Transfer clip for packaging test of semiconductor chip

Abstract

The utility model relates to a semiconductor chip packaging test transfer clip, and relates to the field of semiconductor chip packaging manufacturing. According to the technical scheme, the multiple slots are distributed in the cartridge holder shell from top to bottom at intervals, and the slots are used for being connected with a substrate or a frame in an inserted mode; wherein ratchet gear lever mechanisms are arranged at openings in the two sides of the cartridge holder shell, the ratchet gear lever mechanisms are hinged to the cartridge holder shell and can be self-locked in the single direction, and the ratchet gear lever mechanisms are used for preventing the base plate or the frame from shaking in the inserting direction of the inserting groove. Under the condition, the anti-shaking clip which is practical, effective and high in operability is provided for fixing the substrate or the frame, the anti-shaking clip can adapt to products in various packaging forms, the problem that the substrate or the frame is abnormal in the transportation process is effectively solved, and particularly, the risk in the transportation process is reduced when the anti-shaking clip is used for processing ultrathin and ultra-wide substrates or frames.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip packaging and manufacturing technology, and in particular to a semiconductor chip packaging and testing transfer clip. Background Technology

[0002] In the semiconductor chip packaging process, when the product is not yet separated into individual chips, the traditional transport method typically uses ordinary clips for loading. However, this method has many drawbacks: unseparated chips or substrates are prone to collapse and falling out in ordinary clips. These problems can not only cause physical damage but also lead to a decrease in yield in subsequent processes. Especially in modern semiconductor manufacturing, with the advancement of technology nodes, chip sizes are constantly shrinking, and shapes are becoming more diverse and complex, which poses a serious challenge to the design of traditional clips.

[0003] In particular, for ultra-thin and ultra-wide substrates and frames, traditional designs struggle to provide sufficient support and stability, increasing the risks during transport. Furthermore, because different types of chip packages have varying physical characteristics, such as thickness, width, and weight, they often require specific transport vehicles, further increasing production line complexity and management costs, while also limiting production flexibility.

[0004] To address these issues, the industry urgently needs a new solution that can adapt to various types of chip packages and improve transport efficiency while ensuring safety. Summary of the Invention

[0005] The purpose of this invention is to provide a semiconductor chip packaging and testing transfer clip to solve the problems existing in the prior art.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0007] A semiconductor chip packaging test transport clip includes a clip housing, the interior of which is hollow and open on both sides. Multiple slots are spaced apart from top to bottom inside the clip housing, and the slots are used to insert a substrate or frame.

[0008] The magazine housing has ratchet stop mechanisms at both openings. These ratchet stop mechanisms are hinged to the magazine housing and can self-lock in one direction. The ratchet stop mechanisms are used to prevent the base plate or frame from shaking along the insertion direction of the slot.

[0009] In one possible implementation, the semiconductor chip packaging test transport clip further includes a support pad for placing under the substrate or frame in each of the slots to prevent the substrate or frame from wobbling up and down in the slots.

[0010] In one possible implementation, the inner side of the support pad is hollow, with only an outer frame that inserts into the slot, to prevent damage to the substrate spherical surface or the frame EP surface.

[0011] In one possible implementation, the ratchet stop mechanism is hinged to the magazine housing via a hole and a pin.

[0012] In one possible implementation, the ratchet stop mechanism includes:

[0013] The lever is U-shaped, with a ratchet sleeve on the first pin at its first end and inserted into the pin hole corresponding to the first pin on the magazine housing, and a second pin at its second end inserted into the pin hole corresponding to the second pin on the magazine housing by a spring.

[0014] The ratchet engages with a pawl mounted on the magazine housing.

[0015] In one possible implementation, when the lever rotates toward the magazine housing, the pawl can slide over the teeth of the ratchet; when rotating in the opposite direction, the pawl can engage between the teeth of the ratchet to prevent it from rotating in the opposite direction, thereby achieving unidirectional self-locking.

[0016] In one possible implementation, the length of the stop lever is greater than the height of the magazine housing, in order to provide elastic space for the spring.

[0017] In one possible implementation, the plurality of said slots are evenly spaced from top to bottom within the magazine housing.

[0018] The beneficial effects of the technical solution provided by this utility model include at least the following:

[0019] This technical solution utilizes multiple slots spaced from top to bottom within the magazine housing for inserting substrates or frames. Ratchet mechanisms are installed at the openings on both sides of the magazine housing, hinged to the housing and capable of unidirectional self-locking. These mechanisms prevent the substrate or frame from wobbling along the insertion direction of the slots. This provides a practical, effective, and highly operable anti-wobbling magazine for securing substrates or frames, adaptable to various packaging types, effectively solving the problems caused by substrates or frames during transportation, especially for ultra-thin and ultra-wide substrates or frames, reducing risks during transport. Attached Figure Description

[0020] The accompanying drawings are provided to further understand the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation thereof.

[0021] Figure 1 This diagram shows a first-view axial side view of the semiconductor chip packaging test transport magazine provided in an exemplary embodiment of the present invention.

[0022] Figure 2 This diagram shows a second-view axial side view of the semiconductor chip packaging test transport magazine provided in an exemplary embodiment of the present invention.

[0023] Figure 3 This illustration shows a structural schematic of a support pad for a semiconductor chip packaging test transport clip provided in an exemplary embodiment of the present invention.

[0024] Figure 4 A partial structural schematic diagram of the first end of the ratchet stop mechanism of the semiconductor chip packaging test transport magazine provided in an exemplary embodiment of the present invention is shown.

[0025] Figure 5 This diagram shows a partial perspective view of the second end of the ratchet stop mechanism of a semiconductor chip packaging test transport clip provided in an exemplary embodiment of the present invention.

[0026] Figure 6 A schematic diagram of the ratchet stop mechanism of a semiconductor chip packaging test transfer clip provided in an exemplary embodiment of the present invention is shown.

[0027] In the picture:

[0028] 1. Magazine housing; 2. Slot; 3. Base plate or frame; 4. Ratchet stop mechanism; 5. Supporting pad;

[0029] 41. Stop lever; 42. First pin; 43. Ratchet; 44. Second pin; 45. Spring; 46. Pad. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] In this specification, identical components are represented by the same reference numerals. It should be noted that the terms "front," "rear," "left," "right," "upper," and "lower" used in the following description refer to directions in the accompanying drawings of this utility model, while the terms "bottom surface," "top surface," "inner," and "outer" refer to directions towards or away from a specific component, respectively. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "multiple" means two or more.

[0032] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0033] Figure 1 This diagram illustrates the structure of a semiconductor chip packaging test transport clip provided in an exemplary embodiment of the present invention. Figure 2 The diagram shows a second-view axial side view of the semiconductor chip packaging test transport clip provided in an exemplary embodiment of the present invention. The semiconductor chip packaging test transport clip includes a clip housing 1, which is hollow inside and open on both sides. Multiple slots 2 are distributed from top to bottom inside the clip housing 1. The slots 2 are used to insert a substrate or frame 3. A ratchet stop mechanism 4 is provided at both openings on both sides of the clip housing 1. The ratchet stop mechanism 4 is hinged to the clip housing 1 and can be self-locked in one direction. The ratchet stop mechanism 4 is used to prevent the substrate or frame 3 from shaking along the insertion direction of the slot 2.

[0034] In this embodiment, the semiconductor chip packaging test transport clip is designed to ensure the stability and safety of the substrate or frame 3 during transportation and handling. By providing a ratchet stop mechanism 4 at the openings on both sides of the clip housing 1, and by hinged to the clip housing 1 with a unidirectional self-locking function, the design effectively prevents the substrate or frame 3 from shaking or accidentally slipping out along the insertion direction of the slot 2. This design not only improves operational safety and reduces the risk of product damage during transportation, but also ensures the correct position of the substrate or frame 3 within the slot 2, thereby improving overall work efficiency and product quality. The unidirectional self-locking characteristic of the ratchet stop mechanism 4 allows the substrate or frame 3 to be easily inserted, while providing a reliable locking mechanism to prevent them from shifting or falling out unintentionally.

[0035] Preferably, the multiple slots 2 are evenly spaced from top to bottom within the magazine housing 1.

[0036] Figure 2The diagram shows a second-view axial side view of the semiconductor chip packaging test transport clip provided in an exemplary embodiment of the present invention. The semiconductor chip packaging test transport clip also includes a support pad 5, which is used to place under the substrate or frame 3 in each slot 2 to prevent the substrate or frame 3 from shaking up and down in the slot 2.

[0037] In this embodiment, the support pad 5 is disposed under the substrate or frame 3 within each slot 2. Its main function is to provide additional support and stability to prevent the substrate or frame 3 from wobbling vertically within the slot 2. This design effectively reduces displacement of the substrate or frame 3 due to vibration or impact during transportation and operation, thereby avoiding potential physical damage or electrical connection problems. Furthermore, the support pad 5 helps to evenly distribute pressure, protecting the delicate semiconductor structure from excessive stress and ensuring that high-precision requirements during packaging and testing are met (in the semiconductor industry, a "delicate" semiconductor structure refers to materials and devices that are extremely sensitive to environmental conditions and easily subject to physical or chemical damage). In this way, the support pad 5 not only improves the safety and reliability of transport but also indirectly promotes product quality improvement.

[0038] Optionally, the thickness of the supporting pad 5 varies depending on the thickness of the substrate or frame 3, so that the substrate or frame 3 will not wobble up and down in the slot 2 under the action of the supporting pad 5.

[0039] It is worth mentioning that, Figure 3 The diagram shows a schematic of the structure of a support pad for a semiconductor chip packaging test transport clip provided in an exemplary embodiment of the present invention. The support pad 5 is hollow inside and has only an outer frame that is inserted into the slot 2, which is used to prevent damage to the substrate spherical surface or the frame EP surface.

[0040] In this embodiment, the support pad 5 features an inner hollow design, retaining only the outer frame for insertion into the slot 2. This structural design aims to avoid direct contact with the substrate's spherical surface or the frame's EP surface, thereby preventing physical damage to these sensitive areas during transportation and handling. Since the substrate's spherical surface and the frame's EP surface typically contain delicate and critical electrical connection points, any minor scratches or indentations can lead to product quality degradation or even failure. By using this specially designed support pad, necessary support can be provided while ensuring no pressure or scratches are applied to the surface, protecting critical components from damage and thus guaranteeing the reliability and performance of the semiconductor product. Furthermore, this design of the support pad 5 reduces unnecessary material usage and weight without compromising its function as a buffer and support element. This not only helps reduce manufacturing costs but also improves operational efficiency, as the lighter design facilitates rapid and accurate operation by automated equipment. In summary, the unique construction of the support pad 5 optimizes the safety and economy of semiconductor packaging and testing transport, ensuring that each chip completes the transition from production to application in optimal condition.

[0041] It's important to note that the substrate ball-mounting surface refers to the side used to mount solder balls or solder pads in SiP (System-in-Package) or other packaging technologies. These solder balls act as leads connected to the PCB (Printed Circuit Board), providing both electrical connection and mechanical fixation. The quality of the ball mounting is crucial for ensuring good electrical contact, affecting not only signal transmission quality but also product reliability and lifespan. The ball-mounting process typically involves applying solder paste or flux to pre-defined pads, then precisely placing the solder balls at the pad positions using an automated ball-mounting machine or stencil placement, and finally reflow soldering to form a strong metallurgical bond between the solder balls and the pads. The EP surface (Electroplating Plane or Exposure Plane) of the lead frame refers to the critical surface on the lead frame in semiconductor packaging processes that has undergone special treatment to facilitate subsequent processing steps.

[0042] Furthermore, Figure 4 This diagram shows a partial structural schematic of the first end of the ratchet stop mechanism of a semiconductor chip packaging test transport clip provided in an exemplary embodiment of the present invention. Figure 5 This diagram shows a partial perspective view of the second end of the ratchet stop mechanism of a semiconductor chip packaging test transport clip provided in an exemplary embodiment of the present invention. Figure 6This diagram illustrates the structure of a ratchet stop mechanism for a semiconductor chip packaging test transport magazine according to an exemplary embodiment of the present invention. The ratchet stop mechanism 4 is hinged to the magazine housing 1 via a hole and pin. Specifically, the ratchet stop mechanism 4 includes: a stop 41, which is U-shaped, with a first pin 42 at its first end fixedly fitted with a ratchet 43 and inserted into a corresponding pin hole on the magazine housing 1; and a second pin 44 at its second end inserted into a corresponding pin hole on the magazine housing 1 via a spring 45; wherein the ratchet 43 engages with a pawl 46 mounted on the magazine housing 1.

[0043] In this embodiment, the U-shaped stop lever 41 serves as the main moving component, with its two ends connected to corresponding pin holes on the magazine housing 1 via a first pin 42 and a second pin 44, respectively. This structure allows the pawl 46 to slide on the surface of the ratchet 43 without interference when the stop lever 41 rotates toward the magazine housing 1; however, when attempting to rotate the stop lever 41 in the opposite direction, the pawl 46 engages with the teeth of the ratchet 43, effectively preventing reverse rotation and achieving a unidirectional self-locking function.

[0044] Furthermore, to ensure that the spring 45 has sufficient compression space to maintain appropriate preload, the length of the stop lever 41 is intentionally greater than the height of the magazine housing 1. This allows the spring 45 to be moderately compressed in the assembled state, providing continuous pressure to the pawl 46 and ensuring it remains in close contact with the ratchet 43, thus guaranteeing the reliability of the ratchet mechanism. Simultaneously, when it is necessary to release the self-locking state between the ratchet 43 and the pawl 46, the stop lever 41 can be pulled upwards, causing the spring 45 to continue compressing until the ratchet 43 is higher than the pawl 46 and separates from it, thus unlocking the mechanism.

[0045] Next, the working principle of a semiconductor chip packaging and testing transfer clip involved in the embodiments of this utility model will be explained.

[0046] This semiconductor chip packaging and testing transport magazine utilizes a ratchet stop mechanism 4 hinged to both sides of the magazine housing 1. This mechanism's one-way self-locking function prevents the substrate or frame 3 from wobbling or slipping out along the slot 2, ensuring stability and safety during transport and handling. Support pads 5 are located under the substrate or frame 3 within each slot 2, providing additional support and preventing direct contact with sensitive areas, thus preventing physical damage. The ratchet stop mechanism 4 consists of a U-shaped stop 41, a first pin 42, a ratchet 43, a second pin 44, a spring 45, and a pawl 46. It allows the substrate or frame 3 to be easily inserted and locked. When rotating in the opposite direction, the pawl 46 engages with the teeth of the ratchet 43 to prevent reverse rotation. When unlocking is required, pulling the stop 41 compresses the spring 45, separating the ratchet 43 from the pawl 46 to complete the unlocking process. This design improves operational safety and product protection while ensuring the accurate positioning of the substrate or frame 3, thus enhancing work efficiency and product quality.

[0047] In summary, this technical solution utilizes multiple slots spaced from top to bottom within the magazine housing for inserting substrates or frames. Ratchet mechanisms are installed at both sides of the magazine housing's openings, hinged to the magazine housing and capable of unidirectional self-locking. These mechanisms prevent the substrate or frame from wobbling along the insertion direction of the slots. This provides a practical, effective, and highly operable anti-wobbling magazine for securing substrates or frames, adaptable to various packaging types, effectively solving the problems caused by substrates or frames during transportation, especially for ultra-thin and ultra-wide substrates or frames, reducing risks during transport.

[0048] In the embodiments disclosed in this utility model, the terms "installation," "connection," "linking," and "fixing" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; "linking" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments disclosed in this utility model according to the specific circumstances.

[0049] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A semiconductor chip packaging test transfer clip, comprising a clip housing (1), wherein the interior of the clip housing (1) is hollow and open on both sides, characterized in that, A plurality of slots (2) are distributed at intervals from top to bottom in the magazine housing (1), and the slots (2) are used for inserting substrates or frames (3). Among them, ratchet stop lever mechanisms (4) are provided at both openings on both sides of the magazine housing (1). The ratchet stop lever mechanisms (4) are hinged to the magazine housing (1) and can be self-locked in one direction. The ratchet stop lever mechanisms (4) are used to prevent the substrate or frame (3) from shaking in the insertion direction of the slot (2).

2. The semiconductor chip packaging and testing transfer clip according to claim 1, characterized in that, The semiconductor chip packaging and testing transfer magazine further includes a supporting gasket (5). The supporting gasket (5) is used to be placed under the substrate or frame (3) in each slot (2) to prevent the substrate or frame (3) from shaking up and down in the slot (2).

3. The semiconductor chip packaging and testing transfer clip according to claim 2, characterized in that, The inner side of the supporting gasket (5) is hollow and only has an outer frame inserted into the slot (2), which is used to prevent damage to the substrate implantation surface or the frame EP surface.

4. The semiconductor chip packaging and testing transfer clip according to claim 1, characterized in that, The ratchet stop lever mechanism (4) is hinged to the magazine housing (1) by means of holes and pins.

5. The semiconductor chip packaging and testing transfer clip according to claim 4, characterized in that, The ratchet stop lever mechanism (4) includes: A stop lever (41), which is in a U-shape. A first pin shaft (42) at its first end is sleeved with a ratchet wheel (43) and inserted into the pin hole corresponding to the first pin shaft (42) on the magazine housing (1). A second pin shaft (44) at its second end is inserted into the pin hole corresponding to the second pin shaft (44) on the magazine housing (1) through a spring (45). Among them, the ratchet wheel (43) is engaged with a pawl (46) installed on the magazine housing (1).

6. The semiconductor chip packaging and testing transfer clip according to claim 5, characterized in that, When the stop lever (41) rotates towards the direction of the magazine housing (1), the pawl (46) can slide over the teeth of the ratchet wheel (43). When rotating in the reverse direction, the pawl (46) can be stuck between the teeth of the ratchet wheel (43) to prevent its reverse rotation, so as to achieve self-locking in one direction.

7. The semiconductor chip packaging and testing transfer clip according to claim 5, characterized in that, The length of the stop lever (41) is greater than the height of the magazine housing (1) to provide an elastic space for the spring (45).

8. The semiconductor chip packaging and testing transfer clip according to claim 1, characterized in that, The plurality of slots (2) are evenly distributed at intervals from top to bottom in the magazine housing (1).

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