Ceramic stack structure for optimizing mechanical transmission, piezoelectric ceramic and semiconductor device

Abstract

The utility model discloses a ceramic pile structure for optimizing mechanical transmission, piezoelectric ceramic and a semiconductor device. The utility model relates to the technical field of piezoelectric effect. The structure mainly comprises an actuating stack 2 and a fixed group 1. The fixing group 1 is designed to be capable of tightly wrapping and fixedly connected to the periphery of the actuating stack 2, and meanwhile micro position movement is allowed to be conducted in the axial direction of the actuating stack 2. By means of the design, it is ensured that when the fixed set 1 is subjected to external force, the axial consistency of the fixed set 1 and the actuating stack 2 can be kept, and rotating force in the horizontal direction is avoided; according to the utility model, through the fixing group, the telescopic group and the connecting structure, high integration of the piezoelectric ceramic actuator is realized. Due to the design, the whole actuator is compact in structure, small in size and convenient to install and integrate into various devices. And a disc spring in the telescopic group is used as an elastic piece, so that stable pre-tightening force is provided for the piezoelectric ceramic stacking structure. The pre-tightening force can be realized by adjusting the pre-tightening degree and rigidity of the disc spring.

Description

Technical Field

[0001] This utility model relates to the field of piezoelectric effect technology, specifically to the field of piezoelectric actuation technology, and particularly to ceramic stack structures for optimizing mechanical transmission, piezoelectric ceramics, and semiconductor devices. Background Technology

[0002] Piezoelectric ceramic actuators, as key components in the field of precision motion control, are based on the unique physical phenomenon of the piezoelectric effect. The piezoelectric effect describes how, when a specific crystalline material, such as piezoelectric ceramic, is subjected to external force, the centers of positive and negative charges within it shift, thus generating a potential difference; conversely, when these materials are placed in an electric field, they undergo shape changes. This property endows piezoelectric ceramic actuators with the ability to achieve precise movements at minute scales under the drive of an electric field.

[0003] In precision motion control applications, piezoelectric ceramic actuators have become the preferred solution due to their advantages such as high resolution, rapid response, and absence of electromagnetic interference. However, the deformation of a single piezoelectric ceramic sheet is extremely limited, making it difficult to meet the demands of large strokes in practical applications. To address this, engineers have innovatively adopted piezoelectric ceramic stacking technology, which involves bonding multiple piezoelectric ceramic sheets together with adhesive to achieve cumulative deformation and improved performance. This stacking design not only increases the total deformation but also enhances the actuator's load-bearing capacity and stiffness.

[0004] According to the article "Zhang Tao, Sun Lining, Cai Hegao. Research on Basic Properties of Piezoelectric Ceramics [J]. Optics and Precision Engineering, 1998(5)", piezoelectric ceramics are stacked by adhesive bonding to improve overall functionality. Therefore, preload is required to ensure the tightness of the stacked structure. Traditionally, preload is applied by rotating and pressing down from the top, but this method has room for improvement. The core function of preload is to eliminate gaps between stacked pieces, ensure close contact between each piece, and allow the electric field energy to be uniformly applied to each piezoelectric ceramic piece, achieving efficient electro-mechanical energy conversion.

[0005] While preload is crucial to the performance of piezoelectric ceramic stacks, the traditional rotational compression method presents problems. This method inevitably introduces a horizontal rotational force while applying preload. For piezoelectric ceramic stacks, this non-axial horizontal force is an instability factor. Piezoelectric ceramic materials are inherently brittle, and the adhesive layers in the stack may shear or break due to uneven stress. The horizontal rotational force exacerbates these effects, leading to uneven stress distribution within the stack and potentially inducing cracks or delamination. Furthermore, it can affect the motion accuracy and repeatability of piezoelectric ceramic actuators because the non-axial force complicates and makes deformation behavior unpredictable, thus reducing positioning accuracy and motion stability.

[0006] According to Xu Liping, "Design and Analysis of Flexible Hinge for White Light Interferometer Based on Piezoelectric Ceramic Drive [D]. Fujian: Huaqiao University, 2013," to achieve precise linear motion, the piezoelectric ceramic actuator needs to be embedded in a frictionless flexible hinge guide mechanism. This mechanism can achieve hysteresis-free motion within a stroke range of a few millimeters, integrating force decoupling and preloading, and has no negative impact on system stiffness. Meanwhile, Xiu Zhou, "Testing and Analysis of Piezoelectric Ceramic (PZT) Characteristics [J]. Kunming University of Science and Technology, 2005," emphasizes that the flexible hinge guide mechanism can precisely control motion, transmitting the driving force of the piezoelectric ceramic through its elastic deformation while maintaining system stiffness. It relies on the elastic angular deformation of the weakest part of the mechanism to complete the transmission and conversion of motion or force.

[0007] In summary, the current technical problem to be solved is: how to effectively avoid applying unnecessary horizontal rotational force to the piezoelectric ceramic stack structure while applying sufficient preload, so as to ensure that the actuator can maintain long-term stability and high performance.

[0008] To address this, we propose optimized ceramic stack structures, piezoelectric ceramics, and semiconductor devices for mechanical transmission. Utility Model Content

[0009] In view of this, the present invention aims to provide a ceramic stack structure, piezoelectric ceramics, and semiconductor devices with optimized mechanical transmission to solve or alleviate the technical problems existing in the prior art, namely, how to effectively avoid applying unnecessary horizontal rotational force to the piezoelectric ceramic stack structure while applying sufficient preload, so as to ensure that the actuator can maintain long-term stability and high performance, and at least provide a beneficial option for this purpose; the technical solution of the present invention is achieved as follows:

[0010] Firstly, optimize the ceramic stack structure for mechanical transmission:

[0011] The structure mainly comprises an actuating stack 2 and a fixing assembly 1. The fixing assembly 1 is designed to tightly wrap around and fix the actuating stack 2 to its periphery, while allowing for slight positional movement along the axial direction of the actuating stack 2. This design ensures that the fixing assembly 1 maintains axial consistency with the actuating stack 2 when subjected to external forces, avoiding the generation of horizontal rotational forces. Furthermore, a telescopic assembly 4 is connected to the telescopic end of the actuating stack 2. The telescopic assembly 4 achieves a fixed connection with the actuating stack 2 by applying a fastening force parallel to the axial direction of the actuating stack 2. This connection method not only ensures effective force transmission but also guarantees the stability of the actuating stack 2 under stress.

[0012] Specifically, the fixed assembly 1 may employ a flexible or finely adjustable structural design, such as using an elastic sleeve or a mating component with a small clearance, to allow for slight movement in the axial direction. The telescopic assembly 4 may employ fasteners such as bolts, nuts, or hydraulic cylinders, and apply a fastening force parallel to the axial direction of the actuating stack 2 by adjusting the tightness of the fasteners or the pressure of the hydraulic cylinder.

[0013] In one embodiment, the actuated stack 2 is carefully manufactured using a layer-bonded co-firing process. This process involves stacking piezoelectric ceramic sheets, approximately 100 micrometers thick, in a specific sequence. These sheets are connected by alternating electrodes; that is, the upper and lower surfaces of each piezoelectric ceramic sheet are coated with electrode material, and the electrodes of adjacent layers are electrically isolated but mechanically tightly connected. Through this stacking and electrode alternation, the piezoelectric ceramic sheets form a series structure mechanically and a parallel structure electrically.

[0014] Specifically, the laminated bonding co-firing process involves stacking piezoelectric ceramic sheets in a designed order and orientation, followed by sintering at high temperature to firmly bond the layers together using an adhesive material. Electrode materials are typically metals with good electrical conductivity and high-temperature resistance, such as silver and platinum. During sintering, the electrode material also forms good electrical contact and mechanical connection with the piezoelectric ceramic sheets.

[0015] In one embodiment, the fixing assembly 1 is designed to include two non-directly contacting housings, a first housing 101 and a second housing 102. These two housings are independent but structurally connected together by a specific connecting structure 3 to form a single unit. The design of the first housing 101 and the second housing 102 considers their function of enclosing and fixing the actuating stack 2, while ensuring that their relative positions remain flexible under external forces to avoid transmitting unnecessary horizontal rotational forces to the actuating stack 2. The connecting structure 3 can take various forms, such as elastic connectors, adjustable bolt-nut combinations, or mating structures with small clearances. These connecting structures are designed to allow slight relative movement of the first housing 101 and the second housing 102 in the axial direction while maintaining their stability in the radial direction. Thus, when the fixing assembly 1 is subjected to external forces, such as the gravity of connected external structural components, the connecting structure 3 can absorb and disperse these forces, reducing or eliminating the transmission of horizontal rotational forces.

[0016] In one embodiment, the connecting structure 3 is designed to include a first fastener 301 fixed to the first housing 101 and a second fastener 302 fixed to the second housing 102. These two fasteners are connected by a hinged snap-fit, forming a connection that is both stable and flexible. A gap 304 exists between the first fastener 301 and the second fastener 302, allowing relative movement when subjected to external forces. Specifically, the first fastener 301 has a rounded corner 303 that tangentially engages with the second fastener 302, ensuring smooth sliding during relative movement. When the fixing assembly 1 is subjected to external forces, such as the gravity of external structural components, the gap 304 between the first fastener 301 and the second fastener 302 gradually disappears. Because the connection is a hinged snap-fit, the first fastener 301 adjusts its angle, and the rounded corner 303 slides tangentially with the second fastener 302. This sliding causes the first snap-fit ​​body 301 to adaptively press against the second housing 102, thereby adjusting the gap between the second housing 102 and the first housing 101. This adjustment method can effectively disperse external pressure horizontally from the axial direction, avoiding the transmission of horizontal rotational force to the actuating stack 2.

[0017] In one embodiment, the telescopic assembly 4 is designed to include a telescopic member 401, an elastic element (specifically a disc spring 402), and a connecting block 403. The telescopic member 401 is slidably fitted within the first housing 101, allowing it to move a certain amount axially within the first housing 101. The telescopic member 401 is fixedly connected to the disc spring 402, which, as a component with excellent elastic properties, generates corresponding elastic force when compressed or stretched. The other end of the disc spring 402 is fixedly connected to the connecting block 403, which acts as a bridge between the telescopic assembly 4 and the actuating stack 2, and is fixedly connected to the telescopic end of the actuating stack 2. When the actuating stack 2 needs to extend or retract, by controlling the movement of the telescopic member 401, the disc spring 402 can be elastically deformed, thereby generating a corresponding elastic force. This elastic force is transmitted to the actuating stack 2 through the connecting block 403, pushing it to extend or retract. Meanwhile, the elastic properties of the disc spring 402 can also absorb and buffer the impact force that may be generated during the extension or retraction of the actuator stack 2, protecting the actuator stack 2 from damage.

[0018] Secondly, piezoelectric ceramics:

[0019] In the actuated stack 2, piezoelectric ceramic sheets are arranged in a specific electrode configuration and stacking manner to form a stack structure with specific electrical and mechanical properties. The built-in power supply line is connected to the electrodes of the piezoelectric ceramic sheets and is responsible for transmitting electrical energy provided by the external power source to the piezoelectric ceramic sheets.

[0020] Thirdly, semiconductor devices:

[0021] This semiconductor device uses piezoelectric ceramics as internal components, as described above. Piezoelectric ceramics primarily function as actuators or sensors in semiconductor devices, utilizing their piezoelectric effect to convert electrical energy into mechanical energy.

[0022] Compared with the prior art, the beneficial effects of this utility model are:

[0023] I. Compact Structure and High Integration: This invention achieves a high degree of integration of the piezoelectric ceramic actuator through a fixed assembly, a telescopic assembly, and a connecting structure. This design makes the entire actuator compact and small in size, facilitating installation and integration into various devices. The disc spring in the telescopic assembly acts as an elastic element, providing a stable preload for the piezoelectric ceramic stacked structure. This preload can be adjusted by changing the preload and stiffness of the disc spring, thus meeting the needs of different application scenarios.

[0024] II. Effective Avoidance of Horizontal Rotational Force: This invention, through its hinged snap-fit ​​design in the connecting structure, effectively converts external force into axial compressive or tensile force, rather than horizontal rotational force. This significantly reduces unnecessary stress on the piezoelectric ceramic stack structure, improving its stability and durability. The disc spring not only provides stable preload but also has excellent impact absorption and buffering capabilities. During the actuator's extension or retraction, the disc spring absorbs and buffers potential impact forces, protecting the piezoelectric ceramic stack structure from damage.

[0025] III. Long-term stability and high performance: This invention effectively avoids the application of horizontal rotational force and provides stable preload and impact absorption capabilities, thus ensuring that the piezoelectric ceramic actuator maintains stable performance and reliability during long-term use. It has strong adaptability and can be applied to various scenarios requiring precise control and stable output, such as microelectromechanical systems, consumer electronics, medical, aerospace, and automotive fields. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a three-dimensional perspective view of the present invention;

[0028] Figure 2This is a three-dimensional schematic diagram from another perspective of the present invention;

[0029] Figure 3 For the present utility model Figure 2 A magnified view of area A;

[0030] Figure 4 This is a schematic diagram from the front view of this utility model;

[0031] Figure 5 For the present utility model Figure 4 A magnified view of area B.

[0032] Reference numerals: 1. Fixing assembly; 101. First housing; 102. Second housing; 2. Actuating stack; 3. Connecting structure; 301. First fastener; 302. Second fastener; 303. Rounded corner; 304. Gap area; 4. Telescopic assembly; 401. Telescopic component; 402. Disc spring; 403. Connecting block; Detailed Implementation

[0033] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0034] Example 1: In the prior art, preload is applied by rotating and pressing down from the top, but this method has room for improvement. The core function of preload is to eliminate gaps between stacked pieces, ensuring tight contact between each piece and allowing the electric field energy to be uniformly applied to each piezoelectric ceramic piece, achieving efficient electro-mechanical energy conversion. Although preload is crucial to the performance of piezoelectric ceramic stack structures, the traditional rotational pressing method introduces problems. This method inevitably introduces a horizontal rotational force while applying preload; for this reason, please refer to... Figure 1-5 This specific embodiment will provide a ceramic stack structure with optimized mechanical transmission to solve the above-mentioned technical problems:

[0035] It includes an actuating stack 2 and a fixing group 1, wherein the fixing group 1 encloses and fixes the actuating stack 2 within it; the fixing group 1 can move slightly along the axial direction of the actuating stack 2.

[0036] One retractable end of the actuating stack 2 is connected to a telescopic assembly 4, which is fixedly connected to the actuating stack 2 by applying a fastening force parallel to the axial direction of the actuating stack 2. This ensures that when the fixed end 1 is subjected to external forces (such as the weight of an external structural component that the piezoelectric actuation structure needs to push), no horizontal rotational force is transmitted to the actuating stack 2. Furthermore, compared to the traditional method of rotating and pressing down on the piezoelectric actuation structure, which imparts a horizontal rotational force to the piezoelectric ceramic stack inside the device—a non-axial horizontal force that can disrupt the stability of the actuating stack 2—this solution ensures that when the fixed end 1 is subjected to external forces (such as the weight of an external structural component that the piezoelectric actuation structure needs to push), no horizontal rotational force is transmitted to the actuating stack 2. Simultaneously, the adaptive position-changing structure of the fixed assembly 1 can, as far as possible, counteract the influence of external forces.

[0037] Specifically, the core principle of this technical solution lies in optimizing the design of the fixed group 1 and the telescopic group 4 to achieve optimized force transmission. The wrapping and fixed connection design of the fixed group 1, as well as its slight axial movement capability, ensures that under external force, the fixed group 1 will not transmit the horizontal rotational force to the actuating stack 2. This is because the fixed group 1 can adaptively adjust its position to counteract the horizontal component force brought by the external force. At the same time, the telescopic group 4, by applying a fastening force parallel to the axis of the actuating stack 2, further ensures that the direction of force transmission is always consistent with the axis of the actuating stack 2, thereby avoiding the generation of horizontal rotational force.

[0038] It is understood that the functionality of the technical solution provided in this embodiment is mainly reflected in improving the stability and reliability of the piezoelectric actuation structure. Traditional piezoelectric actuation structures, when applying preload by rotating and pressing, introduce a horizontal rotational force into the piezoelectric ceramic stack structure inside the device. This non-axial horizontal force can disrupt the stability of the actuation stack. This solution, by optimizing the design of the fixed group 1 and the telescopic group 4, effectively avoids the generation of horizontal rotational force, thereby protecting the stability of the actuation stack 2. Furthermore, the adaptive position change characteristics of the fixed group 1 can also minimize the impact of external forces on the actuation stack 2, further improving the adaptability and reliability of the piezoelectric actuation structure.

[0039] In the technical solution provided in this embodiment, please refer to Figures 2-5 The actuated stack 2 is formed by connecting piezoelectric ceramic sheets with a thickness of about 100 micrometers through an alternating electrode process using a layer bonding co-firing process. The layers are connected in series mechanically and in parallel in circuit.

[0040] Specifically, the laminated bonding co-firing process involves stacking piezoelectric ceramic sheets in a designed order and orientation, followed by sintering at high temperature to firmly bond the layers together using an adhesive material. Electrode materials are typically metals with good electrical conductivity and high-temperature resistance, such as silver and platinum. During sintering, the electrode material also forms good electrical contact and mechanical connection with the piezoelectric ceramic sheets.

[0041] Specifically, the core principle of this embodiment lies in utilizing a layered bonding and co-firing process and an alternating electrode connection method to achieve mechanical series connection and electrical parallel connection of piezoelectric ceramic sheets. Mechanical series connection allows each layer of piezoelectric ceramic sheets to work collaboratively under stress, jointly bearing the external force, thereby improving the load-bearing capacity and stability of the actuated stack 2. Electrical parallel connection allows each layer of piezoelectric ceramic sheets to operate electrically independently without interference, thus improving the electrical performance and response speed of the actuated stack 2. Furthermore, by controlling the number of piezoelectric ceramic sheet layers and the electrode connection method, performance parameters such as output displacement and driving force of the actuated stack 2 can be adjusted to meet the needs of different application scenarios.

[0042] It is understood that in the technical solution provided in this embodiment, the functionality of this implementation mainly lies in improving the performance and adaptability of the actuated stack 2. Through the layered bonding co-firing process and the alternating electrode connection method, the actuated stack 2 not only has high load-bearing capacity and stability, but also good electrical performance and response speed. This enables the actuated stack 2 to work stably in various complex mechanical and electrical environments, meeting the application requirements of high precision and high reliability. At the same time, since the performance parameters of the actuated stack 2 can be adjusted by controlling the number of piezoelectric ceramic sheets and the electrode connection method, this implementation also has high flexibility and customizability. This makes the actuated stack 2 applicable to piezoelectric actuation structures in different fields and scenarios, providing a broader space and possibilities for the application and development of piezoelectric technology.

[0043] In the technical solution provided in this embodiment, please refer to Figures 2-5 The fixed assembly 1 includes a first housing 101 and a second housing 102 that are not in direct contact with each other, and the first housing 101 and the second housing 102 are connected together by a connecting structure 3.

[0044] Specifically, the core principle of this embodiment lies in achieving the adaptability and stability of the fixed assembly 1 under stress by designing a first shell 101 and a second shell 102 that do not directly contact each other, and the connecting structure 3 between them. The independent design of the first shell 101 and the second shell 102 allows them to adjust their positions independently when subjected to external forces, thereby avoiding the direct transmission of horizontal rotational force to the actuating stack 2. The design of the connecting structure 3 ensures the realization of this adaptability while maintaining the stability and integrity of the fixed assembly 1 in the overall structure. In addition, by carefully selecting and designing the materials and parameters of the connecting structure 3, the stiffness and damping characteristics of the fixed assembly 1 under stress can be adjusted, further optimizing its mechanical performance.

[0045] It is understood that in the technical solution provided in this embodiment, the functionality of this implementation mainly lies in improving the adaptability of the fixed assembly 1 and protecting the stability of the actuated stack 2. By designing the first shell 101 and the second shell 102, which are not in direct contact with each other, and the connection structure 3 between them, the fixed assembly 1 can adaptively adjust its position when subjected to external forces, thereby effectively avoiding the transmission of horizontal rotational forces to the actuated stack 2. This helps protect the actuated stack 2 from damage by non-axial forces and improves its long-term stability and reliability. At the same time, this implementation also has a certain degree of flexibility and adjustability. By changing the design and materials of the connection structure 3, the mechanical properties and adaptability of the fixed assembly 1 can be adjusted to meet the needs of different application scenarios. This makes this implementation have broad application prospects and practical value in piezoelectric actuation structures.

[0046] In the technical solution provided in this embodiment, please refer to Figures 2-5 The connecting structure 3 includes a first fastener 301 fixed to the first housing 101 and a second fastener 302 fixed to the second housing 102. The first fastener 301 and the second fastener 302 are hinged and snap-fit ​​connected. There is a gap area 304 between the first fastener 301 and the second fastener 302. The first fastener 301 has a rounded corner portion 303 for tangentially engaging with the second fastener 302. When affected by external force, the gap area 304 between the first fastener 301 and the second fastener 302 is eliminated. Because the first fastener 301 and the second fastener 302 are hinged and snap-fit ​​connected, the first fastener 301 adjusts its angle. At this time, the rounded corner portion 303 slides tangentially with the second fastener 302 and begins to adaptively press against the second housing 102, thereby adjusting the gap between the second housing 102 and the first housing 101. This, in turn, drives the compression between the stacked units 2, causing the external pressure to disperse horizontally from the axial direction.

[0047] Specifically, the core principle of this embodiment lies in utilizing the hinged snap-fit ​​connection of the first snap-fit ​​body 301 and the second snap-fit ​​body 302, along with the tangential fit of the rounded corner portion 303, to achieve the self-adaptability and stability of the fixing assembly 1 under stress. The design of the gap area 304 allows the first housing 101 and the second housing 102 to move relative to each other when subjected to external force, while the hinged snap-fit ​​connection ensures that this movement is within a controlled range and will not damage the overall structure of the fixing assembly 1. The tangential fit of the rounded corner portion 303 serves a lubricating and guiding function, allowing the first snap-fit ​​body 301 and the second snap-fit ​​body 302 to slide smoothly during relative movement, reducing friction and wear. This design not only improves the durability of the fixing assembly 1 but also allows it to adjust its shape more flexibly under stress, thereby effectively dispersing and absorbing external pressure.

[0048] It is understood that in the technical solution provided in this embodiment, the functionality of this implementation mainly lies in improving the adaptability of the fixing group 1 and protecting the stability of the actuated stack 2. By designing the hinged snap-fit ​​connection of the first snap body 301 and the second snap body 302, and the tangential fit of the rounded corner portion 303, the fixing group 1 can adaptively adjust its shape and position when subjected to external force, thereby effectively avoiding the transmission of horizontal rotational force to the actuated stack 2. This helps protect the actuated stack 2 from damage by non-axial forces, improving its long-term stability and reliability. At the same time, this implementation also has a certain shock absorption and vibration reduction effect. When the fixing group 1 is subjected to external impact, the relative movement between the first snap body 301 and the second snap body 302 and the sliding of the rounded corner portion 303 can absorb and disperse part of the impact force, reducing the impact and vibration on the actuated stack 2. This makes this implementation significantly advantageous in application scenarios that require withstanding impact and vibration.

[0049] In the technical solution provided in this embodiment, please refer to Figures 2-5 The telescopic assembly 4 includes a telescopic member 401, an elastic member, and a connecting block 403. The telescopic member 401 is slidably fitted in the first housing 101 and fixedly connected to the elastic member. The elastic member is fixedly connected to the connecting block 403, and the connecting block 403 is fixedly connected to one telescopic end of the actuating stack 2. The elastic member is a disc spring 402.

[0050] Specifically, the core principle of this embodiment lies in utilizing the sliding fit of the telescopic component 401, the elastic properties of the disc spring 402, and the fixed connection of the connecting block 403 to control the extension and retraction of the actuated stack 2 by the telescopic assembly 4. The sliding fit of the telescopic component 401 allows it to move a certain amount within the first housing 101, making the extension and retraction of the actuated stack 2 possible. The elastic properties of the disc spring 402 enable the telescopic assembly 4 to generate corresponding elastic force, pushing the actuated stack 2 to move and absorbing and buffering any potential impact forces. The fixed connection of the connecting block 403 ensures a stable connection between the telescopic assembly 4 and the actuated stack 2, allowing the elastic force to be accurately transmitted to the actuated stack 2.

[0051] It is understood that in the technical solution provided in this embodiment, the functionality of this implementation mainly lies in improving the flexibility and reliability of the telescopic assembly 4. Through the design of the sliding fit of the telescopic component 401, the elastic properties of the disc spring 402, and the fixed connection of the connecting block 403, the telescopic assembly 4 can flexibly control the extension and retraction of the actuated stack 2, and absorb and buffer possible impact forces, protecting the actuated stack 2 from damage. Meanwhile, the disc spring 402, as a component with excellent elastic properties, has advantages such as compact structure, light weight, high elasticity, and fatigue resistance. This allows the telescopic assembly 4 to maintain stable performance during long-term use, improving the reliability and durability of the entire piezoelectric actuation structure. Furthermore, by adjusting parameters such as the preload and stiffness of the disc spring 402, the elasticity and response speed of the telescopic assembly 4 can also be adjusted to meet the needs of different application scenarios.

[0052] In summary, regarding the related problems in traditional technologies, this specific implementation method, based on the optimized mechanical transmission ceramic stack structure, piezoelectric ceramics, and semiconductor devices provided above, employs the following technical means or features to achieve solutions:

[0053] (1) Application of sufficient preload: Through the design of the telescopic assembly 4, especially the use of disc spring 402 as an elastic element, a stable preload is provided for the piezoelectric ceramic stack structure (i.e., the actuated stack 2). Disc spring 402 has excellent elastic properties and can generate a continuous elastic force when compressed. This elastic force is transmitted to the actuated stack 2 through connecting block 403, ensuring that the piezoelectric ceramic sheets in each layer of the stack structure maintain close contact, thereby applying sufficient preload.

[0054] (2) Avoiding the application of horizontal rotational force: In conventional technologies, horizontal rotational force may be generated due to the instability of the fixed structure or the action of external forces, which may damage the piezoelectric ceramic stacked structure. In this embodiment, the stability and flexibility of the fixed group 1 are achieved through the design of the first housing 101 and the second housing 102, and the hinged snap-fit ​​connection of the connecting structure 3 (including the first snap-fit ​​body 301 and the second snap-fit ​​body 302). When affected by external forces, the gap area 304 between the first snap-fit ​​body 301 and the second snap-fit ​​body 302 is eliminated, the first snap-fit ​​body 301 is angled, and the rounded corner 303 slides tangentially with the second snap-fit ​​body 302. This design converts the external force into axial compressive or tensile force, rather than horizontal rotational force, thereby effectively avoiding the application of unnecessary horizontal rotational force to the piezoelectric ceramic stacked structure.

[0055] (3) Guarantee of long-term stability and high performance: Through the above design, it is ensured that the actuated stack 2 can maintain a stable preload when subjected to external force, while avoiding the application of horizontal rotational force, which helps to reduce stress concentration and wear in the stack structure. In addition, the elastic properties of the disc spring 402 can also absorb and buffer the impact force that may be generated during the extension or retraction of the actuated stack 2, further protecting the piezoelectric ceramic stack structure from damage.

[0056] Example 2: Based on the structure provided in Example 1, this example further provides a piezoelectric ceramic:

[0057] The piezoelectric ceramic supplies power to the actuation stack 2 via a built-in power supply line.

[0058] In the actuated stack 2, piezoelectric ceramic sheets are arranged in a specific electrode configuration and stacking manner to form a stack structure with specific electrical and mechanical properties. An internal power supply line is connected to the electrodes of the piezoelectric ceramic sheets, responsible for transmitting electrical energy supplied by an external power source to the piezoelectric ceramic sheets. When the power supply line is energized, the piezoelectric ceramic sheets deform under the influence of the electric field, thereby causing the entire actuated stack 2 to extend or retract.

[0059] The built-in power supply circuit powers the actuator stack 2, enabling precise control of the piezoelectric ceramic sheet under the influence of an electric field, thus improving the response speed and accuracy of the actuator stack 2. The power supply circuit design is matched to the performance of the piezoelectric ceramic sheet, fully utilizing the piezoelectric effect to increase the output force and displacement of the actuator stack 2. The built-in power supply circuit also makes the actuator stack 2 more compact and highly integrated, facilitating integration with other mechanical or electronic systems.

[0060] Example 3: Based on the piezoelectric ceramic provided in Example 2, this example further provides a semiconductor device:

[0061] This semiconductor device employs piezoelectric ceramics as internal components, as described above. Piezoelectric ceramics primarily function as actuators or sensors in semiconductor devices, utilizing their piezoelectric effect to convert electrical energy into mechanical energy. When used as an actuator, the piezoelectric ceramic deforms under the influence of an electric field, driving the device to perform specific actions; when used as a sensor, it senses external mechanical stimuli and converts them into electrical signals. For example, in microelectromechanical systems (MEMS), piezoelectric ceramics can serve as micro-actuators or micro-sensors, enabling precise control and measurement at minute scales.

[0062] The embodiments described above merely illustrate the implementation methods of the relevant practical applications of this utility model. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An optimized ceramic stack structure for mechanical transmission, including induced stacking (2), characterized in that, It also includes a fixing group (1), which encloses and fixes the actuating stack (2) therein; the fixing group (1) is movable along the axial direction of the actuating stack (2); The actuating stack (2) has a telescopic assembly (4) connected to one of its telescopic ends. The telescopic assembly (4) is fixedly connected to the actuating stack (2) by applying a fastening force parallel to the axial direction of the actuating stack (2).

2. The ceramic stack structure according to claim 1, characterized in that: The actuated stack (2) is formed by connecting piezoelectric ceramic sheets through alternating electrodes. The layers are connected in series mechanically and in parallel in circuit.

3. The ceramic stack structure according to claim 1, characterized in that: The fixed assembly (1) includes a first housing (101) and a second housing (102) that are not in direct contact with each other, and the first housing (101) and the second housing (102) are connected together by a connection structure (3).

4. The ceramic stack structure according to claim 3, characterized in that: The connection structure (3) includes a first buckle (301) fixed on the first housing (101) and a second buckle (302) fixed on the second housing (102), wherein the first buckle (301) and the second buckle (302) are hinged and snap-fit ​​connected.

5. The ceramic stack structure according to claim 4, characterized in that: There is a gap area (304) between the first buckle body (301) and the second buckle body (302), and the first buckle body (301) has a rounded corner portion (303) for tangentially engaging with the second buckle body (302).

6. The ceramic stack structure according to any one of claims 3 to 5, characterized in that: The telescopic assembly (4) includes a telescopic member (401), an elastic member, and a connecting block (403). The telescopic member (401) is slidably fitted in the first housing (101) and fixedly connected to the elastic member. The elastic member is fixedly connected to the connecting block (403), and the connecting block (403) is fixedly connected to one of the telescopic ends of the actuating stack (2).

7. The ceramic stack structure according to claim 6, characterized in that: The elastic element is a disc spring (402).

8. A piezoelectric ceramic employing the ceramic stack structure as described in any one of claims 1 to 7.

9. The piezoelectric ceramic according to claim 8, characterized in that: The piezoelectric ceramic supplies power to the actuation stack (2) through a built-in power supply line.

10. A semiconductor device employing the piezoelectric ceramic as described in claim 9.

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