Vehicle-mounted charger circuit chip with multi-layer structure

Abstract

The utility model discloses a vehicle-mounted charger circuit chip with a multilayer structure, which relates to the technical field of circuit chips, and comprises a substrate and a semiconductor crystal tube, a protection assembly is arranged in the substrate, the protection assembly comprises an electromagnetic isolation layer, a sealing lining ring and a partition barrier layer, the inner wall of the sealing lining ring is attached to the semiconductor crystal tube, the electromagnetic isolation layer and the partition barrier layer are mutually stacked in the vertical direction, the sealing lining ring is made of a silicon rubber material, and due to the high elasticity of the sealing lining ring, the silicon rubber can well fill a tiny gap between a chip and the packaging shell, and the sealing performance of the packaging shell is improved. The sealing lining ring can maintain the sealing effect through the elastic deformation of the sealing lining ring, a complex heat conduction network can be formed in the chip through the multi-section bent heat conduction bridge, the contact area with a substrate is increased, the heat conduction bridge can be in contact with more heat dissipation areas by increasing the number of the bent sections of the heat conduction bridge, and the heat dissipation efficiency is improved. And the heat can be more effectively dissipated, so that the overall heat dissipation efficiency of the chip is improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit chip technology, and in particular to a vehicle charger circuit chip with a multi-layer structure. Background Technology

[0002] The on-board charger circuit chip is the core component of an on-board charger. It is mainly responsible for converting the electrical energy from the vehicle's power supply into electrical energy suitable for charging electronic devices. In practical applications, the device typically requires the following technologies:

[0003] 1. The semiconductor substrate provides a physical support platform;

[0004] 2. Interconnect layer, used to connect various active and passive devices on the chip;

[0005] 3. Transistors, which enable functions such as signal amplification and switching control;

[0006] Different electronic devices require different current levels when charging. The onboard charger circuit chip can adjust the output current according to the needs of the connected electronic devices to ensure safe and efficient charging.

[0007] The interior of a car is a complex electromagnetic environment. Circuit chips are susceptible to interference from various electromagnetic sources. Different functional modules within the chip also generate electromagnetic interference during operation. High-frequency noise generated by digital circuit modules can interfere with the normal operation of analog circuit modules, causing deviations in the acquisition and processing of analog signals and reducing the reliability and accuracy of the chip. Utility Model Content

[0008] To address the shortcomings of existing technologies, this utility model provides a vehicle charger circuit chip with a multi-layer structure, solving the technical problem that the interior of a car is a complex electromagnetic environment, where circuit chips are easily interfered with by various electromagnetic sources, and different functional modules within the chip also generate electromagnetic interference during operation.

[0009] To achieve the above objectives, this utility model provides the following technical solution:

[0010] A vehicle charger circuit chip with a multilayer structure includes a substrate and a semiconductor transistor. The substrate has a protective component inside, which includes an electromagnetic isolation layer, a sealing ring, and a partition barrier layer. The inner wall of the sealing ring is attached to the semiconductor transistor, and the electromagnetic isolation layer and the partition barrier layer are stacked on top of each other in the vertical direction.

[0011] Preferably, the electromagnetic isolation layer is a thin copper sheet that is laid and fixed on the inner side of the substrate;

[0012] The sealing ring is made of silicone rubber, and the partition barrier layer is made of alumina ceramic. The partition barrier layer is located below the electromagnetic isolation layer, and there is a gap between the electromagnetic isolation layer and the partition barrier layer.

[0013] Preferably, one end of the partition barrier layer is fixedly installed with a support wedge for supporting the semiconductor tube, and two thermal bridges for connecting substrates are fixedly installed inside the support wedge. The thermal bridge is a multi-segment bending mechanism.

[0014] Metal strips for support are fixedly mounted on the surface of the substrate.

[0015] Compared with the prior art, the present invention has the following beneficial effects;

[0016] In this invention, by laying and fixing the electromagnetic isolation layer on the inner side of the substrate, copper can effectively reflect and absorb electromagnetic interference. When electromagnetic radiation hits the copper shielding layer, most of the electromagnetic energy will be reflected back. The free electrons in the copper can be redistributed under the action of the electromagnetic field to form a reverse electromagnetic field, thereby canceling out external electromagnetic interference and ensuring that the chip can work stably in a complex electromagnetic environment.

[0017] In this invention, a complex heat conduction network can be formed inside the chip through multiple bent thermal bridges, increasing the contact area with the substrate. By increasing the number of bent segments of the thermal bridges, they can come into contact with more heat dissipation areas, which helps to dissipate heat more effectively, thereby improving the overall heat dissipation efficiency of the chip. Attached Figure Description

[0018] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings.

[0019] Figure 1 This is a structural diagram of the chip of this utility model;

[0020] Figure 2 This is a structural diagram of the substrate of this utility model;

[0021] Figure 3 This is a structural diagram of the electromagnetic isolation layer of this utility model;

[0022] Figure 4 This is a structural diagram of the partitioned barrier layer of this utility model.

[0023] In the figure: 11, substrate; 12, semiconductor transistor; 13, electromagnetic isolation layer; 14, sealing gasket; 15, partition barrier layer; 16, support wedge; 17, thermal bridge; 18, metal strip. Detailed Implementation

[0024] This application provides a vehicle charger circuit chip with a multi-layer structure, which effectively solves the problem that the interior of a car is a complex electromagnetic environment where circuit chips are easily interfered with by various electromagnetic sources, and different functional modules inside the chip also generate electromagnetic interference during operation. By laying and fixing an electromagnetic isolation layer on the inner side of the substrate, copper can effectively reflect and absorb electromagnetic interference. When electromagnetic radiation hits the copper shielding layer, most of the electromagnetic energy is reflected back, and the free electrons in the copper can be redistributed under the action of the electromagnetic field to form a reverse electromagnetic field, thereby canceling out external electromagnetic interference and ensuring that the chip can work stably in a complex electromagnetic environment.

[0025] Example

[0026] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the technical solution in this application embodiment effectively solves the technical problem that the interior of a car is a space with a complex electromagnetic environment, where circuit chips are easily interfered with by various electromagnetic sources, and different functional modules inside the chip also generate electromagnetic interference during operation. The overall idea is as follows:

[0027] To address the problems existing in the prior art, this utility model provides a vehicle charger circuit chip with a multi-layer structure, including a substrate 11 and a semiconductor transistor 12. The substrate 11 has a protective component inside, which includes an electromagnetic isolation layer 13, a sealing ring 14, and a partition barrier layer 15. The inner wall of the sealing ring 14 is attached to the semiconductor transistor 12, and the electromagnetic isolation layer 13 and the partition barrier layer 15 are stacked on top of each other in the vertical direction.

[0028] The electromagnetic isolation layer 13 is a thin copper sheet that is laid and fixed on the inner side of the substrate 11. Copper can effectively reflect and absorb electromagnetic interference. When electromagnetic radiation hits the copper shielding layer, most of the electromagnetic energy will be reflected back. The free electrons in the copper can be redistributed under the action of the electromagnetic field to form a reverse electromagnetic field, thereby canceling the external electromagnetic interference and ensuring that the chip can work stably in a complex electromagnetic environment.

[0029] The sealing ring 14 is a silicone rubber material. Due to its high elasticity, silicone rubber can fill the tiny gaps between the chip and the package shell well, forming a tight seal. The sealing ring 14 can maintain the sealing effect through its own elastic deformation.

[0030] The partition barrier layer 15 is an alumina ceramic material. The partition barrier layer 15 is located below the electromagnetic isolation layer 13, and there is a gap between the electromagnetic isolation layer 13 and the partition barrier layer 15. The ceramic encapsulation can effectively prevent the intrusion of moisture, dust and chemicals, and ensure the normal operation of the chip.

[0031] One end of the partition barrier layer 15 is fixedly installed with a support wedge 16 for supporting the semiconductor transistor 12. Inside the support wedge 16, two thermal bridges 17 connecting the substrate 11 are fixedly installed. The thermal bridge 17 is a multi-segment bending mechanism. The multi-segment bending thermal bridge 17 can form a complex heat conduction network inside the chip, increasing the contact area with the substrate 11. By increasing the number of bending segments of the thermal bridge 17, it can contact more heat dissipation areas, which helps to dissipate heat more effectively, thereby improving the overall heat dissipation efficiency of the chip.

[0032] A metal strip 18 for support is fixedly mounted on the surface of the substrate 11. The metal strip 18 can provide additional mechanical support for the substrate 11, reducing the damage to the chip itself when it is subjected to accidental collision or compression.

[0033] Working principle:

[0034] The first step is to lay and fix the electromagnetic isolation layer 13 on the inner side of the substrate 11. Copper can effectively reflect and absorb electromagnetic interference. When electromagnetic radiation hits the copper shielding layer, most of the electromagnetic energy will be reflected back. The free electrons in the copper can be redistributed under the action of the electromagnetic field to form a reverse electromagnetic field, thereby canceling the external electromagnetic interference and ensuring that the chip can work stably in a complex electromagnetic environment. In addition, the sealing ring 14 is a silicone rubber material. Due to its high elasticity, silicone rubber can fill the tiny gap between the chip and the package shell well to form a tight seal. The sealing ring 14 can maintain the sealing effect through its own elastic deformation.

[0035] In the second step, the partition barrier layer 15 is located below the electromagnetic isolation layer 13, and there is a gap between the electromagnetic isolation layer 13 and the partition barrier layer 15. The ceramic package can effectively prevent the intrusion of moisture, dust and chemicals, ensuring the normal operation of the chip. The multi-segment bent thermal bridge 17 can form a complex heat conduction network inside the chip, increasing the contact area with the substrate 11. By increasing the number of bends in the thermal bridge 17, it can come into contact with more heat dissipation areas, which helps to dissipate heat more effectively, thereby improving the overall heat dissipation efficiency of the chip.

[0036] Finally, it should be noted that the above embodiments are merely examples for clearly illustrating the present invention and are not intended to limit the implementation. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A vehicle charger circuit chip with a multilayer structure, comprising a substrate (11) and a semiconductor transistor (12), characterized in that, The substrate (11) is provided with a protective component, which includes an electromagnetic isolation layer (13), a sealing ring (14) and a partition barrier layer (15). The inner wall of the sealing ring (14) is attached to the semiconductor tube (12), and the electromagnetic isolation layer (13) and the partition barrier layer (15) are stacked on each other in the vertical direction.

2. The on-board charger circuit chip with a multi-layer structure as described in claim 1, characterized in that, The electromagnetic isolation layer (13) is a thin sheet of copper metal, which is laid and fixed on the inner side of the substrate (11).

3. The on-board charger circuit chip with a multi-layer structure as described in claim 1, characterized in that, The sealing ring (14) is made of silicone rubber.

4. A vehicle charger circuit chip with a multi-layer structure as described in claim 1, characterized in that, The partition barrier layer (15) is an alumina ceramic material. The partition barrier layer (15) is located below the electromagnetic isolation layer (13), and there is a gap between the electromagnetic isolation layer (13) and the partition barrier layer (15).

5. A vehicle charger circuit chip with a multi-layer structure as described in claim 1, characterized in that, One end of the partition barrier layer (15) is fixedly installed with a support wedge (16) for supporting the semiconductor tube (12). Inside the support wedge (16) are two thermal bridges (17) connecting the substrate (11), and the thermal bridge (17) is a multi-segment bending mechanism.

6. A vehicle charger circuit chip with a multi-layer structure as described in claim 1, characterized in that, A metal strip (18) for support is fixedly mounted on the surface of the substrate (11).

Images