Lead frame and frame unit structure for rapidly packaging chips of multiple specifications

Abstract

The utility model relates to the technical field of semiconductor device packaging, in particular to a lead frame and frame unit structure for rapid packaging of chips of multiple specifications, comprising a frame body, a plurality of lead frame units arranged on the frame body, a plurality of runners arranged on the frame body, and a plurality of universal frame units of different sizes, the universal frame unit comprises a large frame unit with the largest size and other small and medium frame units with different sizes smaller than the large frame unit, the lead frame is provided with a plurality of balance grooves with different sizes, and the balance grooves are in one-to-one correspondence with the small and medium frame units and are communicated with the small and medium frame units. And the balancing grooves with the sizes from large to small are communicated with the small and medium frame units with the sizes from small to large. Through the arrangement of the balance grooves, the general frame units with different sizes can be arranged on the frame body, so that the compatibility of packaging forms of chips with various shapes and specifications can be realized. And the internal structure of the minimum unit of the frame is machined through laser cutting, and a flexible and efficient scheme is achieved.

Description

Technical Field

[0001] This application relates to the field of semiconductor device packaging technology, and in particular to a lead frame and frame unit structure for rapid packaging of multi-specification chips. Background Technology

[0002] In the packaging process of integrated chips, the lead frame is the substrate component of the package. Specifically, in traditional technology, single-row lead frames are arranged side by side horizontally along the length of the external working track, while individual frames are arranged vertically.

[0003] Leadframes are a crucial component of chip packaging. Common manufacturing methods include etching and stamping. Etching involves arranging individual chips in a matrix using a photomask to etch the desired pattern onto the leadframe. Stamping, on the other hand, requires die-cutting to form the leadframe. Both processes are time-consuming, and existing leadframes are typically designed for a specific type of chip, limiting their product coverage and making it difficult to meet the packaging requirements of diverse chip types. Therefore, existing leadframes suffer from two main drawbacks: long manufacturing times hinder rapid product packaging, and limited product coverage. Utility Model Content

[0004] In order to enable the packaging of various types of chips, this application provides a lead frame for rapid packaging of multi-specification chips.

[0005] One objective of this application is to provide a lead frame for rapid packaging of multi-specification chips, employing the following technical solution:

[0006] A lead frame for rapid packaging of multi-specification chips includes a frame body with multiple lead frame units disposed on the frame body. Several flow channels are equally spaced along the length of the frame body. The lead frame units are distributed on both sides of the flow channels. Each lead frame unit includes several general-purpose frame units of different sizes. The general-purpose frame units include a large frame unit (the largest size) and other small and medium-sized frame units of varying sizes. The lead frame is provided with several balancing slots of different sizes, each balancing slot corresponding to and connected to a small or medium-sized frame unit. The balancing slots, from largest to smallest, are connected to the small and medium-sized frame units, from smallest to largest.

[0007] By employing the above technical solution, general-purpose frame units of different sizes are arranged on the frame body in a specific order. During injection molding through the flow channel, larger general-purpose frame units require a larger injection volume, while smaller general-purpose frame units require a smaller injection volume, and the flow rate within the flow channel is constant. After the injection volume in the smaller general-purpose frame units reaches the required packaging volume, injection molding continues until the injection volume of the larger general-purpose frame units reaches the target. Excess injection volume in the smaller general-purpose frame units flows to the balancing groove, which accommodates the excess injection volume, thus ensuring that all general-purpose frames meet the packaging requirements, thereby achieving rapid packaging of multi-specification chips.

[0008] Preferably, the general frame units are symmetrically distributed on both sides of the flow channel.

[0009] By adopting the above technical solution, the general frame units are symmetrically distributed, which can ensure that the injection volume of the general frame on both sides of the flow channel is consistent during injection molding, thereby ensuring the encapsulation effect.

[0010] Preferably, the large frame unit is located at one end of the flow channel, and the remaining medium and small frame units are distributed along the flow channel to the other end in descending order of size.

[0011] Preferably, the large frame unit is located in the middle of the flow channel, and the remaining small and medium frame units are distributed along the flow channel from large to small towards both ends of the flow channel.

[0012] By adopting the above technical solution, the length and width of the frame body are not limited by the size of the general frame unit, and can be distributed according to the actual type, which greatly improves the utilization rate of the frame body.

[0013] Preferably, the balancing groove is located on the side of the small and medium frame unit away from the flow channel.

[0014] By adopting the above technical solution, during injection molding, the molten plastic in the flow channel first flows into the small and medium frame units, and the excess flows into the balance tank, thereby ensuring the encapsulation effect of the small and medium frame units.

[0015] Preferably, the frame body is provided with a plurality of stress relief grooves parallel to the flow channel, and the stress relief grooves are located on the side of the lead frame unit away from the flow channel.

[0016] By adopting the above technical solution, the stress relief groove eliminates the stress generated in the frame body during the processing, thereby ensuring the size and packaging effect of the general frame unit.

[0017] Another objective of this application is to provide a frame unit structure for rapid packaging of multi-specification chips, including a package body, applied to the aforementioned lead frame for rapid packaging of multi-specification chips. The package body has several pins on both sides and support legs at both ends. The internal structure of the package body is formed by cutting.

[0018] By adopting the above-mentioned technical solutions, the framework structure in the chip packaging field is generally achieved through etching or stamping processes. These two methods are complex and lack flexibility. However, laser cutting equipment is now being widely used in the processing and assembly industry. Laser cutting can be used to cut the internal structure of the package to create universal framework units, which is more flexible and efficient. It can also cut out various internal structures with different configurations to adapt to various types of chip packaging needs.

[0019] Preferably, there are inwardly arched semi-circular cutting and positioning protrusions between adjacent pins and on both sides of the support.

[0020] By adopting the above technical solution, the cutting positioning bump is the starting positioning point for laser cutting. Since the package contains multiple cutting positioning bumps, the laser can select a large number of starting points during cutting. Therefore, the cutting methods and directions, as well as the shapes and types of the resulting cutting tracks, are very diverse, thus adapting to various chip packaging requirements. This improves the versatility of the general-purpose frame unit.

[0021] In summary, this application includes at least one of the following beneficial technical effects:

[0022] By setting up the balancing slots, general-purpose frame units of different sizes can be arranged on the frame body, thereby enabling rapid packaging of chips of various specifications.

[0023] Laser cutting is used to process the internal structure of the package to create a universal frame unit, which is more flexible and efficient. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1;

[0025] Figure 2 This is a structural schematic diagram of Embodiment 2;

[0026] Figure 3-1a This is a schematic diagram of the cutting channels of one type of package in the embodiment;

[0027] Figure 3-1b In the embodiments Figure 3-1a A schematic diagram of the internal structure of the package formed after cutting;

[0028] Figure 3-2aThis is a schematic diagram of the cutting channel of another type of package in the embodiment;

[0029] Figure 3-2b In the embodiments Figure 3-2a A schematic diagram of the internal structure of the package formed after cutting;

[0030] Figure 3-3a This is a schematic diagram of the cutting channel of another type of package in the embodiment;

[0031] Figure 3-3b In the embodiments Figure 3-3a A schematic diagram of the internal structure of the package formed after cutting;

[0032] Figure 3-4a This is a schematic diagram of the cutting channel of another type of package in the embodiment;

[0033] Figure 3-4b In the embodiments Figure 3-4a A schematic diagram of the internal structure of the package formed after cutting.

[0034] Explanation of reference numerals in the attached figures:

[0035] 1. Frame body; 2. Lead frame unit; 3. Flow channel; 4. General frame unit; 5. Large frame unit; 6. Medium and small frame unit; 7. Balance groove; 8. Package body; 9. Pin; 10. Support; 11. Stress relief groove; 12. Cutting and positioning bumps. Detailed Implementation

[0036] The present application will be further described in detail below with reference to all the accompanying drawings.

[0037] Example 1

[0038] This application discloses a lead frame for rapid packaging of multi-specification chips, referring to... Figure 1 It includes a frame body 1, and several flow channels 3 are equally spaced along the length direction of the frame body 1. The length of the flow channels 3 is slightly shorter than the width of the frame body 1.

[0039] Reference Figure 1 Several lead frame units 2 are symmetrically and evenly distributed on both sides of the flow channel 3. The lead frame units 2 are used to package the chip. The frame body 1 is provided with a stress relief groove 11 located on the side of the lead frame unit 2 away from the flow channel 3. The stress relief groove 11 eliminates the stress in the frame body 1, ensuring the dimensional accuracy and packaging effect of the lead frame unit 2.

[0040] Reference Figure 1The lead frame unit 2 includes several general-purpose frame units 4 of different sizes. The general-purpose frame units 4 include a large frame unit 5 (the largest) and other small and medium-sized frame units 6, each smaller than the large frame unit 5 and varying in size. The lead frame is provided with several balancing slots 7 of different sizes. Each balancing slot 7 corresponds to and is connected to one of the small and medium-sized frame units 6. The balancing slots 7, from largest to smallest, are connected to the small and medium-sized frame units 6, and are located on the side of the small and medium-sized frame units 6 furthest from the flow channel 3. Furthermore, the volume of any balancing slot 7 and the small and medium-sized frame unit 6 connected to it is not less than the volume of the large frame unit 5.

[0041] Reference Figure 1 Different sizes and specifications of general-purpose frame units 4 require different injection volumes during injection molding, but the flow rate of the molten plastic into each general-purpose frame unit 4 is basically the same. Therefore, when the injection volume in the smaller general-purpose frame unit 4 reaches the required level, the injection volume in the larger general-purpose frame unit 4 is still insufficient. To ensure that the largest general-purpose frame unit 4 meets the packaging requirements, injection molding needs to continue. At this time, the excess molten plastic in the smaller general-purpose frame unit 4 flows into the balancing tank 7 to accommodate the excess molten plastic, thereby ensuring that general-purpose frame units 4 of all sizes and specifications can be packaged.

[0042] Reference Figure 1 The general-purpose frame unit 4 has two distribution patterns on the frame body 1. First, the large frame unit 5 is located at one end of the flow channel 3, and the remaining medium and small frame units 6 are distributed along the flow channel 3 from largest to smallest towards the other end. Second, the large frame unit 5 is located in the middle of the flow channel 3, and the remaining medium and small frame units 6 are distributed along the flow channel 3 from largest to smallest towards both ends. The length and width of the frame body 1 are not limited by the size of the general-purpose frame unit 4 and can be distributed according to the actual types, thus greatly improving the utilization rate of the frame body 1.

[0043] The implementation principle of a lead frame for rapid packaging of multi-specification chips in this application embodiment is as follows: select general-purpose frame units 4 of different sizes according to the type, size and model of the chip, and arrange them on the frame body 1 in sequence. Cut the internal structure of the package body 8 by laser cutting, and finally perform injection molding packaging through the flow channel 3.

[0044] Example 2

[0045] This application discloses a frame unit structure for rapid packaging of multi-specification chips, referring to... Figure 1 and Figure 2The frame unit structure is the general frame unit 4 in the above embodiment, including a package body 8, with several pins 9 on both sides of the package body 8 and support legs 10 at both ends. The internal structure of the package body 8 is formed by cutting. In the field of chip packaging, frame structures are generally achieved through etching or stamping processes. These two processes are complex and lack flexibility. Currently, laser cutting equipment is being widely used in the processing and assembly industry. Using laser cutting to cut the internal structure of the package body 8 to create the general frame unit 4 is more flexible and efficient, and can cut out various internal structures with different configurations, thus adapting to various types of chip packaging needs.

[0046] Reference Figure 2 Between adjacent pins 9 and on both sides of the support 10, there are inwardly arched semi-circular cutting positioning bumps 12. The cutting positioning bumps 12 are the starting positioning points for laser cutting. The package body 8 has multiple cutting positioning bumps 12. When the laser is cutting, there are many starting points to choose from. Therefore, the cutting methods and directions, as well as the shapes and types of cutting tracks formed, are very diverse, thus adapting to the packaging needs of various chips. This improves the versatility of the general-purpose frame unit 4.

[0047] Reference Figures 3-1a to 3-4b When packaging chips of the same specification but different models, the internal structure of the package 8 required is different, but the external structure of the package 8 is the same. In this case, laser cutting can be used to select the corresponding cutting positioning bumps 12 along the cutting path according to different requirements to form different internal structures of the package 8 to match the chip packaging. By using laser cutting in conjunction with a package 8 with a uniform external structure, rapid packaging of chips of the same specification but different models can be achieved.

[0048] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A lead frame for rapid packaging of multi-specification chips, comprising a frame body (1), wherein a plurality of lead frame units (2) are disposed on the frame body (1), characterized in that: The frame body (1) is provided with several flow channels (3) at equal intervals along the length direction of the frame body (1). The lead frame unit (2) is distributed on both sides of the flow channel (3). The lead frame unit (2) includes several general frame units (4) of different sizes. The general frame unit (4) includes the largest large frame unit (5) and other small and medium frame units (6) with different sizes and smaller sizes than the large frame unit (5). The lead frame is provided with several balance grooves (7) of different sizes. The balance grooves (7) correspond one-to-one with the small and medium frame units (6) and are connected. The balance grooves (7) with sizes from large to small are connected to the small and medium frame units (6) with sizes from small to large.

2. The lead frame for rapid packaging of multi-specification chips according to claim 1, characterized in that: The general frame unit (4) is symmetrically distributed on both sides of the flow channel (3).

3. The lead frame for rapid packaging of multi-specification chips according to claim 1, characterized in that: The large frame unit (5) is located at one end of the flow channel (3), and the remaining small and medium frame units (6) are distributed along the flow channel (3) to the other end of the flow channel (3) in descending order of size.

4. The lead frame for rapid packaging of multi-specification chips according to claim 1, characterized in that: The large frame unit (5) is located in the middle of the flow channel (3), and the remaining small and medium frame units (6) are distributed along the flow channel (3) from large to small in order to both ends of the flow channel (3).

5. The lead frame for rapid packaging of multi-specification chips according to claim 1, characterized in that: The balancing groove (7) is located on the side of the small and medium frame unit (6) away from the flow channel (3).

6. The lead frame for rapid packaging of multi-specification chips according to claim 1, characterized in that: The frame body (1) is provided with several stress relief grooves (11) parallel to the flow channel (3), and the stress relief grooves (11) are located on the side of the lead frame unit (2) away from the flow channel (3).

7. A frame unit structure for rapid packaging of multi-specification chips, comprising a package body (8), characterized in that: The lead frame for rapid packaging of multi-specification chips as described in any one of claims 1-6 is provided with a plurality of pins (9) on both sides of the package body (8), and support feet (10) are provided at both ends of the package body (8). The internal structure of the package body (8) is formed by cutting.

8. The frame unit structure for rapid packaging of multi-specification chips according to claim 7, characterized in that: Between two adjacent pins (9) and on both sides of the support (10), there are inwardly arched semi-circular cutting positioning protrusions (12).

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