Cooling plate and baking device for cooling hot plate in photoetching machine

Abstract

The utility model provides a cooling plate and baking device for cooling a hot plate in a photoetching machine table, which comprises a body, and an inlet and an outlet which are communicated with the inside are formed in the side edge of the body; the interior of the body is of a cavity design and is provided with a guide structure, the guide structure at least comprises a first flow guide plate and second flow guide plates, the first flow guide plate is arranged between the inlet and the outlet and extends towards the interior of the body, the second flow guide plates are symmetrically arranged on the two sides of the extending end of the first flow guide plate, and the first flow guide plate and the second flow guide plate are oppositely arranged. And the guide plate is used for guiding cooling liquid to enter from the inlet and flow to the outlet along a preset path. The internal structure of the body is changed into full-cavity filling from an original pipeline structure, and the guide structure is arranged, so that cooling liquid can be uniformly distributed in a larger area, and the heat conduction efficiency is remarkably improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a cooling plate and baking device for cooling the hot plate in a lithography machine. Background Technology

[0002] In photolithography, different hot plates serve different functions. For example, the soft bake hot plate removes moisture from the photoresist, laying a good foundation for subsequent exposure, development, and etching processes to form an effective pattern. In actual production, due to the different characteristics of different photoresists, their soft bake temperature requirements also vary. It often happens that the previous batch of goods was set to a soft bake temperature of 130°C, while the next batch requires a soft bake temperature of only 90°C. In this case, the wafers on the chute have to wait on the cold plate or in the transport buffer until the hot plate temperature is adjusted appropriately. Existing cold plates cool down via internal cooling pipes, and this waiting time is unstable, ranging from approximately 50 to 70 minutes. This waiting time for the wafers reduces the hourly output of the equipment, thus affecting the overall production line capacity. Utility Model Content

[0003] In order to solve all or part of the problems of the prior art, this utility model provides a cooling plate and baking device for cooling the hot plate in a lithography machine. The internal structure of the main body is changed from the original pipeline structure to a full cavity filling structure, and a guiding structure is provided to increase the heat transfer area and further improve the cooling efficiency.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] A cooling plate for cooling a hot plate in a lithography machine includes a body with an inlet and an outlet communicating with the interior on its side. The interior of the body is designed as a cavity and has a guiding structure. The guiding structure includes at least a first guide plate and a second guide plate. The first guide plate is disposed between the inlet and the outlet and extends into the interior of the body. The second guide plate is symmetrically disposed on both sides of the extension end of the first guide plate to guide coolant into the body from the inlet and flow to the outlet along a predetermined path.

[0006] The body is made of nickel alloy, and its surface is sequentially electroplated with a layer of metallic silver and a layer of metallic gold with a thickness of 3-7 μm.

[0007] The height of the first guide plate and the second guide plate is the same as the height of the cavity; the connection between the first guide plate and the second guide plate and the main body, and the connection between the first guide plate and the second guide plate, are all made by welding or integral molding.

[0008] The second guide plate is curved in an arc shape and extends towards the two side walls of the body.

[0009] The inlet is located at the bottom of the side of the body, and the outlet is located at the top of the side of the body, higher than the inlet.

[0010] The body is also provided with at least two clearance holes, which extend from the outer surface of the body to the interior, and are used to avoid components on the hot plate in the lithography machine.

[0011] The two clearance holes are located in the middle of the symmetrically arranged second guide plates.

[0012] The body is circular, matching the size of the hot plate in the lithography machine.

[0013] This utility model also provides a baking device for a lithography machine, which adopts the cooling plate described above, including a base, at least one hot plate is provided above the base, and a top cover is provided above the hot plate. It also includes a cooling mechanism provided on the base, the cooling mechanism including a driving part and the cooling plate, the cooling plate covering the hot plate for cooling under the drive of the driving part.

[0014] A cooling gas pipeline is provided below the hot plate, and a waste recovery pipeline is provided on the side. The cooling gas pipeline outputs cooling gas to blow and cool the lower surface of the hot plate, and the waste recovery pipeline recovers the used cooling gas.

[0015] This utility model has at least the following beneficial effects:

[0016] 1) By employing a special coating structure and optimizing the internal structure of the body, the cooling efficiency of the cooling plate is significantly improved. Before the improvement measures were adopted, it took about 60 minutes to cool a hot plate of the same specifications, while the improved cooling plate reduces the cooling time to about 7.5 minutes, increasing efficiency by about 8 times. This efficient cooling method not only meets the rapid cooling requirements of lithography equipment and shortens the production cycle, but also completes more batches of hot plate cooling operations per unit time, significantly improving the turnaround speed of the entire production process, thereby effectively reducing production costs.

[0017] 2) The heights of the first and second guide plates match the height of the main body cavity, and the connection is achieved through welding or integral molding, making the overall structure of the cooling plate more stable and enhancing the durability and reliability of the device. The arc-shaped bending design of the second guide plate effectively reduces coolant flow resistance and turbulence, improves the uniformity and stability of the flow, and allows the coolant to more smoothly contact the hot plate to absorb heat. The rational layout of the inlet and outlet, and the design that utilizes the principle of thermal expansion and contraction to allow the coolant to rise and flow out of the outlet, achieves highly efficient heat exchange. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the specific embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a cooling plate used for cooling the hot plate in a lithography machine in Embodiment 1 of this utility model.

[0020] Figure 2 This is a schematic diagram of the structure of a baking device for a lithography machine in Embodiment 2 of this utility model.

[0021] Reference numerals: 1. Inlet; 2. Outlet; 3. Guide structure; 301. First guide plate; 302. Second guide plate; 4. Clearance hole; 5. Base; 6. Hot plate; 7. Top cover; 8. Cooling mechanism; 801. Drive unit; 802. Cooling plate; 9. Cooling gas pipeline; 10. Waste recovery pipeline. Detailed Implementation

[0022] The technical solutions in specific embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0023] Example 1

[0024] In this embodiment of the utility model, in conjunction with reference to the reference Figure 1As shown, a cooling plate for cooling a hot plate in a lithography machine is provided. This cooling plate has a body with an inlet 1 and an outlet 2 communicating with the interior on its side. The interior of the body is designed with a cavity structure, which provides the necessary space for the flow of coolant. Furthermore, a guide structure 3 is provided inside the body, which plays a crucial role in guiding the flow of coolant. Specifically, the guide structure 3 includes at least a first guide plate 301 and a second guide plate 302. The first guide plate 301 is disposed between the inlet 1 and the outlet 2 and extends into the interior of the body, effectively guiding the initial flow direction of the coolant. The second guide plates 302 are symmetrically arranged on both sides of the extended end of the first guide plate 301. When the coolant enters the cavity of the body from the inlet 1, it first flows in a specific direction under the guidance of the first guide plate 301, and then enters the guiding range of the second guide plates 302 on both sides of the extended end of the first guide plate 301. The second guide plate 302 works in conjunction with the first guide plate 301 to precisely guide the coolant along a pre-set path to the outlet 2, thereby achieving orderly and efficient flow of the coolant within the cooling plate and cooling the hot plate. This cooling plate design ensures that the coolant covers as much of the internal space as possible during the entire flow from inlet 1 to outlet 2, improving cooling efficiency and effectively cooling the hot plate in the lithography machine.

[0025] The cooling plate body is made of nickel alloy, which possesses good mechanical properties and a certain thermal conductivity, with a thermal conductivity coefficient of approximately 50 W / (M·K). To effectively improve the cooling efficiency of the cooling plate, a special plating structure is applied to the surface of the body, consisting of two layers of electroplated metallic silver and metallic gold. The thickness of the metallic gold plating is within the range of 3-7 μm; in this embodiment, a 5 μm thick metallic gold plating is used. Metallic silver has a high thermal conductivity coefficient, reaching up to 429 W / (M·K), exhibiting excellent heat conduction performance. When a layer of metallic gold is electroplated onto the surface of metallic silver, precise testing shows that a plating thickness of 5 μm reduces the thermal conductivity of silver by approximately 5%. Calculations show that the overall thermal conductivity coefficient after gold plating still reaches 429 × 0.95 = 407 W / (M·K). Although thermal conductivity may be slightly reduced, this design still offers numerous advantages. From a chemical stability perspective, gold is extremely stable and can resist chemical reagents and moisture erosion during photolithography, protecting the silver plating from corrosion and oxidation, and ensuring long-term stable thermal conductivity. From a thermal perspective, while gold's thermal conductivity is lower than silver's, it buffers and homogenizes heat flow. This results in more uniform heat transfer across the plate surface, preventing localized overheating or uneven heat conduction. During the cooling of the hot plate in the photolithography machine, this allows for synchronized cooling across all parts, enhancing cooling stability and efficiency. This silver-then-gold plating structure significantly improves the cooling effect of the cooling plate, contributing to increased overall efficiency of the photolithography process.

[0026] Before adopting this improved coating structure, cooling operations using a hot plate of the same specifications took approximately 60 minutes. However, with the improved cooling plate, the cooling time was significantly reduced to about 7.5 minutes, increasing cooling efficiency by approximately 8 times. Furthermore, the internal structure of the cooling plate itself was optimized. The original internal structure was a pipe system, which had limitations in heat transfer, such as a relatively small heat transfer area. The internal structure was now changed to a fully filled cavity. This fully filled cavity structure allows the coolant to flow throughout the entire cavity, greatly increasing the contact area with the plate and thus increasing the heat transfer area, further improving cooling efficiency.

[0027] The heights of the first guide plate 301 and the second guide plate 302 are matched with the cavity height of the main body, ensuring that the coolant can fully fill the entire cavity during the flow process, thus improving the flow efficiency. The connections between the first and second guide plates 301 and the main body, and between the first and second guide plates 301 and 302, are made by welding or integral molding, making the overall structure more stable, enhancing the durability and reliability of the device, and reducing the risk of leakage due to loose connections. The second guide plate 302 is curved in an arc shape, extending towards the side walls of the main body. This unique design better guides the coolant to flow along a predetermined path, reducing resistance and turbulence during flow, thereby improving the uniformity and stability of the flow, which is particularly important for the high-precision process environment in lithography machines. Inlet 1 is located at the bottom of the side of the main body, and outlet 2 is located at the top of the side of the main body, with outlet 2 higher than inlet 1. This layout facilitates the formation of an upward flow path, allowing the coolant to come close to the hot plate in the lithography machine during the flow process, absorbing its heat and achieving efficient heat exchange. When the coolant reaches outlet 2, due to the principle of thermal expansion and contraction, the coolant, having absorbed heat, expands in volume and rises to flow out of outlet 2. This process not only effectively removes the heat generated by components such as the hot plate, lowering their temperature, but also allows the coolant to be smoothly discharged from the device, providing power for subsequent cooling cycles and further improving the overall heat dissipation efficiency and operational stability of the lithography machine.

[0028] In this embodiment, the main body is circular, matching the size of the hot plate in the lithography machine, facilitating close thermal contact and achieving optimal cooling. The main body also has at least two clearance holes 4 extending from its outer surface to its interior. These holes avoid components on the hot plate in the lithography machine, preventing interference between the cooling plate and these components and ensuring smooth installation and normal operation of the cooling plate. The two clearance holes 4 are located in the middle of the symmetrically arranged second guide plates 302. This symmetrical layout is not only aesthetically pleasing but also ensures balanced airflow, making the airflow effect consistent on both sides, further improving the device's performance, ensuring uniform distribution of coolant within the main body, and achieving all-around heat exchange.

[0029] Example 2

[0030] Reference Figure 2As shown, this utility model also provides a baking device for a lithography machine, which employs the cooling plate described in Embodiment 1. The baking device includes a base 5, with at least one hot plate 6 positioned above the base 5, and a top cover 7 positioned above the hot plate 6. Furthermore, it includes a cooling mechanism 8 mounted on the base 5, comprising a driving unit 801 and a cooling plate 802. Driven by the driving unit 801, the cooling plate 802 covers the hot plate 6, thereby effectively cooling the hot plate 6. A cooling gas pipeline 9 is located below the hot plate 6, and a waste recovery pipeline 10 is located on its side. The cooling gas pipeline 9 outputs cooling gas to blow and cool the lower surface of the hot plate 6, while the waste recovery pipeline 10 is responsible for recovering the used cooling gas. This design not only improves cooling efficiency but also achieves resource recycling and reduces environmental impact.

[0031] In the baking apparatus, the cooling plate 802, driven by the drive unit 801, can cover the hot plate 6 for cooling. At the same time, a cooling gas pipe 9 is provided below the hot plate 6 to blow cooling gas onto the lower surface of the hot plate 6. This method of cooling from both above and below can remove the heat from the hot plate 6 more quickly than a single cooling path, greatly improving the overall cooling efficiency.

[0032] It should be noted that, for those skilled in the art, several improvements and modifications can be made to this utility model without departing from the principle of this utility model, and these improvements and modifications also fall within the scope of protection of the claims of this utility model.

Claims

1. A cooling plate for cooling a hot plate in a lithography machine, characterized in that, The device includes a main body, on the side of which are provided an inlet (1) and an outlet (2) communicating with the interior. The interior of the main body is designed as a cavity and is provided with a guide structure (3). The guide structure (3) includes at least a first guide plate (301) and a second guide plate (302). The first guide plate (301) is disposed between the inlet (1) and the outlet (2) and extends into the interior of the main body. The second guide plate (302) is symmetrically disposed on both sides of the extension end of the first guide plate (301) for guiding coolant from the inlet (1) to flow along a predetermined path to the outlet (2).

2. The cooling plate according to claim 1, characterized in that, The body is made of nickel alloy, and its surface is sequentially electroplated with a layer of metallic silver and a layer of metallic gold with a thickness of 3-7 μm.

3. The cooling plate according to claim 1, characterized in that, The heights of the first guide plate (301) and the second guide plate (302) are the same as the height of the cavity; the connection between the first guide plate (301) and the second guide plate (302) and the main body, and the connection between the first guide plate (301) and the second guide plate (302) are all made by welding or integral molding.

4. The cooling plate according to claim 1, characterized in that, The second guide plate (302) is curved in an arc shape and extends towards the two side walls of the body.

5. The cooling plate according to claim 1, characterized in that, The inlet (1) is located at the bottom of the side of the body, and the outlet (2) is located at the top of the side of the body, higher than the inlet (1).

6. The cooling plate according to claim 1, characterized in that, The body is also provided with at least two clearance holes (4), which extend from the outer surface of the body to the interior and are used to avoid components on the hot plate in the lithography machine.

7. The cooling plate according to claim 6, characterized in that, The two clearance holes (4) are located in the middle of the symmetrically arranged second guide plates (302).

8. The cooling plate according to claim 1, characterized in that, The body is circular, matching the size of the hot plate in the lithography machine.

9. A baking apparatus for a photolithography machine, characterized in that, The cooling plate according to any one of claims 1-8 includes a base (5), at least one hot plate (6) is disposed above the base (5), and a top cover (7) is disposed above the hot plate (6). It also includes a cooling mechanism (8) disposed on the base (5). The cooling mechanism (8) includes a driving part (801) and the cooling plate (802). The cooling plate (802) covers the hot plate (6) for cooling under the drive of the driving part (801).

10. The baking apparatus according to claim 9, characterized in that, A cooling gas pipeline (9) is provided below the hot plate (6), and a waste recovery pipeline (10) is provided on the side. The cooling gas pipeline (9) outputs cooling gas to blow and cool the lower surface of the hot plate (6), and the waste recovery pipeline (10) recovers the used cooling gas.

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