Conductive structure for continuous electroplating production line
By designing a conductive structure in the continuous electroplating production line, and utilizing sliders, limit frames, and locking mechanisms, the wear-out conductive blocks can be easily replaced, solving the problem of poor contact caused by wear of the conductive blocks, and ensuring the copper plating effect and ease of maintenance.
Patent Information
- Application Number
- CN202520088838.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-15
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2035-01-15
AI Technical Summary
In the existing continuous electroplating production line, the continuous movement of the moving plate causes wear on the conductive blocks, resulting in poor contact between the conductive blocks and the moving plate, which affects the copper plating effect and makes it difficult to disassemble and replace them conveniently.
A conductive structure is designed, which includes components such as a guide rail frame, a support frame, a movable plate, a base rod, a base plate, and conductive blocks. The second slider is slidably connected to the slide groove, which facilitates the disassembly and replacement of worn conductive blocks. The T-shaped slider cooperates with the slide groove for guidance and limiting. The limiting frame, guide block, and locking mechanism are used for support and limiting.
This allows for easy disassembly and replacement of worn conductive blocks, preventing poor contact between the conductive blocks and the moving board, and ensuring the stability of the copper plating effect and convenient maintenance.
Smart Images
Figure CN223852819U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a conductive structure, in particular to a conductive structure for continuous electroplating production line belongs to conductive structure technical field. BACKGROUND
[0002] Usually in vertical continuous electroplating production line, with plating metal as anode, circuit board as cathode, circuit board is soaked in electroplating solution and realizes copper plating, vertical continuous electroplating production line includes guide rail and conductive block, the mobile plate is slidably installed on the guide rail, the mobile plate is in contact with the conductive block, the mobile plate lower end is connected with the hanger, the hanger bottom is connected with the circuit board, the guide rail and the mobile plate all adopt conductive metal material, and the circuit board is moved in the copper deposition tank, and the copper plating of the circuit board is realized.
[0003] And the existing conductive structure for continuous electroplating production line, since the mobile plate is constantly moving, the wear of the conductive block is easy to cause, thereby leading to the poor contact between the conductive block and the mobile plate, the copper deposition effect is influenced, in actual use, the worn conductive block cannot be conveniently disassembled and replaced. CONTENT OF THE UTILITY MODEL
[0004] The utility model discloses a main purpose is to solve the problem of not convenient to disassemble and replace the worn conductive block, and provide a kind of conductive structure for continuous electroplating production line.
[0005] The utility model discloses a main purpose can be achieved by adopting following technical scheme:
[0006] A kind of conductive structure for continuous electroplating production line, including guide rail frame and support frame, the mobile plate is slidably installed on the guide rail frame, bottom bar is installed on the support frame, bottom plate is slidably installed in the bottom of bottom bar, the conductive block is installed in the bottom of bottom plate, the second sliding block is installed at the top of bottom plate, the sliding slot that is cooperated with the second sliding block is set up on the bottom bar, limit frame is slidably installed on the bottom bar.
[0007] Preferably, the second sliding block is a T-shaped sliding block, and the sliding slot is a T-shaped sliding slot.
[0008] Preferably, the support frame includes a second support rod and a top plate, the top of the second support rod is connected with the bottom of the top plate, the bottom bar is installed at the bottom of the top plate, and the bottom bar is located above the mobile plate.
[0009] Preferably, the limit frame includes a limit frame, a second connecting rod and a supporting plate, a guide frame is installed on the bottom bar, the supporting plate is slidably installed on the guide frame, the second connecting rod is installed on one of the supporting plate, one end of the second connecting rod is connected with the limit frame, and the through slot that is cooperated with the conductive block is set up on the limit frame.
[0010] Preferably, the supporting plate is provided with a guide block, the guide frame is provided with a guide slot matched with the guide block, and the guide block is provided with a clamping mechanism.
[0011] Preferably, the guide frame comprises a first connecting rod and a guide ring, the bottom rod is provided with the first connecting rod, one end of the first connecting rod is provided with the guide ring, the guide ring is provided with the guide slot matched with the guide block, and the top of the guide block is provided with a positioning plate.
[0012] Preferably, the clamping mechanism comprises a cavity, a spring and a clamping ball, the guide block is provided with the cavity, the cavity is internally provided with the spring, one end of the spring is provided with the clamping ball, and the guide ring is provided with a clamping slot matched with the clamping ball.
[0013] Preferably, the guide rail frame comprises a first supporting rod and a sliding rail, the top of the first supporting rod is provided with the sliding rail, and the sliding rail is slidably provided with a moving plate.
[0014] The present application has the following beneficial technical effects:
[0015] 1. The conductive structure for the continuous electroplating production line according to the present application is provided with a second sliding block and a sliding groove in sliding connection, so that the conductive block can be conveniently disassembled and replaced after wear, and the poor contact between the conductive block and the moving plate can be avoided to prevent the copper deposition effect from being reduced.
[0016] 2. The second sliding block is a T-shaped sliding block matched with a T-shaped sliding groove to guide and limit the conductive block, and the second supporting rod and the top plate are arranged to support the bottom rod and the conductive block. BRIEF DESCRIPTION OF DRAWINGS
[0017] Figure 1 It is a schematic diagram of the overall structure of the present application;
[0018] Figure 2 It is a schematic diagram of the second sliding block structure of the present application;
[0019] Figure 3 It is a schematic diagram of the conductive block structure of the present application;
[0020] Figure 4 It is a schematic diagram of the guide block structure of the present application;
[0021] Figure 5 It is a schematic diagram of the limiting frame structure of the present application;
[0022] Figure 6 It is a schematic diagram of the clamping ball structure of the present application.
[0023] In the figure: 1, the first support rod; 2, the slide rail; 3, the spring; 4, the boom; 5, the lifting ring; 6, the moving plate; 7, the second support rod; 8, the top plate; 9, the bottom rod; 10, the guide ring; 11, the first connecting rod; 12, the guide block; 13, the bottom plate; 14, the conductive block; 15, the limiting frame; 16, the positioning plate; 17, the clamping ball; 18, the second sliding block; 19, the second connecting rod; 20, the supporting plate. DETAILED DESCRIPTION
[0024] In order for those skilled in the art to more clearly and clearly understand the technical scheme of the utility model, the utility model will be further described in detail below in conjunction with the embodiments and drawings, but the implementation of the utility model is not limited thereto.
[0025] As Figures 1-6 shown, the conductive structure for continuous electroplating production line provided by the embodiment comprises a guide rail frame and a support frame, characterized in that the moving plate 6 is slidably installed on the guide rail frame, the bottom rod 9 is installed on the support frame, the bottom plate 13 is slidably installed at the bottom of the bottom rod 9, the conductive block 14 is installed at the bottom of the bottom plate 13, the second sliding block 18 is installed at the top of the bottom plate 13, the slide groove matched with the second sliding block 18 is formed in the bottom rod 9, the limiting frame is slidably installed on the bottom rod 9, the second sliding block 18 is a T-shaped sliding block, the slide groove is a T-shaped slide groove, the support frame comprises the second support rod 7 and the top plate 8, the top of the second support rod 7 is connected with the bottom of the top plate 8, the bottom rod 9 is installed at the bottom of the top plate 8, the bottom rod 9 is located above the moving plate 6, the guide rail frame comprises the first support rod 1 and the slide rail 2, the slide rail 2 is installed at the top of the first support rod 1, the moving plate 6 is slidably installed on the slide rail 2, the second sliding block 18 and the slide groove are slidably connected, which can facilitate the replacement of the worn conductive block 14, can avoid the poor contact between the conductive block 14 and the moving plate 6, and can avoid the decline of copper deposition effect, the second sliding block 18 is a T-shaped sliding block matched with the T-shaped slide groove, which can guide and limit the conductive block 14, and the second support rod 7 and the top plate 8 can support the bottom rod 9 and the conductive block 14.
[0026] In the embodiment, as Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6As shown, the limiting frame includes a limiting frame 15, a second connecting rod 19 and a supporting plate 20, a guide frame is installed on the bottom rod 9, the supporting plate 20 is slidably installed on the guide frame, the second connecting rod 19 is installed on one side of the supporting plate 20, one end of the second connecting rod 19 is connected with the limiting frame 15, a through slot is formed in the limiting frame 15 and matched with the conductive block 14, by matching the limiting frame 15 with the conductive block 14, the sliding bottom plate 13, the second sliding block 18 is slid into the sliding slot, the conductive block 14 is installed, the limiting frame 15 is slid to slide the conductive block 14 into the inside of the limiting frame 15 to limit the installed conductive block 14, the guide block 12 is installed on the supporting plate 20, a guide slot is formed in the guide frame and matched with the guide block 12, the clamping mechanism is installed on the guide block 12, by matching the guide block 12 with the guide slot, the limiting frame 15 can be guided and limited, the guide frame includes a first connecting rod 11 and a guide ring 10, the first connecting rod 11 is installed on the bottom rod 9, one end of the first connecting rod 11 is installed with the guide ring 10, a guide slot is formed in the guide ring 10 and matched with the guide block 12, the positioning plate 16 is installed on the top of the guide block 12, by matching the first connecting rod 11, the guide ring 10, the guide block 12 and the guide slot, the limiting frame 15 can be guided and limited, the clamping mechanism includes a cavity, a spring 3 and a clamping ball 17, the cavity is formed in the guide block 12, the spring 3 is installed in the inside of the cavity, one end of the spring 3 is installed with the clamping ball 17, a clamping slot is formed in the guide ring 10 and matched with the clamping ball 17, by setting the clamping ball 17, the limiting frame 15 after sliding can be limited.
[0027] In this embodiment, as shown, the working process of the conductive structure for the continuous electroplating production line provided by this embodiment is as follows: Figures 1-6
[0028] Step 1: sliding the sliding bottom plate 13, sliding the second sliding block 18 into the sliding slot to install the conductive block 14;
[0029] Step 2: sliding the limiting frame 15, the guide block 12 slides in the guide slot to cover the limiting frame 15 on the conductive block 14, the clamping ball 17 slides out of one clamping slot and clamps into another clamping slot to limit the installed conductive block 14;
[0030] Step 3: the sliding rail 2 starts to drive the moving plate 6 to move to cooperate with the conductive block 14 to plate copper on the circuit board.
[0031] In summary, in the embodiment, the conductive structure for the continuous electroplating production line according to the embodiment can facilitate the disassembly and replacement of the worn conductive block 14 by setting the second sliding block 18 in sliding connection with the sliding groove, can avoid the poor contact between the conductive block 14 and the moving plate 6 to cause the copper deposition effect to decrease, can guide and limit the position of the conductive block 14 by setting the second sliding block 18 as a T-shaped sliding block matched with a T-shaped sliding groove, can support the bottom rod 9 and the conductive block 14 by setting the second supporting rod 7 and the top plate 8, can install the conductive block 14 by setting the limiting frame 15 matched with the conductive block 14, sliding the bottom plate 13, and sliding the second sliding block 18 into the sliding groove, can limit the position of the installed conductive block 14 by sliding the limiting frame 15 to slide the conductive block 14 into the inside of the limiting frame 15, can guide and limit the position of the limiting frame 15 by setting the guide block 12 matched with the guide groove, can guide and limit the position of the limiting frame 15 by setting the first connecting rod 11, the guide ring 10, the guide block 12, and the guide groove matched with each other, and can limit the position of the sliding limiting frame 15 by setting the clamping ball 17.
[0032] As used in the specification and claims, certain terminology is used to designate certain components. One of skill in the art will understand that different names can be used by hardware manufacturers to refer to the same or similar components. The specification and claims do not differentiate between the components based on name but rather on functionality. As used throughout the specification and claims, "comprising" is to be read as "comprising, without limitation." "Approximately" refers to a range of acceptable error, within which a skilled artisan would understand the technical problem to be solved and the technical result to be achieved substantially.
[0033] It should be noted that the terms "comprising," "including," and any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element preceded by "comprises a" does not exclude the existence of additional identical elements in the process, method, article, or apparatus including the element.
[0034] The foregoing description illustrates and describes the only preferred embodiments of the application. However, it is to be understood that the application is not limited to the disclosed embodiments, and that numerous modifications are possible without departing from the spirit and scope of the application. These modifications can be made by those skilled in the art, and can be made in light of the foregoing description. The scope of the application is to be limited only by the claims appended hereto and their equivalents.
Claims
1. An electrically conductive structure for a continuous electroplating production line comprising a rail frame and a support frame, characterized in that, The guide rail frame is slidably installed with a moving plate (6), the support frame is installed with a bottom rod (9), the bottom of the bottom rod (9) is slidably installed with a bottom plate (13), the bottom of the bottom plate (13) is installed with a conductive block (14), the top of the bottom plate (13) is installed with a second sliding block (18), a sliding groove matched with the second sliding block (18) is formed in the bottom rod (9), and a limiting frame is slidably installed on the bottom rod (9).
2. The electrically conductive structure for use in a continuous electroplating production line according to claim 1, characterized in that, The second sliding block (18) is a T-shaped sliding block, and the sliding groove is a T-shaped sliding groove.
3. The electrically conductive structure for use in a continuous electroplating production line according to claim 1, wherein, The support frame comprises a second support rod (7) and a top plate (8), the top of the second support rod (7) is connected with the bottom of the top plate (8), and the bottom rod (9) is installed at the bottom of the top plate (8) and located above the moving plate (6).
4. The electrically conductive structure for use in a continuous electroplating production line according to claim 1, wherein, The limiting frame comprises a limiting frame (15), a second connecting rod (19) and a supporting plate (20), a guide frame is installed on the bottom rod (9), the supporting plate (20) is slidably installed on the guide frame, the second connecting rod (19) is installed on one side of the supporting plate (20), one end of the second connecting rod (19) is connected with the limiting frame (15), and a through groove matched with the conductive block (14) is formed in the limiting frame (15).
5. A conductive structure for a continuous electroplating production line according to claim 4, characterized in that, A guide block (12) is installed on the supporting plate (20), a guide groove matched with the guide block (12) is formed in the guide frame, and a clamping mechanism is installed on the guide block (12).
6. A conductive structure for a continuous electroplating production line according to claim 5, characterized in that, The guide frame comprises a first connecting rod (11) and a guide ring (10), the first connecting rod (11) is installed on the bottom rod (9), one end of the first connecting rod (11) is installed with the guide ring (10), a guide groove matched with the guide block (12) is formed in the guide ring (10), and a positioning plate (16) is installed on the top of the guide block (12).
7. A conductive structure for a continuous electroplating production line according to claim 6, characterized in that, The clamping mechanism comprises a cavity, a spring (3) and a clamping ball (17), the cavity is formed in the guide block (12), the spring (3) is installed in the cavity, one end of the spring (3) is installed with the clamping ball (17), and a clamping groove matched with the clamping ball (17) is formed in the guide ring (10).
8. The electrically conductive structure for use in a continuous electroplating production line according to claim 1, wherein, The guide rail frame comprises a first support rod (1) and a sliding rail (2), the top of the first support rod (1) is installed with the sliding rail (2), and the moving plate (6) is slidably installed on the sliding rail (2).