Large-size semiconductor packaging dispensing jig
By designing a large-size semiconductor packaging dispensing fixture and adopting a "rice"-shaped transmission channel and a one-way valve structure, the problems of low efficiency and unstable quality of traditional dispensing devices have been solved, achieving a high-efficiency and stable dispensing effect.
Patent Information
- Application Number
- CN202520209297.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-10
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2035-02-10
AI Technical Summary
Traditional dispensing devices are inefficient during operation and are prone to problems such as glue breakage, stringing, and inconsistent glue width, which affect the dispensing quality.
A large-size semiconductor packaging dispensing fixture was designed, comprising a dispensing frame, a dispensing tube, an air tube, and a dispensing groove. It adopts a "rice"-shaped transmission pipeline and a one-way valve structure to achieve one-time fixed dispensing, and uses air supply through the air tube to achieve debinding and shaping, reducing the risk of glue leakage and overflow.
It improves the stability and quality of dispensing, reduces the risk of dispensing breakage and overflow, ensures the uniformity of dispensing width and height, and improves the yield of packaged products.
Smart Images
Figure CN223847345U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a dispensing fixture for large-size semiconductor packaging. Background Art
[0002] In the rapidly changing technical field of semiconductor packaging today, 2.5D and 3D packaging technologies are undoubtedly the two most prominent development directions. Among them, the dispensing process plays an essential role. Currently, traditional dispensing uses a valve trajectory to perform cyclic glue application to cover components. When this dispensing device operates, multiple dispensing operations need to be completed simultaneously, resulting in low operation efficiency. Problems such as glue breakage, wire drawing, and scattered dots often occur during the operation. After dispensing, the glue height and width vary in size, affecting the dispensing quality.
[0003] Therefore, in order to improve the dispensing quality and obtain higher-quality packaging products, the structure of the dispensing device needs to be further improved. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a dispensing fixture for large-size semiconductor packaging, which can avoid glue breakage during dispensing, achieve one-time fixed dispensing, and improve the dispensing performance and yield.
[0005] To achieve the above-mentioned utility model purpose, the utility model provides a dispensing fixture for large-size semiconductor packaging, including a dispensing frame, a connecting part, a glue transfer pipe, and an air pipe;
[0006] The dispensing frame is provided with a transmission pipeline, the bottom of the dispensing frame is provided with a dispensing part, and the dispensing part is provided with a glue outlet groove;
[0007] The connecting part is located at the top of the dispensing frame, the glue transfer pipe and the air pipe are located inside the connecting part, and the glue transfer pipe is communicated with the glue outlet groove through the transmission pipeline; the air pipe is communicated with the top of the glue outlet groove, and the air pipe is connected with a check valve.
[0008] As a further improvement of the utility model, the dispensing frame is provided with a plurality of the transmission pipelines, the distribution structure of the plurality of transmission pipelines is a "rice" shape, the feeding end of the transmission pipeline is communicated with the glue transfer pipe, and the discharging end of the transmission pipeline is communicated with the glue outlet groove.
[0009] As a further improvement of the utility model, a pneumatic valve diaphragm is provided at the connection between the air pipe and the glue outlet groove.
[0010] As a further improvement of the utility model, a glue pad is provided at the bottom of the dispensing part, and the glue pad is located on the side of the glue outlet groove.
[0011] The utility model discloses a large -size semiconductor packaging point gum jig, and point gum department is pressed in target point gum position, and through the current injection glue pump, the glue is inputted transmission glue pipe, and the glue is transmitted to transmission pipeline through transmission glue pipe, and finally flows into glue outlet groove, and the glue flows to target point gum position from glue outlet groove, and then stops injection glue, and through the current gas supply component, the gas is supplied to glue outlet groove through air pipe, thereby realizing degumming and shaping, and the point gum department fast degumming is realized.
[0012] The utility model discloses a large -size semiconductor packaging point gum jig with the advantages compared with prior art:
[0013] (1) through the point gum department of adapting to injection glue position, the glue is injected into injection glue position simultaneously, realizes disposable fixed point gum, reduces the risk such as broken glue, wire drawing, and the glue width and glue height size of unified injection glue position are enhanced, and the point gum quality is enhanced;
[0014] (2) air pipe and transmission glue pipe are independently arranged, reduce the risk of glue into air pipe, also improve the stability of glue height of each point gum position. DRAWINGS
[0015] Figure 1 It is a large -size semiconductor packaging point gum jig structure schematic view of the utility model;
[0016] Figure 2 It is a large -size semiconductor packaging point gum jig structure sectional view of the utility model;
[0017] Figure 3 It is air pipe connection schematic view;
[0018] Figure 4 It is " mi " shape transmission pipeline distribution schematic view. CONCRETE IMPLEMENTING METHOD
[0019] The specific implementing method of the utility model is further explained in detail below in combination with the drawings.
[0020] As Figures 1-2 The utility model discloses a large -size semiconductor packaging point gum jig, including point gum frame 1, connecting portion 2, transmission glue pipe 3 and air pipe 4;
[0021] Point gum frame 1 is equipped with transmission pipeline 11, and the bottom of point gum frame 1 is equipped with point gum department 51, and point gum department 51 is adapted to the size and shape of actual injection glue position, and point gum department 51 is equipped with glue outlet groove 51;
[0022] Connecting portion 2 is located at the top of point gum frame 1, and transmission glue pipe 3 and air pipe 4 are located in connecting portion 2, and transmission glue pipe 3 is communicated with glue outlet groove 51 through transmission pipeline 11;Air pipe 4 is communicated with the top of glue outlet groove 51, and air pipe 4 is connected with one-way valve 41.
[0023] The utility model discloses a large -size semiconductor packaging point gum jig, and point gum department 51 is pressed in target point gum position, and the glue is input transmission glue pipe 3 through the existing glue injection pump, and the glue is transmitted to transmission pipeline 11 through transmission glue pipe 3, and finally flows into glue outlet groove 51, and the glue flows to target point gum position from glue outlet groove 51, and then stops glue injection, and the glue outlet groove 51 is supplied with gas through the existing gas supply assembly through air pipe 4, thereby realizing degumming and shaping, and making point gum department 51 quickly degum.
[0024] Point gum frame 1 is equipped with several transmission pipeline 11, and the distribution structure of several transmission pipeline 11 is "Mi" character shape, the feed end of transmission pipeline 11 is communicated with transmission glue pipe 3, and the discharge end of transmission pipeline 11 is communicated with glue outlet groove 51.
[0025] The one-way valve 41 of air pipe 4 reduces the risk of glue entering air pipe 4 to a certain extent. After stopping glue injection, there is excess glue in transmission glue pipe 3 and transmission pipeline 11, and when degumming and shaping by air pressure, if air pipe 4 is communicated with glue outlet groove 51 through transmission pipeline 11, the excess glue will be continuously pushed into glue outlet groove 51 by the air pressure in air pipe 4, causing unstable glue height size at each point gum position. The structure that air pipe 4 is directly communicated with glue outlet groove 51 makes air pipe 4 and transmission glue pipe 3 transmit independently, which can reduce the risk of glue in transmission glue pipe 3 running into air pipe 4 and causing air pipe 4 to be blocked, and also makes the air flow transmission channel and the glue transmission channel independent, avoiding excess glue in transmission glue pipe 3 and transmission pipeline 11 from being blown out.
[0026] The connection between air pipe 4 and glue outlet groove 5 is provided with a gas valve diaphragm 42, which can further prevent glue from entering air pipe 4 without affecting gas transmission.
[0027] The bottom of point gum department 51 is provided with a rubber pad 52, which is located on the side of glue outlet groove 51. When injecting glue, point gum department 51 needs to be pressed tightly on the target point gum position, and the rubber pad 52 can play a buffering and sealing role, which can reduce the friction between point gum department 51 and the target point gum position, reduce glue overflow, and improve the stability of the glue width size of the point gum position.
[0028] The above has carried out the specific description to the preferred embodiment of the utility model creation, but the utility model creation is not limited to the described embodiment, and those skilled in the art can make various equivalent modifications or replacements without departing from the spirit of the utility model creation, and these equivalent modifications or replacements are all included in the range defined by the claims of the present application.
Claims
1. A large-size semiconductor package dispensing jig, characterized by, It includes a dispensing rack, a connecting part, a glue transmission pipe, and an air pipe; The dispensing rack is provided with a transmission pipeline. The bottom of the dispensing rack is provided with a dispensing part, and the dispensing part is provided with a glue outlet groove; The connecting part is located at the top of the dispensing rack. The glue transmission pipe and the air pipe are located inside the connecting part. The glue transmission pipe is communicated with the glue outlet groove through the transmission pipeline; the air pipe is communicated with the top of the glue outlet groove, and a check valve is connected to the air pipe.
2. The large-size semiconductor package dispensing jig according to claim 1, wherein The dispensing rack is provided with a plurality of the transmission pipelines. The distribution structure of the plurality of transmission pipelines is a "rice" shape. The feeding end of the transmission pipeline is communicated with the glue transmission pipe, and the discharging end of the transmission pipeline is communicated with the glue outlet groove.
3. The large scale semiconductor package dispensing jig of claim 1, wherein, An air valve diaphragm is provided at the connection between the air pipe and the glue outlet groove.
4. The large scale semiconductor package dispensing jig of claim 1, wherein, A rubber pad is provided at the bottom of the dispensing part, and the rubber pad is located on the side of the glue outlet groove.