High-power amplification system
By employing a high-power amplification system in the satellite communication system and utilizing a combination design of mounting plate and liquid cooling unit, the problems of poor heat dissipation and low reliability in the existing technology are solved, achieving high power output and reasonable layout, and reducing maintenance costs.
Patent Information
- Application Number
- CN202423313120.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2034-12-31
AI Technical Summary
In existing satellite communication high-power amplifier systems, existing power amplifiers suffer from problems such as low reliability, poor maintainability, high price, unreasonable layout, and poor heat dissipation. Furthermore, the output power of individual solid-state devices is limited, which cannot meet the requirements of high frequency, high efficiency, wide bandwidth, and high power.
A high-power amplification system is adopted, including a chassis, a mounting plate, and a liquid cooling unit. The first signal transmission unit and the second signal transmission unit are respectively placed in different areas of the mounting plate, and heat dissipation is achieved by using thermally conductive materials and liquid cooling units. High power output is achieved by combining components such as a multi-channel power divider and combiner and a bent waveguide.
While achieving high power output, it improves the rationality of system layout and heat dissipation, ensuring that the system can still work normally when some components fail, and reducing maintenance costs.
Smart Images
Figure CN223844068U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of communication technology equipment, specifically to a high-power amplification system. Background Technology
[0002] With the rapid development of satellite communication systems, the demand for high-frequency, high-efficiency, wide-bandwidth, high-power solid-state power amplifiers is increasing daily. However, the power output of a single solid-state device in the microwave and millimeter-wave bands is limited and cannot meet the system's requirements. To obtain greater output power, power combining measures are often required. For example, multiple power devices are combined into a single power combining amplifier. On the other hand, for economic and reliability considerations, smaller power sources are usually used for combining, rather than using a large power source directly. In this way, in addition to generating higher power, the system can continue to operate without complete failure even if one or more sources fail, but system performance is somewhat degraded.
[0003] At present, the power amplifiers used in the satellite communication high-power amplifier systems of satellite broadcasting and television earth stations in various provinces and cities in China are basically klystron and traveling wave tube power amplifiers from CPI Corporation of the United States. Although they can achieve high power output without the need for power combining, they are not reliable, have poor replacement and maintenance, are expensive, and have problems such as unreasonable layout and poor heat dissipation. Utility Model Content
[0004] The purpose of this invention is to provide a high-power amplification system that has the advantages of reasonable layout, compact structure, and good heat dissipation in practical use, while also achieving high power output.
[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:
[0006] A high-power amplification system includes a chassis and a mounting plate disposed inside the chassis. The invention also includes a first signal transmission unit and a second signal transmission unit disposed within the chassis.
[0007] The first signal transmission unit and the second signal transmission unit are both mounted on the mounting plate, with the first signal transmission unit located on the lower surface of the mounting plate and the second signal transmission unit located on the upper surface of the mounting plate.
[0008] The mounting plate is provided with connection holes, through which the first signal transmission unit passes and connects to the second signal transmission unit; the mounting plate is provided with a liquid cooling unit inside, and the mounting plate is made of thermally conductive material.
[0009] Furthermore, the mounting plate is made of thermally conductive aluminum sheet.
[0010] Further optimization includes the first signal transmission unit comprising a preamplifier module, a low-power isolator, a first driver module, a high-power isolator, a power divider, a second driver module, an isolator, and a multi-channel combiner.
[0011] Each output of the power divider is connected to the second driving module. The second driving module is connected to the input of the power combiner through an isolator. The output of the power combiner is connected to the second signal transmission unit through a twisted waveguide. After the preamplifier module, the low-power isolator, the first driving module, and the high-power isolator are connected in sequence, the high-power isolator is connected to the input of the power divider.
[0012] Further specifying, the power divider is a 4-channel power divider, and the power combiner is a 4-channel combiner.
[0013] Further optimization includes a second signal transmission unit comprising a first flexed waveguide, a second flexed waveguide, a high-power radial power divider, a power amplifier module, a high-power isolator, a high-power radial combiner, a third flexed waveguide, a waveguide filter, and a waveguide dual-directional coupler. The first flexed waveguide, second flexed waveguide, high-power radial power divider, power amplifier module, high-power isolator, high-power radial combiner, third flexed waveguide, and waveguide filter are connected sequentially.
[0014] A waveguide unidirectional coupler is provided between the first bend waveguide and the second bend waveguide;
[0015] The output of the waveguide filter is connected to a waveguide dual directional coupler, and a third bend waveguide is provided between the waveguide dual directional coupler and the high-power radial synthesizer.
[0016] Furthermore, the high-power radial power divider is connected to the final stage power amplifier module via an RF cable.
[0017] Among them, the high-power radial combiner is a 16-channel high-power radial combiner, and the high-power radial power divider is a 16-channel high-power radial power divider.
[0018] Further limiting, the output power of the power amplifier module is 200W.
[0019] Further optimizations have been made, with the input of the 16-channel high-power radial synthesizer using an N-type connector and the output being a BJ70 waveguide port.
[0020] Compared with the prior art, the present invention has the following beneficial effects:
[0021] In practical use, this utility model divides the interior of the chassis into two areas by setting a mounting plate, and sets the first signal transmission unit and the second signal transmission unit in the two areas respectively. The first signal transmission unit is located on the lower surface of the mounting plate. Since the mounting plate is equipped with a liquid cooling unit, it can dissipate heat from the first signal transmission unit and the second signal transmission unit at the same time, making the internal layout of the chassis more reasonable and enabling heat dissipation of the first signal transmission unit and the second signal transmission unit at the same time, thus improving the overall heat dissipation effect. Attached Figure Description
[0022] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.
[0023] Figure 1 This is a schematic diagram of the overall structure of this utility model.
[0024] Figure 2 This utility model Figure 1 The main view.
[0025] Figure 3 This utility model Figure 1 A bottom view.
[0026] Figure 4 This utility model Figure 1 Top view.
[0027] Figure 5 This is a schematic diagram of the internal structure of the new mounting plate of this utility model.
[0028] Figure label:
[0029] 101 Chassis, 102 Mounting plate, 103 First signal transmission unit, 104 Second signal transmission unit, 105 Flow channel, 106 Preamplifier module, 107 Low-power isolator, 108 First driver module, 109 High-power isolator, 110 Power divider, 111 Second driver module, 112 Isolator, 113 Multi-channel combiner, 114 First bend waveguide, 115 Waveguide single directional coupler, 116 Second bend waveguide, 117 High-power radial power divider, 118 Power amplifier module, 119 First high-power isolator, 120 High-power radial combiner, 121 Third bend waveguide, 122 Waveguide filter, 123 Waveguide dual directional coupler, 124 Bracket, 125 Twisted waveguide. Detailed Implementation
[0030] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.
[0031] In the description of the embodiments of this utility model, it should be understood that the terms "length", "vertical", "horizontal", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.
[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.
[0033] In this embodiment of the invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.
[0034] In this embodiment of the invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0035] The following disclosure provides many different implementations or examples for different structures of the embodiments of the present invention. To simplify the disclosure of the embodiments of the present invention, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the embodiments of the present invention. Furthermore, reference numerals and / or reference letters may be repeated in different examples of the embodiments of the present invention; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.
[0036] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.
[0037] See Figures 1-5 This embodiment discloses a high-power amplification system, including a chassis 101 and a mounting plate 102 disposed inside the chassis 101. This embodiment also includes a first signal transmission unit 103 and a second signal transmission unit 104 disposed inside the chassis 101.
[0038] The first signal transmission unit 103 and the second signal transmission unit 104 are both mounted on the mounting plate 102, with the first signal transmission unit 103 located on the lower surface of the mounting plate 102 and the second signal transmission unit 104 located on the upper surface of the mounting plate 102.
[0039] The mounting plate 102 is provided with a connection hole, through which the first signal transmission unit 103 passes and connects to the second signal transmission unit 104; the mounting plate 102 is provided with a liquid cooling unit inside, and the mounting plate 102 is made of thermally conductive material.
[0040] In practical use, this utility model divides the interior of the chassis 101 into two areas using the mounting plate 102, and respectively sets the first signal transmission unit 103 and the second signal transmission unit 104 in the two areas. The first signal transmission unit 103 is located on the lower surface of the mounting plate 102. Since the mounting plate 102 is equipped with a liquid cooling unit, it can simultaneously dissipate heat from the first signal transmission unit 103 and the second signal transmission unit, making the internal layout of the chassis 101 more reasonable and enabling simultaneous heat dissipation of the first signal transmission unit 103 and the second signal transmission unit, thereby improving the overall heat dissipation effect.
[0041] The mounting plate 102 is made of thermally conductive aluminum plate.
[0042] In practical use, the liquid cooling unit includes a chiller, a pump, heat exchange tubes, and refrigerant. The heat exchange tubes have a continuous S-shaped structure and are arranged inside the mounting plate. The heat exchange tubes are connected to the chiller via the pump, and the refrigerant is located inside the heat exchange tubes. In practical use, the chiller is used to cool the refrigerant. Under the action of the pump, the refrigerant circulates between the heat exchange tubes and the chiller, quickly removing the heat from the mounting plate 102 and achieving the purpose of rapid heat dissipation.
[0043] Furthermore, in some preferred embodiments, the mounting plate 102 is provided with several interconnected flow channels 105, which are connected to the chiller and pump, so that the refrigerant is in direct contact with the mounting plate 102, thereby improving the heat exchange efficiency.
[0044] The first signal transmission unit 103 includes a preamplifier module 106, a low-power isolator 107, a first driver module 108, a high-power isolator 109, a power divider 110, a second driver module 111, an isolator 112, and a multi-channel combiner 113.
[0045] Each output of the power divider 110 is connected to the second drive module 111. The second drive module 111 is connected to the input of the multi-combiner 113 through the isolator 112. The output of the multi-combiner 113 is connected to the second signal transmission unit 104 through the twisted waveguide 125. The preamplifier module 106, the low-power isolator 107, the first drive module 108, and the high-power isolator 109 are connected in sequence. The high-power isolator 109 is connected to the input of the power divider 110.
[0046] Further specifying, the power divider 110 is a 4-channel power divider, and the power combiner 113 is a 4-channel combiner.
[0047] In practical use, the second signal transmission unit 104 includes a first curved waveguide 114, a second curved waveguide 116, a high-power radial power divider 117, a power amplifier module 118, a first high-power isolator 119, a high-power radial combiner 120, a third curved waveguide 121, a waveguide filter 122, and a waveguide dual-directional coupler 123. The first curved waveguide 114, the second curved waveguide 116, the high-power radial power divider 117, the power amplifier module 118, the first high-power isolator 119, the high-power radial combiner 120, the third curved waveguide 121, and the waveguide filter 122 are connected sequentially.
[0048] A waveguide unidirectional coupler 115 is provided between the first curved waveguide 114 and the second curved waveguide 116.
[0049] The output of the waveguide filter 122 is connected to a waveguide dual directional coupler 123, and the third bend waveguide 121 is provided between the waveguide dual directional coupler 123 and the high-power radial synthesizer 120.
[0050] Furthermore, the high-power radial power divider 117 is connected to the final stage power amplifier module via an RF cable.
[0051] Among them, the high-power radial combiner 120 is a 16-channel high-power radial combiner 120, and the high-power radial power divider 117 is a 16-channel high-power radial power divider 117.
[0052] Furthermore, the output power of the power amplifier module 118 is 200W.
[0053] The 16-channel high-power radial synthesizer 120 uses an N-type connector at its input and a BJ70 waveguide output at its output.
[0054] To facilitate a better understanding of this invention by those skilled in the art, the following detailed description is provided in conjunction with specific implementation examples.
[0055] The small radio frequency signal first passes through the first signal transmission unit 103, and is then input to the preamplifier module 106 for signal amplification. The signal coupling port of the preamplifier module is mainly used to detect the presence or absence of external input signals.
[0056] The amplified signal passes through a low-power isolator 107. The main function of the low-power isolator 107 is to match the pre-amplifier and post-amplifier modules and to prevent signal reflection.
[0057] The signal is then amplified again in the first drive module 108, then passed through the high-power isolator 109, and then distributed to the four second drive modules 111 by a four-way power divider for further signal amplification. After passing through four isolators 112, the signal is combined by a four-way combiner and output to the twisted waveguide 125. The twisted waveguide 125 converts the E-plane and H-plane of the waveguide. In actual use, the unidirectional coupler can also change direction after conversion by the twisted waveguide 125, making full use of the space in the chassis 101, thereby reducing the size of the whole machine.
[0058] After passing through the first bend of waveguide 114, the signal enters the waveguide unidirectional coupler. (The unidirectional coupler port is mainly used to detect whether the power of the second drive module 111 has reached the power required by the power amplifier module 118. When the power of the whole system is insufficient, it is easy to determine the location of the fault.)
[0059] After passing through the second bend waveguide 116, the signal is input to the 16-channel radial power divider, which distributes the signal to the 16-channel power amplifier module 118 via RF cables for final signal amplification. After passing through the high-power isolator 119, the signal is combined by the 16-channel high-power radial combiner 120 to output the required high-power signal. The final high-power signal passes through the third bend waveguide 121 and the waveguide filter 122, and then through the waveguide dual directional coupler 123 (the forward port of the waveguide dual directional coupler 123 is mainly used to detect the magnitude of the final output power, and the reverse port of the waveguide dual directional coupler 123 is mainly used to detect the magnitude of the reflected power), and finally connects to the antenna to transmit the signal.
[0060] In practice, the high-power radial power divider 117 is installed inside the chassis 101 by a metal bracket 124 to prevent the high-power radial power divider 117 from falling off.
[0061] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.
[0062] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A high-power amplification system, comprising a chassis and a mounting plate disposed inside the chassis, characterized in that: It also includes a first signal transmission unit and a second signal transmission unit installed inside the chassis. The first signal transmission unit and the second signal transmission unit are both mounted on the mounting plate, with the first signal transmission unit located on the lower surface of the mounting plate and the second signal transmission unit located on the upper surface of the mounting plate. The mounting plate is provided with connection holes, through which the first signal transmission unit passes and connects to the second signal transmission unit; the mounting plate is provided with a liquid cooling unit inside, and the mounting plate is made of thermally conductive material.
2. The high-power amplification system according to claim 1, characterized in that: The mounting plate is made of thermally conductive aluminum sheet.
3. The high-power amplification system according to claim 1, characterized in that: The first signal transmission unit includes a preamplifier module, a low-power isolator, a first driver module, a high-power isolator, a power divider, a second driver module, an isolator, and a multi-channel combiner. Each output of the power divider is connected to the second driving module. The second driving module is connected to the input of the power combiner through an isolator. The output of the power combiner is connected to the second signal transmission unit through a twisted waveguide. After the preamplifier module, the low-power isolator, the first driving module, and the high-power isolator are connected in sequence, the high-power isolator is connected to the input of the power divider.
4. A high-power amplification system according to claim 3, characterized in that: The power divider is a 4-channel power divider, and the power combiner is a 4-channel combiner.
5. A high-power amplification system according to claim 3, characterized in that: The second signal transmission unit includes a first flexed waveguide, a second flexed waveguide, a high-power radial power divider, a power amplifier module, a first high-power isolator, a high-power radial combiner, a third flexed waveguide, a waveguide filter, and a waveguide dual-directional coupler. The first flexed waveguide, second flexed waveguide, high-power radial power divider, power amplifier module, high-power isolator, high-power radial combiner, third flexed waveguide, and waveguide filter are connected sequentially. A waveguide unidirectional coupler is provided between the first bend waveguide and the second bend waveguide; The output of the waveguide filter is connected to a waveguide dual directional coupler, and a third bend waveguide is provided between the waveguide dual directional coupler and the high-power radial synthesizer.
6. A high-power amplification system according to claim 5, characterized in that: The high-power radial power divider is connected to the final stage power amplifier module via an RF cable.
7. A high-power amplification system according to claim 6, characterized in that: The high-power radial combiner is a 16-channel high-power radial combiner, and the high-power radial power divider is a 16-channel high-power radial power divider.
8. A high-power amplification system according to claim 5, characterized in that: The output power of the small power amplifier module is 200W.
9. A high-power amplification system according to claim 7, characterized in that: The input of the 16-channel high-power radial synthesizer uses an N-type connector, and the output is a BJ70 waveguide port.