Grinding fluid conveying mechanism and grinding equipment

Abstract

The utility model provides a grinding fluid conveying mechanism and grinding equipment. The grinding fluid conveying mechanism is arranged above the grinding pad and is provided with a fixed end and a free end opposite to the fixed end; a spraying head is arranged at the free end of the grinding fluid conveying mechanism, and a plurality of spraying holes are formed in one side of the spraying head and used for spraying grinding fluid to the surface of the grinding pad. Wherein the plurality of spray holes are arranged in an array. According to the grinding fluid conveying mechanism, grinding fluid falling points in a larger range can be achieved, the grinding fluid can be distributed more evenly, the grinding rate is more stable, the grinding flatness is improved, the requirement for the grinding rate can be met on the premise of low flow, and the grinding fluid cost is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, in particular to a polishing liquid delivery mechanism and a polishing device. BACKGROUND

[0002] In modern mechanical polishing processes, polishing devices play a crucial role. As a key component of polishing devices, the structure and performance of polishing liquid delivery arms directly affect the quality of polishing products.

[0003] During the polishing process, the polishing liquid is sprayed onto the polishing pad by the polishing liquid delivery arm in a single point or a straight line, and then polished by the trimmer through back-and-forth swinging, so as to uniformly distribute the polishing liquid on the polishing pad.

[0004] However, the polishing process has very high requirements for the uniformity of the polishing liquid spray. Once the spray is not uniform, it will seriously affect the polishing rate and flatness, resulting in a significant decrease in polishing quality, which is difficult to meet the needs of high-precision polishing processes.

[0005] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the present application, and therefore can include information that does not constitute prior art known to those of ordinary skill in the art. CONTENT OF THE INVENTION

[0006] Therefore, the present application provides a polishing liquid delivery mechanism and a polishing device, which can realize a larger range of polishing liquid drop points, make the polishing liquid more uniformly distributed, and thus make the polishing rate more stable, improve the polishing flatness, meet the requirements of the polishing rate under the premise of low flow, and reduce the cost of the polishing liquid.

[0007] According to some embodiments, the present application provides a polishing liquid delivery mechanism arranged above a polishing pad, the polishing liquid delivery mechanism having a fixed end and a free end opposite to the fixed end;

[0008] The free end of the polishing liquid delivery mechanism is provided with a spray head, one side of the spray head is provided with a plurality of spray holes for spraying the polishing liquid to the surface of the polishing pad.

[0009] Among them, a plurality of spray holes are arranged in an array.

[0010] In some embodiments, a plurality of spray holes are arranged in a first direction and alternately staggered in a second direction, and the first direction intersects the second direction.

[0011] In some embodiments, the spray holes are inclined relative to the surface of the polishing pad.

[0012] In some embodiments, in a first direction from the fixed end to the free end, the plurality of the spray holes are arranged in M columns;

[0013] In a second direction intersecting the first direction, the plurality of the spray holes are arranged in N rows;

[0014] wherein M and N are positive integers, and M is greater than or equal to N.

[0015] In some embodiments, the diameter of the spray hole is greater than or equal to 0.8 mm; and / or, the distance between any two spray holes is less than or equal to 10 mm.

[0016] In some embodiments, the spray hole has an inclination angle with respect to the surface of the polishing pad ranging from 30° to 60°.

[0017] In some embodiments, in the direction from the fixed end to the free end, the fixed end of the polishing liquid delivery mechanism is movably connected to a base.

[0018] According to some embodiments, another aspect of the present application also provides a polishing device, comprising:

[0019] a polishing pad;

[0020] the polishing liquid delivery mechanism provided in the foregoing embodiments, disposed above the polishing pad, wherein a plurality of spray holes are arranged on the side of the spray head of the polishing liquid delivery mechanism facing the polishing pad.

[0021] In some embodiments, the center of the polishing pad is located in the direction from the fixed end to the free end of the polishing liquid delivery mechanism.

[0022] In some embodiments, the distance between the fixed end and the free end of the polishing liquid delivery mechanism is at least 3 / 4 of the radius of the polishing pad.

[0023] The polishing liquid delivery mechanism and the polishing device provided by the present application can / at least have the following advantages:

[0024] The present application provides a polishing liquid delivery mechanism and a polishing device, which can / at least have the following advantages:

[0025] Therefore, the distribution of the polishing liquid on the polishing pad is uniform, so that the polishing rate of each area during the polishing process is more stable, and it also helps to avoid quality problems such as uneven surface of the workpiece caused by uneven polishing rate, and improves the polishing flatness.

[0026] Meanwhile, the uniform distribution of the polishing liquid can also improve the utilization rate of the polishing liquid, and the polishing rate requirement can be met even under the condition of low flow rate, thereby reducing the cost of the polishing liquid.

[0027] Additional advantages, objects, and features of the application will be set forth in part by the description that follows, and in part will become apparent to those skilled in the art upon examination of the following specification or can be learned by practice of the application. The objects and other advantages of the application can be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings. BRIEF DESCRIPTION OF DRAWINGS

[0028] Other features, objects, and advantages of the application will become apparent from the detailed description of non-limiting embodiments set forth below.

[0029] Figure 1 is a top view of a polishing pad and a polishing liquid delivery mechanism according to some embodiments of the application;

[0030] Figure 2 is a side view of a polishing liquid delivery mechanism according to some embodiments of the application;

[0031] Figure 3 is a top view of a polishing liquid delivery mechanism according to some embodiments of the application;

[0032] Figure 4 is a distribution of spray holes on a spray head in a polishing liquid delivery mechanism according to some embodiments of the application;

[0033] Figure 5 is a partial enlarged view of a spray hole in a polishing liquid delivery mechanism according to some embodiments of the application;

[0034] Figure 6 is a cross-sectional view of a spray head in a polishing liquid delivery mechanism according to some embodiments of the application;

[0035] Figure 7 is a side view of a polishing liquid delivery mechanism according to some other embodiments of the application;

[0036] Figure 8 is a top view of a polishing pad in a polishing apparatus according to some embodiments of the application.

[0037] REFERENCE NUMERALS:

[0038] 10 polishing liquid delivery mechanism

[0039] 10A fixed end 10B free end

[0040] 101 spray head 101a spray hole

[0041] 102 base 103 screw

[0042] 20 polishing pad DETAILED DESCRIPTION

[0043] For the purposes of this application, a more complete description of the application will be presented in the following detailed description of the application. The preferred embodiments of the application are illustrated in the attached drawings. However, the application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0045] Although the terms "upper," "between," and the like can be used in the present specification to describe different example features and elements of the application, these terms are used in this document for convenience and are not intended to limit the application to any particular direction or orientation. Nothing in this specification should be construed as requiring a specific three-dimensional orientation of structures in order to fall within the scope of the application. Moreover, the drawings provided in the present embodiments are only schematic and are non-limiting, various aspects of the disclosure will be described with reference to a few preferred embodiments. However, a person of ordinary skill in the art will readily recognize that the various teachings herein can be applied in a multitude of different embodiments. Accordingly, the descriptions and examples are not meant to limit the scope of the present disclosure.

[0046] As used herein, the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. It should also be appreciated that the use of the term "comprising" or "comprises" as used herein is intended to mean that the mentioned features are present, but not excluding the presence of one or more other features, integers, elements, components or groups. Also, as used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0047] In the polishing process, the polishing liquid is presented on the polishing pad by the polishing liquid delivery arm in a drop or in a straight line, and then polished by the trimmer by swinging back and forth, so that the polishing liquid is evenly distributed on the polishing pad.

[0048] The polishing mode of the conditioner mainly includes two types, namely, IN SITU (the conditioner polishes while the polishing liquid flows) and EX SITU (the conditioner polishes before the polishing liquid flows, and stops polishing when the polishing liquid flows).

[0049] However, the spraying uniformity of the polishing liquid is required to be extremely high in the polishing process (especially in the EX SITU polishing mode), and once the spraying is not uniform, the polishing rate and flatness will be seriously affected, the polishing quality will be greatly reduced, and the demand of high-precision polishing process cannot be met.

[0050] In view of the above deficiencies, the present application provides a polishing liquid conveying mechanism and a polishing device, which can realize a larger range of polishing liquid landing points, make the polishing liquid more uniformly distributed, thereby making the polishing rate more stable, improving the polishing flatness, and meeting the requirement of the polishing rate under the premise of low flow, thereby reducing the cost of the polishing liquid. The detailed content will be described in the subsequent embodiments.

[0051] According to some embodiments, the present application provides a polishing liquid conveying mechanism. Please refer to Figure 1 The polishing liquid conveying mechanism 10 can be arranged above the polishing pad 20. As shown in Figure 2 The polishing liquid conveying mechanism 10 has a fixed end 10A and a free end 10B opposite to the fixed end 10A.

[0052] As shown in Figure 3 The free end 10B of the polishing liquid conveying mechanism 10 is provided with a spray head 101, and as shown in Figure 4 One side of the spray head 101 is provided with a plurality of spray holes 101a for spraying the polishing liquid to the surface of the polishing pad 20. The plurality of spray holes 101a are arranged in an array.

[0053] The polishing liquid conveying mechanism 10 is provided with the spray head 101 at the free end 10B, and the plurality of spray holes 101a arranged in an array are arranged at one side of the spray head 101, so that the number of spraying points of the polishing liquid is increased and the distribution is regular. Compared with the traditional layout of a single landing point of the polishing liquid, the plurality of spray holes 101a arranged in an array can ensure that the coverage range of the polishing liquid on the polishing pad 20 is wider and more uniform, and a larger range of polishing liquid landing points is realized.

[0054] Therefore, the polishing liquid is uniformly distributed in each area of the polishing pad 20, so that the polishing rate of each area in the polishing process is more stable, and it is also helpful to avoid quality problems such as uneven surface of the workpiece caused by uneven polishing rate, and to improve the polishing flatness.

[0055] In the conventional polishing process, due to uneven distribution of the polishing liquid, the supply amount of the polishing liquid often needs to be increased to ensure the polishing effect, thereby causing waste of the polishing liquid. Therefore, the polishing liquid conveying mechanism 10 can improve the utilization rate of the polishing liquid through uniform distribution of the polishing liquid, can meet the requirement of the polishing rate even under the premise of low flow, and thereby reduces the cost of the polishing liquid.

[0056] In some embodiments, the plurality of spray holes 101a are sequentially arranged along a first direction and alternately staggered arranged along a second direction. The first direction intersects the second direction. Hereinafter, the first direction is taken as an example for illustration, and the second direction is taken as an example for illustration. Figure 4 The X direction shown in the figure, and the Y direction shown in the figure. Figure 4 The X direction shown in the figure, and the Y direction shown in the figure.

[0057] In the above embodiment, the spray holes 101a are arranged in an alternating staggered manner, and the polishing liquid can interweave and supplement after being sprayed. Each row of spray holes 101a is staggered with the adjacent row of spray holes 101a, thereby filling the blank area between the adjacent spray holes 101a, which is beneficial to uniformly spray the polishing liquid on the surface of the polishing pad 20, and further improves the uniformity of the polishing liquid on the polishing pad 20.

[0058] Please understand that, as an example, the first direction can be the direction in which the fixed end 10A points to the free end 10B, and the second direction intersects the first direction. Figure 2 Figure 4 As an example, in the first direction, the plurality of spray holes 101a are arranged in M columns; in the second direction, the plurality of spray holes 101a are arranged in N rows; M and N are both positive integers. As shown in the figure, M is 6, and N is 4, that is, the plurality of spray holes 101a are arranged in an array of 6 columns by 4 rows.

[0059] Figure 4 In some embodiments, M is greater than or equal to N, that is, more spray holes 101a are arranged along the extension direction (the first direction) of the polishing liquid conveying mechanism 10, so that the polishing liquid can be sprayed in multiple points and dispersed in this direction. Since the number of spray holes is more reasonably arranged according to the extension direction of the polishing liquid conveying mechanism 10, the coverage range of the polishing liquid in this direction is further expanded, so that the polishing liquid is distributed to the surface of the polishing pad 20 in a more uniform manner.

[0060] The size of the polishing liquid conveying mechanism 10 is not specifically limited in the embodiments of the present application. As an example, the length L of the polishing liquid conveying mechanism 10 in the first direction (for example, the X direction) ranges from 60 mm to 80 mm, for example, the length L can be 60 mm, 65 mm, 70 mm, 75 mm or 80 mm, and the like.

[0061] As an example, the length L of the polishing liquid conveying mechanism 10 in the first direction (for example, the X direction) ranges from 60 mm to 80 mm, for example, the length L can be 60 mm, 65 mm, 70 mm, 75 mm or 80 mm, and the like.

[0062] As an example, the length L of the polishing liquid conveying mechanism 10 in the first direction (for example, the X direction) ranges from 60 mm to 80 mm, for example, the length L can be 60 mm, 65 mm, 70 mm, 75 mm or 80 mm, and the like. Figure 4 ​As shown, a plurality of spray holes 101a are provided on one side of the spray head 101 for spraying polishing liquid onto the surface of the polishing pad 20. The plurality of spray holes 101a are arranged in an array.

[0063] like Figure 4 As shown, the distance d between any two nozzles 101a is less than or equal to 10 mm.

[0064] Please see Figure 5 In some embodiments, the diameter d1 of the nozzle 101a is greater than or equal to 0.8 mm.

[0065] Please see Figure 6 In some embodiments, the nozzle 101a is inclined relative to the surface of the abrasive pad 20.

[0066] The angled nozzle 101a allows the polishing slurry to land closer to the center of the polishing pad 20 without contacting the polishing head, resulting in more precise slurry supply and better meeting the polishing process's requirements for slurry positioning. Furthermore, the angled nozzle 101a ensures a more uniform distribution of the polishing slurry on the polishing pad 20. After being sprayed from the angled nozzle 101a, the slurry can more evenly cover the polishing area on the polishing pad 20, further improving polishing quality and preventing polishing defects caused by uneven slurry distribution.

[0067] The embodiments of this application do not specifically limit the tilt angle of the nozzle 101a relative to the surface of the abrasive pad 20. As an example, the tilt angle range of the nozzle 101a relative to the surface of the abrasive pad 20 may include 30° to 60°, such as 30°, 40°, 45°, 50° or 60°, etc.

[0068] For example Figure 6 The nozzle 101a shown is tilted at an angle of 45° relative to the surface of the polishing pad 20. The 45° tilt angle allows the polishing slurry to have a larger spray distance on the polishing pad 20, which helps to form a more uniform distribution of polishing slurry and ensures that the polishing slurry can fully cover the polishing area.

[0069] Please see Figure 7 In some embodiments, the fixed end 10A of the grinding fluid delivery mechanism 10 is movably connected to the base 102 in the direction from the fixed end 10A to the free end 10B.

[0070] In the above embodiment, the polishing liquid delivery mechanism 10 is movable in the front-rear direction, for example, the polishing liquid delivery mechanism 10 is moved forward to the position shown by the dotted line. By adjusting the position of the polishing liquid delivery mechanism 10, the range of the polishing liquid drop position can be accurately determined, which is beneficial to meet different polishing process requirements, for example, according to different workpiece sizes, shapes and / or polishing requirements, the polishing liquid is supplied at different positions on the polishing pad 20.

[0071] The design of the movable connection also enhances the flexibility and adaptability of the polishing liquid delivery mechanism 10. When facing different polishing process requirements, the entire polishing liquid delivery mechanism 10 does not need to be complicatedly modified or replaced, but only needs to be simply adjusted to meet the new process requirements, which helps to save equipment costs.

[0072] For example, as shown in Figure 7 , the polishing liquid delivery mechanism 10 can be movably connected to the base 102 by a screw 103. When the polishing liquid delivery mechanism 10 needs to be adjusted, it is convenient and fast to operate.

[0073] For example, the screw 103 can be loosened to move the polishing liquid delivery mechanism 10 forward and backward for adjustment. After adjustment is completed, the screw 103 is fixed again to restore normal use.

[0074] According to some embodiments, another aspect of the present application also provides a polishing device. Please continue to refer to Figure 1 , the polishing device comprises the polishing pad 20 and the polishing liquid delivery mechanism 10 provided in the above embodiment.

[0075] The polishing liquid delivery mechanism 10 is arranged above the polishing pad 20, wherein a plurality of spray holes 101a are arranged on the side of the spray head 101 of the polishing liquid delivery mechanism 10 facing the polishing pad 20.

[0076] The polishing device in the embodiment of the present application comprises the polishing liquid delivery mechanism 10 in the above embodiment, so the technical effects that can be achieved by the above-mentioned polishing liquid delivery mechanism 10 can also be achieved by the polishing device, which will not be described in detail here.

[0077] Please continue to refer to Figure 1 , in some embodiments, the center of the polishing pad 20 is located in the direction in which the fixed end 10A of the polishing liquid delivery mechanism 10 points to the free end 10B, that is, the extension direction of the polishing liquid delivery mechanism 10 is in a straight line with the center of the polishing pad 20.

[0078] The specific radius of the polishing pad 20 is not limited in the embodiment of the present application. For example, as shown in Figure 8As shown, the radius R of the polishing pad 20 can be between 350mm and 400mm, for example, the radius R can be 350mm, 380mm or 400mm, etc.

[0079] Please continue to refer to Figure 8 In some embodiments, the distance D between the fixed end 10A and the free end 10B of the polishing liquid delivery mechanism 10 is at least 3 / 4 of the radius R of the polishing pad 20. For example, the radius R of the polishing pad 20 is 380mm, and the distance D between the fixed end 10A and the free end 10B of the polishing liquid delivery mechanism 10 is about 300mm.

[0080] It should be noted that the technical features between the device embodiments and the mechanism embodiments in the embodiments of the present application can be replaced and supplemented with each other without conflict, so that those skilled in the art can understand the technical content of the present application.

[0081] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description simple, all possible combinations of the technical features of the above-mentioned embodiments are not described, but as long as the combination of the technical features does not exist, it should be considered as the scope of the present application.

[0082] The above-mentioned embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the patent scope of the present application. It should be pointed out that for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A polishing liquid delivery mechanism disposed above a polishing pad, characterized by, The polishing liquid delivery mechanism has a fixed end and a free end opposite to the fixed end; The free end of the polishing liquid delivery mechanism is provided with a spray head, one side of the spray head is provided with a plurality of spray holes for spraying polishing liquid to the surface of the polishing pad; Wherein, a plurality of the spray holes are arranged in an array.

2. The abrasive slurry delivery mechanism of claim 1, wherein, A plurality of the spray holes are sequentially arranged along a first direction and alternately staggered arranged along a second direction, the first direction intersects the second direction.

3. The abrasive slurry delivery mechanism of claim 1, wherein, The spray holes are obliquely arranged relative to the surface of the polishing pad.

4. The polishing liquid delivery mechanism according to claim 1, wherein, In the first direction in which the fixed end points to the free end, a plurality of the spray holes are arranged in M columns; In the second direction intersecting the first direction, a plurality of the spray holes are arranged in N rows; Wherein, M and N are both positive integers, and M is greater than or equal to N.

5. The abrasive slurry delivery mechanism of claim 4, wherein, The diameter of the spray hole is greater than or equal to 0.8mm; and / or, the distance between any two spray holes is less than or equal to 10mm.

6. The abrasive slurry delivery mechanism of claim 3, wherein, The inclination angle of the spray hole relative to the surface of the polishing pad ranges from 30° to 60°.

7. The abrasive slurry delivery mechanism of claim 1, wherein, In the direction in which the fixed end points to the free end, the fixed end of the polishing liquid delivery mechanism is movably connected to the base.

8. A grinding apparatus characterized by comprising: Comprising: A polishing pad; The polishing liquid delivery mechanism according to any one of claims 1 to 7 is arranged above the polishing pad, wherein a plurality of spray holes are arranged on the side of the spray head of the polishing liquid delivery mechanism facing the polishing pad.

9. The lapping apparatus of claim 8, wherein, The center of the polishing pad is located in the direction in which the fixed end of the polishing liquid delivery mechanism points to the free end.

10. The lapping apparatus of claim 8, wherein, The distance between the fixed end and the free end of the polishing liquid delivery mechanism is at least 3 / 4 of the radius of the polishing pad.

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