High-heat-dissipation type low-loss converter valve

Abstract

The utility model discloses a high-heat-dissipation low-loss converter valve, which comprises a heat dissipation bottom plate, a first power control assembly, a second power control assembly, a damping capacitor, a voltage-sharing capacitor, a damping resistor, a voltage-sharing resistor and a saturable reactor, the first power control assembly, the second power control assembly, the damping capacitor, the voltage-sharing capacitor, the damping resistor, the voltage-sharing resistor and the saturable reactor are all fixedly installed on the upper surface of the heat dissipation bottom plate, and the first power control assembly and the second power control assembly are connected through a connecting bridge; the first lower pole piece is connected with the first upper pole piece and matched with the first fins to achieve effective heat dissipation of the first thyristor, the second lower pole piece is connected with the second upper pole piece and matched with the second fins to achieve effective heat dissipation of the second thyristor, and meanwhile the connecting bridge is matched with the grid plate through the structure of the connecting bridge to further conduct auxiliary heat dissipation. And the first thyristor and the second thyristor carry out self heat dissipation through self structures, so that the power loss of the thyristors caused by high temperature is reduced.

Description

Technical Field

[0001] This utility model relates to the field of converter valve technology, specifically a high heat dissipation, low loss converter valve. Background Technology

[0002] The converter valve is the core equipment of DC transmission projects. It obtains the desired DC voltage and controls the power by sequentially connecting the three-phase AC voltage to the DC terminal. Its value accounts for about 22 to 25% of the total price of the complete set of converter station equipment.

[0003] Existing converter stations generally use circulating valve towers to handle ultra-high voltage and high current loads. The converter valve is the core working component, and the core component of the converter valve is the thyristor. It is made of semiconductor materials, which makes it highly susceptible to feedback effects from temperature changes, resulting in increased power loss. However, under ultra-high voltage and high current conditions, the thyristor itself is prone to generating a lot of heat. Therefore, effective heat dissipation of the thyristor structure is required to ensure stable operation.

[0004] Therefore, it is necessary to design a high-heat-dissipation, low-loss converter valve. Utility Model Content

[0005] The purpose of this invention is to provide a high-heat-dissipation, low-loss converter valve to solve the problems mentioned in the background art.

[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0007] A high-heat-dissipation, low-loss converter valve includes a heat dissipation base plate, a first control component, a second control component, a damping capacitor, a voltage-equalizing capacitor, a damping resistor, a voltage-equalizing resistor, and a saturated reactor. The first control component, the second control component, the damping capacitor, the voltage-equalizing capacitor, the damping resistor, the voltage-equalizing resistor, and the saturated reactor are all fixedly mounted on the upper surface of the heat dissipation base plate. The first control component and the second control component are connected by a connecting bridge. The first control component, the second control component, the damping resistor, the voltage-equalizing resistor, and the saturated reactor are connected in series. The damping capacitor and the voltage-equalizing capacitor are connected in parallel in the circuit.

[0008] According to the above technical solution, the first power control component includes a first thyristor, a first lower clamping plate, and a first upper clamping plate. A first lower insulating sheet is placed on the upper surface of the first lower clamping plate, and a first lower electrode is placed on the upper surface of the first lower insulating sheet. The first thyristor is placed on the upper surface of the first lower electrode, and the upper end face of the first thyristor matches one end of a connecting bridge. A first upper insulating sheet is provided between the upper surface of one end of the connecting bridge and the first upper clamping plate. The rear end of the first lower electrode is integrally formed with a first upper electrode, and the upper end of the first upper electrode is located above the first upper clamping plate.

[0009] According to the above technical solution, the second power control component includes a second thyristor, a second lower clamping plate, and a second upper clamping plate. A second lower insulating sheet is placed on the upper surface of the second lower clamping plate, and the other end of the connecting bridge is placed on the upper surface of the second lower insulating sheet. The lower end of the second thyristor matches the other end of the connecting bridge. A second lower electrode is provided on the upper end face of the second thyristor. A second upper insulating sheet is provided between the second lower electrode and the second upper clamping plate. The rear end of the second lower electrode is integrally formed with a second upper electrode. The upper end of the second upper electrode is located above the second upper clamping plate.

[0010] According to the above technical solution, the first upper clamping plate and the first lower clamping plate, as well as the second upper clamping plate and the second lower clamping plate, are fixed by fastening screws.

[0011] According to the above technical solution, the upper ends of the first upper electrode and the upper ends of the second upper electrode are integrally formed with a pressing edge, and an electrode screw is screwed onto the pressing edge.

[0012] According to the above technical solution, the first thyristor and the second thyristor have the same structure. The first thyristor includes a ceramic outer cylinder, and a heat dissipation ring and a heat conduction column are provided inside the ceramic outer cylinder. The two are integrally formed. The heat conduction column is arranged in a ring array as a group, and there are two groups that are symmetrical and mutually insulated. A semiconductor chip is provided in the middle of the ceramic outer cylinder. The upper electrode column and the lower electrode column are respectively attached to the two ends of the semiconductor chip.

[0013] According to the above technical solution, the connecting bridge includes a first end, a second end, and a connecting plate, and the three are integrally formed. The first end and the second end have a centrally symmetrical structure. A positioning groove is formed on the upper surface of the second end. A top protrusion is integrally formed in the middle of the positioning groove. Both sides of the connecting plate are integrally formed with grid plates.

[0014] According to the above technical solution, the outer diameter of the heat dissipation ring is 1.1 to 1.2 times the outer diameter of the ceramic outer cylinder.

[0015] According to the above technical solution, a first fin is integrally formed on the outer side of the vertical plate of the first upper electrode, and a second fin is integrally formed on the outer side of the vertical plate of the second upper electrode.

[0016] Compared with the prior art, the beneficial effects achieved by this utility model are:

[0017] The connection between the first lower electrode and the first upper electrode, together with the first fin, effectively dissipates heat from the first thyristor. The connection between the second lower electrode and the second upper electrode, together with the second fin, effectively dissipates heat from the second thyristor. At the same time, the connecting bridge, through its own structure and in conjunction with the grid plate, further assists in heat dissipation. The first and second thyristors also achieve independent heat dissipation through their own structures. All three work simultaneously to ensure heat dissipation and reduce power loss caused by high temperature in the thyristors. Attached Figure Description

[0018] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0019] Figure 1 This is a three-dimensional structural schematic diagram of this utility model from one perspective;

[0020] Figure 2 This is a schematic diagram of the connection structure between the first and second power control components of this utility model;

[0021] Figure 3 This is a right-side structural schematic diagram of the first power control component of this utility model;

[0022] Figure 4 This is a right-side view of the structure of the second power control component of this utility model;

[0023] Figure 5 This is a three-dimensional structural diagram of the connecting bridge of this utility model from one perspective;

[0024] Figure 6 This is a cross-sectional structural schematic diagram of the first thyristor of this utility model.

[0025] In the diagram: 1. Heat dissipation base plate; 2. First power control assembly; 201. First thyristor; 201a. Ceramic outer cylinder; 201b. Heat-conducting pillar; 201c. Heat dissipation ring; 201d. Semiconductor chip; 201e. Upper electrode pillar; 201f. Lower electrode pillar; 202. First lower clamping plate; 203. First upper clamping plate; 204. First upper electrode plate; 205. First lower electrode plate; 206. First fin; 207. First lower insulating sheet; 208. First upper insulating sheet; 3. Second power control assembly; 301. Second thyristor. 302. Tube, 303. Second lower clamping plate, 304. Second upper clamping plate, 305. Second lower clamping plate, 306. Second fin, 307. Second lower insulating sheet, 308. Second upper insulating sheet, 4. Damping capacitor, 5. Equalizing capacitor, 6. Damping resistor, 7. Equalizing resistor, 8. Saturated reactor, 9. Connecting bridge, 901. First end, 902. Second end, 903. Connecting plate, 904. Grid plate, 905. Positioning groove, 906. Top protrusion, 10. Electrode screw, 11. Fastening screw. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Example 1

[0028] Please see Figure 1-6 This utility model provides a technical solution: a high heat dissipation type low loss converter valve, including a heat dissipation base plate 1, a first control component 2, a second control component 3, a damping capacitor 4, a voltage equalizing capacitor 5, a damping resistor 6, a voltage equalizing resistor 7, and a saturated reactor 8. The first control component 2, the second control component 3, the damping capacitor 4, the voltage equalizing capacitor 5, the damping resistor 6, the voltage equalizing resistor 7, and the saturated reactor 8 are all fixedly installed on the upper surface of the heat dissipation base plate 1. The first control component 2 and the second control component 3 are connected through a connecting bridge 9. The first control component 2, the second control component 3, the damping resistor 6, the voltage equalizing resistor 7, and the saturated reactor 8 are connected in series. The damping capacitor 4 and the voltage equalizing capacitor 5 are connected in parallel in the circuit.

[0029] The heat dissipation base plate 1 is made of insulating and thermally conductive material, which ensures heat dissipation while supporting the electrical components. The first power control component 2, the second power control component 3, the damping capacitor 4, the voltage equalizing capacitor 5, the damping resistor 6, the voltage equalizing resistor 7 and the saturated reactor 8 are connected by circuit to form a voltage and current conversion.

[0030] Specifically, the first power control assembly 2 includes a first thyristor 201, a first lower clamping plate 202, and a first upper clamping plate 203. A first lower insulating sheet 207 is placed on the upper surface of the first lower clamping plate 202, and a first lower electrode 205 is placed on the upper surface of the first lower insulating sheet 207. The first thyristor 201 is placed on the upper surface of the first lower electrode 205. The upper end face of the first thyristor 201 matches one end of the connecting bridge 9. A first upper insulating sheet 208 is provided between the upper surface of one end of the connecting bridge 9 and the first upper clamping plate 203. A first upper electrode 204 is integrally formed at the rear end of the first lower electrode 205, and the upper end of the first upper electrode 204 is located above the first upper clamping plate 203.

[0031] The first thyristor 201 is the core structure of the first power control component 2. The first upper clamping plate 203 and the first lower clamping plate 204 provide a limited combination basis for the internal components. The first lower insulating sheet 207 and the first upper insulating sheet 208 isolate the internal electrical components from the first lower clamping plate 202 and the first upper clamping plate 203 to prevent leakage. The first lower electrode 205, together with the first upper electrode 204, forms the external electrical connection basis to guide the current into the first thyristor 201. The connecting bridge 9 guides the current to the second thyristor 301.

[0032] Specifically, the second power control assembly 3 includes a second thyristor 301, a second lower clamping plate 302, and a second upper clamping plate 303. A second lower insulating sheet 307 is placed on the upper surface of the second lower clamping plate 302, and the other end of the connecting bridge 9 is placed on the upper surface of the second lower insulating sheet 307. The lower end of the second thyristor 301 matches the other end of the connecting bridge 9. A second lower electrode 305 is provided on the upper end face of the second thyristor 301. A second upper insulating sheet 308 is provided between the second lower electrode 305 and the second upper clamping plate 303. A second upper electrode 304 is integrally formed at the rear end of the second lower electrode 305, and the upper end of the second upper electrode 304 is located above the second upper clamping plate 303.

[0033] The second thyristor 301 is the core structure of the second power control assembly 3. The second upper clamping plate 303 and the second lower clamping plate 304 provide a limited combination basis for the internal components. The second lower insulating sheet 307 and the second upper insulating sheet 308 isolate the internal electrical components from the second lower clamping plate 302 and the second upper clamping plate 303 to prevent leakage. The second lower electrode 305, together with the second upper electrode 304, forms the external electrical connection basis to conduct current out of the second thyristor 301. The connecting bridge 9 guides the current into the second thyristor 301.

[0034] Specifically, the first upper clamping plate 203 and the first lower clamping plate 202, and the second upper clamping plate 303 and the second lower clamping plate 302 are both fixed by fastening screws 11.

[0035] By tightening the screw 11, the electrical components between the first upper clamping plate 203 and the first lower clamping plate 202, and between the second upper clamping plate 303 and the second lower clamping plate 302, can be ensured to have effective electrical contact, thus avoiding the problem of loose connection.

[0036] Specifically, the upper ends of the first upper electrode 204 and the second upper electrode 304 are both integrally formed with a pressing edge, and an electrode screw 10 is screwed onto the pressing edge.

[0037] The electrode screw 10, which ensures contact during circuit connection by pressing the edge of the platform, improves the stability of the circuit connection.

[0038] Specifically, the first thyristor 201 and the second thyristor 301 have the same structure. The first thyristor 201 includes a ceramic outer cylinder 201a. The ceramic outer cylinder 201a is provided with a heat dissipation ring 201c and a heat conduction pillar 201b, which are integrally formed. The heat conduction pillars 201b are arranged in a ring array as a group, and there are two groups that are symmetrical and mutually insulated. A semiconductor chip 201d is provided in the middle of the ceramic outer cylinder 201a. The two ends of the semiconductor chip 201d are respectively attached to an upper electrode pillar 201e and a lower electrode pillar 201f.

[0039] The ceramic outer cylinder 201a protects the internal semiconductor chip 201d and provides a limited working position to ensure the contact between the upper electrode post 201e and the lower electrode post 201f. The heat-conducting post 201b effectively directs the heat from the semiconductor chip 201d to the ceramic outer cylinder 201a and the heat dissipation ring 201c and the contacting metal sheet, achieving effective heat transfer and dissipation. The semiconductor chip 201d is the main working component.

[0040] Specifically, the connecting bridge 9 includes a first end 901, a second end 902, and a connecting plate 903, all of which are integrally formed. The first end 901 and the second end 902 have a centrally symmetrical structure. A positioning groove 905 is provided on the upper surface of the second end 902. A top protrusion 906 is integrally formed in the middle of the positioning groove 905. Both sides of the connecting plate 903 are integrally formed with grid plates 904.

[0041] The first end 901 and the second end 902 can effectively match and position the first thyristor 201 and the second thyristor 301 by opening the positioning groove 905. The top protrusion 906 is set to increase the contact margin and ensure the tight contact after the overall assembly. The integrally formed grid plate 904 is set on the connecting plate 903 to further increase the heat dissipation area, so that the connecting bridge 9 can effectively perform auxiliary heat dissipation.

[0042] Specifically, the outer diameter of the heat dissipation ring is 1.1 to 1.2 times the outer diameter of the ceramic outer cylinder.

[0043] By utilizing the difference in outer diameter between the heat dissipation ring and the ceramic outer cylinder, heat dissipation is ensured while avoiding excessive overall height.

[0044] Specifically, the first upper electrode 204 has a first fin 206 integrally formed on the outer side of the vertical plate, and the second upper electrode 304 has a second fin 306 integrally formed on the outer side of the vertical plate.

[0045] The first fin 206 and the second fin 306 can effectively increase the heat dissipation area of ​​the first upper plate and the second upper plate 304, thereby improving the heat dissipation efficiency.

[0046] Working principle: When in use, the device is connected to the circuit. During operation, the first thyristor 201 and the second thyristor 301 generate a large amount of heat, which then stabilizes and increases the overall temperature. The temperature rises and is transferred to the ceramic outer cylinder, guided by the heat-conducting pillars to the heat dissipation ring, and then guided by the upper and lower electrode pillars to the connecting bridge 9, the first lower electrode plate 205, and the second lower electrode plate 305. It is then guided to the first fin 206, the second fin 306, and the gate plate 904, thereby achieving synchronous heat dissipation of the heat dissipation ring, the first fin 206, the second fin 306, and the gate plate 904. This enables temperature control of the semiconductor chip and the first thyristor 201 and the second thyristor 301.

[0047] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0048] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A high-heat-dissipation, low-loss converter valve, comprising a heat dissipation base plate (1), a first control component (2), a second control component (3), a damping capacitor (4), a voltage equalizing capacitor (5), a damping resistor (6), a voltage equalizing resistor (7), and a saturated reactor (8), characterized in that: The first power control component (2), the second power control component (3), the damping capacitor (4), the equalizing capacitor (5), the damping resistor (6), the equalizing resistor (7), and the saturated reactor (8) are all fixedly installed on the upper surface of the heat dissipation base plate (1). The first power control component (2) and the second power control component (3) are connected through a connecting bridge (9). The first power control component (2), the second power control component (3), the damping resistor (6), the equalizing resistor (7), and the saturated reactor (8) are connected in series. The damping capacitor (4) and the equalizing capacitor (5) are connected in parallel in the circuit.

2. The high heat dissipation, low loss converter valve according to claim 1, characterized in that: The first power control assembly (2) includes a first thyristor (201), a first lower clamping plate (202) and a first upper clamping plate (203). A first lower insulating sheet (207) is placed on the upper surface of the first lower clamping plate (202). A first lower electrode (205) is placed on the upper surface of the first lower insulating sheet (207). The first thyristor (201) is placed on the upper surface of the first lower electrode (205). The upper end face of the first thyristor (201) matches one end of the connecting bridge (9). A first upper insulating sheet (208) is provided between the upper surface of one end of the connecting bridge (9) and the first upper clamping plate (203). A first upper electrode (204) is integrally formed at the rear end of the first lower electrode (205). The upper end of the first upper electrode (204) is located above the first upper clamping plate (203).

3. The high heat dissipation, low loss converter valve according to claim 2, characterized in that: The second power control assembly (3) includes a second thyristor (301), a second lower clamping plate (302) and a second upper clamping plate (303). A second lower insulating sheet (307) is placed on the upper surface of the second lower clamping plate (302). The other end of the connecting bridge (9) is placed on the upper surface of the second lower insulating sheet (307). The lower end of the second thyristor (301) matches the other end of the connecting bridge (9). A second lower electrode (305) is provided on the upper end face of the second thyristor (301). A second upper insulating sheet (308) is provided between the second lower electrode (305) and the second upper clamping plate (303). A second upper electrode (304) is integrally formed at the rear end of the second lower electrode (305). The upper end of the second upper electrode (304) is located above the second upper clamping plate (303).

4. The high heat dissipation, low-loss converter valve according to claim 3, characterized in that: The first upper clamping plate (203) and the first lower clamping plate (202), and the second upper clamping plate (303) and the second lower clamping plate (302) are both fixed by fastening screws (11).

5. The high heat dissipation, low-loss converter valve according to claim 3, characterized in that: The upper ends of the first upper electrode (204) and the upper ends of the second upper electrode (304) are integrally formed with a pressing edge, and an electrode screw (10) is screwed onto the pressing edge.

6. The high heat dissipation, low loss converter valve according to claim 3, characterized in that: The first thyristor (201) and the second thyristor (301) have the same structure. The first thyristor (201) includes a ceramic outer cylinder (201a). The ceramic outer cylinder (201a) is provided with a heat dissipation ring (201c) and a heat conduction column (201b), which are integrally formed. The heat conduction column (201b) is arranged in a ring array as a group, and the two groups are symmetrical and mutually insulated. A semiconductor chip (201d) is provided in the middle of the ceramic outer cylinder (201a). The two ends of the semiconductor chip (201d) are respectively attached with an upper electrode column (201e) and a lower electrode column (201f).

7. The high heat dissipation, low loss converter valve according to claim 1, characterized in that: The connecting bridge (9) includes a first end (901), a second end (902), and a connecting plate (903), and the three are integrally formed. The first end (901) and the second end (902) are centrally symmetrical. A positioning groove (905) is provided on the upper surface of the second end (902). A top protrusion (906) is integrally formed in the middle of the positioning groove (905). Both sides of the connecting plate (903) are integrally formed with grid plates (904).

8. A high-heat-dissipation, low-loss converter valve according to claim 6, characterized in that: The outer diameter of the heat dissipation ring (201c) is 1.1 to 1.2 times the outer diameter of the ceramic outer cylinder (201a).

9. A high-heat-dissipation, low-loss converter valve according to claim 3, characterized in that: The first upper electrode (204) has a first fin (206) integrally formed on the outer side of the vertical plate, and the second upper electrode (304) has a second fin (306) integrally formed on the outer side of the vertical plate.

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