Earphone and optical fiber two-in-one component

Abstract

The utility model discloses an earphone and optical fiber two-in-one component comprising a positioning column, the positioning column is provided with an earphone seat and an optical fiber seat, and the earphone seat and the optical fiber seat are integrated through the positioning column; the optical fiber seat comprises an optical fiber lamp bead and an optical fiber pin connected with the optical fiber lamp bead, the optical fiber pin penetrates through the positioning column and exposes a pin for welding, the optical fiber lamp bead is located in the positioning column, and the positioning column is fused on the optical fiber pin. Compared with the prior art, the earphone and optical fiber two-in-one component integrates the earphone seat and the optical fiber seat through the positioning column, so that the size of a PCB (printed circuit board) and the size of the structure are reduced, the material cost of a product is reduced, and the product is miniaturized; the SMT technology can be realized for automatic chip mounting, the technological process is simplified, the production efficiency is improved, and the welding quality is improved; the material types are reduced, the production process is simplified, full-patch is realized, the production cost is reduced, and the production efficiency is improved.

Description

Technical Field

[0001] This utility model belongs to the field of electronic manufacturing technology, specifically relating to a two-in-one component combining headphones and optical fiber. Background Technology

[0002] Surface Mount Technology (SMT) reflow soldering is increasingly becoming the mainstream process due to its high reliability, strong shock resistance, and ability to greatly improve production efficiency and enable automated production. For products requiring both headphone and fiber optic connectors, the PCB board and structure must include locations for these connectors.

[0003] With the increasing demand for miniaturization and lightweighting of electronic products, the traditional method of mounting headphone and fiber optic connectors separately on the PCB board takes up a lot of space and has low production efficiency. Furthermore, the separate design of headphone and fiber optic connectors increases the size and cost of the PCB board, which is not conducive to product miniaturization and cost control. Utility Model Content

[0004] A brief overview of embodiments of the present invention is provided below to provide a basic understanding of certain aspects of the invention. It should be understood that this overview is not an exhaustive summary of the invention. It is not intended to identify key or essential parts of the invention, nor is it intended to limit the scope of the invention. Its purpose is merely to present certain concepts in a simplified form as a prelude to the more detailed description that follows.

[0005] To address the aforementioned issues, this invention provides a two-in-one component combining headphones and optical fiber. By integrating the headphone socket and optical fiber socket into one unit, the PCB board size is reduced, material costs are lowered, and a full surface mount technology (SMT) process is implemented, thereby improving production efficiency.

[0006] Specifically, the technical solution of this utility model is as follows: A two-in-one component for headphones and optical fiber includes a positioning post, on which a headphone socket and an optical fiber socket are disposed, and the headphone socket and the optical fiber socket are fused together by the positioning post; wherein, the optical fiber socket includes an optical fiber LED and an optical fiber pin connected to the optical fiber LED, the optical fiber pin passes through the positioning post and exposes pins for soldering, the optical fiber LED is located inside the positioning post, and the positioning post is fused to the optical fiber pin, and is fused together with the headphone socket and the optical fiber socket.

[0007] As one specific implementation, the positioning post is a cuboid structure.

[0008] As one specific implementation, the headphone socket includes headphone pins that pass through the positioning post and expose pins for soldering.

[0009] As one specific implementation, the fiber optic pin and the earphone pin are located on the same side of the component.

[0010] Pins are used for insertion into the PCB board for soldering. In through-hole reflow soldering in SMT processes, if the pins are too long, the solder paste carried away by the pin tips cannot be pulled back during reflow, forming solder balls at the tips, which may result in insufficient solder within the through-hole. Therefore, the pin length needs to be limited. In this invention, as a specific implementation, the pin length of the fiber optic pin is ≤2.0mm, and the pin length of the headphone pin is ≤2.0mm.

[0011] During manufacturing, a stencil is first made on the PCB board, and solder paste is transferred to the pads and through holes. Then, an SMT machine is used to insert the integrated headphone and fiber optic connector into the PCB board, with the pins inserted into the through holes. Finally, reflow soldering is performed according to the set temperature profile to form solder joints and fix the integrated component.

[0012] This invention provides a two-in-one earphone and fiber optic component. The two components include an earphone socket and a fiber optic socket, which are fused together by positioning posts. Using this two-in-one component saves PCB board space, reduces PCB board costs, and allows for automated SMT placement using a through-hole reflow soldering process, improving production efficiency.

[0013] Compared with the prior art, the embodiment of this utility model uses a material that integrates the earphone socket and the fiber optic socket into one piece by positioning posts, which reduces the PCB board and structural size, thereby reducing product material costs and miniaturizing the product; it can realize automatic surface mount technology (SMT), simplifying the process flow, improving production efficiency and welding quality; it reduces the types of materials and simplifies the production process, realizes full surface mount technology, reduces production costs and improves production efficiency. Attached Figure Description

[0014] This invention can be better understood by referring to the following description taken in conjunction with the accompanying drawings, in which the same or similar reference numerals are used throughout the drawings to denote the same or similar parts. These drawings, together with the following detailed description, are incorporated in and form part of this specification, and are used to further illustrate preferred embodiments of the invention and explain the principles and advantages of the invention. In the drawings:

[0015] Figure 1 This is a schematic diagram of the structure of the headphone and optical fiber combined component according to an embodiment of the present invention. Detailed Implementation

[0016] Embodiments of the present invention will now be described with reference to the accompanying drawings. Elements and features described in one drawing or embodiment of the present invention may be combined with elements and features shown in one or more other drawings or embodiments. It should be noted that, for clarity, representations and descriptions of components and processes unrelated to the present invention and known to those skilled in the art have been omitted from the drawings and description.

[0017] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0018] As electronic products evolve towards miniaturization, lightweight design, and high integration, the traditional method of separately mounting headphone and fiber optic connectors on PCBs can no longer meet the space and cost requirements of modern products. Existing technologies require significant PCB space for both the headphone and fiber optic connectors, leading to low production efficiency and increased production costs due to the variety of materials involved. To address these issues, this invention provides a combined headphone and fiber optic component. By integrating the headphone and fiber optic connectors into a single unit, it reduces PCB space requirements and costs. Furthermore, the component utilizes a through-hole reflow soldering process, enabling automated surface mount technology (SMT) placement and improving production efficiency.

[0019] Specifically, this utility model provides an embodiment of a combined headphone and optical fiber component, see [link to embodiment]. Figure 1 It includes an optical fiber socket 1, an earphone socket 2, and a positioning post 3. The earphone socket 2 and the optical fiber socket 1 are mounted on the positioning post 3, and the earphone socket 2 and the optical fiber socket are integrated into one unit through the positioning post.

[0020] The fiber optic connector 1 includes a fiber optic LED and a fiber optic pin 11 connected to the LED. The fiber optic pin 11 passes through the positioning post and exposes pins for soldering. The fiber optic LED is located inside the positioning post. The headphone connector 2 includes a headphone pin 21, which passes through the positioning post 3 and exposes pins for soldering. The positioning post integrates the headphone connector and the fiber optic connector into one unit.

[0021] In this embodiment, the positioning post 3 is a cuboid, and the headphone pin 21 and the fiber optic pin 11 are on the same side of the headphone + fiber optic dual-function component.

[0022] It should be noted that, in order to perform SMT (Surface Mount Technology) soldering on the headphone + fiber optic dual-component component, in this embodiment of the invention, the positioning post 3 is integrated with the fiber optic base 1 and the headphone base 2, thereby allowing the SMT placement machine to directly pick up the headphone + fiber optic dual-component material for SMT placement. The positioning post 3 is made of high-temperature resistant plastic, so it will not deform during the placement process.

[0023] The pins of the headphone pin 21 and the fiber optic pin 11 are used for insertion into the PCB board for soldering. In through-hole reflow soldering in SMT processes, if the pin is too long, the solder paste carried away by the pin tip cannot be pulled back during reflow, forming solder balls at the tip, which may result in insufficient solder in the through-hole. Therefore, the pin length needs to be limited. In this embodiment, the pin length is set to ≤2.0mm.

[0024] Compared with existing technologies, the headphone + fiber optic dual-function component of this utility model uses a material that integrates the headphone socket and fiber optic socket into one piece via positioning posts, reducing the PCB board and structural size, thereby lowering product material costs and miniaturizing the product. It also reduces the types of materials and simplifies production processes, enabling full surface mount technology (SMT), reducing production costs and improving production efficiency.

[0025] This utility model embodiment also provides a welding method for the above-mentioned headphone + optical fiber dual-component component, which includes the following steps:

[0026] Step S1: Solder paste printing:

[0027] First, a stencil is created using a PCB film file. Solder paste is then transferred through openings in the stencil to the pads and vias of the PCB board, allowing some of the solder paste to seep into the vias. It's important to note that the PCB film file defines the pads and vias on the PCB board, and the stencil created from the PCB film file includes openings for the solder paste, allowing it to flow accurately into the desired areas.

[0028] In this embodiment of the invention, the formula for calculating the required solder paste volume for through-hole solder joints is as follows:

[0029] Vs = (Vh - Vl) * 2F;

[0030] Where Vs is the volume of solder paste required to fill the through-hole, Vh is the volume of the through-hole, Vl is the volume of the pin insertion portion of the through-hole, and F is an adjustment coefficient. In this embodiment of the invention, the value of F ranges from 0.9 to 1.0.

[0031] Step S2: Inserting materials by machine:

[0032] The SMT machine inserts the headphone + fiber optic combo component into the PCB board, so that the pins of the headphone + fiber optic combo component are inserted into the through holes, and the positioning posts of the headphone + fiber optic combo component are in contact with the pads.

[0033] Step S3: Reflow soldering:

[0034] The PCB board and solder paste are reflow soldered according to the set reflow soldering temperature profile to form solder joints, and the headphone + optical fiber dual-component component is fixed on the PCB board.

[0035] In this embodiment of the invention, the reflow soldering temperature profile has a constant temperature phase time of more than 100 seconds, and the temperature is set and controlled between 240 and 245°C.

[0036] In summary, the headphone + fiber optic dual-component component provided by the embodiments of this utility model is a material that integrates the headphone and fiber optic into one piece by positioning posts, thereby enabling automatic placement in SMT process, simplifying the process flow, improving production efficiency and enhancing welding quality.

[0037] It should be emphasized that the term "including / comprises" as used herein refers to the presence of a feature, element, step, or component, but does not exclude the presence or addition of one or more other features, elements, steps, or components.

[0038] Although the present invention has been disclosed above through the description of specific embodiments, it should be understood that all the embodiments and examples described above are exemplary and not restrictive. Those skilled in the art can design various modifications, improvements, or equivalents to the present invention within the spirit and scope of the appended claims. These modifications, improvements, or equivalents should also be considered to be included within the protection scope of the present invention.

Claims

1. A dual-function component combining headphones and optical fiber, characterized in that: The device includes a positioning post, on which an earphone socket and an optical fiber socket are mounted, and the earphone socket and the optical fiber socket are fused together by the positioning post; wherein, the optical fiber socket includes an optical fiber LED and an optical fiber pin connected to the optical fiber LED, the optical fiber pin passes through the positioning post and exposes pins for soldering, and the optical fiber LED is located inside the positioning post.

2. The combined headphone and fiber optic component according to claim 1, characterized in that: The positioning post has a cuboid structure.

3. The combined headphone and fiber optic component according to claim 1, characterized in that: The headphone socket includes headphone pins that pass through the positioning post and expose pins for soldering.

4. The combined headphone and fiber optic component according to claim 3, characterized in that: The fiber optic pin and the headphone pin are located on the same side of the component.

5. The headphone and fiber optic dual-function component according to any one of claims 1-4, characterized in that: The pin length of the optical fiber pin is ≤2.0mm.

6. The combined headphone and fiber optic component according to claim 3, characterized in that: The pin length of the headphone pin is ≤2.0mm.

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