High-temperature testing device for semiconductor parts

Abstract

The utility model discloses a high temperature testing device for semiconductor parts, which belongs to the technical field of high temperature testing of semiconductor parts, and comprises a main body module, an automatic pick-and-place module and a cooling module, the main body module comprises a bottom plate, the top of the bottom plate is fixedly connected with a high temperature testing box, the lower part of one side of the high temperature testing box is fixedly connected with an n-shaped block, and the n-shaped block is fixedly connected with the automatic pick-and-place module. Through the arrangement of a feeding plate, a metal sheet, a steering assembly, a pushing assembly and a driving assembly, when the device is used, a worker does not need to directly take a semiconductor part in a high-temperature state, the semiconductor part can automatically move to a cooling position to be cooled, the cooling efficiency is improved, and the working efficiency is improved. And meanwhile, the placed to-be-detected semiconductor part can be automatically sent to a detection position for detection, manual placement by workers is not needed, the device is more convenient to operate, the workers can be prevented from being scalded, and the safety of the device is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of high temperature test of semiconductor parts more particularly, relate to a kind of high temperature test device of semiconductor parts. BACKGROUND

[0002] Semiconductor parts are various basic components of semiconductor devices and integrated circuits, which play a crucial role in electronic devices. They can be used to generate, control, receive, transform, amplify signals and perform energy conversion. The semiconductor material of semiconductor devices is silicon, germanium or gallium arsenide. They can be used as rectifiers, oscillators, light emitters, amplifiers, light meters and other equipment. During the production of semiconductor parts, high temperature test devices can be used to test semiconductor parts.

[0003] According to the search, patent number CN215678629U discloses a semiconductor test temperature control equipment, which includes a body. The front of the body is rotatably connected to a rotating door. The front of the body and above the rotating door are fixedly installed with a control switch and a control screen. The inside of the body is provided with an inner cavity. The inner sides of the inner cavity are fixedly installed with sliding rails. The surface of the sliding rails is slidably connected to a tray. The rotating door drives the tray to slide. The inner sides of the inner cavity are fixedly installed with a fire extinguishing mechanism. The utility model solves the problem of the semiconductor test temperature control equipment, which requires the arm to be inserted into the inner cavity when removing and replacing the semiconductor device, which can easily cause arm burns and is very inconvenient. At the same time, when the semiconductor device is tested at high temperature, the semiconductor device is prone to explosion, which can cause serious damage to the device and reduce safety.

[0004] In view of the above-mentioned related technology, the semiconductor test equipment can realize high temperature test of semiconductor parts and facilitate the removal of semiconductor parts. However, in actual operation, the overall temperature of the semiconductor parts is high after testing, and it is inconvenient for the staff to take them. After taking, additional cooling is needed for subsequent operation. At the same time, the internal temperature of the test machine is also high, which can easily cause burns when placing the next semiconductor part. Therefore, we propose a kind of high temperature test device of semiconductor parts. UTILITY MODEL CONTENTS

[0005] To solve the above problems, the utility model provides a kind of high temperature test device of semiconductor parts, adopts the following technical scheme:

[0006] The utility model provides a kind of semiconductor parts high temperature testing device, including main module, automatic pick-and-place module and cooling module, the main module includes bottom plate, the top of the bottom plate is fixedly connected with high temperature test box, the lower part of one side of the high temperature test box is fixedly connected with n-shaped block, the upper portion of one side of the high temperature test box is equipped with feed inlet, the automatic pick-and-place module includes rotationally connected on the bottom plate center rotating rod, the top of the center rotating rod is fixedly connected with rotating disc, the outer surface of the rotating disc is annularly and equidistantly fixedly connected with eight slide rods, slidingly sleeved with feeding plate between the outer surface of every two slide rods, one of the feeding plate extends to the inside of high temperature test box by feed inlet, the bottom of four feeding plates is fixedly connected with metal sheet, the outer surface of the center rotating rod and the top of the bottom plate are provided with steering assembly, the cooling module is arranged on the top of the bottom plate, the inside of the n-shaped block is provided with pusher assembly, the pusher assembly is connected with one of the metal sheet, the top of the bottom plate is provided with drive assembly, the drive assembly is connected with pusher assembly, the drive assembly is matched with steering assembly.

[0007] Further, the pusher assembly includes a chute opened at the top of the n-shaped block, a sliding block is slidably connected inside the chute, a magnetic sheet is fixedly connected to the top of the sliding block, the magnetic sheet is magnetically connected to one of the metal sheets, and a hollow frame is fixedly connected to the bottom of the sliding block.

[0008] Further, the pusher assembly further includes a horizontal plate fixedly connected inside the n-shaped block, two inner shaft rods are rotatably connected inside the horizontal plate, chain wheels are fixedly connected to the top of the two inner shaft rods, a chain is drivingly connected between the outer surfaces of the two chain wheels, a drive shaft is fixedly connected to the top of the chain, and the drive shaft is movably connected inside the hollow frame. A pinion is fixedly connected to the bottom of one of the inner shaft rods.

[0009] Further, the steering assembly includes a four-corner groove wheel fixedly connected to the outer surface of the center rotating rod, a movable rod is rotatably connected to the top of the bottom plate, a linkage gear is fixedly connected to the top of the movable rod, a drive disc is fixedly connected to the outer surface of the movable rod, and the outer surface of the drive disc is movably connected with the four-corner groove wheel.

[0010] Further, the drive assembly includes a first motor fixedly connected to the top of the bottom plate, an incomplete gear is fixedly connected to the output shaft of the first motor, the outer surface of the incomplete gear is meshed with the pinion, and the outer surface of the incomplete gear is matched with the linkage gear.

[0011] Further, the cooling module comprises an L-shaped plate fixedly connected to the top of the bottom plate, a mounting frame is fixedly connected to the top of the L-shaped plate, semiconductor refrigerating sheets are fixedly connected to the two sides of the mounting frame, heat-conducting sheets are fixedly connected to the two sides of the two semiconductor refrigerating sheets, a second motor is fixedly connected to the top of the mounting frame, and a heat dissipation fan blade is fixedly connected to the output shaft of the second motor.

[0012] Further, the cooling module comprises two flow guide boxes fixedly connected to the two sides of the mounting frame respectively, the two semiconductor refrigerating sheets are located in the interiors of the two flow guide boxes respectively, and drainage hoppers are fixedly connected to the two sides of the inner wall of the mounting frame and communicate with the interiors of the two flow guide boxes respectively.

[0013] In conclusion, the utility model has the following beneficial technical effects:

[0014] (1) The utility model discloses a feeding plate, a metal sheet, a steering assembly, a pushing assembly and a driving assembly are arranged, so that the device does not need to be directly used to take the semiconductor parts in a high-temperature state, the semiconductor parts will be automatically moved to the cooling position for cooling, and the placed semiconductor parts to be detected will be automatically sent to the detection position for detection, so that the device operation is more convenient, the scalding of the staff can be avoided, and the safety of the device is improved.

[0015] (2) The utility model discloses a cooling module is arranged, so that the air can be cooled during the cooling of the semiconductor parts, the cooling effect is improved, the back of the semiconductor refrigerating sheet can be cooled, the refrigeration effect is improved, and the cooling effect of the semiconductor parts is further improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is an overall structure schematic view of the utility model;

[0017] Figure 2 It is an overall sectional structure schematic view of the utility model;

[0018] Figure 3 It is a driving assembly structure schematic view of the utility model;

[0019] Figure 4 It is an overall structure schematic view of the utility model Figure 3 It is an enlarged structure schematic view of A in the utility model;

[0020] Figure 5 It is a sectional structure schematic view of the cooling module of the utility model.

[0021] Mark explanation in the drawing:

[0022] 100, main body module; 110, bottom plate; 120, high temperature test box; 130, n-shaped block;

[0023] 200, automatic pick-and-place module; 210, central rotating rod; 220, rotating disc; 230, sliding rod; 240, feeding plate; 250, metal sheet; 260, steering assembly; 261, four-cornered groove wheel; 262, movable rod; 263, driving disc; 264, linkage gear; 270, pushing assembly; 271, sliding groove; 272, sliding block; 273, magnetic suction sheet; 274, hollow frame; 275, horizontal plate; 276, inner shaft rod; 277, chain wheel; 278, chain; 279, drive shaft; 2710, pinion; 280, driving assembly; 281, first motor; 282, incomplete gear;

[0024] 300, cooling module; 310, mounting frame; 320, second motor; 330, heat dissipation fan blade; 340, semiconductor refrigeration sheet; 350, heat conduction sheet; 360, flow guide box; 370, flow guide hopper. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0026] In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom end" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0027] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "provided with", "sleeved / connected", "connected" and the like should be broadly understood, for example, "connected" can be fixedly connected, can be detachably connected, or integrally connected; can be mechanically connected, can be electrically connected; can be directly connected, can be indirectly connected through an intermediate medium, and can be connected inside two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0028] The following will be described in conjunction with the drawingsFigures 1-5 The utility model makes further detailed description.

[0029] Please refer to Figures 1-5 A semiconductor part high temperature testing device, including main module 100, automatic taking and placing module 200 and cooling module 300, main module 100 includes bottom plate 110, the top of bottom plate 110 is fixedly connected with high temperature test box 120, the lower part of one side of high temperature test box 120 is fixedly connected with n-shaped block 130, the upper portion of one side of high temperature test box 120 is provided with feeding port, automatic taking and placing module 200 includes the center rotary rod 210 of rotationally connected on bottom plate 110, the top of center rotary rod 210 is fixedly connected with rotary disc 220, the outer surface of rotary disc 220 is annularly and equidistantly fixedly connected with eight slide rods 230, and the outer surface between every two slide rods 230 is slidably provided with feeding plate 240, wherein one of feeding plate 240 extends to the inside of high temperature test box 120 through feeding port, and the bottom of four feeding plates 240 is fixedly connected with metal sheet 250, and the outer surface of center rotary rod 210 and the top of bottom plate 110 are provided with steering assembly 260, cooling module 300 is set up at the top of bottom plate 110, the inside of n-shaped block 130 is provided with push assembly 270, push assembly 270 is connected with one of metal sheet 250, the top of bottom plate 110 is provided with drive assembly 280, drive assembly 280 is connected with push assembly 270, and drive assembly 280 is adapted with steering assembly 260.

[0030] In use, the staff places the semiconductor part needing testing on one of feeding plate 240, then opens drive assembly 280, drive assembly 280 will first drive push assembly 270, push assembly 270 drives the feeding plate 240 in the inside of high temperature test box 120 to draw out through metal sheet 250, then push assembly 270 is separated from metal sheet 250, drive assembly 280 is separated from push assembly 270, subsequently drive assembly 280 drives steering assembly 260, steering assembly 260 will drive center rotary rod 210 and rotary disc 220 to rotate, rotary disc 220 will drive the feeding plate 240 with semiconductor part to move to the position close to high temperature test box 120, subsequently drive assembly 280 is connected with push assembly 270 again, push assembly 270 pushes the feeding plate 240 with semiconductor part into the inside of high temperature test box 120 again through another metal sheet 250, at this moment, drive assembly 280 stops rotating, high temperature test box 120 tests the semiconductor part, after testing, drive assembly 280 is opened again to repeat the above steps, so that the semiconductor part after testing is removed and is moved to the cooling module 300 below to cool, after cooling, the staff takes and replaces again, so that the whole process, the staff does not exist scalding risk, improves overall security.

[0031] The pushing assembly 270 comprises a chute 271 opened at the top of the n-shaped block 130, the inside of the chute 271 is slidably connected with a sliding block 272, the top of the sliding block 272 is fixedly connected with a magnetic sheet 273, the magnetic sheet 273 is magnetically connected with one of the metal sheets 250, the bottom of the sliding block 272 is fixedly connected with a hollow frame 274, the pushing assembly 270 further comprises a horizontal plate 275 fixedly connected inside the n-shaped block 130, the inside of the horizontal plate 275 is rotatably connected with two inner shaft rods 276, the top of the two inner shaft rods 276 is fixedly connected with a chain wheel 277, the outer surfaces of the two chain wheels 277 are drivingly connected with a chain 278, the top of the chain 278 is fixedly connected with a driving shaft 279, the driving shaft 279 is movably connected inside the hollow frame 274, the bottom of one of the inner shaft rods 276 is fixedly connected with a pinion 2710, the steering assembly 260 comprises a four-corner groove wheel 261 fixedly connected to the outer surface of the central rotating rod 210, the top of the bottom plate 110 is rotatably connected with a movable rod 262, the top of the movable rod 262 is fixedly connected with a linkage gear 264, the outer surface of the movable rod 262 is fixedly connected with a driving disc 263, the outer surface of the driving disc 263 is movably connected with the four-corner groove wheel 261, the driving assembly 280 comprises a first motor 281 fixedly connected to the top of the bottom plate 110, the output shaft of the first motor 281 is fixedly connected with an incomplete gear 282, the outer surface of the incomplete gear 282 is engaged with the pinion 2710, and the outer surface of the incomplete gear 282 is matched with the linkage gear 264.

[0032] The first motor 281 is turned on, the first motor 281 drives the incomplete gear 282 to rotate one circle, the incomplete gear 282 will first drive the pinion 2710, the pinion 2710 drives one of the inner shaft rods 276 and one of the chain wheels 277 to rotate, so that the chain 278 rolls, the chain 278 drives the drive shaft 279 to move, the drive shaft 279 will move inside the hollow frame 274 and push the hollow frame 274, the hollow frame 274 drives the magnetic suction piece 273 to move through the sliding block 272, the magnetic suction piece 273 drives the feeding plate 240 located inside the high temperature test box 120 to slide out from the outer surface of the two sliding rods 230 through the metal sheet 250, then the magnetic suction piece 273 is separated from the metal sheet 250, the incomplete gear 282 is separated from the pinion 2710, the subsequent incomplete gear 282 drives the linkage gear 264, the linkage gear 264 drives the driving disc 263 to rotate one circle, so that the driving disc 263 drives the four-corner groove wheel 261 to drive the center rotating rod 210 to rotate ninety degrees, so that the rotating disc 220 rotates to drive the feeding plate 240 on which the semiconductor parts are placed to move to a position close to the high temperature test box 120, then the incomplete gear 282 is separated from the linkage gear 264 and connected with the pinion 2710 again, the drive shaft 279 pushes the magnetic suction piece 273, the magnetic suction piece 273 pushes the feeding plate 240 on which the semiconductor parts are placed into the inside of the high temperature test box 120 by being connected with another metal sheet 250, at this time the first motor 281 is turned off and the incomplete gear 282 stops rotating, the high temperature test box 120 tests the semiconductor parts at high temperature, after the test is completed, the first motor 281 is turned on again to repeat the above steps, so as to move the tested semiconductor parts out and move to the cooling module 300 below for cooling, and then the workers take and replace them.

[0033] The cooling module 300 comprises an L-shaped plate fixedly connected to the top of the bottom plate 110, the top of the L-shaped plate is fixedly connected with a mounting frame 310, both sides of the mounting frame 310 are fixedly connected with semiconductor refrigerating fins 340, both sides of the two semiconductor refrigerating fins 340 are fixedly connected with heat-conducting fins 350, the top of the mounting frame 310 is fixedly connected with a second motor 320, the output shaft of the second motor 320 is fixedly connected with heat dissipation fan blades 330, the cooling module 300 comprises two flow guide boxes 360 fixedly connected to both sides of the mounting frame 310, the two semiconductor refrigerating fins 340 are located inside the two flow guide boxes 360 respectively, both sides of the inner wall of the mounting frame 310 are fixedly connected with drainage hoppers 370, the two drainage hoppers 370 are respectively penetrated with the inside of the two flow guide boxes 360.

[0034] The second motor 320 drives the heat dissipation fan blade 330 to rotate, and the heat dissipation fan blade 330 will perform air supply to cool the semiconductor parts. The adjacent side of the semiconductor refrigeration sheet 340 will perform refrigeration, and the refrigeration surface cools the air through the plurality of heat conduction sheets 350, thereby improving the cooling effect of the semiconductor parts. The air inlet 370 will guide part of the air into the inside of the flow guide box 360, and the air will dissipate heat from the heating surface of the semiconductor refrigeration sheet 340, thereby improving the refrigeration effect of the semiconductor refrigeration sheet 340 during operation.

[0035] The implementation principle of the embodiment of the utility model is: in use, the staff places the semiconductor parts needing to be tested on one of the feeding plates 240, then opens the first motor 281, the first motor 281 drives the incomplete gear 282 to rotate one round, the incomplete gear 282 will first drive the pinion 2710, the pinion 2710 drives one of the inner shaft rods 276 and one of the sprockets 277 to rotate, so that the chain 278 rolls, the chain 278 drives the driving shaft 279 to move, the driving shaft 279 will move inside the hollow frame 274 and push the hollow frame 274, the hollow frame 274 drives the magnetic suction piece 273 to move through the sliding block 272, the magnetic suction piece 273 drives the feeding plate 240 inside the high temperature test box 120 to slide out on the outer surface of the two slide rods 230 through the metal sheet 250, then the magnetic suction piece 273 is separated from the metal sheet 250, the incomplete gear 282 is separated from the pinion 2710, the subsequent incomplete gear 282 drives the linkage gear 264, the linkage gear 264 drives the driving disc 263 to rotate one round, so that the driving disc 263 drives the four-corner groove wheel 261 to drive the center rotating rod 210 to rotate ninety degrees, so that the rotating disc 220 drives the feeding plate 240 on which the semiconductor parts are placed to move to the position close to the high temperature test box 120, the subsequent incomplete gear 282 is separated from the linkage gear 264 and is connected with the pinion 2710 again, the driving shaft 279 pushes the magnetic suction piece 273, the magnetic suction piece 273 pushes the feeding plate 240 on which the semiconductor parts are placed into the inside of the high temperature test box 120 through being connected with the other metal sheet 250, at this time, the first motor 281 is closed and the incomplete gear 282 stops rotating, the high temperature test box 120 tests the semiconductor parts, after the test is completed, the first motor 281 is opened again to repeat the above steps, so that the tested semiconductor parts are moved out and are moved to below the cooling module 300 to cool, after cooling, the staff takes and replaces again, so that in the whole process, the staff does not have the risk of scalding, the overall safety is improved, when the semiconductor parts cool, the second motor 320 is opened to drive the heat dissipation fan blade 330 to rotate, the heat dissipation fan blade 330 will blow air to cool the semiconductor parts, and the side adjacent to the semiconductor refrigeration piece 340 will refrigerate, the refrigeration surface cools the air through the plurality of heat conduction sheets 350, so that the cooling effect of the semiconductor parts is improved, and the diversion hopper 370 will guide part of the air into the inside of the flow guide box 360, the air will dissipate heat to the heating surface of the semiconductor refrigeration piece 340, so that the refrigeration effect of the semiconductor refrigeration piece 340 is improved when working.

[0036] The above are the preferred embodiments of the utility model, which do not limit the protection scope of the utility model, so that: equivalent changes made according to the structure, shape and principle of the utility model should be covered in the protection scope of the utility model.

Claims

1. A high temperature testing apparatus for semiconductor components, comprising a main module (100), an automatic pick-and-place module (200) and a cooling module (300), characterized in that: The main module (100) includes a bottom plate (110), the top of the bottom plate (110) is fixedly connected with a high-temperature test box (120), the lower part of one side of the high-temperature test box (120) is fixedly connected with an n-shaped block (130), and the upper part of one side of the high-temperature test box (120) is provided with an inlet; The automatic taking and placing module (200) comprises a central rotating rod (210) rotatably connected to the bottom plate (110), the top end of the central rotating rod (210) is fixedly connected with a rotating disc (220), the outer surface of the rotating disc (220) is annularly and equidistantly fixedly connected with eight slide rods (230), each two slide rods (230) are slidably sleeved with a feeding plate (240), one feeding plate (240) extends into the high-temperature test box (120) through the inlet, the bottom of four feeding plates (240) is fixedly connected with a metal sheet (250), the outer surface of the central rotating rod (210) and the top of the bottom plate (110) are provided with a steering assembly (260), the cooling module (300) is arranged on the top of the bottom plate (110), the inside of the n-shaped block (130) is provided with a pushing assembly (270), the pushing assembly (270) is connected with one metal sheet (250), the top of the bottom plate (110) is provided with a driving assembly (280), the driving assembly (280) is connected with the pushing assembly (270), and the driving assembly (280) is matched with the steering assembly (260).

2. The apparatus of claim 1, wherein: The pushing assembly (270) comprises a sliding groove (271) formed in the top of the n-shaped block (130), the sliding groove (271) is slidably connected with a sliding block (272), the top of the sliding block (272) is fixedly connected with a magnetic sheet (273), the magnetic sheet (273) is magnetically connected with one metal sheet (250), and the bottom of the sliding block (272) is fixedly connected with a hollow frame (274).

3. The apparatus of claim 2, wherein: The pushing assembly (270) further comprises a horizontal plate (275) fixedly connected in the inside of the n-shaped block (130), two inner shaft rods (276) are rotatably connected in the inside of the horizontal plate (275), the top ends of the two inner shaft rods (276) are fixedly connected with chain wheels (277), the outer surfaces of the two chain wheels (277) are drivingly connected with a chain (278), the top of the chain (278) is fixedly connected with a driving shaft (279), and the driving shaft (279) is movably connected in the inside of the hollow frame (274). The bottom end of one inner shaft rod (276) is fixedly connected with a pinion (2710).

4. The apparatus of claim 3, wherein: The steering assembly (260) comprises a four-corner groove wheel (261) fixedly connected to the outer surface of the central rotating rod (210), an active rod (262) rotatably connected to the top of the bottom plate (110), a linkage gear (264) fixedly connected to the top end of the active rod (262), a driving disc (263) fixedly connected to the outer surface of the active rod (262), and the outer surface of the driving disc (263) is movably connected with the four-corner groove wheel (261).

5. The apparatus of claim 4, wherein: The driving assembly (280) comprises a first motor (281) fixedly connected at the top of the bottom plate (110), an output shaft of the first motor (281) is fixedly connected with an incomplete gear (282), an outer surface of the incomplete gear (282) is engaged with the pinion (2710), and the outer surface of the incomplete gear (282) is matched with the linkage gear (264).

6. The apparatus of claim 5, wherein: The cooling module (300) comprises an L-shaped plate fixedly connected at the top of the bottom plate (110), a mounting frame (310) is fixedly connected at the top of the L-shaped plate, both sides of the mounting frame (310) are fixedly connected with semiconductor refrigerating sheets (340), both sides of the two semiconductor refrigerating sheets (340) are fixedly connected with heat-conducting sheets (350), the top of the mounting frame (310) is fixedly connected with a second motor (320), and an output shaft of the second motor (320) is fixedly connected with heat-dissipating fan blades (330).

7. The apparatus of claim 6, wherein: The cooling module (300) comprises two flow guide boxes (360) fixedly connected at both sides of the mounting frame (310) respectively, the two semiconductor refrigerating sheets (340) are located inside the two flow guide boxes (360) respectively, both sides of the inner wall of the mounting frame (310) are fixedly connected with flow guide hoppers (370), and the two flow guide hoppers (370) are penetrated with the interiors of the two flow guide boxes (360) respectively.

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