Graphene floor heating assembly

Abstract

A graphene floor heating assembly comprises an XPS extruded sheet layer, an XPE heat preservation cotton layer, a first reflection film layer, an insulation layer, a packaging chip PVC layer and a waterproof insulation layer, the packaging chip PVC layer comprises an upper PVC layer and a lower PVC layer, a graphene heating sheet layer is arranged between the upper PVC layer and the lower PVC layer, the graphene heating sheet layer comprises an upper PET layer, a lower PET layer, a second reflection film, a graphene slurry layer, a silver strip and a copper strip, and the silver strip and the copper strip are arranged on the upper PET layer. The beneficial effects are as follows: firstly, the lightweight degree is further improved; secondly, the service life of the product is prolonged; thirdly, other sections can still work normally; and fourthly, the safety of the product is improved.

Description

Technical Field

[0001] This utility model relates to the field of decoration and building materials technology, and in particular to a floor heating component using graphene heating. Background Technology

[0002] As residents' living standards continue to improve, they have higher requirements for the comfort of their living environment. Installing underfloor heating can improve the comfort of the living environment during winter.

[0003] Due to its extremely high conductivity, graphene can rapidly convert electrical energy into heat when energized. Furthermore, graphene has low resistivity, resulting in more uniform heating than traditional metal wires. Therefore, graphene heating components have gained popularity among manufacturers. Additionally, the ultra-thin nature of graphene is an advantage in achieving product lightweighting. Utility model patent CN212299151U discloses a far-infrared cloud-based floor heating system. Its principle involves energizing a graphene heating film, and then, through a reflective film beneath the film and surrounding insulation, directing the heat generated towards the floor to meet the requirements of floor heating.

[0004] This patent also has shortcomings: First, the integration of the graphene heating element is not compact enough, and the lightweight nature of the patented product needs further improvement. Second, the reliability of the contact between the graphene heating film and the copper strip is insufficient, resulting in high resistance at local contact points. This can cause the graphene heating film to overheat and burn out under the thermal effect of the resistance, leading to the copper strip detaching from the graphene heating film and causing the graphene heating film to fail. Third, this product cannot be adapted to the requirements of site space for material selection. Fourth, the waterproof and insulation performance of this patent needs further improvement, and its safety performance does not meet the requirements. Utility Model Content

[0005] This utility model provides a graphene floor heating component. The purpose of developing this product is: first, to further improve the integration of the graphene electric heating component, thereby improving its lightweight nature; second, to reduce the occurrence of burn-out failure of the electric heating component during use, thereby increasing the product's service life; third, this product can adapt to different installation environments on site; and fourth, to improve the product's waterproof and insulation performance, thereby improving the product's safety.

[0006] The following describes the technical solution. Before proceeding, the following material abbreviations in the industry are explained: PET is polyethylene terephthalate; PVC is polyvinyl chloride; PE is polyethylene; XPS is extruded polystyrene; XPE is cross-linked polyethylene.

[0007] A graphene underfloor heating component includes an XPS extruded polystyrene board layer 1, an XPE insulation cotton layer 2, a first reflective film layer 3, an insulation layer 4, an encapsulated chip PVC layer 5, and a waterproof insulation layer 6. The encapsulated chip PVC layer 5 includes an upper PVC layer 11 and a lower PVC layer 12. A graphene heating element layer 13 is disposed between the upper PVC layer 11 and the lower PVC layer 12. The graphene heating element layer 13 includes an upper PET layer 15, a lower PET layer 16, a second reflective film 14, a graphene paste layer 17, a silver strip 18, and a copper strip 19. A second reflective film 14 is disposed between the upper PET layer 15 and the lower PET layer 16. The second reflective film 14 comprises a graphene paste layer 17, silver bars 18, and copper bars 19. The graphene paste layer 17 is printed on the lower PET layer 16. The silver bars 18 include a first silver bar 181 and a second silver bar 182. The copper bars 9 include a first copper bar 191 and a second copper bar 192. The first silver bar 181 and the second silver bar 182 are respectively printed on the left and right ends of the graphene paste layer 17. The first silver bar 181 is connected to the first copper bar 191, and the second silver bar 182 is connected to the second copper bar 192. The second reflective film 14 is disposed in the middle position of the upper PET layer 15.

[0008] Preferably, the first copper bar 191 and the second copper bar 192 are respectively connected to the wire harness 111 via wires. The wire harness 111 is electrically connected to the temperature controller 20. The PVC layer 5 of the encapsulated chip is connected to the sensor 22. The sensor 22 is electrically connected to the temperature controller 20. The switch 21 is connected to the power supply and is also electrically connected to the temperature controller 20.

[0009] Preferably, both the insulating layer 4 and the waterproof insulating layer 6 are made of polypropylene fabric.

[0010] Preferably, the thickness of the XPE insulation layer 2 is 2~5mm.

[0011] The beneficial effects of this utility model are as follows: First, this product achieves an ultra-thin structure by using graphene material printing and feeding, further improving the product's lightweight nature while increasing manufacturing efficiency. Second, the high conductivity of silver reduces the transition resistance of the electrodes on both sides of the graphene paste layer 7, lowering the resistive heating effect that should be avoided at the electrode positions, preventing melting at the electrode connection points, and improving the product's service life. Third, a parallel circuit is formed between the segments of the graphene heating element layer 13; if one segment fails due to an open circuit, the remaining segments can still continue to work normally. Furthermore, different numbers of graphene heating element layers 13 can be selected according to the size requirements of the site to adapt to different installation environments. Fourth, the encapsulated chip PVC layer 5 is placed between the insulating layer 4 and the waterproof insulating layer 6, preventing water from seeping into the circuit and causing a short circuit. Insulating layers are also provided on both the upper and lower surfaces of the encapsulated chip PVC layer 5 to prevent leakage and improve product safety. Attached Figure Description

[0012] Figure 1 This is a front view of the PVC layer of the encapsulated chip described in this utility model.

[0013] Figure 2 yes Figure 1 A sectional view along line AA.

[0014] Figure 3 This is a front view of the graphene heating element encapsulated between the upper and lower PVC layers.

[0015] Figure 4 yes Figure 3 A sectional view along line AA.

[0016] Figure 5 This is a schematic diagram of the structural layer connection relationship of the graphene floor heating component.

[0017] Figure 6 This is the wiring diagram of the temperature control module of the graphene floor heating component. Detailed Implementation

[0018] The present invention will be further described in conjunction with the following specific embodiments.

[0019] Appendix Figure 1 To be continued Figure 6 The markings in the diagram are as follows: XPS extruded board layer 1, XPE insulation cotton layer 2, first reflective film layer 3, insulation layer 4, encapsulated chip PVC layer 5, waterproof insulation layer 6, cement layer 7, cement mortar layer 71, floor tile layer 72, upper PVC layer 11, lower PVC layer 12, graphene heating element layer 13, second reflective film 14, upper PET layer 15, lower PET layer 16, graphene paste layer 17, silver bar 18, copper bar 19, first silver bar 181, second silver bar 182, first copper bar 191, second copper bar 192, wire harness 111, temperature controller 20, switch 21, sensor 22.

[0020] A graphene underfloor heating component includes, from bottom to top, an XPS extruded polystyrene board layer 1, an XPE insulation cotton layer 2, a first reflective film layer 3, an insulation layer 4, an encapsulated chip PVC layer 5, and a waterproof insulation layer 6. Below the XPS extruded polystyrene board layer 1 is a cement layer 7, and above the waterproof insulation layer 6 is a cement mortar layer 71. A floor tile layer 72 is then laid on top of the cement mortar layer. Figure 5 As shown.

[0021] The PVC layer 5 of the encapsulated chip includes an upper PVC layer 11 and a lower PVC layer 12. A graphene heating element layer 13 is disposed between the upper PVC layer 11 and the lower PVC layer 12. The graphene heating element layer 13 includes an upper PET layer 15, a lower PET layer 16, a second reflective film 14, a graphene paste layer 17, a silver bar 18, and a copper bar 19. The second reflective film 14, the graphene paste layer 17, the silver bar 18, and the copper bar 19 are disposed between the upper PET layer 15 and the lower PET layer 16. The graphene paste layer 17 is printed on the lower PET layer 11. 6. The graphene material printing method is used to achieve the ultra-thin structure of the product, further improving the product's lightweight nature. The silver bar 18 includes a first silver bar 181 and a second silver bar 182, and the copper bar 19 includes a first copper bar 191 and a second copper bar 192. The first silver bar 181 and the second silver bar 182 are respectively printed on the left and right ends of the graphene paste layer 17. The high conductivity of silver reduces the resistance of the electrodes on both sides of the graphene paste layer 7, reduces the resistive heat effect that should be avoided at the electrode position, and improves the product's service life.

[0022] The first silver bar 181 is connected to the first copper bar 191, and the second silver bar 182 is connected to the second copper bar 192. A small amount of silver material is sufficient to meet the functional requirements at the electrode positions. The second reflective film 14 is positioned in the middle of the upper PET layer 15 to reflect the thermal radiation generated by the graphene heating element layer 3, allowing heat to be transferred in the desired direction. Additionally, a first reflective film layer 3 is located below the entire PVC layer 5 of the encapsulated chip to reflect residual heat from the outside of the PVC layer 5. With two reflective layers inside and outside the PVC layer 5, heat reflection is improved, increasing heat utilization.

[0023] Preferably, the first copper strip 191 and the second copper strip 192 are respectively connected to the wire harness 111 via wires. The wire harness 111 is electrically connected to the temperature controller 20. The PVC layer 5 of the encapsulated chip is connected to a sensor 22, which is electrically connected to the temperature controller 20. The switch 21 is connected to the power supply and also electrically connected to the temperature controller 20 to control the temperature of the product within the required set range. Furthermore, a parallel circuit is formed between the segments of the graphene heating element layer 13. If one segment fails due to an open circuit, the remaining segments can still continue to work normally. The overall function of the product will not be affected by the damage to a single graphene heating element layer 13. Figure 6 As shown.

[0024] Preferably, both the insulating layer 4 and the waterproof insulating layer 6 are made of polypropylene fabric.

[0025] Preferably, the thickness of the XPE insulation layer 2 is 2~5mm.

[0026] Finally, it should be noted that this embodiment is a preferred example of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A graphene floor warming assembly, comprising an XPS extruded board layer (1), an XPE thermal insulation cotton layer (2), a first reflective film layer (3), an insulation layer (4), a packaged chip PVC layer (5), and a waterproof insulation layer (6), characterized in that, The packaging chip PVC layer (5) comprises an upper PVC layer (11) and a lower PVC layer (12), and a graphene heating sheet layer (13) is arranged between the upper PVC layer (11) and the lower PVC layer (12), the graphene heating sheet layer (13) comprises an upper PET layer (15), a lower PET layer (16), a second reflective film (14), a graphene paste layer (17), a silver strip (18) and a copper strip (19), the second reflective film (14), the graphene paste layer (17), the silver strip (18) and the copper strip (19) are arranged between the upper PET layer (15) and the lower PET layer (16), the graphene paste layer (17) is printed on the lower PET layer (16), the silver strip (18) comprises a first silver strip (181) and a second silver strip (182), the copper strip (19) comprises a first copper strip (191) and a second copper strip (192), the first silver strip (181) and the second silver strip (182) are respectively printed on left and right ends of the graphene paste layer (17), the first silver strip (181) is connected with the first copper strip (191), the second silver strip (182) is connected with the second copper strip (192), and the second reflective film (14) is arranged at a middle position of the upper PET layer (15).

2. The graphene floor warming assembly of claim 1, wherein, The first copper strip (191) and the second copper strip (192) are respectively connected with a wire harness (111) through wires, the wire harness (111) is electrically connected with a temperature controller (20), the packaging chip PVC layer (5) is connected with a sensor (22), the sensor (22) is electrically connected with the temperature controller (20), a switch (21) is connected with a power supply and is electrically connected with the temperature controller (20).

3. The graphene floor warming assembly of claim 1, wherein, The insulation layer (4) and the waterproof insulation layer (6) are both polypropylene fabric.

4. The graphene floor warming assembly of claim 1, wherein, The thickness of the XPE thermal insulation cotton layer (2) is 2-5 mm.

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