Automatic IC tray laser marking machine

Abstract

The utility model discloses an automatic IC tray laser marking machine, which relates to the technical field of automatic laser marking machines and comprises an IC tray, a support frame, an IC tray conveying mechanism and a laser marking mechanism. The IC tray is in sliding connection with the top of the support frame; the IC tray conveying mechanism is fixedly connected with the bottom of the IC tray and installed at the bottom of the supporting frame in a sliding mode. The laser marking mechanism is fixedly connected with the supporting frame and located on the top of the supporting frame. The supporting frame comprises a feeding area, a tray dividing area, a marking area and a tray collecting area. The feeding area, the disc dividing area, the marking area and the disc collecting area are sequentially arranged, and the marking area is close to the bottom of the laser marking mechanism. The panel dividing area is provided with first angle steel, a panel dividing clamping piece and a panel dividing jacking piece, and the first angle steel is fixedly installed at the four corners of the panel dividing area. The tray separating clamping piece is fixedly mounted on the outer side of the tray separating area; and the tray separating jacking piece is fixedly mounted on the inner side of the tray separating area. The beneficial effects of the utility model are that the marking efficiency is improved, and the user experience is optimized.

Description

TECHNICAL FIELD

[0001] The utility model relates to automatic laser marking machine technical field, more specifically, relate to a kind of automatic IC tray laser marking machine. BACKGROUND

[0002] Marking system is widely used in the surface marking of integrated circuit board in IC industry. According to different use requirements, there are two forms of material strip (combination chip) or chip (block granular chip) (hereinafter referred to as material, element) for integrated circuit board used in IC industry. The material strip is a plate material composed of several chips. When marking each chip on the material strip, automatic marking is realized by directly feeding the material strip. The chip is a small block granular material that must be placed in a track tray. Automatic marking of the chip is realized by feeding the track tray. Most of the currently used tray IC marking machines directly run from the feeding area to the marking area for marking. This method cannot realize the quick switching of marking finished products and marking raw materials due to the long running path, so the marking efficiency cannot be guaranteed.

[0003] Therefore, the utility model provides an automatic IC tray laser marking machine, which can realize the quick switching of marking finished products and marking raw materials in the marking area, thereby improving the marking efficiency and optimizing the user experience. UTILITY MODEL CONTENTS

[0004] In order to overcome the shortcomings of the prior art, the utility model provides an automatic IC tray laser marking machine, which can realize the quick switching of marking finished products and marking raw materials in the marking area, thereby improving the marking efficiency and optimizing the user experience.

[0005] The utility model solves the technical problems by adopting the following technical scheme: an automatic IC tray laser marking machine, which is improved in that the automatic IC tray laser marking machine comprises an IC tray, a support frame, an IC tray conveying mechanism and a laser marking mechanism; the IC tray is slidingly connected to the top of the support frame; the IC tray conveying mechanism is fixedly connected to the bottom of the IC tray and slidingly installed at the bottom of the support frame; the laser marking mechanism is fixedly connected to the support frame and located at the top of the support frame.

[0006] The support frame comprises a feeding area, a tray separating area, a marking area and a tray collecting area; the feeding area, the tray separating area, the marking area and the tray collecting area are arranged in sequence, and the marking area is close to the bottom of the laser marking mechanism.

[0007] The tray separating area is provided with a first angle steel, a tray separating clamping piece and a tray separating jacking piece; the first angle steel is fixedly installed at the four corners of the tray separating area; the tray separating clamping piece is fixedly installed at the outer side of the tray separating area; and the tray separating jacking piece is fixedly installed at the inner side of the tray separating area.

[0008] In the above structure, the sub-plate clamping piece comprises a transmission bearing, a guide shaft, a first driving motor and a sub-plate clamping jaw; the transmission bearing is fixedly installed on the outer side of the sub-plate area; the guide shaft is fixedly installed on the outer side of the sub-plate area and located on both sides of the transmission bearing; the driving shaft of the first driving motor is in transmission connection with the transmission bearing; the sub-plate clamping jaw is fixedly connected with the driving shaft of the first driving motor and in sliding connection with the guide shaft.

[0009] In the above structure, the sub-plate area is provided with a second angle steel, a sub-plate clamping piece and a sub-plate jacking piece; the second angle steel is fixedly installed on the four corners of the sub-plate area; the sub-plate clamping piece is fixedly installed on the outer side of the sub-plate area and close to the second angle steel; the sub-plate jacking piece is fixedly installed on the inner side of the sub-plate area.

[0010] In the above structure, the first angle steel and the second angle steel are both provided with a reserved hole close to the position of the support frame, and the width of the reserved hole is slightly larger than the thickness of the IC tray.

[0011] In the above structure, the sub-plate clamping piece comprises a clamping piece fixed block and a clamping piece movable block; the clamping piece fixed block is fixedly connected with the outer side of the sub-plate area and close to the second angle steel; the clamping piece movable block is in rotational connection with the clamping piece fixed block.

[0012] In the above structure, the clamping piece fixed block is provided with a mounting hole; the clamping piece movable block is rotatably installed in the mounting hole.

[0013] In the above structure, the sub-plate clamping piece further comprises a rotating shaft; the rotating shaft passes through the clamping piece movable block and is inserted into both sides of the mounting hole.

[0014] In the above structure, the laser marking mechanism comprises a connecting arm and a laser marking device; one side of the connecting arm is fixedly connected with the side of the first angle steel close to the marking area, and the other side of the connecting arm is in sliding connection with the laser marking device.

[0015] In the above structure, the laser marking mechanism further comprises a mounting shell, a second driving motor, a first transmission wheel, a first transmission shaft, a second transmission wheel, a first conveying belt, a second transmission shaft and a second conveying belt; the mounting shell is fixedly installed on the top of the connecting arm and close to the end of the connecting arm; the driving shaft of the second driving motor passes through the top of the mounting shell and is fixedly connected with the first transmission wheel; the first transmission shaft is inserted into one end of the connecting arm close to the second driving motor, and the top of the first transmission shaft is fixedly connected with the second transmission wheel; the first conveying belt is wound between the first transmission wheel and the second transmission wheel; the second transmission shaft is inserted into the other end of the connecting arm away from the second driving motor, and the side of the connecting arm close to the laser marking device is provided with a mounting groove; the second conveying belt is wound between the first transmission shaft and the second transmission shaft.

[0016] In the above structure, the laser marking device comprises a laser marking device body and a connecting block; one end of the connecting block is fixedly connected with the laser marking device body, the other end is fixedly connected with the second conveying belt, and the connecting block is located in the mounting groove at one end of the laser marking device.

[0017] The utility model discloses the beneficial effect is: the utility model discloses through setting up the disc area between the loading area and the marking area, and the disc area can stack and store the IC tray of marking raw material through the mutual cooperation between first angle steel, disc clamping piece and disc jacking piece, and the disc area is close to one side of the marking area, so that IC tray conveying mechanism can quickly run the IC tray of disc area to the marking area, in addition, the marking area is close to the other side of the marking area, so that IC tray conveying mechanism can quickly run the IC tray of standard completion to the collection disc area storage, therefore, the utility model discloses can realize the quick switching of marking finished product and marking raw material in the marking area, thereby improve the marking efficiency, optimize user experience. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is the overall structure diagram of an automatic IC tray laser marking machine of the utility model Figure One ;

[0019] Figure 2 It is the overall structure diagram of an automatic IC tray laser marking machine of the utility model Figure Two ;

[0020] Figure 3 It is the structure diagram of disc clamping piece of an automatic IC tray laser marking machine of the utility model;

[0021] Figure 4 It is the structure diagram of disc collection piece of an automatic IC tray laser marking machine of the utility model;

[0022] Figure 5 It is the structure diagram of laser marking mechanism of an automatic IC tray laser marking machine of the utility model.

[0023] Figure 6 It is the transmission structure diagram inside connecting arm of an automatic IC tray laser marking machine of the utility model. DETAILED DESCRIPTION

[0024] The utility model is further explained below in connection with the drawings and examples.

[0025] The concept, specific structure and generated technical effects of the present application will be clearly and completely described in combination with the embodiments and drawings, so as to fully understand the purposes, features and effects of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments of the present application, other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application. In addition, all the connection / connection relationships involved in the patent do not mean that the components are directly connected, but that a better connection structure can be composed by adding or reducing connection auxiliary parts according to the specific implementation situation. The various technical features in the present application can be interactively combined without mutual contradiction and conflict.

[0026] Referring to Figure 1 and Figure 2 The utility model discloses an automatic IC tray laser marking machine, the automatic IC tray laser marking machine includes IC tray 4, support frame 1, IC tray conveying mechanism 2 and laser marking mechanism 3, IC tray 4 and the top sliding connection of support frame 1, IC tray conveying mechanism 2 and the bottom fixed connection of IC tray 4, and sliding installation is in the bottom of support frame 1, laser marking mechanism 3 and support frame 1 fixed connection, and located in the top of support frame 1, the support frame 1 includes loading area, divides the tray area, marks the area and collects the tray area, the position of loading area, divides the tray area, marks the area and collects the tray area and arranges in proper order, and the marking area is close to the bottom of laser marking mechanism 3, the tray area is provided with first angle steel 5, divides the tray clamping piece 6 and divides the tray jacking piece 9, first angle steel 5 fixed mounting is in the four corners of tray area, divides the tray clamping piece 6 fixed mounting is in the outside of tray area, divides the tray jacking piece 9 fixed mounting is in the inside of tray area.

[0027] It should be noted that in the embodiment, the IC tray 4 serves as a carrier of IC chips, the IC chips are loaded in the IC tray 4 in an array; the support frame 1 is used to provide mechanical support and mounting structure for the IC tray 4, the IC tray conveying mechanism 2 and the laser marking mechanism 3, specifically, the support frame 1 comprises a feeding area, a tray separating area, a marking area and a tray collecting area; the feeding area serves as a feeding area of the IC tray 4, is used to feed the IC tray 4 to the support frame 1 and convey the fed IC tray 4 to the tray separating area; the tray separating area serves as a storage area of the IC tray 4, is used to stack the IC tray 4 loaded with the IC chips to be marked, so as to quickly convey the IC tray 4 to the marking area; the marking area serves as a marking area of the IC chips in the IC tray 4, is used to mark the IC chips in the IC tray 4, and convey the marked IC chips to the tray collecting area; the tray collecting area serves as a tray collecting area of the IC tray 4, is used to collect the IC chips in the IC tray 4 which are marked; the IC tray conveying mechanism 2 serves as a power mechanism for conveying the IC tray 4, is used to push the IC tray 4 from the tray separating area to the tray separating area, the marking area and the tray collecting area in sequence; further, the tray separating area is provided with a first angle steel 5, a tray separating clamping piece 6 and a tray separating jacking piece 9, wherein the first angle steel 5, the tray separating clamping piece 6 and the tray separating jacking piece 9 are used to cooperate with the IC tray conveying mechanism 2 to stack and store the fed IC tray 4 in the tray separating area.In the implementation of the utility model, the automatic IC tray laser marking machine first pushes the IC tray 4 from the feeding area to the tray stacking area by the IC tray conveying mechanism 2, then pushes the IC tray 4 to the marking area by the IC tray conveying mechanism 2 and marks by the laser marking device, and finally pushes the marked IC tray 4 to the tray collecting area by the IC tray conveying mechanism 2 for stacking, so as to complete the feeding, tray stacking, marking and tray collecting of the IC tray 4. Further, in the process of stacking the IC tray 4 in the tray stacking area, first, the tray stacking area lifts the existing IC tray 4 in the tray stacking area by the tray lifting piece 9 and stacks the IC tray 4 at the bottom of the tray clamping piece 6, then the IC tray conveying mechanism 2 pushes the IC tray 4 in the feeding area to the tray stacking area and stacks it at the bottom of the existing IC tray 4 in the tray stacking area, when the IC tray 4 is stacked again, the tray clamping piece releases the tray, the tray lifting piece 9 lifts the existing IC tray 4 in the tray stacking area again and clamps the bottom of the stacked IC tray 4 again by the tray clamping piece, then the IC tray conveying mechanism 2 pushes the IC tray 4 in the feeding area to the tray stacking area again, until all the IC trays 4 to be marked are transported to the tray stacking area. In the process of marking the IC tray 4 in the marking area, first, the tray clamping piece clamps the bottom of the second last tray; then the IC tray conveying mechanism 2 pushes the tray at the bottom to the marking area and marks the IC chip in the IC tray 4 by the laser marking mechanism 3, after marking is completed, the IC tray conveying mechanism 2 pushes the marked IC tray 4 to the tray collecting area; then the IC tray conveying mechanism 2 returns to the tray stacking area again, and cooperates with the tray clamping piece and the tray lifting piece 9 to push another IC tray 4 to the marking area for marking and to the tray collecting area for tray collecting, through the above steps until the marking and tray collecting of all the stacked IC trays 4 in the tray stacking area are completed. In the above process, the automatic IC tray laser marking machine sets the tray stacking area between the feeding area and the marking area, the tray stacking area can stack and store the IC tray 4 to be marked through the cooperation between the first angle steel 5, the tray clamping piece 6 and the tray lifting piece 9; and the tray stacking area is close to one side of the marking area, so that the IC tray conveying mechanism 2 can quickly transport the IC tray 4 in the tray stacking area to the marking area, in addition, the marking area is close to the other side of the marking area, so that the IC tray conveying mechanism 2 can quickly transport the marked IC tray 4 to the tray collecting area for storage, therefore, the embodiment can realize the quick switching of the marked product and the marking raw material in the marking area, thereby improving the marking efficiency and optimizing the user experience.

[0028] Reference Figure 3As shown in the drawings, the disc clamping piece 6 comprises a transmission bearing 604, a guide shaft 603, a first driving motor 601 and a disc clamping jaw 602; the transmission bearing 604 is fixedly installed on the outside of the disc area; the guide shaft 603 is fixedly installed on the outside of the disc area and is located on both sides of the transmission bearing 604; the driving shaft of the first driving motor 601 is in transmission connection with the transmission bearing 604; the disc clamping jaw 602 is fixedly connected with the driving shaft of the first driving motor 601 and is in sliding connection with the guide shaft 603.

[0029] It should be noted that in the embodiment, the disc clamping piece 6 is designed to clamp or release the IC tray 4 stacked in the disc area so as to cooperate with the IC tray conveying mechanism 2 to transport the IC tray 4 stacked in the disc area to the marking area for marking; specifically, the disc clamping piece 6 comprises a transmission bearing 604, a guide shaft 603, a first driving motor 601 and a disc clamping jaw 602, wherein the first driving motor 601 is used to provide power; the transmission bearing 604 is used to transmit the power provided by the first driving motor 601 and drive the disc clamping jaw 602 to move towards or away from the disc area; the disc clamping jaw 602 is used to clamp or release the IC tray 4 stacked in the disc area by following the movement of the transmission bearing 604; and the guide shaft 603 is used to guide the movement direction of the disc clamping jaw 602. When the first driving motor 601 is started in the implementation of the utility model, the driving shaft starts to rotate, the transmission bearing 604 receives the power transmitted by the motor, the transmission bearing 604 converts the movement mode of the driving shaft of the first driving motor 601 into linear movement in the horizontal direction, drives the disc clamping jaw 602 to move, and guides the movement through the guide shaft 603, so as to clamp or release the IC tray 4 stacked in the disc area.

[0030] Referring to Figure 1 and Figure 2 As shown in the drawings, the disc collecting area is provided with a second angle steel 8, a disc collecting clamp 7 and a disc collecting jacking piece 10; the second angle steel 8 is fixedly installed on the four corners of the disc collecting area; the disc collecting clamp 7 is fixedly installed on the outside of the disc collecting area and is close to the second angle steel 8; and the disc collecting jacking piece 10 is fixedly installed on the inside of the disc collecting area.

[0031] It should be noted that in the embodiment, the second angle steel 8, the disc collecting clamp 7 and the disc collecting jacking piece 10 are designed to cooperate with the IC tray conveying mechanism 2 to collect the IC tray 4 after marking; specifically, referring to Figure 4As shown, the tray clamping member 7 comprises a clamping fixed block 701, a clamping movable block 702 and a rotating shaft 704; the clamping fixed block 701 is fixedly connected with the outer side of the tray area and is close to the second angle steel 8; the clamping movable block 702 is rotationally connected with the clamping fixed block 701; the clamping fixed block 701 is provided with a mounting hole 703; the clamping movable block 702 is rotationally mounted in the mounting hole 703; the rotating shaft 704 passes through the clamping movable block 702 and is inserted into the two sides of the mounting hole 703; the clamping fixed block 701, the clamping movable block 702 and the rotating shaft 704 are designed to cooperate with the angle steel to fixedly support and stack the IC tray 4 in the tray area.

[0032] The first angle steel 5 and the second angle steel 8 are provided with a reserved hole near the position of the support frame 1, and the width of the reserved hole is slightly greater than the thickness of the IC tray 4.

[0033] It should be noted that in the present embodiment, the design of the reserved hole is to ensure that the IC tray 4 can smoothly enter the tray area, the marking area and the tray area during the pushing process.

[0034] Referring to Figure 5 and Figure 6 As shown, the laser marking mechanism 3 comprises a connecting arm 302, a laser marking device 301, a mounting shell 304, a second driving motor 303, a first transmission wheel 305, a first transmission shaft 309, a second transmission wheel 306, a first conveying belt 307, a second transmission shaft 310 and a second conveying belt 308; one side of the connecting arm 302 is fixedly connected with the side of the first angle steel 5 close to the marking area, and the other side of the connecting arm 302 is slidingly connected with the laser marking device 301; the mounting shell 304 is fixedly mounted on the top of the connecting arm 302 and is close to the end of the connecting arm 302; the driving shaft of the second driving motor 303 passes through the top of the mounting shell 304 and is fixedly connected with the first transmission wheel 305; the first transmission shaft 309 passes through one end of the connecting arm 302 close to the second driving motor 303, and the top of the first transmission shaft 309 is fixedly connected with the second transmission wheel 306; the first conveying belt 307 is wound between the first transmission wheel 305 and the second transmission wheel 306; the second transmission shaft 310 passes through the other end of the connecting arm 302 away from the second driving motor 303, and one side of the connecting arm 302 close to the laser marking device 301 is provided with a mounting groove; the second conveying belt 308 is wound between the first transmission shaft 309 and the second transmission shaft 310; the laser marking device 301 comprises a laser marking device 301 body and a connecting block; one end of the connecting block is fixedly connected with the laser marking device 301 body, and the other end is fixedly connected with the second conveying belt 308, and one end of the connecting block and the laser marking device 301 are located in the mounting groove.

[0035] It should be noted that in the embodiment, the connecting arm 302 is used to provide mechanical support and mounting structure for the laser marking device 301; the laser marking device 301 is used to perform laser marking on IC chips in the IC tray 4; the mounting shell 304 is used to provide mechanical support and mounting structure for the second driving motor 303; the second driving motor 303 is designed to provide power for adjusting the position of the laser marking device 301; the first transmission wheel 305, the first transmission shaft 309, the second transmission wheel 306, the first conveying belt 307, the second transmission shaft 310 and the second conveying belt 308 are used to transmit power for adjusting the position of the laser marking device 301; when the utility model is implemented, when the second driving motor 303 is started, the driving shaft drives the first transmission wheel 305 to rotate, the first conveying belt 307 drives the second transmission wheel 306 to rotate, and then the first transmission shaft 309 is driven to rotate; since the first transmission shaft 309 and the second transmission shaft 310 are connected through the second conveying belt 308, when the first transmission shaft 309 is driven, the first transmission shaft 309 drives the second transmission shaft 310 to rotate through the second conveying belt 308; in addition, since the laser marking device 301 includes the laser marking device 301 body and the connecting block, when the connecting block is fixedly installed between the second conveying belt 308 and the laser marking device 301 body, when the second conveying belt 308 moves with the first transmission shaft 309, the connecting block and the laser marking device 301 body also move along the mounting groove, so that the position of the laser marking device 301 is adjusted and the laser marking precision is optimized.

[0036] The above is a specific description of the preferred embodiment of the utility model, but the utility model is not limited to the described embodiment, and those skilled in the art can make various equivalent modifications or replacements without departing from the spirit of the utility model, and these equivalent modifications or replacements are all included in the range defined by the claims of the present application.

Claims

1. An automated IC tray laser marking machine characterized by, The automatic IC tray laser marking machine comprises an IC tray, a support frame, an IC tray conveying mechanism and a laser marking mechanism; the IC tray is slidably connected to the top of the support frame; the IC tray conveying mechanism is fixedly connected to the bottom of the IC tray and slidably installed at the bottom of the support frame; the laser marking mechanism is fixedly connected to the support frame and located at the top of the support frame. The support frame comprises a feeding area, a tray separating area, a marking area and a tray collecting area; the feeding area, the tray separating area, the marking area and the tray collecting area are arranged in sequence, and the marking area is close to the bottom of the laser marking mechanism. The tray separating area is provided with a first angle steel, a tray separating clamping piece and a tray separating jacking piece; the first angle steel is fixedly installed at the four corners of the tray separating area; the tray separating clamping piece is fixedly installed at the outer side of the tray separating area; and the tray separating jacking piece is fixedly installed at the inner side of the tray separating area.

2. An automated IC tray laser marking machine according to claim 1, wherein, The tray separating clamping piece comprises a transmission bearing, a guide shaft, a first driving motor and a tray separating clamping jaw; the transmission bearing is fixedly installed at the outer side of the tray separating area; the guide shaft is fixedly installed at the outer side of the tray separating area and located at the two sides of the transmission bearing; the driving shaft of the first driving motor is in transmission connection with the transmission bearing; and the tray separating clamping jaw is fixedly connected with the driving shaft of the first driving motor and slidably connected with the guide shaft.

3. An automated IC tray laser marking machine according to claim 2, wherein, The tray collecting area is provided with a second angle steel, a tray collecting clamping piece and a tray collecting jacking piece; the second angle steel is fixedly installed at the four corners of the tray collecting area; the tray collecting clamping piece is fixedly installed at the outer side of the tray collecting area and close to the second angle steel; and the tray collecting jacking piece is fixedly installed at the inner side of the tray collecting area.

4. An automated IC tray laser marking machine according to claim 3, wherein, The first angle steel and the second angle steel close to the support frame are provided with a reserved hole, and the width of the reserved hole is slightly greater than the thickness of the IC tray.

5. An automated IC tray laser marking machine according to claim 3, wherein, The tray collecting clamping piece comprises a clamping piece fixed block and a clamping piece movable block; the clamping piece fixed block is fixedly connected with the outer side of the tray collecting area and close to the second angle steel; and the clamping piece movable block is rotationally connected with the clamping piece fixed block.

6. An automated IC tray laser marking machine according to claim 5, wherein, The clamping piece fixed block is provided with a mounting hole; and the clamping piece movable block is rotationally installed in the mounting hole.

7. An automated IC tray laser marking machine according to claim 6, wherein, The tray collecting clamping piece further comprises a rotating shaft; the rotating shaft penetrates through the clamping piece movable block and is inserted into the two sides of the mounting hole.

8. An automated IC tray laser marking machine according to claim 1, wherein, The laser marking mechanism comprises a connecting arm and a laser marking device; one side of the connecting arm is fixedly connected with the side of the first angle steel close to the marking area, and the other side of the connecting arm is slidably connected with the laser marking device.

9. An automated IC tray laser marking machine according to claim 8, wherein, The laser marking mechanism further comprises a mounting shell, a second driving motor, a first transmission wheel, a first transmission shaft, a second transmission wheel, a first conveying belt, a second transmission shaft and a second conveying belt; the mounting shell is fixedly installed on the top of the connecting arm and close to the end of the connecting arm; the driving shaft of the second driving motor penetrates through the top of the mounting shell and is fixedly connected with the first transmission wheel; the first transmission shaft is arranged on the end of the connecting arm close to the second driving motor, and the top of the first transmission shaft is fixedly connected with the second transmission wheel; the first conveying belt is wound between the first transmission wheel and the second transmission wheel; the second transmission shaft is arranged on the end of the connecting arm away from the second driving motor, and the side of the connecting arm close to the laser marking device is provided with a mounting groove; and the second conveying belt is wound between the first transmission shaft and the second transmission shaft.

10. An automated IC tray laser marking machine according to claim 9, wherein, The laser marking device comprises a laser marking device body and a connecting block; one end of the connecting block is fixedly connected with the laser marking device body, the other end is fixedly connected with the second conveying belt, and one end of the connecting block and the laser marking device is located in the mounting groove.

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