Removal apparatus

Abstract

The utility model provides a removing device. The removing device is constructed to remove materials from a component bearing part during manufacturing of the plate-shaped component bearing part. The removal apparatus includes: a transport unit configured to hold and transport the component carrier; a removing unit configured to remove a material from a surface of the component carrier transported by the transporting unit; a cleaning unit comprising a cleaning device facing at least one main surface of the component carrier transported by the transport unit, the cleaning device comprising at least one rotatable cleaning conduit, the cleaning device being configured to spray a fluid to the main surface of the component carrier through the cleaning conduit; and a purge unit configured to spray a gas toward the main surface of the component carrier to remove a residue on the main surface of the component carrier.

Description

Technical Field

[0001] This utility model relates to the field of electronic devices, and in particular to a removal device. Background Technology

[0002] With the increasing functionality of component carriers equipped with one or more electronic components, the gradual miniaturization of such components, and the growing number of components to be mounted on component carriers such as printed circuit boards, increasingly powerful array-like components or packages with multiple contacts or connections are being adopted. The spacing between these contacts is becoming increasingly smaller, placing higher demands on the structural precision of the component carriers. Therefore, the manufacturing process of component carriers involves a series of operations such as drilling, polishing, and cleaning on the board, creating numerous small and dense holes (e.g., vias or through-holes) for future copper plating, component placement, and other operations.

[0003] However, in the existing process flow for producing component carriers, especially component carriers with ultra-high density holes, the holes are often blocked due to the particles generated during drilling not being thoroughly cleaned, which affects subsequent processing. For example, impurities can seep into the plating layer during copper plating, and components cannot be properly embedded or buried in the component carrier, resulting in a decline in the quality of the final product.

[0004] For the reasons mentioned above, there is an urgent need in the art for a removal device that can clean holes to improve the quality of drilling. Utility Model Content

[0005] The purpose of this invention is to provide a removal device that at least addresses the deficiencies described above in the prior art.

[0006] According to an exemplary embodiment of the present invention, a removal device is provided, which can be configured to remove material from a component carrier during the manufacture of a plate-shaped component carrier. The removal device may include: a transport unit configured to hold and transport the component carrier; a removal unit configured to remove material from a surface of the component carrier transported by the transport unit; a cleaning unit comprising a cleaning device facing at least one main surface of the component carrier transported by the transport unit, the cleaning device comprising at least one rotatable cleaning pipe configured to spray fluid onto the main surface of the component carrier through the cleaning pipe; and a purging unit configured to spray gas onto the main surface of the component carrier to remove residues on the main surface of the component carrier.

[0007] In the context of this application, the term "component carrier" may specifically refer to any support structure, such as a plate-like structure, capable of accommodating one or more components thereon and / or therein to provide mechanical support and / or electrical connection. In other words, a component carrier can be constructed as a mechanical and / or electronic carrier of a component. In particular, a component carrier can be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. A component carrier can also be a hybrid plate combining different carriers of the above-described types of component carriers.

[0008] In the context of this application, the term "component carrier structure" may specifically refer to a prefabricated component carrier currently being manufactured. Specifically, a component carrier structure may include multiple component carriers or prefabricated components that remain integrally connected, and these component carriers or prefabricated components may be manufactured in a batch process prior to individualization. In particular, a component carrier structure may be a panel (e.g., having a size of 18 inches × 24 inches or larger) or an array (e.g., an array of six component carriers currently being manufactured). For example, the manufactured component carrier may be a printed circuit board or an IC substrate.

[0009] In alternative embodiments, the manufactured component carrier may include a stack of at least one electrically insulating layer structure and / or at least one conductive layer structure. For example, the component carrier may be a laminate of electrically insulating and conductive layer structures, particularly formed by applying mechanical pressure and / or heat. A “stack” can provide a plate-like component carrier that offers a large mounting surface for other components while remaining very thin and compact. The term “layer structure” may specifically refer to a continuous layer, a patterned layer, or multiple discontinuous islands within a common plane.

[0010] In an alternative implementation, the component carrier is shaped like a plate. This contributes to a compact design, where the component carrier still provides a large base for mounting components. Furthermore, particularly as a bare mold for embedded electronic components, its small thickness allows for easy embedding into thin plates, such as printed circuit boards.

[0011] In an alternative implementation, the component carrier is configured as one of a group consisting of a printed circuit board, a substrate (particularly an IC substrate), and an intermediate layer.

[0012] In the context of this application, the term "printed circuit board" (PCB) can specifically refer to a board-shaped component carrier formed by laminating several conductive layer structures with several electrically insulating layer structures, for example by applying pressure and / or by providing heat. As the preferred material for PCB technology, the conductive layer structures are made of copper, while the electrically insulating layer structures can consist of resin and / or glass fiber, i.e., so-called prepreg or FR4 material. Various conductive layer structures can be formed with through-holes in the laminate, for example by laser drilling or mechanical drilling, and connected to each other in the desired manner by filling them with a conductive material (particularly copper), thus forming through-hole connections. In addition to one or more components that can be embedded in the PCB, PCBs are generally constructed to accommodate one or more components on one or two opposing surfaces of the board-shaped PCB. They can be soldered to their respective main surfaces. The dielectric portion of the PCB can consist of resin and reinforcing fibers (such as glass fiber).

[0013] At least one “component” that can be embedded in and / or surface-mounted on a component carrier may be selected from the group consisting of: non-conductive inlays (e.g., ceramic inlays, preferably including aluminum nitride or aluminum oxide), conductive inlays (e.g., metallic inlays, preferably including copper or aluminum), heat transfer units (e.g., heat pipes), light guiding elements (e.g., optical waveguides or optical conductor connections), optical elements (e.g., lenses), electronic components, or combinations thereof. For example, the component may be an active electronic component, a passive electronic component, an electronic chip, a storage device (e.g., DRAM or other data storage), a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a light-emitting diode, an optical connector, a voltage converter (e.g., a DC / DC converter or an AC / DC converter), a encryption component, a transmitter and / or a receiver, an electromechanical transducer, a sensor, an actuator, a microelectromechanical system (MEMS), a microprocessor, a capacitor, a resistor, an inductor, a battery, a switch, a camera, an antenna, a logic chip, and an energy harvesting unit. However, other components may be embedded in the component carrier. For example, magnetic elements may be used as components. This magnetic element can be a permanent magnetic element (e.g., a ferromagnetic element, an antiferromagnetic element, a multiferromagnetic element, or a ferrite core) or a paramagnetic element. However, the component can also be a substrate, an interlayer, or another component carrier, such as in a board-in-board configuration. The component can be surface-mounted on a component carrier and / or embedded therein. Furthermore, other components can also be used as components.

[0014] In an alternative embodiment, the component carrier can be a laminated component carrier. In such an embodiment, the component carrier can be a multilayered compound that is stacked and bonded together by applying pressure and / or heat. After processing the inner layer structure of the component carrier, one or two opposing main surfaces of the processed layer structure can be symmetrically or asymmetrically covered (particularly by lamination) with one or more additional electrically insulating and / or conductive layer structures. In other words, accumulation can continue until the desired number of layers is obtained. After completing the stack of electrically insulating and conductive layer structures, the obtained layer structure or component carrier can be surface-treated, perforated, etc.

[0015] Specifically, regarding drilling, mechanical drilling, laser drilling, or other methods can be used to process the plate-shaped parts, thereby creating, for example, through holes or vias. The drilled plate-shaped parts are then transported to the removal equipment of this embodiment for further processing and cleaning.

[0016] In the foregoing of this application, the terms “longitudinal” and “longitudinal direction” may specifically refer to the transport direction of the removal equipment or a direction parallel to the transport direction, such as direction X shown in the figures; the terms “lateral” and “lateral direction” may specifically refer to a direction perpendicular to the transport direction of the removal equipment and nearly parallel to the ground on which the removal equipment is installed, such as direction Y shown in the figures; and the terms “vertical” and “vertical direction” may specifically refer to a direction perpendicular or approximately perpendicular to the ground on which the removal equipment is installed, such as direction Z shown in the figures.

[0017] Other example implementations of removing the device will be described below.

[0018] In an optional embodiment, the cleaning apparatus may include an upper cleaning device disposed above the transport unit and a lower cleaning device disposed below the transport unit. The upper cleaning device may be configured to spray fluid onto the upper main surface of the component carrier through the cleaning pipe, and the lower cleaning device may be configured to spray fluid onto the lower main surface of the component carrier through the cleaning pipe. This allows both the upper and lower surfaces of the component carrier to be effectively cleaned.

[0019] In an optional embodiment, the cleaning device can rotate about a rotation axis perpendicular to the main surface of the component carrier.

[0020] In an optional embodiment, the cleaning device may include a plurality of cleaning pipes, which are rotatable about a rotation axis perpendicular to the main surface of the component carrier.

[0021] In an optional embodiment, the cleaning device may include a plurality of cleaning pipes, which may be arranged radially about a rotation axis perpendicular to the main surface of the component carrier. This arrangement allows the relative positions of the rotatable cleaning pipes and the surface of the component carrier to continuously change, thereby effectively cleaning the entire surface of the component carrier.

[0022] In an optional embodiment, the cleaning conduit can be arranged in a cross shape. In a preferred embodiment, multiple spray outlets can be provided in the middle and at the ends of the cross-shaped cleaning conduit, as needed, so that the cleaning range covers the entire surface of the component carrier. For example, the liquid sprayed from each spray outlet of the cleaning conduit provides a fan-shaped coverage area, and the coverage areas provided by the liquid from multiple spray outlets can overlap to enhance the cleaning effect.

[0023] In an optional embodiment, the pressure of the fluid injected by the cleaning device through the cleaning pipe can be in the range of 90 bar to 110 bar.

[0024] In an optional embodiment, the pressure of the fluid sprayed by the cleaning device through the cleaning pipe can be 100 bar. This ultra-high pressure cleaning fluid can not only clean the surface of the component carrier but also remove impurities and other contaminants from within the holes, carrying these contaminants away from the component carrier.

[0025] In an optional embodiment, the transport unit may include rollers that contact at least one main surface of the component carrier. Preferably, the rollers may be arranged in a row of side-by-side rollers to achieve support and transport of the component carrier.

[0026] In an optional implementation, the transport unit may be driven by a motor.

[0027] In an optional embodiment, the removal unit may include an upper removal device and a lower removal device. The upper removal device and the lower removal device may be configured to contact and process the upper and lower main surfaces of the component carrier, respectively, to effectively remove particulate impurities and other contaminants from the upper and lower main surfaces of the component carrier.

[0028] In an optional embodiment, each of the upper removal device and the lower removal device may include at least one roughening roller for polishing the main surface of the component carrier.

[0029] In an optional embodiment, the surface of the roughening roller may be provided with bristles.

[0030] In an optional embodiment, the purging unit can be located in the loading area and / or unloading area of ​​the removal device. A purging unit located in the loading area can pre-purge the component carrier, initially removing particulate impurities and other contaminants from the surface and pores of the component carrier, thereby improving the overall cleaning and removal efficiency of the device.

[0031] In an optional implementation, the residue can be a liquid, such as a cleaning fluid. The purging unit located in the unloading area can not only further remove particulate impurities and other contaminants from the surface and holes of the component carrier, but also serve a drying function to remove the (cleaning) fluid remaining on the surface and in the holes of the component carrier.

[0032] In an optional embodiment, the cleaning unit may further include a container. The cleaning unit and the container are in fluid communication, and the cleaned liquid can be transported and stored in the container through a connecting pipeline. After being filtered, the liquid can be pumped back into the cleaning unit to clean the component carrier. This arrangement of the cleaning unit, container, filter, and pump can form a circulation loop for the cleaning fluid.

[0033] In an optional embodiment, the removal device may further include a pre-cleaning unit located upstream of the cleaning unit along the transport direction of the component carrier. The pre-cleaning unit can also remove particulate impurities and other contaminants from the surface and pores of the component carrier, improving the overall cleaning and removal efficiency of the device.

[0034] In an optional embodiment, the pre-cleaning unit may include at least one pre-cleaning nozzle and a container, into which the liquid after pre-cleaning the component carrier is transported and stored.

[0035] In an optional embodiment, the container may be provided with a filter for filtering the liquid and a pump for pumping the filtered liquid back to the pre-cleaning nozzle.

[0036] In an optional implementation, the pressure of the liquid provided by the pre-cleaning unit may be less than the pressure of the liquid provided by the cleaning unit.

[0037] In an optional implementation, the pressure of the liquid provided by the pre-cleaning unit can be in the range of 10 bar to 17 bar.

[0038] In an optional implementation, the pressure of the liquid provided by the pre-cleaning unit can be 10 bar.

[0039] In an optional embodiment, the cleaning unit may further include an ultrasonic cleaning device.

[0040] According to the embodiments of this application, the removal device, through the cooperation of various mechanisms such as the transport unit, the purging unit, the cleaning unit, and the pre-cleaning unit, effectively treats the surface of the component carrier plate, cleans the holes multiple times, improves the drilling quality, ensures that the plating layer on the holes will not contain foreign matter, and that the components can be properly placed, embedded, or buried in the component carrier, thereby improving the yield of the final product and ensuring the normal use of the electronic devices in the future. Attached Figure Description

[0041] The above-defined aspects and other aspects of the present invention will become apparent from the embodiments described below with reference to the accompanying drawings. The present invention will be described below with reference to the embodiments, but the present invention is not limited to the described embodiments.

[0042] Figure 1 This is a schematic diagram of a removal device according to an embodiment of the present invention;

[0043] Figure 2 This is a schematic perspective view of the upper cleaning device installed in the removal device according to an embodiment of the present invention; and

[0044] Figure 3 This is a schematic perspective view of a lower cleaning device provided in a removal device according to an embodiment of the present invention.

[0045] List of reference numerals in the attached diagram:

[0046] 1. Removal equipment; 10. Component carrier; 2. Transport unit; 3. Removal unit;

[0047] 32 Upper removal device; 34 Lower removal device; 4 Cleaning unit; 42 Cleaning device;

[0048] 422 Upper cleaning device; 4222 Upper cleaning pipe; 4224 Upper base;

[0049] 424 Lower cleaning device; 4242 Lower cleaning pipe; 4244 Lower base;

[0050] 44 Cleaning pipes; 5 Purging unit; 52 Upper purging device; 54 Lower purging device;

[0051] 6. Pre-cleaning unit; 62. Pre-cleaning nozzle; 64. Container. Detailed Implementation

[0052] The illustrations in the accompanying drawings are schematic. It should be noted that in different drawings, similar or identical elements or features are given the same reference numerals or reference numerals that differ only in the first digit. To avoid unnecessary repetition, elements or features already described with respect to the foregoing embodiments will not be described again in subsequent descriptions.

[0053] Furthermore, spatially related terms, such as "front" and "back," "up" and "down," "left" and "right," are used to describe the relationship between one element and another as shown in the figures. Thus, spatially related terms can be applied to orientations in use that differ from those illustrated in the figures. Clearly, all such spatially related terms refer only to the orientations shown in the figures for ease of description and are not necessarily limiting, as the device according to the embodiments of this invention may be assumed to have orientations different from those illustrated in the figures during use. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0054] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0055] Figure 1 A schematic diagram of a removal device 1 according to an embodiment of the present invention. The removal device 1 can be configured to remove material from the component carrier 10 during the manufacturing of the plate-shaped component carrier 10, for example, by treating the edges of holes in a perforated plate-shaped component or by cleaning the inside of the holes to remove foreign objects.

[0056] The removal device 1 may include: a transport unit 2 configured to hold and transport the component carrier 10; a removal unit 3 configured to remove material from the surface of the component carrier 10 transported by the transport unit 2; a cleaning unit 4 including a cleaning device 42 facing at least one main surface of the component carrier 10 transported by the transport unit 2, the cleaning device 42 including at least one rotatable cleaning pipe 44 configured to spray fluid onto the main surface of the component carrier 10 through the cleaning pipe 44; and a purging unit 5 configured to spray gas onto the main surface of the component carrier 10 to remove residues on the main surface of the component carrier 10.

[0057] It is understood that the transport unit 2 can extend throughout the entire removal device 1, thereby transporting the component carrier 10 from the loading end of the removal device 1 to the various processing units of the removal device 1 until the component carrier 10 leaves the removal device 1 from the unloading end. In some embodiments, the transport unit 2 may include rollers that contact at least one main surface of the component carrier 10, and the transport unit 2 may be driven by a motor. In a preferred embodiment, the transport unit 2 may include rollers that contact both main surfaces of the component carrier 10, and only the rollers that contact the lower surface of the component carrier 10 are driven by a motor.

[0058] refer to Figure 1 As shown, the transport unit 2 includes two rows of conveyor rollers that clamp the component carrier 10, with the two rows of conveyor rollers contacting the upper and lower main surfaces of the component carrier 10, respectively. The surfaces of the conveyor rollers may be provided with rubber rings to cushion and protect the surfaces of the component carrier 10 during transport. It is understood that the transport unit 2 may also include only one row of conveyor rollers, supporting the component carrier 10 from below and transporting it to the various units of the removal device 1. Alternatively, the transport unit 2 may take other forms, such as a conveyor belt.

[0059] In some embodiments, the purging unit 5 may be located in the loading area and / or unloading area of ​​the removal device 1. (See reference...) Figure 1 As shown, along the transport direction of the removal device 1, a purging unit 5 is provided at the loading end and the unloading end of the removal device 1, respectively. The purging unit 5 can be connected to an air pump, for example, so that pressurized gas is sprayed onto the surface of the plate-shaped member through, for example, a hose or nozzle, to remove excess liquid from the surface of the plate-shaped member at the loading end and the unloading end, or residual liquid in the holes of the plate-shaped member.

[0060] The purging unit 5 may include an upper purging device 52 and a lower purging device 54. The upper purging device 52 and the lower purging device 54 may each include at least one nozzle, which is configured to spray gas onto the upper main surface and the lower main surface of the component carrier 10, respectively.

[0061] It will be understood by those skilled in the art that Figure 1 The arrangement of the purging unit 5 shown is merely illustrative; more or fewer purging units 5 can be set according to production requirements. A single purging unit 5 can be set at either the loading or unloading end, or purging units 5 can be set along the transport direction between various units, such as between the loading end and the removal unit 3, between the removal unit 3 and the cleaning unit 4, and between the cleaning unit 4 and the unloading end, to ensure the cleanliness of the plate-shaped component surface at all times.

[0062] refer to Figure 1 As shown, the removal unit 3 may include an upper removal device 32 and a lower removal device 34. When the component carrier 10 is transported by the transport unit 2 through the removal unit 3, the upper removal device 32 and the lower removal device 34 contact the upper main surface and the lower main surface of the component carrier 10, respectively, and perform processing.

[0063] Specifically, each of the upper removal device 32 and the lower removal device 34 may include four roughening rollers (e.g., Figure 1 The rollers shown have shaded lines on their surfaces) and four drive rollers (e.g. Figure 1 (The roller shown has no shaded lines on its surface). In the longitudinal direction, taking the upper removal device 32 as an example, four roughening rollers and four drive rollers can be arranged at intervals. In the vertical direction, one roughening roller of the upper removal device 32 can be aligned with one drive roller of the lower removal device 34, and correspondingly, one drive roller of the upper removal device 32 can be aligned with one roughening roller of the lower removal device 34. With this arrangement, the component carrier 10 is clamped by the upper removal device 32 and the lower removal device 34 when passing through the removal unit 3, and at least one main surface is acted upon by the roughening roller, so that the surface of the component carrier 10 is polished, and the burrs on the edge of the hole are also removed, enhancing the smoothness of the hole edge.

[0064] It is understood that the above arrangement of the roughening rollers is merely illustrative, and the number and position of the roughening rollers can be adjusted according to production requirements. For example, the upper removal device 32 and / or the lower removal device 34 can be equipped with 2, 3, 5, 6, or 7 roughening rollers, with no drive rollers between them, or with one drive roller between 2 or 3 roughening rollers. Furthermore, the arrangement of the roughening rollers in the upper removal device 32 and the lower removal device 34 can be the same or different; the specific number and arrangement will not be listed in detail here.

[0065] In some embodiments, the roughening roller may have a layer of polishing material on its surface, such as bristles or polishing pads, to polish the main surface of the component carrier 10.

[0066] refer to Figure 1 As shown, the cleaning unit 4 may include a cleaning device 42, which may be configured to spray fluid onto the main surface of the component carrier 10 through a cleaning pipe 44. The cleaning device 42 may have an upper cleaning device 422 and a lower cleaning device 424 arranged vertically. When the component carrier 10 is transported through the cleaning unit 4 by the transport unit 2, the upper cleaning device 422 cleans the upper main surface of the component carrier 10, and the lower cleaning device 424 cleans the lower main surface of the component carrier 10. The cleaning pipe 44 may include an upper cleaning pipe 4222 above the component carrier 10 and a lower cleaning pipe 4242 below the component carrier 10.

[0067] Specifically, refer to Figure 1 Schematic diagram and Figure 2 The diagram shows a perspective view of the upper cleaning device 422. The upper cleaning device 422 may have an upper base 4224 and four upper cleaning pipes 4222 in fluid communication with the upper base 4224. The upper base 4224 is connected to the top of the frame of the removal device 1. Preferably, the upper base 4224 is fixed to the top of the frame, and the upper base 4224 has a fluid channel inside to supply external cleaning fluid to the upper cleaning pipes 4222.

[0068] The upper cleaning device 422 can rotate about a rotation axis perpendicular to the main surface of the component carrier 10, for example, about the vertical axis Z. This rotation can be achieved, for example, by connecting the upper base 4224 to four upper cleaning pipes 4222 in a rotatable manner, for example, by a hinged connection or by providing a multi-hole ball joint at the connection point. This allows the four upper cleaning pipes 4222 to rotate relative to the fixed upper base 4224 while maintaining fluid communication with it. The four upper cleaning pipes 4222 can rotate about the vertical axis Z around the connection point, thereby spraying cleaning liquid onto the entire upper main surface of the component carrier 10.

[0069] Four upper cleaning pipes 4222 are arranged radially from the connection point, for example, in a cross shape.

[0070] Similarly, refer to Figure 1 Schematic diagram and Figure 3 The diagram shows a perspective view of the lower cleaning device 424. The lower cleaning device 424 may have a lower base 4244 and four lower cleaning pipes 4242 in fluid communication with the lower base 4244. The lower base 4244 is connected to the bottom of the frame of the removal device 1. Preferably, the lower base 4244 is fixed to the bottom of the frame, and a fluid channel is provided inside the lower base 4244 to supply external cleaning fluid to the lower cleaning pipes 4242.

[0071] The lower cleaning device 424 can rotate about an axis perpendicular to the main surface of the component carrier 10, for example, about the vertical axis Z. This rotation can be achieved, for example, by the following means: The lower base 4244 is rotatably connected to four lower cleaning pipes 4242, for example, by a hinged connection or by providing a multi-hole ball joint at the connection point, so that the four lower cleaning pipes 4242 can rotate relative to the fixed lower base 4244 while in fluid communication with the lower base 4244. The four lower cleaning pipes 4242 can rotate about the vertical axis Z around the connection point, thereby spraying cleaning liquid onto the entire lower main surface of the component carrier 10. The four lower cleaning pipes 4242 are also arranged in a cross shape around the connection point.

[0072] It is understood that the arrangement of the upper cleaning device 422 and the lower cleaning device 424, as well as the arrangement of the upper cleaning pipe 4222 and the lower cleaning pipe 4242, are all illustrative and can be adjusted and changed according to different production needs.

[0073] For example, in removal device 1, a second, third, or more sets of upper cleaning devices 422 and lower cleaning devices 424 of different heights can be provided along the longitudinal direction. Furthermore, the number and arrangement of upper cleaning pipes 4222 and lower cleaning pipes 4242 can be the same or different. Taking upper cleaning pipes 4222 as an example, two upper cleaning pipes 4222 can be provided, arranged in opposite directions and capable of rotating around the vertical direction; three upper cleaning pipes 4222 can also be provided, with adjacent upper cleaning pipes 4222 forming a 120-degree angle; or five, six, or more upper cleaning pipes 4222 can be provided, thereby providing sufficient cleaning fluid to the main surface of the component carrier 10. In the case of more upper cleaning pipes 4222, the upper cleaning pipes 4222 can be fixed rather than rotating; in the fixed case, the fluid provided by the upper cleaning pipes 4222 can also rinse the entire main surface of the component carrier 10.

[0074] Furthermore, it is understandable that the number of cleaning pipes 44 can also be determined based on factors such as the surface area of ​​the main surface of the component carrier 10 to be treated and the distance between the pipe nozzle and the main surface of the component carrier 10. For example, the larger the surface area of ​​the main surface of the component carrier, the more cleaning pipes 44 can be; the farther the distance between the pipe nozzle and the main surface of the component carrier 10, the more cleaning pipes 44 can be, and vice versa.

[0075] For example, the flow rate of the fluid used to clean the surface of the component carrier 10 can be altered by adding additional nozzles. As shown in the figure, a nozzle can be installed at the end of each cleaning pipe 44. When the surface area of ​​the component carrier 10 to be cleaned is large, additional nozzles can be added along the length of the cleaning pipe 44 to ensure that the cleaning fluid completely covers the surface of the component carrier 10. Preferably, the multiple nozzles on the cleaning pipe 44 can be arranged at equal intervals.

[0076] In some embodiments, the cleaning pipe 44 can be made of different materials. For example, the cleaning pipe 44 can be made of metal, preferably with an anti-corrosion coating on its surface. Alternatively, the cleaning pipe 44 can be made of corrosion-resistant plastic.

[0077] In some embodiments, both the upper cleaning device 422 and the lower cleaning device 424 can spray fluid with a pressure in the range of 90 bar to 110 bar through the cleaning pipe 44. Preferably, the fluid pressure can be, but is not limited to, 90 bar, 95 bar, 100 bar, 105 bar, or 110 bar, and an appropriate pressure range can be selected according to actual needs, provided that the component carrier is not damaged.

[0078] In some embodiments, the cleaning unit 4 may further include a container. The cleaning unit 4 and the container are in fluid communication, and the cleaning liquid can be transported and stored in the container through a connecting pipeline. After being filtered by a filter, the liquid can be pumped back into the cleaning unit 4 to clean the component carrier. This arrangement of the cleaning unit 4, container, filter, and pump can form a circulation loop for the cleaning fluid.

[0079] In some embodiments, the rotational angular velocity w of the cleaning pipe 44, the transport speed v of the transport unit 2, and the length L of the component carrier 10 along the transport direction X can be set to satisfy the formula: w = 4πv / L.

[0080] For example, if the length L of the component carrier 10 to be processed is typically 518 mm, and the transport speed v of the transport unit 2 can be set to 2 m / min, then the rotational angular velocity w of the cleaning pipe can be set to 48.5 radians / min.

[0081] In some embodiments, the cleaning unit 4 may also include an ultrasonic cleaning device. The ultrasonic cleaning device is configured to be driven by an associated ultrasonic generator, the generated ultrasonic waves propagating in the liquid, causing the liquid to vibrate at the ultrasonic frequency, thereby cleaning the surface of the component carrier 10.

[0082] In some embodiments, the removal device 1 may further include a pre-cleaning unit 6 located upstream of the cleaning unit 4 along the transport direction of the component carrier 10. The pre-cleaning unit 6 may include at least one pre-cleaning nozzle 62 and a container 64, into which liquid after pre-cleaning the component carrier 10 is conveyed and stored.

[0083] For example, refer to Figure 1 As shown, the pre-cleaning unit 6 is equipped with eight pre-cleaning nozzles 62 and a container 64. Four pre-cleaning nozzles 62 are located above the transport unit 2, and the other four are located below the transport unit 2. These nozzles supply liquid to the upper and lower main surfaces of the component carrier 10, respectively, to perform pre-cleaning. The pre-cleaned liquid is then transported and stored in the lower container 64. The container 64 may be equipped with a filter to filter the liquid and pumps, such as P1-P6 shown in the figure, to pump the filtered liquid back to the pre-cleaning nozzles 62.

[0084] In some embodiments, the pressure of the liquid provided by the pre-cleaning unit 6 may be lower than the pressure of the liquid provided by the cleaning unit 4. For example, the pressure of the liquid provided by the pre-cleaning unit 6 may be in the range of 10 bar to 17 bar. Preferably, the pressure of the liquid provided by the pre-cleaning unit 6 may be, for example, but not limited to, 10 bar, 11 bar, 12 bar, 13 bar, 14 bar, 15 bar, 16 bar, or 17 bar.

[0085] Furthermore, those skilled in the art will understand that, in the case of high production volume, the transport unit 2 continuously conveys multiple spaced-apart component carriers 10 through the removal device 1. Therefore, each unit of the removal device 1 may not require sensing devices and can operate continuously to process the passing component carriers 10. Alternatively, the removal device 1 may also be equipped with sensing devices, such as infrared sensors, which can be located at the entrance of each unit. When the sensing device detects the arrival of a component carrier 10, the transport unit 2 stops. After each unit completes the processing of the component carrier 10, the transport unit 2 continues to operate to transport the processed component carrier 10 to the next unit or away from the removal device 1.

[0086] In summary, the operating principle of the removal device 1 provided by the exemplary embodiment of this utility model is as follows: The component carrier 10 to be processed enters the removal device 1 at the loading end, and is first transported by the transport unit 2 to the purging unit 5. The purging unit 5 sprays pressurized gas onto the main surface of the component carrier 10 to remove residual liquid and some contaminants from the previous process from the main surface. Then, it is transported by the transport unit 2 to the removal unit 3. The rough roller of the removal unit 3 processes the main surface, making the main surface polished and the edges of the holes flat. Then, it is transported by the transport unit 2 to the pre-cleaning unit 6. The pre-cleaning unit 6 uses a low-pressure liquid to pre-clean the component carrier 10. Then, it is transported by the transport unit 2 to the cleaning unit 4. The cleaning device 42 in the cleaning unit 4 performs a deep cleaning of the component carrier 10 again to ensure that there are no foreign objects in all the holes of the component carrier 10. Finally, it is transported by the transport unit 2 to another purging unit 5 to blow away the residual liquid on the main surface and in the holes of the component carrier 10, and then it is transported to the unloading end.

[0087] Although, in the exemplary embodiment shown, the removal device 1 includes two purging units 5, one removal unit 3, one pre-cleaning unit 6, and one cleaning unit 4 along the transport direction, those skilled in the art will understand that the number and arrangement order of each unit are not fixed. Depending on different production requirements, the removal device 1 may include more purging units 5, removal units 3, pre-cleaning units 6, and cleaning units 4, and the arrangement order of each unit may also vary, as long as the component carrier 10 is thoroughly cleaned in the end.

[0088] Unless the context explicitly requires it, the word "comprising" and similar terms in the specification and claims are considered to have an inclusive meaning, as opposed to an exclusive or comprehensive meaning; that is, they mean "including but not limited to". The use of singular or plural terms also includes the plural or singular, respectively. Furthermore, when the terms "here", "above", "below", and similar terms are used in this application, they refer to the entire application and not to any particular part of it.

[0089] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it; although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A removal device, characterized in that, The removal device (1) is configured to remove material from the component carrier (10) during the manufacture of the plate-shaped component carrier (10), and the removal device (1) includes: Transport unit (2), the transport unit (2) being configured to hold and transport the component carrier (10); Removal unit (3) is configured to remove material from the surface of the component carrier (10) being transported by the transport unit (2); A cleaning unit (4) comprising a cleaning device (42) facing at least one main surface of the component carrier (10) being transported by the transport unit (2), the cleaning device (42) comprising at least one rotatable cleaning pipe (44), the cleaning device (42) being configured to spray fluid onto the main surface of the component carrier (10) through the cleaning pipe (44); and A purging unit (5) is configured to spray gas onto the main surface of the component carrier (10) to remove residues on the main surface of the component carrier (10).

2. The removal device according to claim 1, characterized in that, The cleaning device (42) includes an upper cleaning device (422) disposed above the transport unit and a lower cleaning device (424) disposed below the transport unit. The upper cleaning device (422) is configured to spray fluid onto the upper main surface of the component carrier (10) through the cleaning pipe (44), and the lower cleaning device (424) is configured to spray fluid onto the lower main surface of the component carrier (10) through the cleaning pipe (44).

3. The removal device according to claim 1 or 2, characterized in that, The cleaning device (42) rotates about a rotation axis that is perpendicular to the main surface of the component carrier (10).

4. The removal device according to claim 1 or 2, characterized in that, The cleaning device (42) includes a plurality of cleaning pipes (44) that rotate about a rotation axis perpendicular to the main surface of the component carrier (10).

5. The removal device according to claim 1 or 2, characterized in that, The cleaning device (42) includes a plurality of cleaning pipes (44) arranged radially about a rotation axis perpendicular to the main surface of the component carrier (10).

6. The removal device according to claim 5, characterized in that, The cleaning pipes (44) are arranged in a cross shape.

7. The removal device according to claim 1 or 2, characterized in that, The pressure of the fluid sprayed by the cleaning device (42) through the cleaning pipe (44) is in the range of 90 bar to 110 bar.

8. The removal device according to claim 1 or 2, characterized in that, The transport unit (2) includes a roller that contacts at least one main surface of the component carrier (10).

9. The removal device according to claim 1 or 2, characterized in that, The transport unit (2) is driven by a motor.

10. The removal device according to claim 1 or 2, characterized in that, The removal unit (3) includes an upper removal device (32) and a lower removal device (34), which are configured to contact and process the upper and lower main surfaces of the component carrier (10), respectively.

11. The removal device according to claim 10, characterized in that, Each of the upper removal device (32) and the lower removal device (34) includes at least one roughening roller for polishing the main surface of the component carrier (10).

12. The removal device according to claim 11, characterized in that, The surface of the rough roller is provided with bristles.

13. The removal device according to claim 1 or 2, characterized in that, The purging unit (5) is located in the loading area and / or unloading area of ​​the removal device (1).

14. The removal device according to claim 1, characterized in that, The residue is a liquid.

15. The removal device according to claim 1 or 2, characterized in that, The removal device (1) also includes a pre-cleaning unit (6) upstream of the cleaning unit (4) along the transport direction of the component carrier (10).

16. The removal device according to claim 15, characterized in that, The pre-cleaning unit (6) includes at least one pre-cleaning nozzle (62) and a container (64), into which the liquid after pre-cleaning the component carrier (10) is transported and stored.

17. The removal device according to claim 16, characterized in that, The container (64) is provided with a filter for filtering the liquid and a pump for pumping the filtered liquid back to the pre-cleaning nozzle (62).

18. The removal device according to claim 15, characterized in that, The pressure of the liquid provided by the pre-cleaning unit (6) is less than the pressure of the liquid provided by the cleaning unit (4).

19. The removal device according to claim 15, characterized in that, The pressure of the liquid provided by the pre-cleaning unit (6) is in the range of 10 bar to 17 bar.

20. The removal device according to claim 1 or 2, characterized in that, The cleaning unit (4) also includes an ultrasonic cleaning device.

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