Radiator and laser

Abstract

The utility model belongs to the technical field of laser equipment, and discloses a radiator which comprises a vapor chamber used for placing a heat source and a shell arranged on the vapor chamber, the shell comprises a plurality of outer walls connected end to end, and at least one outer wall is filled with phase change materials. The utility model can realize quick temperature equalization of a heat source, avoids heat concentration, and has smaller mass at the same time. The utility model also discloses a laser with the radiator.

Description

Technical Field

[0001] This utility model belongs to the field of laser equipment technology, and in particular relates to a heat sink and a laser. Background Technology

[0002] As laser technology advances, overall equipment is becoming increasingly miniaturized and lightweight, while the requirements for heat dissipation are becoming more stringent. Compared to liquid-cooled fiber lasers, air-cooled fiber lasers do not require a cooling water tank, making them more compact and portable. However, when using air cooling, the heat transfer coefficient is lower than that of water cooling, so heat cannot be transferred in time. Heat accumulation in the laser can easily lead to overheating and failure. Therefore, the optical power of air-cooled lasers cannot be too high.

[0003] With the increasing demand for lightweight laser systems, the weight of various laser components is decreasing, including fiber-coupled semiconductor lasers (pump sources), which have a relatively high mass. However, if the pump source is too light, it may result in insufficient heat capacity, leading to heat concentration and failure during operation due to the lack of thermal buffering. Utility Model Content

[0004] To address the aforementioned technical problems, this utility model discloses a heat sink capable of rapidly equalizing the temperature of a heat source and preventing heat concentration. This utility model also discloses a laser incorporating the aforementioned heat sink.

[0005] The specific technical solution of this utility model is as follows:

[0006] A heat sink includes a heat spreader for housing a heat source and a housing disposed on the heat spreader, the housing including a plurality of end-to-end connected outer walls, at least one of which is filled with a phase change material.

[0007] The phase change material is a material that undergoes a phase change within a specific temperature range. It has the characteristics of high heat storage density and near-isothermal phase change process. During the phase change process, the phase change material absorbs or releases a large amount of latent heat while the temperature remains basically unchanged. Therefore, this application increases the heat capacity of the heat source through phase change heat storage, realizes heat buffering, and simultaneously reduces the weight of the shell. Thus, while ensuring miniaturization and lightweight, it can effectively achieve rapid temperature uniformity of the heat source and avoid heat concentration.

[0008] Preferably, the outer wall for filling the phase change material has multiple filling cavities, and the phase change material is encapsulated within the filling cavities.

[0009] The presence of partition walls between adjacent filling cavities ensures the molding and structural stability of the shell, while effectively saving on the filling cost of phase change materials.

[0010] Preferably, the shell has a rectangular structure, with one outer wall having an interface and a mounting portion respectively, and the other outer wall being filled with a phase change material.

[0011] This structure can meet the needs of the heat source and effectively dissipate heat, ensuring that the heat source is in normal working condition.

[0012] Preferably, the housing and / or heat spreader are provided with heat dissipation fins.

[0013] The heat dissipation fins can increase the heat dissipation area and effectively improve heat dissipation efficiency.

[0014] Preferably, the heat dissipation fins of the housing are located on the outer wall filled with phase change material.

[0015] This structure can further improve heat dissipation efficiency and further avoid heat concentration.

[0016] Preferably, the outer wall of the housing is made of copper or a copper alloy or aluminum or an aluminum alloy.

[0017] Preferably, the heat spreader is made of a high thermal conductivity composite material.

[0018] In existing technologies, vapor chambers are generally made of copper, which has low thermal conductivity, high density, low specific heat capacity, significant heat concentration, and is relatively heavy. Furthermore, liquid-gas vapor chambers are prone to performance degradation or failure due to excessive acceleration, making them unsuitable for high-acceleration environments. Therefore, in this application, diamond or graphite powder particles are added to the vapor chamber to further enhance the thermal conductivity of the metal material while achieving miniaturization and weight reduction.

[0019] Preferably, the heat spreader and the shell are integrally sintered or welded together.

[0020] The structure is simple to form, easy to manufacture, and has low time cost.

[0021] Lasers, including a heat sink as described above.

[0022] Preferably, the heat sources of the laser, such as the pump source and / or resonant cavity and / or beam combiner and / or grating, are cooled by heat sinks.

[0023] This application has a wide range of applications and can dissipate heat from various heat sources, ensuring performance.

[0024] Compared with the prior art, the present invention fills the shell with phase change material, which increases the heat capacity and reduces the weight of the pump itself. Therefore, it can improve the heat dissipation efficiency while meeting the requirements of miniaturization and weight reduction. Since the heat spreader of the present invention is made of high thermal conductivity composite material, it can also dissipate the heat emitted by the heat source more quickly and avoid heat concentration. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the heat sink in an embodiment of the present invention;

[0026] Figure 2 for Figure 1 A diagram illustrating the concealed cover.

[0027] In the diagram: 1-Heat spreader; 2-Shell; 21-Outer wall; 3-Phase change material; 4-Cover plate; 5-Chip; 6-Interface section; 7-Mounting section; 8-Fiber optic cable; 9-Fin 1; 10-Fin 2. Detailed Implementation

[0028] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to specific embodiments.

[0029] This embodiment discloses a heat sink for a laser. Heat sources such as the laser's pump source and / or resonant cavity and / or beam combiner and / or grating are cooled by the heat sink. In this embodiment, the heat source is further described as the pump source.

[0030] Generally, the heat transfer coefficient of air cooling is 20–150 W / (m²). 2 ·℃), the water-cooled heat transfer coefficient is 1000~11000W / (m²). 2 The heat transfer efficiency of air cooling is lower than that of water cooling (temperature range of ℃). Furthermore, as lasers become increasingly miniaturized and lightweight, the smaller the laser and the smaller the heat capacity of the pump source, the more prone the pump source is to heat concentration and failure. Therefore, this embodiment fills the housing 2 with a phase change material 3 to balance lightweight design and heat dissipation efficiency. Specifically, as... Figures 1-2 As shown, a radiator includes a heat spreader 1 for housing a heat source and a housing 2 disposed on the heat spreader 1. The housing 2 includes multiple outer walls 21 connected end-to-end, at least one of which is filled with a phase change material 3. The housing 2 has an annular structure, typically composed of multiple outer walls 21 connected end-to-end. It is sealed at the bottom by the heat spreader 1 and at the top by a cover plate 4, thereby allowing the pump source to be located inside the housing 2. Figure 2 As shown, in a preferred technical solution, the pump source is placed on the heat spreader 1, so that the heat emitted by the pump source can directly act on the heat spreader 1, thereby effectively absorbing the heat emitted by the heat source through the heat spreader 1. Specifically, the pump source chip 5 is directly placed on the heat spreader 1 and arranged in an array. Since at least one outer wall 21 is filled with phase change material 3, the phase change of the phase change material 3 under temperature difference can effectively achieve heat storage, thereby increasing the heat capacity of the heat source and playing a role in heat buffering, thus better avoiding heat concentration. Furthermore, as... Figure 2 As shown, the outer wall 21 for filling the phase change material 3 has multiple filling cavities, and the phase change material 3 is encapsulated within these cavities. Furthermore, the heat dissipation fins of the housing 2 are located on the outer wall 21 filled with the phase change material 3. Specifically, in this embodiment, the housing 2 has a rectangular structure, with one pair of outer walls 21 respectively provided with an interface portion 6 and a mounting portion 7, and the other pair of outer walls 21 filled with the phase change material 3. The interface portion 6 is used to connect to the pump source for power connection; that is, a cable can be connected to the pump source through the interface portion 6. The mounting portion 7 is used to install the optical fiber 8; that is, the optical fiber 8 is positioned and installed through the mounting portion 7 so that the pump source emits laser light from that location. In this embodiment, the phase change material 3 is an alkane-based phase change material. In this embodiment, the phase change material 3 can deform appropriately under temperature changes, better meeting the requirements of the heat dissipation mechanism and helping to reduce extended thermal resistance.

[0031] like Figure 2 As shown, in this embodiment, the housing 2 and / or the heat spreader 1 are provided with heat dissipation fins. That is, in this embodiment, at least one of the housing 2 and the heat spreader 1 is provided with heat dissipation fins. In this embodiment, the housing 2 is provided with fin one 9, and the heat spreader 1 is provided with fin two 10. Fin one 9 forms wings facing both sides of the housing 2, and fin two 10 is formed on the heat spreader 1 facing away from the housing 2. Of course, fin two 10 can also be on the same side as the housing 2. Thus, the heat emitted by the chip 5 can be effectively dissipated directly through the heat spreader 1 and fin two 10, while heat is stored through the phase change material 3, and then dissipated even more efficiently through fin one 9.

[0032] In this embodiment, the outer wall 21 of the shell 2 is made of aluminum alloy. The heat spreader 1 is made of a high thermal conductivity composite material, which can be a copper-diamond composite material, a copper-carbon nanotube composite material, an aluminum-diamond composite material, an aluminum-graphene composite material, an aluminum-silicon carbide composite material, an aluminum-graphite composite material, a carbon fiber-aluminum composite material, or a carbon nanotube-aluminum composite material. Existing heat spreaders 1 are generally made of copper, which has a low thermal conductivity and significant heat concentration. By adding diamond, carbon nanotubes, graphene, silicon carbide, graphite powder particles, or carbon fibers to the heat spreader 1, the thermal conductivity of the metal material can be enhanced. This quickly dissipates the heat from the pump source chip 5, avoiding heat concentration. At the same time, compared with the conventional capillary liquid-gas heat spreader 1, the heat spreader 1 made of a high thermal conductivity composite material in this embodiment will not fail due to high acceleration.

[0033] To simplify the process, in this embodiment, the heat spreader 1 and the housing 2 are integrally sintered or welded. Specifically, a blank is obtained by integrally sintering or welding using a high thermal conductivity composite material through a mold. The blank is then machined to obtain the heat spreader 1 with the actual structure. The housing 2 is machined to form the filling cavity. The housing 2 and the heat spreader 1 are integrally sintered or welded together. Then, the pump source is placed in the housing 2, specifically, the chip 5 is placed on the heat spreader 1. Next, the phase change material 3 is injected, and finally, the fiber optic cable 8 is installed and connected to electricity. This forms the heat sink for the pump source of the laser.

[0034] The above are merely preferred embodiments of this utility model. It should be noted that the above preferred embodiments should not be considered as limitations on this utility model, and the scope of protection of this utility model should be determined by the scope defined in the claims. For those skilled in the art, several improvements and modifications can be made without departing from the spirit and scope of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model.

Claims

1. A radiator, characterized in that, It includes a heat spreader for placing a heat source, and a housing disposed on the heat spreader, the housing including a plurality of end-to-end connected outer walls, at least one of which is filled with a phase change material.

2. A radiator as described in claim 1, characterized in that, The outer wall for filling the phase change material has multiple filling cavities, in which the phase change material is encapsulated.

3. A radiator as described in claim 1 or 2, characterized in that, The shell has a rectangular structure, with an interface and a mounting part on one outer wall and a phase change material filling the other outer wall.

4. A radiator as described in claim 1, characterized in that, The housing and / or heat spreader are provided with heat dissipation fins.

5. A radiator as described in claim 4, characterized in that, The heat dissipation fins of the housing are located on the outer wall filled with phase change material.

6. A radiator as described in claim 1, characterized in that, The outer wall of the shell is made of copper or copper alloy or aluminum or aluminum alloy.

7. A radiator as described in claim 1, characterized in that, The heat spreader is made of a high thermal conductivity composite material.

8. A radiator as described in claim 1, characterized in that, The heat spreader and the shell are integrally sintered or welded together.

9. A laser, characterized in that, Includes a radiator as described in any one of claims 1 to 8.

10. The laser as claimed in claim 9, characterized in that, The heat sources of the laser, such as the pump source and / or resonant cavity and / or beam combiner and / or grating, are cooled by heat sinks.

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