Drying equipment for semiconductor gluing and developing module

Abstract

The utility model relates to the technical field of semiconductors, and discloses a drying device of a semiconductor gluing and developing module, which comprises a drying cabinet, a bottom plate is arranged in the drying cabinet, sliding rails are arranged at the top of the bottom plate at equal intervals, sliding blocks are arranged at the tops of the sliding rails, and a placement disc is arranged between the tops of the sliding blocks. A semiconductor wafer is arranged at the top of the containing disc, a plurality of infrared heating pipes are arranged on the inner top wall of the drying cabinet at equal intervals, a plurality of temperature sensors are arranged between the infrared heating pipes, and the front portion of the drying cabinet is connected with a first box door and a second box door through hinges. According to the utility model, the solvent is efficiently recovered through the circulating cooling system, the pollution is reduced by combining the multi-stage waste gas purification, the wafers are uniformly heated through the sliding rail and the infrared heating pipe, the wafer heating device is adaptive to the wafers of different specifications, the problems of solvent waste, insufficient environmental protection performance and uneven heating in the prior art are solved, and the processing efficiency and the equipment stability are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor, especially relates to a kind of drying equipment of semiconductor gluing developing module. BACKGROUND

[0002] In the semiconductor manufacturing process, gluing developing process is an important link of photoetch processing, and the photoresist coated on wafer surface needs to be heated and solvent removed by high-precision drying equipment to ensure the integrity of the pattern and the stability of the photoetch process.

[0003] The existing drying equipment of semiconductor gluing developing module usually adopts fixed heating mode, such as arranging infrared heating pipe or hot plate heating at the top to constantly heat the wafer. The wafer is usually placed in the chamber by a fixed placement disc, and the pressure inside the chamber is reduced by a vacuum pump at the same time to accelerate the evaporation of solvent.

[0004] The fixed heating mode in the technology is difficult to achieve uniform heating of different areas of the wafer, especially in the drying process of large-size wafers, local overheating can cause distortion of the photoresist pattern or wafer warping. In addition, the treatment scheme of volatile gas is usually direct discharge or simple filtration, which leads to waste of solvent and pollution problem to the environment, which is not consistent with the current trend of pursuing high efficiency, energy saving and environmental protection in the semiconductor industry. At the same time, the fixed placement of wafer platform design is easy to be affected by vibration and thermal stress during equipment operation, which reduces the reliability and adaptability of the equipment. Therefore, a drying equipment for semiconductor gluing developing module is proposed to solve the above problems. UTILITY MODEL CONTENTS

[0005] In order to make up for the above shortcomings, the utility model provides a kind of drying equipment for semiconductor gluing developing module, aims at improving the problems of heating uniformity, gas recovery treatment and wafer stability in the prior art.

[0006] In order to achieve the above purpose, the utility model adopts the following technical scheme: a kind of drying equipment for semiconductor gluing developing module, including drying cabinet, the inside of the drying cabinet is provided with bottom plate, the top of the bottom plate is equidistantly provided with slide rail, the top of the slide rail is provided with sliding block, the top of the sliding block is provided with placement disc, the top of the placement disc is provided with semiconductor wafer, the inner top wall of the drying cabinet is equidistantly provided with multiple infrared heating pipes, multiple temperature sensors are arranged between the infrared heating pipes, the front of the drying cabinet is connected with box door one and box door two by hinge, the inside of the drying cabinet is provided with collection assembly and processing assembly.

[0007] As a further description of the above technical scheme: the collecting assembly includes a condenser, the condenser is arranged in the interior of the drying cabinet, an air inlet of the condenser is connected with the output end of the second air suction pump through a plurality of pipelines, the output end of the second air suction pump is connected with the bottom plate through a pipeline, and the second air suction pump is arranged at the lower part of the bottom plate, a liquid outlet of the condenser is connected with the collecting kettle through a pipeline, the inner bottom wall of the drying cabinet is provided with a water tank, the outer side of the water tank is provided with a water pump, the input end of the water pump is connected with the water tank through a pipeline, the output end of the water pump is connected with the cooling liquid inlet of the condenser through a pipeline, and the cooling liquid outlet of the condenser is connected with the water inlet of the water tank through a pipeline;

[0008] As a further description of the above technical scheme: the processing assembly includes a first air suction pump, the first air suction pump is arranged on the inner wall of the drying cabinet, the input end of the first air suction pump is communicated with the pipeline between the condenser and the collecting kettle through a connecting pipeline, and the output end of the first air suction pump is provided with a waste gas treatment mechanism.

[0009] As a further description of the above technical scheme: the waste gas treatment mechanism includes a cylinder, the cylinder is arranged in a circular hole outside the drying cabinet, equidistant clamping balls are arranged on the outer portion of the cylinder, and the clamping balls are clamped with the circular hole, and the inner portion of the cylinder is provided with a rough filter plate, a precision filter plate and a chemical adsorption filter plate from inside to outside.

[0010] As a further description of the above technical scheme: the inner wall of the drying cabinet is provided with a mounting frame, the top of the mounting frame is provided with a vacuum pump, the input end of the vacuum pump is connected with the bottom plate through a pipeline, and the rear portion of the drying cabinet is provided with a heat dissipation hole.

[0011] As a further description of the above technical scheme: the front portion of the drying cabinet is provided with a plurality of operation buttons, the front portion of the drying cabinet is provided with a display screen, and the outer portion of the drying cabinet is provided with an alarm lamp.

[0012] As a further description of the above technical scheme: the bottom of the drying cabinet is provided with adjustable supporting legs at four corners.

[0013] The utility model has the advantages of the following beneficial effects:

[0014] 1. The utility model discloses a circulating cooling system constituted by condenser, water pump and water tank, which can efficiently recover the solvent in volatile gas and store it through the collecting kettle, and the multi-stage filtering structure of the exhaust pump and the waste gas treatment mechanism can purify the residual waste gas, effectively reducing the environmental pollution caused by solvent volatilization. Compared with the direct volatilization and incomplete waste gas treatment in the prior art, the utility model solves the problems of solvent waste and insufficient environmental protection performance, and maintains the stability of equipment operation through the design of vacuum pump and heat dissipation hole, prolongs the service life of equipment and improves the work efficiency.

[0015] 2. The utility model discloses the combination structure of sliding rail and sliding block is combined with the movement design of setting disc, and combines infrared heating pipe and temperature sensor that inner top wall evenly distributes, and through the position of wafer and real -time monitoring its surface temperature of dynamic adjustment, realized the even heating effect of wafer surface. Compared with the local overheating or overcooling caused by the fixed wafer and the difficult comprehensive coverage of infrared heating pipe position in the prior art, the utility model solves the problem of uneven wafer heating, and through the flexible adjustment of sliding rail, it is adapted to different specifications of wafer, improves the processing flexibility and compatibility of equipment. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is the overall structural drawing of the drying equipment of semiconductor gluing and developing module that the utility model proposes;

[0017] Figure 2 It is the expanded view of the drying equipment of semiconductor gluing and developing module that the utility model proposes;

[0018] Figure 3 It is the sectional view of the drying equipment of semiconductor gluing and developing module that the utility model proposes Figure 1 ;

[0019] Figure 4 It is the sectional view of the drying equipment of semiconductor gluing and developing module that the utility model proposes Figure 2 ;

[0020] Figure 5 It is the sectional view of the drying equipment of semiconductor gluing and developing module that the utility model proposes Figure 4 ; Figure 2 It is the sectional view of the waste gas treatment mechanism in

[0021] LEGEND:

[0022] 1, drying cabinet; 2, alarm light; 3, box door one; 4, operation button; 5, display screen; 6, box door two; 7, waste gas treatment mechanism; 701, cylinder; 702, coarse filter plate; 703, precision filter plate; 704, chemical adsorption filter plate; 705, ball; 8, slide rail; 9, setting disc; 10, semiconductor wafer; 11, infrared heating tube; 12, temperature sensor; 13, condenser; 14, heat dissipation hole; 15, mounting frame; 16, vacuum pump; 17, collection kettle; 18, water tank; 19, water pump; 20, air pump one; 21, air pump two; 22, bottom plate; 23, adjustable support leg. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0024] Reference Figures 1-4The utility model provides an embodiment: the inside of drying cabinet 1 is provided with bottom plate 22, and bottom plate 22 provides the stable support platform for the internal component of equipment, ensures that equipment has stability and anti -vibration ability when operating under the complex working condition such as high temperature, vacuum, simultaneously provides the firm installation foundation for subsequent installation slide rail 8, air pump two 21 and other key components, the top equidistance of bottom plate 22 is provided with slide rail 8, and the arrangement of slide rail 8 makes the bearing platform of wafer have flexible moving ability, and the stability of slider operation is ensured through uniform track distribution, and the top of slide rail 8 is provided with sliding block, and the top between sliding block is provided with setting disc 9, and setting disc 9 provides a flat placement platform for wafer, and its high temperature resistance, low thermal expansion characteristics effectively prevent wafer from producing deformation in high temperature drying process, and the combination of setting disc 9 and sliding block ensures that it does not produce deviation in the movement process, so as to guarantee processing quality 9, and the top of setting disc 9 is provided with semiconductor wafer 10, and semiconductor wafer 10 is the core object needing processing in drying process, and the photoresist coated on its surface is completed solvent volatilization and solidification through uniform heating, and the accurate positioning of wafer can ensure the uniformity of coating thickness and the stability of subsequent process, and the inner top wall of drying cabinet 1 is provided with multiple infrared heating tubes 11, and infrared heating tube 11 directly heats the surface of wafer through radiation heat, and its equidistance distribution design ensures the temperature field uniformity in chamber, avoids the adverse effect of local overheating or overcooling on wafer coating, simultaneously improves drying efficiency, and multiple temperature sensors 12 are arranged between infrared heating tube 11, and temperature sensor 12 monitors the temperature data of wafer surface in real time, and feedback signal is transmitted to control system, so as to realize the dynamic adjustment of infrared heating tube 11 power, ensures that wafer is always in constant temperature environment in the whole drying process, and the front of drying cabinet 1 is connected with box door one 3 and box door two 6 through hinge, and the inside of drying cabinet 1 is provided with collection assembly and processing assembly, and collection assembly recycles liquid component in solvent volatilization through condensation technology, reduces solvent waste, simultaneously reduces emission pollution, and processing assembly realizes environmental protection emission and prevents equipment internal pollution through the filtration and purification of volatile gas,

[0025] The collection assembly includes a condenser 13, which condenses the solvent vapor in the volatile gas into a liquid state through low-temperature cooling technology. The compact internal arrangement effectively shortens the airflow path, improves the condensation efficiency, and avoids excessive equipment volume. The condenser 13 is arranged inside the drying cabinet 1. The air inlet of the condenser 13 is connected to the output end of the second air suction pump 21 through multiple pipelines. The output end of the second air suction pump 21 is connected to the bottom plate 22 through a pipeline. The negative pressure generated by the second air suction pump 21 introduces the volatile gas in the drying chamber into the condenser 13, ensuring that the volatile gas can quickly leave the chamber surface and preventing the gas from recondensing on the wafer surface. The second air suction pump 21 is arranged at the lower part of the bottom plate 22. The liquid outlet of the condenser 13 is connected to the collection kettle 17 through a pipeline. The collection kettle 17 is used to collect the condensed liquid solvent. Its closed design prevents the liquid solvent from evaporating again, facilitates subsequent processing and recycling, further reduces production costs, and the inner bottom wall of the drying cabinet 1 is provided with a water tank 18. The outer side of the water tank 18 is provided with a water pump 19. The input end of the water pump 19 is connected to the water tank 18 through a pipeline. The output end of the water pump 19 is connected to the cooling liquid inlet of the condenser 13 through a pipeline. The cooling liquid outlet of the condenser 13 is connected to the water inlet of the water tank 18 through a pipeline. The water pump 19 sends the cooling liquid from the water tank 18 to the condenser 13. After heat exchange with the volatile gas in the condenser 13, the cooling liquid returns to the water tank 18 from the cooling liquid outlet, forming a circulating cooling system, which significantly reduces the cooling energy consumption;

[0026] The processing assembly includes a first air suction pump 20. The first air suction pump 20 is arranged on the inner wall of the drying cabinet 1. The input end of the first air suction pump 20 is connected to the pipeline between the condenser 13 and the collection kettle 17 through a connecting pipeline. The output end of the first air suction pump 20 is provided with a waste gas treatment mechanism 7. The first air suction pump 20 introduces the residual gas in the condenser 13 and the collection kettle 17 into the waste gas treatment mechanism 7 through the connecting pipeline. The stable air suction capacity of the first air suction pump 20 ensures that the waste gas can completely enter the purification system, preventing the internal and external environment of the equipment from being contaminated;

[0027] The inner wall of the drying cabinet 1 is provided with a mounting bracket 15, which provides a stable mounting position for the vacuum pump 16. The top of the mounting bracket 15 is provided with the vacuum pump 16. The vacuum pump 16 forms a low-pressure environment in the drying chamber by vacuum suction in the bottom plate 22 area to accelerate the evaporation efficiency of the volatile solvent. The input end of the vacuum pump 16 is connected to the bottom plate 22 through a pipeline. The rear part of the drying cabinet 1 is provided with a heat dissipation hole 14;

[0028] A plurality of operation buttons 4 are equidistantly arranged on the front of the drying cabinet 1, which provides the operator with direct control function of the running state of the equipment, facilitates the setting of parameters such as temperature, time, vacuum degree, etc., and improves the convenience of equipment use. A display screen 5 is arranged on the front of the drying cabinet 1, which displays the running parameters and equipment state in real time during the drying process, facilitating the operator to monitor and adjust. An alarm lamp 2 is arranged on the outside of the drying cabinet 1, which provides audible and visual alarm prompt when the equipment runs abnormally or fails, ensuring that the operator can discover the problem in time and take measures to improve the safety of equipment operation.

[0029] Adjustable supporting legs 23 are arranged at the four corners of the bottom of the drying cabinet 1, which can adjust the height according to the actual situation of the equipment installation site, ensure the equipment to be placed horizontally, and thus ensure the uniform heating of the wafer during the drying process and the stable operation of the equipment.

[0030] Referring to Figure 5 The waste gas treatment mechanism 7 includes a cylinder 701 arranged in a circular hole outside the drying cabinet 1, and equidistantly arranged with clamping beads 705 on the outside of the cylinder 701, which are clamped with the circular hole. The inside of the cylinder 701 is provided with a coarse filter plate 702, a precision filter plate 703 and a chemical adsorption filter plate 704 from inside to outside, respectively. The coarse filter plate 702 removes large particle impurities, the precision filter plate 703 intercepts small particles, and the chemical adsorption filter plate 704 adsorbs organic components and odors in volatile gases, ensuring that the waste gas emission meets environmental protection requirements.

[0031] Working principle: The drying equipment generates infrared radiation to heat the semiconductor wafer 10 on the placement disc 9 through the infrared heating pipe 11 arranged at the top of the drying cabinet 1. The infrared heating pipe 11 cooperates with the temperature sensor 12 at the top to monitor the surface temperature data of the wafer in real time and feedback to the control system for accurate adjustment to ensure uniform heating of the wafer surface. The cooperation of the sliding rail 8 and the sliding block enables the placement disc 9 to move smoothly during the heating process as needed, optimizing the uniformity of wafer heating and thus improving the drying quality. Because the fixed position of the infrared heating pipe 11 may cause uneven heating of the local area of the wafer surface, the movement of the placement disc 9 driven by the sliding rail 8 can make each area of the wafer in turn be in the best heating position, uniformly absorb heat energy, and avoid local overheating or overcooling. In addition, the design of movement disperses the heat energy range, reduces the risk of aging of the sliding block and placement disc due to long-term heating in local area, thereby prolonging the service life of the equipment and improving the overall drying efficiency.

[0032] The condenser 13 provides circulating cooling water through the connected water pump 19, and the cooling water is delivered from the water tank 18 to the condenser 13 for heat exchange to reduce the temperature of the gas. When the volatile gas generated during the drying process enters the condenser 13 through the exhaust pump two 21, the low-temperature cooling liquid in the condenser makes the solvent vapor in the gas condense into liquid and flow into the collection jug 17 through the liquid outlet of the condenser 13 to achieve solvent recovery. The cooling liquid flows back to the water tank 18 through the cooling liquid outlet of the condenser 13 after absorbing heat for recycling, thereby effectively reducing the pollution of solvent volatilization to the environment.

[0033] The residual part of the gas in the collection jug 17 enters the exhaust pump one 20 through the pipeline, and the exhaust pump one 20 further delivers the gas to the waste gas treatment mechanism 7 for purification treatment. The waste gas treatment mechanism 7 performs hierarchical filtration and purification on particulate matter and organic compounds in the volatile gas through the set coarse filter plate 702, precision filter plate 703 and chemical adsorption filter plate 704, thereby ensuring that the cleanliness of the discharged gas meets the environmental protection requirements and reducing the pollution of particulate matter to the equipment and external environment.

[0034] The vacuum pump 16 forms a low-pressure environment in the drying chamber by vacuumizing the area of the bottom plate 22 to accelerate the evaporation efficiency of the volatile solvent. The bottom plate 22 provides support for the wafer and cooperates with the sliding rail 8 to ensure that the wafer remains stable in the vacuum environment. The high-temperature residual heat generated in the chamber between the bottom plate 22 and the drying cabinet 1 is discharged through the rear heat dissipation hole 14 to maintain the stable operation of the equipment and prolong the service life of the equipment.

[0035] The operation button 4 at the front of the drying cabinet 1 is used to set the drying parameters, including temperature, time, vacuum degree, etc. The display screen 5 displays the running state and parameter adjustment of the equipment in real time. When the equipment operates abnormally, the alarm lamp 2 set externally will issue an audible and visual alarm to prompt the operator to handle it. The adjustable supporting legs 23 at the bottom of the drying cabinet 1 are used to adjust the stability of the equipment to ensure the stable work of the equipment in the installation site.

[0036] Finally, it should be noted that the above description is only a preferred embodiment of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or make equivalent substitutions for some technical features. Any modification, equivalent substitution, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A drying device of a semiconductor coating and developing module, comprising a drying cabinet (1), characterized in that: The inside of the drying cabinet (1) is provided with a bottom plate (22), the top of the bottom plate (22) is provided with a slide rail (8) at equal intervals, the top of the slide rail (8) is provided with a sliding block, and the top of the sliding block is provided with a placing disc (9), the top of the placing disc (9) is provided with a semiconductor wafer (10), the inner top wall of the drying cabinet (1) is provided with a plurality of infrared heating pipes (11) at equal intervals, and the infrared heating pipes (11) are provided with a plurality of temperature sensors (12) therebetween, and the front of the drying cabinet (1) is connected with a cabinet door one (3) and a cabinet door two (6) through hinges, and the inside of the drying cabinet (1) is provided with a collecting assembly and a processing assembly.

2. The drying device of a semiconductor coating and developing module according to claim 1, wherein: The collecting assembly comprises a condenser (13), the condenser (13) is arranged in the inside of the drying cabinet (1), the air inlet of the condenser (13) is connected with the output end of the exhaust pump two (21) through a plurality of pipelines, the output end of the exhaust pump two (21) is connected with the bottom plate (22) through a pipeline, and the exhaust pump two (21) is arranged at the lower part of the bottom plate (22), the liquid outlet of the condenser (13) is connected with the collecting kettle (17) through a pipeline, and the inner bottom wall of the drying cabinet (1) is provided with a water tank (18), the outer side of the water tank (18) is provided with a water pump (19), the input end of the water pump (19) is connected with the water tank (18) through a pipeline, the output end of the water pump (19) is connected with the cooling liquid inlet of the condenser (13) through a pipeline, and the cooling liquid outlet of the condenser (13) is connected with the water inlet of the water tank (18) through a pipeline.

3. The drying device of a semiconductor coating and developing module according to claim 1, wherein: The processing assembly comprises an exhaust pump one (20), the exhaust pump one (20) is arranged on the inner wall of the drying cabinet (1), the input end of the exhaust pump one (20) is communicated with the pipeline between the condenser (13) and the collecting kettle (17) through a connecting pipeline, and the output end of the exhaust pump one (20) is provided with a waste gas treatment mechanism (7).

4. The drying apparatus of a semiconductor coating and developing module according to claim 3, wherein: The waste gas treatment mechanism (7) comprises a cylinder (701), the cylinder (701) is arranged in a circular hole outside the drying cabinet (1), the outer side of the cylinder (701) is provided with a clamping bead (705) at equal intervals, and the clamping bead (705) is clamped with the circular hole, and the inside of the cylinder (701) is provided with a rough filter plate (702), a precision filter plate (703) and a chemical adsorption filter plate (704) from inside to outside.

5. The drying apparatus of a semiconductor coating and developing module according to claim 1, wherein: The inner wall of the drying cabinet (1) is provided with a mounting bracket (15), the top of the mounting bracket (15) is provided with a vacuum pump (16), the input end of the vacuum pump (16) is connected with the bottom plate (22) through a pipeline, and the rear of the drying cabinet (1) is provided with a heat dissipation hole (14).

6. The drying apparatus of a semiconductor coating and developing module according to claim 1, wherein: The front of the drying cabinet (1) is provided with a plurality of operation buttons (4) at equal intervals, the front of the drying cabinet (1) is provided with a display screen (5), and the outside of the drying cabinet (1) is provided with an alarm lamp (2).

7. The drying apparatus of a semiconductor coating and developing module according to claim 1, wherein: The bottom corners of the drying cabinet (1) are provided with adjustable supporting legs (23).

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