Detector and detection system
By using a high-precision reference plate and positioning markers in the detector, the problem of positional alignment accuracy of detector components was solved, enabling an efficient assembly and low-cost inspection system.
Patent Information
- Application Number
- CN202520074076.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-13
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-01-13
AI Technical Summary
In high-precision detection systems, it is difficult to guarantee the positional alignment accuracy of detector components. Existing technologies rely on the experience and operational skills of technicians, resulting in high assembly difficulty, high cost, and poor system stability.
Using the reference datum mark of the reference board as a reference, and using the reference board made of high-precision materials such as metal, ceramic or plastic, the alignment accuracy of the functional components on the printed circuit board with the anti-scattering grid is ensured, and high-precision assembly is achieved using positioning marks and positioning holes.
This improved the positional alignment accuracy of the detector components, reduced assembly difficulty and maintenance costs, and enhanced the performance and stability of the detection system.
Smart Images
Figure CN223842145U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of detection equipment technology, and more specifically, to a detector and a detection system. Background Technology
[0002] The detector includes a printed circuit board and first functional elements, including a scintillator and a photodiode, which are mounted on the printed circuit board. The detector assembly includes a detector, a base, and an anti-scattering grid. The detector is mounted on the base, and the anti-scattering grid is mounted on the detector. The scintillator and photodiode are required to have high alignment accuracy with the anti-scattering grid. In high-precision detection systems, multiple detector assemblies are typically spliced together to cover a larger detection area; these spliced detector assemblies require extremely high positional alignment accuracy.
[0003] During detector manufacturing, the mounting of scintillators and photodiodes on printed circuit boards (PCBs) is typically based on reference points on the PCB (usually symbols such as "+" or "△"). For example, the pick-and-place machine uses these reference points to identify and mount the scintillators and photodiodes. However, during the field assembly of detector components, the assembly of the detector and the base frame, as well as the assembly of the detector and the anti-scattering grid, cannot use the reference points on the PCB. Other reference points are required. However, using different reference points results in significant accumulated errors, reducing not only the alignment accuracy of the scintillators and photodiodes with the anti-scattering grid during field assembly, but also the positional alignment accuracy of multiple assembled detector components. This necessitates adjustments based on the experience and skill of technicians, which is extremely difficult, especially ensuring the positional alignment accuracy of multiple detector components. Furthermore, due to the material properties of printed circuit boards (PCBs), the manufacturing tolerances of PCBs (generally between ±0.1mm and ±0.2mm) cannot be designed to be very small (it is difficult to achieve micron-level tolerances through machining). This results in a larger cumulative error ratio among multiple detector components spliced together. This also reduces the positional alignment accuracy of the multiple detector components spliced together, increases the difficulty for technicians to adjust the positional alignment accuracy of multiple detector components, and even after the positional alignment accuracy of multiple detector components has been adjusted, the position of multiple detector components may still deviate after the detection system has been running for a long time. Once the positional alignment accuracy exceeds the allowable range, technicians will need to readjust it, which will undoubtedly increase the maintenance difficulty and maintenance cost of the detection system. Utility Model Content
[0004] This utility model provides a detector, including: a printed circuit board; a reference plate fixed on the printed circuit board and having a reference reference mark, wherein the manufacturing tolerance of the reference reference mark is smaller than the manufacturing tolerance of the printed circuit board; and a first functional element fixed on the printed circuit board.
[0005] In some exemplary embodiments, the printed circuit board is provided with a clearance structure, the reference plate is located on a first side of the printed circuit board, the first functional element is located on a second side of the printed circuit board, and the clearance structure corresponds to the position of the reference reference mark, for exposing the reference reference mark on the second side of the printed circuit board.
[0006] In some exemplary embodiments, the reference datum is identified as a reference hole, the clearance structure is a clearance hole, and the diameter of the reference hole is smaller than the diameter of the clearance hole, and the manufacturing tolerance of the reference hole is smaller than the manufacturing tolerance of the clearance hole.
[0007] In some exemplary embodiments, the reference reference identifiers include a plurality of spaced-apart ones, and the first functional element is fixed to the printed circuit board with the plurality of reference reference identifiers as references.
[0008] In some exemplary embodiments, the reference plate is made of metal, ceramic, or plastic.
[0009] In some exemplary embodiments, the first functional element includes at least one of a scintillator and a photodiode.
[0010] In some exemplary embodiments, the detector further includes a second functional element, the printed circuit board includes a first segment and a second segment, the reference board and the first functional element are both disposed in the first segment, and the second functional element is disposed in the second segment.
[0011] This utility model embodiment also provides a detection system, including a detector assembly, wherein the detector assembly includes the detector described in any of the above embodiments.
[0012] In some exemplary embodiments, the detector assembly further includes: a base having a first positioning identifier, the detector being fixed to the base, and the first positioning identifier being opposite to the reference reference identifier; and an anti-scattering grid having a second positioning identifier, fixed to the detector, and the second positioning identifier being opposite to the reference reference identifier.
[0013] In some exemplary embodiments, the first positioning mark is a positioning post, the second positioning mark is a positioning hole, the reference mark is a reference hole, the anti-scattering grid is located on the side of the detector facing away from the base frame, and the positioning post passes through the reference hole and the positioning hole.
[0014] In some exemplary embodiments, the first positioning identifier, the second positioning identifier, and the reference reference identifier include multiple sets that are configured in a one-to-one correspondence, and the multiple second positioning identifiers are made based on the multiple first positioning identifiers, and the multiple reference reference identifiers are also made based on the multiple first positioning identifiers.
[0015] The detector provided in this embodiment uses the reference datum mark on the reference board as the datum during both the detector manufacturing process and the on-site assembly process of the detector components. This ensures that the datum used in the detector manufacturing process is consistent with the datum used in the on-site assembly process of the detector components. Since the manufacturing tolerance of the reference datum mark is smaller than that of the printed circuit board, the positional accuracy of the first functional element on the printed circuit board is higher, the alignment accuracy of the first functional element with the anti-scattering grid is higher, and the positional alignment accuracy of the multiple detector components spliced together is higher. Therefore, this solution can effectively improve the performance of the detection system.
[0016] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of this invention can be realized and obtained by means of the structures particularly pointed out in the description and the drawings. Attached Figure Description
[0017] The accompanying drawings are provided to further illustrate the technical solution of this utility model and constitute a part of the specification. They are used together with the embodiments of this application to explain the technical solution of this utility model and do not constitute a limitation on the technical solution of this utility model.
[0018] Figure 1 An exploded view of the detector provided in some embodiments of this utility model;
[0019] Figure 2 for Figure 1 A top view of the assembled detector phase structure;
[0020] Figure 3 This is a partially exploded structural diagram of a detector assembly provided in some embodiments of the present invention.
[0021] The correspondence between the reference numerals and the component names is as follows:
[0022] 100 Printed circuit board, 110 First board segment, 111 Clearance structure, 120 Second board segment, 200 Base board, 210 Reference mark, 300 First functional element, 400 Base frame, 410 First positioning mark, 500 Anti-scattering grid, 510 Second positioning mark, 600 Second functional element. Detailed Implementation
[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be arbitrarily combined with each other.
[0024] The detector provided in this embodiment of the utility model, such as Figure 1 and Figure 2 As shown, it includes: a printed circuit board 100; a reference board 200, which is fixed to the printed circuit board 100 and has a reference reference mark 210, and the manufacturing tolerance of the reference reference mark 210 is smaller than the manufacturing tolerance of the printed circuit board 100; and a first functional element 300, which is fixed to the printed circuit board 100.
[0025] The detector uses the reference datum mark 210 of the reference board 200 as the datum during both the detector manufacturing process and the on-site assembly of the detector components. This ensures that the datum used in the detector manufacturing process is consistent with the datum used in the on-site assembly of the detector components. Since the manufacturing tolerance of the reference datum mark 210 is smaller than that of the printed circuit board 100, the positional accuracy of the first functional element 300 on the printed circuit board 100 is higher (e.g., ...). Figure 1 and Figure 2 As shown), the first functional element 300 has higher alignment accuracy with the anti-scattering grid 500 (e.g. Figure 3 As shown in the figure, the alignment accuracy of multiple detector components spliced together is higher, so this scheme can effectively improve the performance of the detection system.
[0026] Among them, such as Figures 1 to 3 As shown, the reference datum markers 210 include multiple ones spaced apart. The first functional element 300 is fixed on the printed circuit board 100 with the multiple reference datum markers 210 as references. The base frame 400, detector and anti-scattering grid 500 are assembled in the field with the multiple reference datum markers 210 as references. In this way, the positional accuracy of the first functional element 300 on the printed circuit board 100 is higher, the alignment accuracy of the first functional element 300 with the anti-scattering grid 500 is higher, and the positional alignment accuracy of the multiple detector components spliced together is higher.
[0027] Alternatively, the reference plate 200 can be made of materials with small manufacturing tolerances and high strength (such as metal, ceramic or plastic). These materials can be easily machined to produce micron-level (such as within ±10 microns) reference reference marks 210. This not only improves the alignment accuracy of the first functional element 300 and the anti-scattering grid 500 during the on-site assembly of the detector assembly, but also improves the positional alignment accuracy of multiple detector assemblies spliced together in the detection system.
[0028] Preferably, the reference plate 200 is made of a material with a similar coefficient of thermal expansion to the printed circuit board 100, which can effectively reduce the bending deformation of the detector under the action of thermal expansion and contraction.
[0029] In some examples, such as Figure 1 and Figure 2 As shown, the printed circuit board 100 is provided with a clearance structure 111. The reference plate 200 is located on the first side of the printed circuit board 100, and the first functional element 300 is located on the second side of the printed circuit board 100. The clearance structure 111 corresponds to the position of the reference datum mark 210 and is used to expose the reference datum mark 210 on the second side of the printed circuit board 100. The pick-and-place machine identifies the reference datum mark 210 on the second side of the printed circuit board 100 and uses the reference datum mark 210 as a reference to mount the first functional element 300 onto the printed circuit board 100. Since the manufacturing tolerance of the reference datum mark 210 is smaller than that of the printed circuit board 100, the mounting accuracy of the first functional element 300 on the printed circuit board 100 is higher, that is, the positional accuracy of the first functional element 300 on the printed circuit board 100 is higher.
[0030] In some embodiments, such as Figure 1 and Figure 2 As shown, reference datum mark 210 is a reference hole, and clearance structure 111 is a clearance hole. The diameter of the reference hole is smaller than that of the clearance hole, and the manufacturing tolerance of the reference hole is smaller than that of the clearance hole (the manufacturing tolerance of reference datum mark 210 is smaller than the manufacturing tolerance of printed circuit board 100, i.e., the manufacturing tolerance of the reference hole is smaller than that of the clearance hole). The smaller diameter of the reference hole ensures that the pick-and-place machine can identify reference datum mark 210 on the second side of printed circuit board 100. The manufacturing tolerance of the reference hole is set to the micrometer level, resulting in higher mounting accuracy of the first functional element 300 on printed circuit board 100. During the field assembly of the detector assembly, the alignment accuracy between the first functional element 300 and the anti-scattering grid 500 is higher, and the positional alignment accuracy of multiple detector assemblies spliced together in the detection system is higher.
[0031] In some embodiments, such as Figures 1 to 3As shown, the first functional element 300 includes at least one of a scintillator and a photodiode. Alternatively, the first functional element 300 may include both a scintillator and a photodiode; or it may include a scintillator but not a photodiode; or it may include a photodiode but not a scintillator, etc. All of the above can achieve the purpose of this application, and their intent does not depart from the design concept of this utility model. Therefore, they will not be elaborated further here, and all should fall within the protection scope of this application.
[0032] In some embodiments, such as Figure 1 As shown, the detector also includes a second functional element 600. The printed circuit board 100 includes a first section 110 and a second section 120. The reference board 200, the scintillator, and the photodiode are all disposed on the first section 110, and the second functional element 600 is disposed on the second section 120. The reference board 200 is attached to the first side of the first section 110, and the scintillator and the photodiode are mounted on the second side of the first section 110.
[0033] The detection system provided in this embodiment of the utility model includes a detector assembly, such as... Figure 3 As shown, the detector assembly includes the detector described in any of the above embodiments.
[0034] This detection system possesses all the advantages of the detectors provided in any of the above embodiments, and will not be repeated here. The detection system includes multiple detector components, which are sequentially assembled together.
[0035] In some examples, such as Figure 3 As shown, each detector assembly further includes: a base frame 400 with a first positioning mark 410, the detector being fixed to the base frame 400, and the first positioning mark 410 being opposite to a reference mark 210, enabling the base frame 400 to be assembled with the detector on-site using the reference mark 210 as a reference; and an anti-scattering grid 500 with a second positioning mark 510, the anti-scattering grid 500 being fixed to the detector, and the second positioning mark 510 being opposite to the reference mark 210, enabling the anti-scattering grid 500 to be assembled with the detector on-site using the reference mark 210 as a reference. This scheme achieves extremely high precision in the fit and alignment of the first positioning mark 410 and the reference mark 210, and extremely high precision in the fit and alignment of the second positioning mark 510 and the reference mark 210, thus resulting in extremely high alignment precision between the first functional element 300 and the anti-scattering grid 500. By sequentially splicing multiple base frames 400 together, multiple detector assemblies can be sequentially spliced together, achieving extremely high positional alignment precision for the multiple detector assemblies.
[0036] In some embodiments, such as Figures 1 to 3As shown, the first positioning mark 410 is a positioning post, the second positioning mark 510 is a positioning hole, the reference mark 210 is a reference hole, and the anti-scattering grid 500 is located on the side of the detector facing away from the base frame 400. The positioning post is sequentially inserted into the reference hole and the positioning hole. This scheme makes the on-site assembly process of the detector assembly simpler and faster. The positioning holes and positioning posts can be easily machined to the micrometer level (e.g., within ±10 micrometers). Therefore, the fitting accuracy of the positioning post, positioning hole, and reference hole is extremely high, and the installation error is minimal. Consequently, the cumulative error of multiple detector components spliced together is extremely small, and the positional alignment accuracy is extremely high, eliminating the need for adjustments by technicians. Even after the detection system has been running for a long time, some or all of the multiple detector components will not experience positional deviation. Therefore, this scheme reduces the maintenance difficulty and cost of the detection system.
[0037] Because the manufacturing tolerance of the printed circuit board 100 cannot be set to be relatively small (due to the material limitations of the printed circuit board 100), it is difficult to ensure high alignment accuracy between the first functional element 300 and the anti-scattering grid 500 by directly setting the reference hole on the printed circuit board 100, and it is also difficult to ensure extremely high positional alignment accuracy of multiple detector components.
[0038] In some examples, such as Figures 1 to 3 As shown, for each detector component: the first positioning mark 410, the second positioning mark 510, and the reference mark 210 include multiple sets (two sets in this application, but three or four sets are also possible), and the multiple second positioning marks 510 are manufactured based on the multiple first positioning marks 410, and the multiple reference marks 210 are also manufactured based on the multiple first positioning marks 410. This eliminates the need to modify the base frame 400 and the anti-scattering grid 500, effectively reducing the modification cost of the detection system. Alternatively, during the on-site assembly of the detector components, the reference holes of the detector and the positioning holes of the anti-scattering grid 500 are sequentially fitted onto the positioning posts of the base frame 400, achieving high-precision on-site assembly of the base frame 400, detector, and anti-scattering grid 500. This ensures extremely high positional alignment accuracy after multiple detector components are sequentially spliced together, eliminating the need for adjustments based on experience and operational skills by technicians. Furthermore, the detection system remains relatively stable after long-term operation, with minimal or no deviation in some or all of the multiple detector components, thus improving the reliability and stability of the detection system. Moreover, even if multiple detector components deviate, the alignment accuracy of the multiple detector components can be adjusted in a very short time based on the reference hole, thus reducing the maintenance difficulty and cost of the detection system.
[0039] In summary, the detector provided by this utility model uses the reference datum mark on the reference board as the datum during both the detector manufacturing process and the on-site assembly process of the detector components. This ensures that the datum used in the detector manufacturing process is consistent with the datum used in the on-site assembly process of the detector components. Since the manufacturing tolerance of the reference datum mark is smaller than that of the printed circuit board, the positional accuracy of the first functional element on the printed circuit board is higher, the alignment accuracy of the first functional element with the anti-scattering grid is higher, and the positional alignment accuracy of the multiple detector components spliced together is higher. Therefore, this solution can effectively improve the performance of the detection system.
[0040] In the description of this utility model, it should be noted that the terms "upper", "lower", "one side", "the other side", "one end", "the other end", "side", "opposite", "four corners", "periphery", "'mouth' structure", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the structure referred to has a specific orientation, or is constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0041] In the description of the embodiments of this utility model, unless otherwise expressly specified and limited, the terms "connection," "direct connection," "indirect connection," "fixed connection," "installation," and "assembly" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. The terms "installation," "connection," and "fixed connection" can refer to a direct connection or an indirect connection through an intermediate medium, or they can refer to the internal communication between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.
[0042] Although the embodiments disclosed in this utility model are as described above, the content described is only for the purpose of facilitating understanding of this utility model and is not intended to limit this utility model. Any person skilled in the art to which this utility model pertains may make any modifications and changes in the form and details of the implementation without departing from the spirit and scope disclosed in this utility model, but the patent protection scope of this utility model shall still be defined by the appended claims.
Claims
1. A detector, characterized in that, include: Printed circuit boards; A reference board, fixed to the printed circuit board, is provided with a reference datum mark, and the manufacturing tolerance of the reference datum mark is smaller than the manufacturing tolerance of the printed circuit board; and The first functional element is fixed on the printed circuit board.
2. The detector according to claim 1, characterized in that, The printed circuit board is provided with a clearance structure. The reference plate is located on the first side of the printed circuit board, and the first functional element is located on the second side of the printed circuit board. The clearance structure corresponds to the position of the reference reference mark and is used to expose the reference reference mark on the second side of the printed circuit board.
3. The detector according to claim 2, characterized in that, The reference datum is a datum hole, the clearance structure is a clearance hole, the diameter of the datum hole is smaller than the diameter of the clearance hole, and the manufacturing tolerance of the datum hole is smaller than the manufacturing tolerance of the clearance hole.
4. The detector according to any one of claims 1 to 3, characterized in that, The reference datum markers include a plurality of spaced-apart markers, and the first functional element is fixed to the printed circuit board with the plurality of reference datum markers as references.
5. The detector according to any one of claims 1 to 3, characterized in that, The reference plate is made of metal, ceramic, or plastic.
6. The detector according to any one of claims 1 to 3, characterized in that, The first functional element includes at least one of a scintillator and a photodiode.
7. The detector according to any one of claims 1 to 3, characterized in that, Also includes: The second functional element is provided in the printed circuit board, which includes a first board segment and a second board segment. The reference board and the first functional element are both disposed in the first board segment, and the second functional element is disposed in the second board segment.
8. A detection system, characterized in that, It includes a detector assembly, the detector assembly comprising the detector as claimed in any one of claims 1 to 7.
9. The detection system according to claim 8, characterized in that, The detector assembly also includes: A base frame having a first positioning identifier, the detector being fixed to the base frame, and the first positioning identifier being opposite to the reference datum identifier; and An anti-scattering grid with a second positioning identifier is fixed to the detector, and the second positioning identifier is opposite to the reference reference identifier.
10. The detection system according to claim 9, characterized in that, The first positioning mark is a positioning post, the second positioning mark is a positioning hole, the reference mark is a reference hole, the anti-scattering grid is located on the side of the detector facing away from the base frame, and the positioning post passes through the reference hole and the positioning hole.
11. The detection system according to claim 9 or 10, characterized in that, The first positioning identifier, the second positioning identifier, and the reference benchmark identifier include multiple sets that are configured in a one-to-one correspondence, and the multiple second positioning identifiers are made based on the multiple first positioning identifiers, and the multiple reference benchmark identifiers are also made based on the multiple first positioning identifiers.