Chip capacitor capable of being connected in parallel

Abstract

The utility model discloses a chip capacitor capable of being connected in parallel, which belongs to the field of capacitors and comprises a plurality of chip capacitors which are connected in parallel through a plurality of positioning pins penetrating through the upper end and the lower end of an electrode of the chip capacitor. Compared with the prior art, the chip capacitor fixing device has the advantages that the fixing structures for fixing the chip capacitors are mounted in the outer positive electrode and the outer negative electrode, the clamping plates are driven to be hidden in or extend out of the storage grooves through rotation of the screw rods, and after the clamping plates extend out, the chip capacitors can be fixed in the storage grooves. The buckle plate slides into the L-shaped via holes in the top ends of the outer positive electrode and the outer negative electrode to be clamped and fixed, the buckle plate only needs to be ejected out of the opening in the other end of each L-shaped via hole during disassembly, disassembly can be completed, and the hidden clamping and fixing device is fixed in the chip capacitor, so that the hidden clamping and fixing device can be disassembled through the structure of the hidden clamping and fixing device. And external accessories are not needed.

Description

Technical Field

[0001] This utility model relates to the field of capacitors, specifically to a surface-mount capacitor that can be connected in parallel. Background Technology

[0002] Surface mount capacitors, also known as chip capacitors, are electronic components widely used in electronic devices. Because they store charge and adjust circuit frequency, they are widely used in the circuit boards of various electronic products. In order to increase capacitance, improve the working performance of capacitors, and reduce impedance in AC circuits, people will select capacitors of different power ratings and connect them in parallel according to the equipment used.

[0003] Existing parallel connection methods for surface mount capacitors typically use multiple locating pins to connect the individual surface mount capacitors, and then use screws and connecting plates to fix the outer walls of each surface mount capacitor in place, thereby preventing the parallel surface mount capacitors from falling off.

[0004] While this connection method can effectively connect various parallel surface-mount capacitors, since the connecting plates are mostly fixed on the outer walls of the left and right ends of the surface-mount capacitors, it requires more space during installation. Furthermore, the connecting plates and other structures need to be purchased separately and cannot be moved synchronously with the disassembly of the surface-mount capacitors. If there is a shortage of connecting plate components during assembly, it can lead to unstable connections between the parallel surface-mount capacitors. Utility Model Content

[0005] The technical problem to be solved by this utility model is that existing parallel-connectable surface-mount capacitors rely on the auxiliary connection of external accessories when connected in parallel, while the parallel-connectable surface-mount capacitors themselves do not have a fixing mechanism.

[0006] To solve the above-mentioned technical problems, the technical solution provided by this utility model is as follows: a surface mount capacitor that can be connected in parallel, comprising a plurality of surface mount capacitors, each of the surface mount capacitors being connected in parallel through a plurality of positioning pins passing through the upper and lower ends of the surface mount capacitor electrodes, the upper and lower ends of the surface mount capacitors being provided with a plurality of hidden locking and fixing devices, the hidden locking and fixing devices comprising a snap plate passing through the top surface of the surface mount capacitor and a screw for controlling the snap plate to rotate, the screw passing through the lower side of the surface mount capacitor and the side of the snap plate, and the bottom surface of the surface mount capacitor being provided with a storage groove for storing the snap plate.

[0007] As an improvement, the mounting hole on the top surface of the surface mount capacitor is an L-shaped through hole, and the mounting hole on the top surface of the surface mount capacitor passes through the side surface of the surface mount capacitor.

[0008] As an improvement, one side of the screw is provided with a polygonal fixing post that passes through the buckle plate, and the other end of the screw is provided with a tightening groove corresponding to a screwdriver.

[0009] As an improvement, the chip capacitor consists of a multi-slot ceramic dielectric film, inner positive electrodes and inner negative electrodes that are alternately placed inside each cavity of the multi-slot ceramic dielectric film, and an outer positive electrode that uniformly connects each inner positive electrode and an outer negative electrode that uniformly connects each inner negative electrode. The snap-on plate, screw and storage slot are all located inside the outer positive electrode and the outer negative electrode.

[0010] As an improvement, both the buckle plate and the screw are made of insulating material.

[0011] As an improvement, the inner positive electrode and the outer positive electrode, as well as the inner negative electrode and the outer negative electrode, are all connected by welding.

[0012] The advantages of this invention compared to existing technologies are as follows: This device installs the fixing structure for each surface-mount capacitor inside the outer positive and outer negative electrodes. By rotating the screw, the latch plate is moved to be hidden or extended in the storage slot. When the latch plate is extended, it is slid into the L-shaped through hole at the top of the outer positive and outer negative electrodes for locking and fixing. During disassembly, the latch plate can be pushed out from the other end of the L-shaped through hole to complete the disassembly. Because the hidden locking and fixing device is fixed inside the surface-mount capacitor, it can be disassembled through its own structure without the need for external accessories. Attached Figure Description

[0013] Figure 1 This is a general structural diagram of a surface-mount capacitor that can be connected in parallel according to this utility model.

[0014] Figure 2 This is an exploded view of the overall structure of a surface-mount capacitor that can be connected in parallel according to this utility model.

[0015] Figure 3 This is a cross-sectional view of a surface mount capacitor that can be connected in parallel according to this utility model.

[0016] Figure 4 This is an exploded view of a concealed snap-fit ​​fixing device for a surface-mount capacitor that can be connected in parallel according to this utility model.

[0017] As shown in the figure: 1. Surface mount capacitor; 11. Multi-slot ceramic dielectric film; 12. Inner positive electrode; 13. Inner negative electrode; 14. Outer positive electrode; 15. Outer negative electrode; 2. Positioning pin; 3. Concealed locking device; 31. Clip plate; 32. Screw; 321. Polygonal fixing post; 322. Tightening groove; 33. Storage slot. Detailed Implementation

[0018] The present invention will now be described in further detail with reference to the accompanying drawings.

[0019] As per the instruction manual Figure 1 , 2As shown, the chip capacitor 1 includes several chip capacitors. The chip capacitor 1 consists of a multi-slot ceramic dielectric film 11, inner positive electrodes 12 and inner negative electrodes 13 alternately placed inside each cavity of the multi-slot ceramic dielectric film 11, and outer positive electrodes 14 and outer negative electrodes 15 uniformly connected to each inner positive electrode 12 and each inner negative electrode 13. The inner positive electrodes 12 and outer positive electrodes 14, as well as the inner negative electrodes 13 and outer negative electrodes 15, are all connected by welding. Before sintering, the multi-slot ceramic dielectric film 11 is a single film structure. After the inner positive electrodes 12, the multi-slot ceramic dielectric film 11 and the inner negative electrodes 13 are alternately placed in sequence, they are firmly bonded together by sintering. Then, the outer positive electrodes 14 and outer negative electrodes 15 are welded to the sides of the electrodes 12 and the inner negative electrodes 13 respectively for fixation, making it a whole structure.

[0020] Each of the surface mount capacitors 1 is connected in parallel by several positioning pins 2 passing through the upper and lower ends of the electrodes of the surface mount capacitor 1. Grooves corresponding to the positioning pins 2 are opened at the upper and lower ends of the outer positive electrode 14 and the outer negative electrode 15. The positioning pins 2 are then placed in the grooves for fixation. When connected in parallel, the outer positive electrode 14 or the outer negative electrode 15 with the same electrode are selected for upper and lower splicing. While the positioning pins 2 connect the two, it ensures that there will be no power failure.

[0021] As per the instruction manual Figure 2 , 3As shown in Figure 4, the surface mount capacitor 1 has several hidden locking and fixing devices 3 on its upper and lower sides. Each hidden locking and fixing device 3 includes a latching plate 31 passing through the top surface of the surface mount capacitor 1 and a screw 32 controlling the rotation of the latching plate 31. The screw 32 passes through the lower side of the surface mount capacitor 1 and the side of the latching plate 31. Both the latching plate 31 and the screw 32 are made of insulating material. The bottom surface of the surface mount capacitor 1 has a storage slot 33 for storing the latching plate 31. The fixing hole of the latching plate 31 on the top surface of the surface mount capacitor 1 is an L-shaped through hole, and the fixing hole of the latching plate 31 on the top surface of the surface mount capacitor 1 passes through the side of the surface mount capacitor 1. One side of the screw 32 has a polygonal fixing post 321 passing through the latching plate 31, and the other end of the screw 32 has a tightening groove 322 corresponding to a screwdriver. The latching plate 31, the screw 32, and the storage slot 33 are all located... Inside the outer positive electrode 14 and the outer negative electrode 15, L-shaped through holes corresponding to the snap-fit ​​plate 31 are made in the outer negative electrode 15 and the outer positive electrode 14. The flat end opening of the L-shaped through hole is located at the outer wall end of the outer negative electrode 15, so as to facilitate the retraction of the snap-fit ​​plate 31 during disassembly. Similarly, on the bottom surface of the outer negative electrode 15, a storage groove 33 corresponding to the top surface of the L-shaped through hole is made, and the rotation center of the snap-fit ​​plate 31 is placed in the storage groove 33. The center of the polygonal through hole of the snap-fit ​​plate 31 is aligned with the screw hole on one side of the outer negative electrode 15. While screwing in the screw 32, the polygonal fixing post 321 on the top surface of the screw 32 is inserted into the polygonal through hole of the snap-fit ​​plate 31, so as to control the rotation direction of the snap-fit ​​plate 31. The thread direction of the screw 32 is selected independently according to the position of the storage groove 33 and the rotation direction of the snap-fit ​​plate 31. Similarly, the outer positive electrode 14 is also assembled simultaneously.

[0022] In specific implementation of this utility model, the positioning pin 2 is inserted into the groove on the top surface of the lower surface-mount capacitor 1, and a screwdriver is inserted into the tightening groove 322. The screw 32 below the upper surface-mount capacitor 1 is rotated, so that the latching plate 31 extends out of the storage groove 33 and is inserted into the L-shaped through hole on the top surface of the lower surface-mount capacitor 1 for fixation. At the same time as the latching plate 31 is engaged, the groove on the bottom surface of the upper surface-mount capacitor 1 will fit over the protruding end of the positioning pin 2, thus completing the connection. During assembly, in order to ensure the parallel connection of the surface-mount capacitors 1, attention should be paid to the positive and negative polarity of the surface-mount capacitors 1 to prevent reverse connection. The latching plate 31 of the lowermost surface-mount capacitor 1 is in a hidden state so that it will not affect the normal assembly of the circuit board.

[0023] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A surface mount capacitor that can be connected in parallel, comprising a plurality of surface mount capacitors (1), wherein each of the surface mount capacitors (1) is connected in parallel via a plurality of positioning pins (2) passing through the upper and lower ends of the electrodes of the surface mount capacitors (1), characterized in that: The surface mount capacitor (1) has several hidden locking and fixing devices (3) on its upper and lower sides. The hidden locking and fixing device (3) includes a buckle plate (31) that passes through the top surface of the surface mount capacitor (1) and a screw (32) that controls the buckle plate (31) to rotate. The screw (32) passes through the lower side of the surface mount capacitor (1) and the side of the buckle plate (31). The bottom surface of the surface mount capacitor (1) is provided with a storage groove (33) for storing the buckle plate (31).

2. The surface mount capacitor that can be connected in parallel according to claim 1, characterized in that: The mounting hole of the snap plate (31) on the top surface of the chip capacitor (1) is an L-shaped through hole, and the mounting hole of the snap plate (31) on the top surface of the chip capacitor (1) passes through the side of the chip capacitor (1).

3. A surface-mount capacitor that can be connected in parallel according to claim 1, characterized in that: One side of the screw (32) is provided with a polygonal fixing post (321) that passes through the buckle plate (31), and the other end of the screw (32) is provided with a tightening groove (322) corresponding to the screwdriver.

4. A surface-mount capacitor that can be connected in parallel according to claim 1, characterized in that: The patch capacitor (1) consists of a multi-slot ceramic dielectric film (11), an inner positive electrode (12) and an inner negative electrode (13) arranged alternately inside each cavity of the multi-slot ceramic dielectric film (11), an outer positive electrode (14) uniformly connected to each inner positive electrode (12), and an outer negative electrode (15) uniformly connected to each inner negative electrode (13). The snap plate (31), the screw (32), and the storage slot (33) are all located inside the outer positive electrode (14) and the outer negative electrode (15).

5. A surface-mount capacitor that can be connected in parallel according to claim 1, characterized in that: Both the buckle plate (31) and the screw (32) are made of insulating material.

6. A surface-mount capacitor that can be connected in parallel according to claim 4, characterized in that: The inner positive electrode (12) and the outer positive electrode (14), as well as the inner negative electrode (13) and the outer negative electrode (15), are all connected by welding.

Images