8. The high-speed serial bus slot detection device according to claim 7, characterized in that, The latching structure includes a first latch and a second latch. One end of the high-speed serial bus connector and one end of the detection card connector are fixed together by the first latch, and the other end of the high-speed serial bus connector and the other end of the detection card connector are fixed together by the second latch.
9. The high-speed serial bus slot detection device according to any one of claims 1 to 8, characterized in that, The substrate is a double-sided circuit board structure, and the power module and the light-emitting module are installed on the first side or the second side of the double-sided circuit board structure.
10. A server system, characterized in that, include: The server and the high-speed serial bus slot detection device according to any one of claims 1 to 9.