Gas transmission device and semiconductor process machine

Abstract

The utility model provides a gas transmission device and a semiconductor process machine. The gas transmission device is used for transmitting process gas and comprises a gas tank used for providing the process gas; the first gas transmission pipeline is connected to the gas tank and used for transmitting the process gas to a reaction cavity, the first gas transmission pipeline is provided with a first gas flow detector, and the first gas flow detector is used for detecting the flow of the process gas flowing through the first gas transmission pipeline; the second gas transmission pipeline is connected to the gas tank and used for transmitting the process gas to the reaction cavity, the second gas transmission pipeline is provided with a second gas flow detector, and the second gas flow detector is used for detecting the flow of the process gas flowing through the second gas transmission pipeline; and the gas transmission device can stop transmitting the process gas when any one of the first gas flow detector and the second gas flow detector detects that the gas flow is abnormal. According to the technical scheme, transmission is stopped when the gas flow of one gas transmission pipeline is abnormal.

Description

Technical Field

[0001] This utility model relates to the field of semiconductors, and in particular to a gas transmission device and a semiconductor process equipment. Background Technology

[0002] Currently, the mainstream etching machine for polysilicon is the 508C machine, which places high demands on both the yield and quality of the products. Therefore, meeting these quality requirements and preventing and resolving existing problems is urgently needed.

[0003] Chamber gas flow monitoring is a crucial parameter for the equipment. Gas transfer from the gas box to the chamber is via two lines: one enters the chamber through the middle chamber inlet; the other enters through a gas nozzle. However, all gas is monitored only before exiting the gas box by a mass flow controller (MFC). The two transfer lines from the gas box to the chamber are controlled by pneumatic valves, not by flow control. If the pneumatic valve in either transfer line malfunctions, all gas will enter the chamber through the other line, disrupting the gas flow direction and impacting wafer uniformity.

[0004] Therefore, how to prevent the gas flow direction entering the reaction chamber from affecting the uniformity of the wafer is a problem that needs to be solved. Summary of the Invention

[0005] The technical problem to be solved by this invention is how to avoid the gas flow direction entering the reaction chamber from affecting the uniformity of the wafer, and provides a gas transmission device and semiconductor process equipment.

[0006] To address the aforementioned problems, this utility model provides a gas transmission device for transmitting process gas, comprising: a gas tank for supplying the process gas; a first gas transmission pipeline connected to the gas tank for transmitting the process gas to a reaction chamber, the first gas transmission pipeline being equipped with a first gas flow detector for detecting the flow rate of the process gas flowing through the first gas transmission pipeline; and a second gas transmission pipeline connected to the gas tank for transmitting the process gas to the reaction chamber, the second gas transmission pipeline being equipped with a second gas flow detector for detecting the flow rate of the process gas flowing through the second gas transmission pipeline; the gas transmission device is capable of stopping the transmission of the process gas when either the first gas flow detector or the second gas flow detector detects an abnormal gas flow rate.

[0007] In some embodiments, a third gas flow detector is provided inside the gas box for detecting the flow rate of the process gas transmitted from the gas box.

[0008] In some embodiments, the first gas flow detector, the second gas flow detector, and the third gas flow detector are all gas mass flow controllers.

[0009] In some embodiments, at least one gas nozzle is provided at the top of the reaction chamber, and the first gas transmission pipeline transmits the process gas to the reaction chamber through the gas nozzle.

[0010] In some embodiments, the reaction chamber sidewall includes an outer wall and an inner liner, an intermediate cavity is formed between the outer wall and the inner liner, the inner liner is provided with at least one air inlet, and the second gas transmission pipeline transmits the process gas to the intermediate cavity and to the reaction chamber through the air inlet of the inner liner.

[0011] In some embodiments, the first gas transmission pipeline is further provided with a first pneumatic valve located between the first gas flow detector and the gas box, the first pneumatic valve being used to control the flow and cut-off of process gas in the first gas transmission pipeline; the second gas transmission pipeline is further provided with a second pneumatic valve located between the first gas flow detector and the gas box, the second pneumatic valve being used to control the flow and cut-off of process gas in the second gas transmission pipeline.

[0012] In some embodiments, a transmission main is further included, with one end connected to the gas box and the other end connected to the first gas transmission pipeline and the second gas transmission pipeline.

[0013] In some embodiments, the device further includes a controller that can control the gas transmission device to stop transmitting the process gas when either the first gas flow detector or the second gas flow detector detects an abnormal gas flow.

[0014] In some embodiments, an alarm is also included, which is capable of issuing an alarm when either the first gas flow detector or the second gas flow detector detects an abnormal gas flow.

[0015] To address the aforementioned problems, this invention provides a semiconductor process equipment, comprising: a reaction chamber; and a gas transmission device connected to the reaction chamber, wherein the gas transmission device is the gas transmission device described in this invention.

[0016] The above technical solution involves installing gas flow detectors in both the first and second gas transmission pipelines. When an abnormality occurs in the gas flow of one pipeline, the transmission of process gas is stopped. This prevents all gas from entering the reaction chamber through the other pipeline, which could disrupt the gas flow direction and affect wafer uniformity. Adding a flow detector downstream of the pneumatic valve monitors the gas flow, preventing valve malfunctions that could disrupt gas flow and reducing the impact on the product.

[0017] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit the present invention. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the specific embodiments of this utility model, the accompanying drawings used in the description of the specific embodiments will be briefly introduced below. Obviously, the drawings described below are only some specific embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0019] Figure 1 This is a schematic diagram of an embodiment of the gas transmission device described in this utility model. Detailed Implementation

[0020] The technical solutions in the embodiments of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0021] Please see Figure 1 This is a schematic diagram of an embodiment of the gas transmission device described in this utility model, wherein... Figure 1 The reaction chamber is viewed from above. For example... Figure 1As shown, the gas transmission device is used to transmit process gas and includes: a gas tank 10, a first gas transmission pipeline 11, and a second gas transmission pipeline 12. The gas tank 10 is used to supply the process gas. The first gas transmission pipeline 11 is connected to the gas tank 10 and is used to transmit the process gas to a reaction chamber 13. The first gas transmission pipeline 11 is equipped with a first gas flow detector 110, which is used to detect the flow rate of the process gas flowing through the first gas transmission pipeline 11. The second gas transmission pipeline 12 is connected to the gas tank 10 and is used to transmit the process gas to the reaction chamber 13. The second gas transmission pipeline 12 is equipped with a second gas flow detector 120, which is used to detect the flow rate of the process gas flowing through the second gas transmission pipeline 12. The gas transmission device can stop transmitting the process gas when either the first gas flow detector 110 or the second gas flow detector 120 detects an abnormal gas flow rate.

[0022] The above technical solution involves setting gas flow detectors in the first gas transmission pipeline and the second gas transmission pipeline respectively. When the gas flow in one of the gas transmission pipelines is abnormal, the transmission of process gas is stopped, thus preventing all gas from entering the reaction chamber through the other gas transmission pipeline, which would cause problems with the gas flow direction and affect the uniformity of the wafer.

[0023] Specifically, when the first gas flow detector 110 detects an abnormal gas flow, such as insufficient gas flow or no gas flow, the gas transmission device stops transmitting the process gas to prevent all the process gas from entering the reaction chamber 13 through the second gas transmission pipeline 12 and affecting the uniformity of the wafer process. Similarly, when the second gas flow detector 120 detects an abnormal gas flow, the gas transmission device stops transmitting the process gas. Likewise, when both the first gas flow detector 110 and the second gas flow detector 120 detect abnormal gas flow, the gas transmission device will also stop transmitting the process gas.

[0024] In some embodiments, a third gas flow detector 100 is provided inside the gas box 10 for detecting the flow rate of the process gas transmitted from the gas box 10. In this embodiment, the gas box 10 includes a plurality of third gas transmission pipelines 101, which are used to transmit different types of process gases. Each third gas transmission pipeline 101 is provided with a third gas flow detector 100 to monitor the gas flow rate in the third gas transmission pipeline 101.

[0025] In this embodiment, the first gas flow detector 110, the second gas flow detector 120, and the third gas flow detector 100 all employ a gas mass flow controller (MFC). The gas mass flow controller is a device used to accurately measure and control the mass flow rate of gas. Its working principle is based on fluid mechanics and heat transfer principles. It measures the pressure difference and temperature changes as gas flows through a pipeline using a mass flow sensor, thereby calculating the gas mass flow rate. The gas flow rate is then adjusted by controlling valves to maintain it within a set range.

[0026] In some embodiments, the reaction chamber 13 is used to provide a gaseous environment for wafer processing. At least one gas nozzle 131 is disposed at the top of the reaction chamber 13, and the first gas transmission pipeline 11 transmits the process gas to the reaction chamber 13 through the gas nozzle 131. The gas nozzle 131 is used to spray the process gas into the reaction chamber 13. By introducing organometallic compounds, gaseous elements, and carrier gas into the reaction chamber, a chemical reaction occurs, allowing semiconductor materials to grow on the wafer surface. The gas nozzle 131 can directly spray the process gas into the reaction chamber 13, or it can rotate to spray the process gas, thereby improving the uniformity of the process gas in the reaction chamber 13. In summary, the gas nozzle 131 can directly affect the distribution and diffusion rate of compounds in the reaction chamber 13, thus affecting the quality and performance of the material. In this embodiment, the gas nozzle 131 is made of high-purity ceramic materials (such as alumina, silicon nitride, etc.). Ceramic materials have good high-temperature stability and corrosion resistance, enabling stable operation under high temperature and high pressure, while also reducing contamination of the process gas. In other embodiments, the gas nozzle 131 may also be made of a metallic material.

[0027] In some embodiments, the sidewall of the reaction chamber 13 includes an outer wall 133 and an inner liner 134, with an intermediate cavity 135 formed between the outer wall 133 and the inner liner 134. The inner liner 134 is provided with at least one air inlet 132. The second gas transmission pipeline 12 transmits the process gas to the intermediate cavity 135 and then to the reaction chamber 13 through the air inlet 132 of the inner liner 134. In this embodiment, the inner liner 134 is provided with a plurality of air inlets 132, and the plurality of air inlets 132 are uniformly arranged around the inner liner 134. By providing the intermediate cavity 135 on the sidewall of the reaction chamber 13 and uniformly distributing the plurality of air inlets 132 on the inner liner 134, the process gas entering the reaction chamber 13 can be made more uniform, improving the uniformity of wafer deposition.

[0028] In some embodiments, the first gas transmission pipeline 11 is further provided with a first pneumatic valve 111, located between the first gas flow detector 110 and the gas box 10. The first pneumatic valve 111 is used to control the flow and cut-off of process gas in the first gas transmission pipeline 11, and the first gas transmission pipeline 11 adjusts the gas flow rate of the process gas by adjusting the first pneumatic valve 111. The second gas transmission pipeline 12 is further provided with a second pneumatic valve 121, located between the second gas flow detector 120 and the gas box 10. The second pneumatic valve 121 is used to control the flow and cut-off of process gas in the second gas transmission pipeline 12, and the second gas transmission pipeline 12 adjusts the gas flow rate of the process gas by adjusting the second pneumatic valve 121. The pneumatic valve can change the gas flow rate of the process gas through the gas transmission pipeline or the state of the valve by controlling the movement of the valve core. When it is necessary to reduce the gas flow rate of the process gas, the pneumatic valve can reduce the valve opening to restrict the flow of the process gas; when it is necessary to increase the gas flow rate of the process gas, the pneumatic valve can increase the valve opening to increase the flow of the process gas. Adding a flow detector downstream of the pneumatic valve to monitor the gas flow rate can prevent gas flow problems caused by valve malfunctions, thus reducing the impact on the product.

[0029] In some embodiments, the gas transmission device further includes a transmission main 14, one end of which is connected to the gas box 10, and the other end is connected to the first gas transmission pipeline 11 and the second gas transmission pipeline 12.

[0030] In some embodiments, the gas transfer device further includes a controller (not shown), which can control the gas transfer device to stop transferring the process gas when either the first gas flow detector 110 or the second gas flow detector 120 detects an abnormal gas flow. Specifically, when the first gas flow detector 110 detects an abnormal gas flow, such as insufficient gas flow or no gas flow, to prevent all the process gas from entering the reaction chamber 13 through the second gas transfer pipeline 12 and affecting the uniformity of the wafer process, the controller controls the first pneumatic valve 111 and the second pneumatic valve 121 to cut off gas transport, or controls the gas tank 10 to supply the process gas. When the second gas flow detector 120 detects an abnormal gas flow, the controller controls the first pneumatic valve 111 and the second pneumatic valve 121 to cut off gas transport, or controls the gas tank 10 to supply the process gas. Similarly, when both the first gas flow detector 110 and the second gas flow detector 120 detect abnormal gas flow, the controller controls the first pneumatic valve 111 and the second pneumatic valve 121 to cut off gas transport, or controls the gas box 10 to supply the process gas.

[0031] In some embodiments, the gas transmission device further includes an alarm (not shown), which can sound an alarm when either the first gas flow detector 110 or the second gas flow detector 120 detects an abnormal gas flow, to remind the operator to adjust the process and replace faulty components in a timely manner. The alarm is a mechanical alarm that alerts the operator through sound, light, or air pressure. Specifically, when the first gas flow detector 110 detects an abnormal gas flow, such as insufficient gas flow or no gas flow, the alarm sounds an alarm to remind the operator to adjust the process and replace faulty components in a timely manner. When the second gas flow detector 120 detects an abnormal gas flow, the alarm sounds an alarm to remind the operator. Similarly, when both the first gas flow detector 110 and the second gas flow detector 120 detect abnormal gas flow, the alarm sounds an alarm to remind the operator.

[0032] In this embodiment, the alarm is a buzzer. When either the first gas flow detector 110 or the second gas flow detector 120 detects an abnormal gas flow, the buzzer will emit a piercing sound to attract the operator's attention and prompt them to take immediate action. In other embodiments, the alarm may also be a flashlight, emitting a strong flash when an abnormal gas flow is detected to attract the operator's attention.

[0033] Based on the same inventive concept, an embodiment of this utility model also provides a semiconductor process equipment. The semiconductor process equipment includes a reaction chamber and a gas transfer device. The reaction chamber is used to provide a gaseous environment for wafer processing, and the gas transfer device is used to transfer process gases to the reaction chamber. The gas transfer device is connected to the reaction chamber. The gas transfer device employs, as shown in... Figure 1 The gas transmission device shown is described above and will not be repeated here.

[0034] The above technical solution involves installing gas flow detectors in both the first and second gas transmission pipelines. When an abnormality occurs in the gas flow of one pipeline, the transmission of process gas is stopped. This prevents all gas from entering the reaction chamber through the other pipeline, which could disrupt the gas flow direction and affect wafer uniformity. Adding a flow detector downstream of the pneumatic valve monitors the gas flow, preventing valve malfunctions that could disrupt gas flow and reducing the impact on the product.

[0035] It should be noted that references to "an embodiment," "an embodiment," "an exemplary embodiment," "some embodiments," etc., in the specification indicate that the described embodiments may include specific features, structures, or characteristics, but each embodiment may not necessarily include that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. In addition, when a specific feature, structure, or characteristic is described in connection with an embodiment, whether explicitly described or not, implementing such a feature, structure, or characteristic in conjunction with other embodiments is within the knowledge of those skilled in the art.

[0036] Generally, terms can be understood at least partially from their usage in context. For example, the term "one or more," as used herein, depends at least partially on the context and can be used to describe any feature, structure, or characteristic in a singular sense, or in a plural sense, to describe a combination of features, structures, or characteristics. Similarly, terms such as "a," "a," or "the" can also be understood, at least partially on the context, to express either a singular or plural usage. Furthermore, the term "based on" can be understood not necessarily to express an exclusive set of factors, but rather, alternatively, also at least partially on the context, to allow for the presence of other factors that are not necessarily explicitly described. It should also be noted in this specification that "connection / coupling" refers not only to a direct coupling of one component to another, but also to an indirect coupling of one component to another via an intermediate component.

[0037] It should be noted that the terms "comprising" and "having," and their variations, used in this utility model document are intended to cover non-exclusive inclusion. The terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence, unless explicitly indicated by the context. It should be understood that such data used interchangeably where appropriate. Furthermore, embodiments and features within embodiments of this utility model can be combined with each other without conflict. In addition, descriptions of well-known components and technologies have been omitted in the above description to avoid unnecessarily obscuring the concepts of this utility model. In the various embodiments described above, each embodiment focuses on its differences from other embodiments; similar / identical parts between embodiments can be referred to mutually.

[0038] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A gas transfer device for transferring process gas, characterized in that, include: Gas box, used to supply the process gas; A first gas transmission pipeline is connected to the gas box and is used to transmit process gas to a reaction chamber. The first gas transmission pipeline is equipped with a first gas flow detector, which is used to detect the flow rate of the process gas flowing through the first gas transmission pipeline. A second gas transmission pipeline is connected to the gas box and is used to transmit process gas to the reaction chamber. The second gas transmission pipeline is equipped with a second gas flow detector, which is used to detect the flow rate of the process gas flowing through the second gas transmission pipeline. The gas transmission device can stop transmitting the process gas when either the first gas flow detector or the second gas flow detector detects an abnormal gas flow.

2. The gas transmission device according to claim 1, characterized in that, A third gas flow detector is installed inside the gas box to detect the flow rate of the process gas transmitted from the gas box.

3. The gas transmission device according to claim 2, characterized in that, The first gas flow detector, the second gas flow detector, and the third gas flow detector all employ gas mass flow controllers.

4. The gas transmission device according to claim 1, characterized in that, At least one gas nozzle is provided at the top of the reaction chamber, and the first gas transmission pipeline transmits the process gas to the reaction chamber through the gas nozzle.

5. The gas transmission device according to claim 1, characterized in that, The reaction chamber sidewall includes an outer wall and an inner liner, with an intermediate cavity formed between the outer wall and the inner liner. The inner liner is provided with at least one air inlet. The second gas transmission pipeline transmits the process gas to the intermediate cavity and then to the reaction chamber through the air inlet of the inner liner.

6. The gas transmission device according to claim 1, characterized in that, The first gas transmission pipeline is also equipped with a first pneumatic valve, located between the first gas flow detector and the gas box. The first pneumatic valve is used to control the flow and cut-off of process gas in the first gas transmission pipeline. The second gas transmission pipeline is also equipped with a second pneumatic valve, located between the second gas flow detector and the gas box. The second pneumatic valve is used to control the flow and cut-off of process gas in the second gas transmission pipeline.

7. The gas transmission device according to claim 1, characterized in that, It also includes a transmission main, one end of which is connected to the gas box, and the other end is connected to the first gas transmission pipeline and the second gas transmission pipeline.

8. The gas transmission device according to claim 1, characterized in that, It also includes a controller that can control the gas transmission device to stop transmitting the process gas when either the first gas flow detector or the second gas flow detector detects an abnormal gas flow.

9. The gas transmission device according to claim 1, characterized in that, It also includes an alarm that can sound an alarm when either the first gas flow detector or the second gas flow detector detects an abnormal gas flow.

10. A semiconductor process equipment, characterized in that, include: reaction chamber; A gas transmission device is connected to the reaction chamber, wherein the gas transmission device is the gas transmission device as described in any one of claims 1 to 9.

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