Radiator, power module radiating module and vehicle-mounted charger

Abstract

The utility model discloses a radiator, a power module heat radiation module and a vehicle-mounted charger, and relates to the technical field of heat radiation, one side of the radiator facing a heat source is provided with an insulation heat conduction layer, the insulation heat conduction layer comprises an insulation layer and a metal layer for heat conduction, and the first surface of the insulation layer is in heat conduction connection with the radiator; the second surface of the insulating layer is in heat-conducting connection with the first surface of the metal layer, and the second surface of the metal layer is in heat-conducting connection with a heat source. As the insulating layer is directly connected with the radiator in a heat-conducting manner, no adhesive is arranged between the insulating layer and the radiator to influence heat conduction, and heat resistance is reduced; the insulating layer is in heat-conducting connection with the heat source through the metal layer, and the metal layer is good in heat-conducting performance, so that heat generated by the heat source can be quickly conducted to the radiator through the metal layer and the insulating layer, heat accumulation is reduced, heat dissipation of the radiator is facilitated, and the heat dissipation effect is improved.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a heat sink, a power module heat dissipation module, and an on-board charger. Background Technology

[0002] With the rapid development of high technology, on-board chargers are constantly evolving towards higher integration, miniaturization, and higher performance. Electronic components within on-board chargers, such as power modules, generate a significant amount of heat during operation. This heat buildup leads to temperature increases, affecting the normal operation of these components. Therefore, heat sinks are needed to dissipate heat from the electronic components, preventing malfunctions due to overheating caused by excessive heat accumulation.

[0003] Most existing technologies involve using adhesive to bond thermal conductive gel to the heat sink, and then using adhesive to bond the other side of the thermal conductive gel to the electronic component. Because both sides of the thermal conductive gel are bonded with adhesive, the thermal resistance is high, reducing the heat dissipation effect of the heat sink. This results in a significant amount of heat still accumulating inside the on-board charger, and there is a risk of malfunction in the electronic component. Utility Model Content

[0004] The main purpose of this utility model is to propose a heat sink, a power module heat dissipation module, and an on-board charger, which aims to solve the problem that electronic components in the prior art are bonded to the heat sink with insulating and thermally conductive materials, resulting in high thermal resistance and reduced heat dissipation effect.

[0005] To achieve the above objectives, the present invention proposes a heat sink in which an insulating and thermally conductive layer is formed on the side of the heat sink facing the heat source. The insulating and thermally conductive layer includes an insulating layer and a metal layer for thermal conduction. The first side of the insulating layer is thermally connected to the heat sink, and the second side of the insulating layer is thermally connected to the first side of the metal layer. The second side of the metal layer is used for thermally connecting to the heat source.

[0006] In some embodiments, the insulating layer and the metal layer are disposed on the side of the heat sink facing the heat source by compression bonding.

[0007] In some embodiments, the insulating layer is a polypropylene layer.

[0008] In some embodiments, the metal layer is a copper foil.

[0009] In some embodiments, the second side of the metal layer is welded to the heat dissipation surface of the heat source.

[0010] In some embodiments, the radiator has internal cooling channels for the flow of cooling medium; or

[0011] The side of the radiator away from the heat source is provided with a heat dissipation fin structure. The heat dissipation fin structure includes multiple heat dissipation teeth and a connecting plate. The multiple heat dissipation teeth are connected to the connecting plate and are spaced apart. The connecting plate is connected to the insulating thermally conductive layer.

[0012] This utility model also proposes a power module heat dissipation module, including a power module body and a heat sink, wherein the power module body includes a heat dissipation surface, and the heat dissipation surface is thermally connected to the second surface of the metal layer.

[0013] In some embodiments, the heat dissipation surface is a metal heat dissipation surface, which is welded to the second side of the metal layer.

[0014] In some embodiments, the power module body is a top-heat-dissipating packaged power device.

[0015] This utility model also proposes an on-board charger, which includes a power module heat dissipation module.

[0016] The technical solution of this utility model involves forming an insulating and thermally conductive layer on the side of the radiator facing the heat source. The first side of the insulating layer is thermally connected to the radiator, and the second side of the insulating layer is thermally connected to the first side of a metal layer. The second side of the metal layer is used for thermal connection to the heat source. With this configuration, the insulating layer is directly thermally connected to the radiator, eliminating the need for adhesive between them and reducing thermal resistance. Furthermore, the insulating layer can be thermally connected to the heat source through the metal layer, which has good thermal conductivity. This allows the heat generated by the heat source to be quickly conducted to the radiator through the metal layer and the insulating layer, reducing heat accumulation, facilitating heat dissipation, and improving the overall heat dissipation effect. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0018] Figure 1 A schematic diagram of a structure of an embodiment of the radiator and heat source provided by this utility model;

[0019] Figure 2 A cross-sectional view of another embodiment of the radiator and heat source provided by this utility model;

[0020] Figure 3 A schematic diagram of a power module heat dissipation module according to an embodiment of the present invention;

[0021] Figure 4 This is a schematic diagram of another embodiment of the power module heat dissipation module provided by this utility model.

[0022] Explanation of icon numbers:

[0023] 100. Power module heat dissipation module; 10. Circuit board; 20. Heat source; 21. Main body; 22. Pin; 30. Metal solder layer; 40. Heat sink; 41. Insulating layer; 42. Metal layer; 43. Cooling channel; 44. Heat dissipation fin structure; 440. Heat dissipation teeth; 441. Connecting plate.

[0024] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0026] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0027] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0028] With the rapid development of high technology, on-board chargers are constantly evolving towards higher integration, miniaturization, and higher performance. Electronic components within on-board chargers, such as power modules, generate a significant amount of heat during operation. This heat buildup leads to temperature increases, affecting the normal operation of these components. Therefore, heat sinks are needed to dissipate heat from the electronic components, preventing malfunctions due to overheating caused by excessive heat accumulation.

[0029] Most existing technologies involve using adhesive to bond thermal conductive gel to the heat sink, and then using adhesive to bond the other side of the thermal conductive gel to the electronic component. Because both sides of the thermal conductive gel are bonded with adhesive, the thermal resistance is high, reducing the heat dissipation effect of the heat sink. This results in a significant amount of heat still accumulating inside the on-board charger, and there is a risk of malfunction in the electronic component.

[0030] This utility model proposes a radiator 40. Please refer to [link / reference]. Figures 1 to 4 In one embodiment of the present invention, the heat sink 40 of the present invention has an insulating layer formed on the side facing the heat source 20. The insulating layer includes an insulating layer 41 and a metal layer 42 for heat conduction. The first side of the insulating layer 41 is thermally connected to the heat sink 40, and the second side of the insulating layer 41 is thermally connected to the first side of the metal layer 42. The second side of the metal layer 42 is used for thermally connecting to the heat source 20.

[0031] The insulating layer 41 insulates the heat source 20 from the heat sink 40, preventing a short circuit between them. The insulating layer 41 also conducts heat generated by the heat source 20 to the heat sink 40. The insulating layer 41 can be directly formed on the surface of the heat sink 40, reducing the need for adhesive to bond it to the heat sink 40. This eliminates the need for adhesive between the insulating layer 41 and the heat sink 40, reducing thermal resistance. The metal layer 42 is then thermally connected to the second side of the insulating layer 41, allowing the heat source 20 to conduct heat through the metal layer 42 and the insulating layer 41 to the heat sink 40. Since no gel or adhesive is needed between the heat source 20 and the heat sink 40, the thermal resistance is significantly reduced, improving the heat dissipation effect of the heat sink 40.

[0032] Optionally, the heat source can be a power module. Since the metal layer 42 has good thermal conductivity, the heat from the power module can be conducted to the heat sink 40 through the metal layer 42 and the insulating layer 41. Furthermore, the power module can be soldered to the metal layer 42, reducing the need for adhesive bonding and thus lowering thermal resistance. The heat source 20 can be a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor). A MOSFET includes a body 21 and leads 22. The body 21 of the MOSFET is thermally connected to the metal layer 42, allowing heat to be conducted through the metal layer 42 to the insulating layer 41, and then through the insulating layer 41 to the heat sink 40.

[0033] The heat source can also be a power supply, circuit board, etc. The power supply or circuit board conducts heat to the heat sink 40 through the metal layer 42 and the insulating layer 41 to reduce thermal resistance and improve heat dissipation.

[0034] The technical solution of this utility model involves forming an insulating and thermally conductive layer directly on the side of the radiator 40 facing the heat source 20. The first side of the insulating layer 41 is thermally connected to the radiator 40, and the second side of the insulating layer 41 is thermally connected to the first side of the metal layer 42. The second side of the metal layer 42 is used for thermal connection with the heat source 20. With this configuration, the insulating layer 41 is directly thermally connected to the radiator 40, eliminating the need for adhesive between the insulating layer 41 and the radiator 40, thus reducing thermal resistance. Furthermore, the insulating layer 41 can be thermally connected to the heat source 20 through the metal layer 42, which has good thermal conductivity. This allows the heat generated by the heat source 20 to be quickly conducted to the radiator 40 through the metal layer 42 and the insulating layer 41, reducing heat accumulation and facilitating heat dissipation from the radiator 40, thereby improving the heat dissipation effect.

[0035] The insulating layer 41 and the metal layer 42 are disposed on the side of the heat sink 40 facing the heat source 20 by pressing. Specifically, the insulating layer 41 and the metal layer 42 are formed on the surface of the heat sink 40, and then the insulating layer 41 and the metal layer 42 are pressed onto the surface of the heat sink 40, so that the insulating layer 41 can be directly fixed to the heat sink 40 and the metal layer 42 is fixed to the insulating layer 41, without the need for adhesive. Since there is no adhesive between the insulating layer 41 and the heat sink 40, which affects heat conduction, the thermal resistance is reduced.

[0036] In one embodiment, the insulating layer 41 is a polypropylene layer. Polypropylene layers have the advantages of high temperature resistance, good thermal stability, and low thermal resistance.

[0037] A polypropylene layer is formed on the surface of the heat sink 40. Heat that is conducted from the heat source 20 to the metal layer 42 can be stably conducted to the heat sink 40 through the polypropylene layer so that the heat sink 40 can cool the heat source 20.

[0038] In one embodiment, the metal layer 42 is copper foil. The thermal conductivity of copper foil is approximately 401 W / (m·K). Most adhesives have a thermal conductivity of 0.055-0.071 W / (m·K), indicating that copper foil has better thermal conductivity than adhesive. By thermally connecting the copper foil to the heat source 20, the heat generated by the heat source 20 can be quickly conducted through the copper foil to the insulating layer 41, and then from the insulating layer 41 to the heat sink 40. The superior thermal conductivity of copper foil improves thermal efficiency.

[0039] Furthermore, the second side of the metal layer 42 is welded to the heat dissipation surface of the heat source 20, making the connection between the heat source 20 and the metal layer 42 more stable; it also avoids the use of adhesive, thus ensuring that there is no adhesive between the metal layer 42 and the heat source 20 affecting heat conduction and reducing thermal resistance.

[0040] Specifically, the heat dissipation surface of the heat source 20 is welded to the metal layer 42. The heat from the heat source 20 can be transferred to the heat sink 40 through the metal layer 42 and the insulation layer 41. Furthermore, the metal layer 42 has good thermal conductivity, allowing the heat source 20 to transfer heat to the heat sink 40 through the metal layer 42, thus improving the heat transfer efficiency.

[0041] Among them, reference Figure 4 The radiator 40 has a cooling channel 43 inside for the flow of cooling medium. The cooling medium flows through the cooling channel 43 to dissipate heat from the heat source 20 connected to the radiator 40. Optionally, the radiator 40 can also be a water channel structure with multiple flat tubes installed inside, and the cooling medium flows in the multiple flat tubes.

[0042] To improve the cooling performance of radiator 40, refer to Figure 4 There are multiple cooling channels 43, which are spaced apart and interconnected at their ends. The cooling medium flows through the multiple cooling channels 43, increasing its fluidity and thus enabling faster heat dissipation. The heat source 20 conducts heat to the surface of the radiator 40 through the metal layer 42 and the insulating layer 41. The cooling medium inside the radiator 40 exchanges heat with the surface of the radiator 40 to reduce the temperature of the radiator 40 and the heat source 20.

[0043] Reference Figure 2 In another embodiment, the side of the radiator 40 facing away from the heat source 20 is provided with a heat dissipation fin structure 44; the heat dissipation fin structure 44 includes a plurality of heat dissipation teeth 440 and a connecting plate 441, the plurality of heat dissipation teeth 440 are connected to the connecting plate 441, and the plurality of heat dissipation teeth 440 are spaced apart, and the connecting plate 441 is connected to the insulating layer 41. Optionally, the shape of the heat dissipation teeth 440 can be set to elliptical, cylindrical, straight fin, etc.

[0044] This utility model also proposes a power module heat dissipation module 100, which includes a power module body and a heat sink 40. The specific structure of the power module heat dissipation module 100 is as described in the above embodiments. Since the heat sink 40 adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here. The power module body includes a heat dissipation surface, which is thermally connected to the second surface of the metal layer 42.

[0045] Reference Figure 1 and Figure 3 The heat source 20 includes the power module body. The power module body has a heat dissipation surface, and the metal layer 42 is thermally connected to the heat dissipation surface. The metal layer 42 has a large heat conduction area and good thermal conductivity, so that the heat of the power module body can be quickly conducted to the heat sink 40 through the metal layer 42, thereby facilitating the heat sink 40 to cool the power module body.

[0046] In one embodiment, the heat dissipation surface is a metal heat dissipation surface, which is welded to the second side of the metal layer 42, making the connection between the power module body and the metal layer 42 more stable.

[0047] Specifically, the heat dissipation surface of the power module body is set as a metal heat dissipation surface, which has good thermal conductivity. In this way, not only can the power module body conduct heat to the metal layer 42 more quickly through the metal heat dissipation surface, but the metal heat dissipation surface can also be welded to the metal layer 42, so that the connection between the power module body and the metal layer 42 is more stable.

[0048] Optionally, the metal heat dissipation surface of the power module body can be copper foil.

[0049] Furthermore, the metal heat dissipation surface is welded to the metal layer 42 to form a metal solder layer 30, so that the power module body is firmly fixed to the metal layer 42 through the metal solder layer. The heat from the power module body can also be conducted to the metal layer 42 through the metal solder layer.

[0050] The power module body is a top-heat-dissipating packaged power device, allowing heat generated during operation to be conducted to the heat sink 40 via the heat dissipation surface at the bottom of the power device. (Refer to...) Figures 1 to 4 The power module body includes a main body 21 and pins 22. Pins 22 are connected to the main body 21 and can be electrically connected to the circuit board 10. The bottom of the main body 21 has a heat dissipation surface, which is used for thermally conductive connection with the second side of the metal layer 42.

[0051] The power device is a MOSFET. The pins 22 of the MOSFET are soldered to the circuit board 10 to achieve electrical connection between the MOSFET and the circuit board 10. The heat dissipation surface of the main body 21 can be soldered to the metal layer 42 on the heat sink 40 to connect the MOSFET to the heat sink 40, thereby facilitating heat dissipation from the MOSFET by the heat sink 40. An insulating layer 41 is formed on the surface of the heat sink 40, located between the metal layer 42 and the heat sink 40. The insulating layer 41 serves to prevent short circuits between the heat sink 40 and the MOSFET while transferring the heat generated by the MOSFET to the heat sink 40, allowing the heat sink 40 to cool the MOSFET.

[0052] Traditional power module heat dissipation modules also include a metal substrate installed between the power module body and the heat sink 40 to fix the power module body and the heat sink. Specifically, one side of the metal substrate is soldered to the power module body, and the other side of the metal substrate is coated with thermal grease or gel. Then, screws or spring clips are used to fix the metal substrate to the heat sink, and the thermal grease or gel on the metal substrate is adhered to the heat sink with adhesive so that the metal substrate can conduct heat from the power module body to the heat sink for heat dissipation. This process is complex, the fixing method is cumbersome, the production cost is high, and the heat dissipation effect is poor.

[0053] Therefore, this invention employs a method where at least a portion of the structure of the metal substrate is configured as a heat sink 40. An insulating layer 41 and a metal layer 42 are formed on the side of the metal substrate facing the power module body. The power module body is fixedly connected to the metal layer 42, allowing the power module body to connect to the heat sink 40 on the metal substrate. Because a portion of the metal substrate is configured as a heat sink 40, there is no need to apply gel or adhesive to the side of the metal substrate away from the power module body, reducing the space between the power module body and the heat sink 40. Heat generated by the power module body can be conducted to the heat sink 40 more quickly, reducing thermal resistance and thus improving the heat dissipation performance of the power module heat dissipation module 100. Furthermore, screws or clips are not required to separately fix the heat sink 40 to the metal substrate, simplifying the installation process, simplifying the fixing method, and reducing production costs.

[0054] In this design, a portion of the traditional metal substrate can be configured as a heat sink 40 with internal cooling channels 43, through which the cooling medium flows. Alternatively, a portion of the metal substrate can be configured as a heat dissipation channel structure with multiple flat tubes installed internally, through which the cooling medium flows.

[0055] Alternatively, a portion of the metal substrate can be configured as a heat dissipation fin structure 44, allowing the metal substrate to be directly mounted into the cooling channels. This connects the heat dissipation fin structure 44 of the metal substrate with the cooling channels to form a heat sink 40. Since the metal substrate has a heat dissipation fin structure 44, it is only necessary to fix the cooling channels to the heat dissipation fin structure 44, eliminating the need to separately mount the entire heat sink 40 onto the metal substrate. This reduces thermal resistance and improves the heat dissipation performance of the power module heat dissipation module 100.

[0056] Furthermore, the power module heat dissipation module 100 is equipped with a circuit board 10, which is located on the side of the power module body away from the heat sink 40, and the circuit board 10 is soldered to the power module body.

[0057] In one embodiment, the pins 22 of the MOSFET can be soldered to the circuit board 10 to achieve electrical connection between the MOSFET and the circuit board 10. The circuit board 10 is located on the side of the MOSFET away from the heat sink 40 to avoid the circuit board 10 obstructing the installation of the MOSFET onto the heat sink 40.

[0058] This utility model also proposes an on-board charger, which includes a power module heat dissipation module 100. The specific structure of the power module heat dissipation module 100 is as described in the above embodiments. Since this on-board charger adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0059] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A radiator, characterized in that, An insulating and thermally conductive layer is formed on the side of the radiator facing the heat source. The insulating and thermally conductive layer includes an insulating layer and a metal layer for thermal conduction. The first side of the insulating layer is thermally connected to the radiator, and the second side of the insulating layer is thermally connected to the first side of the metal layer. The second side of the metal layer is used for thermally connecting to the heat source.

2. The radiator as described in claim 1, characterized in that, The insulating layer and the metal layer are disposed on the side of the radiator facing the heat source by compression bonding.

3. The radiator as described in claim 1, characterized in that, The insulating layer is a polypropylene layer.

4. The radiator as described in claim 1, characterized in that, The metal layer is a copper sheet.

5. The radiator as described in claim 1, characterized in that, The second side of the metal layer is welded to the heat dissipation surface of the heat source.

6. The radiator according to any one of claims 1 to 5, characterized in that, The radiator has internal cooling channels for the flow of cooling medium; or The side of the radiator away from the heat source is provided with a heat dissipation fin structure. The heat dissipation fin structure includes multiple heat dissipation teeth and a connecting plate. The multiple heat dissipation teeth are connected to the connecting plate and are spaced apart. The connecting plate is connected to the insulating thermally conductive layer.

7. A power module heat dissipation module, characterized in that, The device includes a power module body and a heat sink as described in any one of claims 1 to 6, wherein the power module body includes a heat dissipation surface, and the heat dissipation surface is thermally connected to a second surface of the metal layer.

8. The power module heat dissipation module as described in claim 7, characterized in that, The heat dissipation surface is a metal heat dissipation surface, and the metal heat dissipation surface is welded to the second side of the metal layer.

9. The power module heat dissipation module as described in claim 8, characterized in that, The power module body is a power device with a top heat dissipation package.

10. An on-board charger, characterized in that, The on-board charger includes the power module heat dissipation module as described in any one of claims 7 to 9.

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