Imaging lens and electronic device

Abstract

The utility model discloses an imaging lens and an electronic device. The imaging lens comprises an optical element and an anti-reflection film. An imaging light penetrates through the optical element, and the optical element is provided with a material injection mark. The anti-reflective film is disposed on at least a portion of the surface of the optical element and includes a nanostructure layer and an interposer. The nanostructure layer has a plurality of ridge-shaped protrusions extending non-directionally, a bottom of each ridge-shaped protrusion is closer to the optical element than a top, and each ridge-shaped protrusion tapers from the bottom to the top. The interposer is disposed between the optical element and the nanostructure layer and includes at least two first dielectric layers and at least one second dielectric layer, the refractive index of the second dielectric layer is different from the refractive index of each first dielectric layer, and the second dielectric layer is disposed between the first dielectric layers. Therefore, the low reflection performance can be maintained.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to an imaging lens, and particularly to an imaging lens applied to a portable electronic device. BACKGROUND

[0002] In recent years, portable electronic devices, such as smart electronic devices, tablet computers, etc., have been flooded in modern people's lives, and imaging lenses loaded on portable electronic devices have also developed rapidly. However, as technology continues to advance, users have increasingly high requirements for the quality of imaging lenses. Therefore, developing an imaging lens that can improve the tolerance of anti-reflection film to environmental changes to maintain low reflection performance has become an important and urgent problem in the industry. SUMMARY

[0003] The present disclosure provides an imaging lens and an electronic device that improve the structural stability of the anti-reflection film through the interlayer, improve the tolerance of the anti-reflection film to environmental changes, and thereby maintain the low reflection performance of the anti-reflection film.

[0004] According to an embodiment of the present disclosure, an imaging lens is provided, which includes an optical element and an anti-reflection film. An imaging light ray penetrates the optical element, and the optical element has a material injection mark. The anti-reflection film is disposed on at least part of the surface of the optical element, and includes a nanostructure layer and an interlayer. The nanostructure layer has a plurality of ridge-shaped protrusions that are not oriented in extension, wherein a bottom of each ridge-shaped protrusion is closer to the optical element than a top, and each ridge-shaped protrusion tapers from the bottom to the top. The interlayer is disposed between the optical element and the nanostructure layer, and includes at least two first dielectric layers and at least one second dielectric layer, wherein the refractive index of the second dielectric layer is different from the refractive index of each first dielectric layer, and the second dielectric layer is disposed between the first dielectric layers. The thickness of each first dielectric layer is LT1, and the thickness of the second dielectric layer is LT2, which satisfy the following conditions: 42nm < LT1 < 112nm; and 1nm < LT2 < 35nm.

[0005] According to the imaging lens of the preceding embodiment, the thickness of each first dielectric layer is LT1, which can satisfy the following condition: 45nm < LT1 < 90nm.

[0006] According to the imaging lens of the preceding embodiment, the thickness of the second dielectric layer is LT2, which can satisfy the following condition: 3nm < LT2 < 27nm.

[0007] The imaging lens according to the implementation of the preceding paragraph, wherein the intermediate layer can further include at least one third dielectric layer, the refractive index of the third dielectric layer can be different from the refractive index of the second dielectric layer, and the third dielectric layer is arranged adjacent to the second dielectric layer. The thickness of the third dielectric layer is LT3, which can satisfy the following condition: 3nm < LT3 < 38nm.

[0008] The imaging lens according to the implementation of the preceding paragraph, wherein the thickness of each first dielectric layer is LT1, and the thickness of the third dielectric layer is LT3, which can satisfy the following condition: 2.3 < LT1 / LT3 < 9.6.

[0009] The imaging lens according to the implementation of the preceding paragraph, wherein the refractive index of the second dielectric layer can be higher than the refractive index of each first dielectric layer and the refractive index of the third dielectric layer.

[0010] The imaging lens according to the implementation of the preceding paragraph, wherein part of the area of the top of the intermediate layer can be in contact with air.

[0011] The imaging lens according to the implementation of the preceding paragraph, wherein the average height of the ridge-shaped protrusions can be greater than 78nm and less than 308nm.

[0012] The imaging lens according to the implementation of the preceding paragraph, wherein the nanostructure layer can be an aluminum oxide layer.

[0013] The imaging lens according to the implementation of the preceding paragraph, wherein each first dielectric layer can be a silicon oxide layer.

[0014] The imaging lens according to the implementation of the preceding paragraph, wherein the second dielectric layer can be a titanium oxide layer.

[0015] The imaging lens according to the implementation of the preceding paragraph, wherein the third dielectric layer can be a silicon oxide layer.

[0016] The imaging lens according to the implementation of the preceding paragraph, wherein the average reflectivity of at least part of the surface of the optical element provided with the nanostructure layer corresponding to the light wavelength of 420nm to 760nm is R4276, which can satisfy the following condition: 0% < R4276 < 0.2%. In addition, it can satisfy the following condition: 0% < R4276 < 0.1%.

[0017] The imaging lens according to the implementation of the preceding paragraph, wherein the optical element can include an extinction structure, the extinction structure forms a concave-convex fluctuation on the surface of the optical element, and the extinction structure is integrally formed with the optical element.

[0018] The imaging lens according to the implementation of the preceding paragraph, wherein the extinction structure can have a plurality of protrusions, and the protrusions are regularly arranged.

[0019] The imaging lens according to the embodiment of the preceding paragraph, wherein each protrusion has a height greater than 40 μm and less than 1000 μm. In addition, each protrusion has a height greater than 50 μm and less than 500 μm.

[0020] The imaging lens according to the embodiment of the preceding paragraph, further comprising an adhesive element, wherein the adhesive element is used to fix the optical element.

[0021] An electronic device according to an embodiment of the present disclosure includes the imaging lens according to the embodiments described above. BRIEF DESCRIPTION OF DRAWINGS

[0022] FIG. 1A FIG. 1 shows a schematic diagram of an imaging lens according to a first embodiment of the present disclosure;

[0023] FIG. 1B FIG. 2 shows a perspective view of an optical element and an anti-reflection film according to the first embodiment of the present disclosure; FIG. 1A

[0024] FIG. 1C FIG. 3 shows a cross-sectional view of an optical element and an anti-reflection film according to the first embodiment of the present disclosure; FIG. 1A

[0025] FIG. 1D FIG. 4 shows a top view of an optical element and an anti-reflection film according to the first embodiment of the present disclosure; FIG. 1A

[0026] FIG. 1E FIG. 5 shows a schematic diagram of an optical element and an anti-reflection film according to the first embodiment of the present disclosure; FIG. 1A

[0027] FIG. 1F FIG. 6 shows a cross-sectional view of an optical element and an anti-reflection film according to the first embodiment of the present disclosure; FIG. 1A

[0028] FIG. 1G FIG. 7 shows reflectivity of an imaging lens according to the first embodiment of the present disclosure; FIG. 1A

[0029] FIG. 2A FIG. 8 shows a schematic diagram of an imaging lens according to a second embodiment of the present disclosure;

[0030] FIG. 2B FIG. 9 shows a perspective view of an optical element and an anti-reflection film according to the second embodiment of the present disclosure; FIG. 2A

[0031] FIG. 2C FIG. 10 shows a schematic diagram of an optical element and an anti-reflection film according to the second embodiment of the present disclosure; FIG. 2A

[0032] FIG. 3A ​​​​​​​​A schematic diagram of an imaging lens according to the third embodiment of this disclosure is shown;

[0033] FIG. 3B Drawing according to FIG. 3A An object-side perspective view of the optical elements and the anti-reflection film in the third embodiment;

[0034] FIG. 3C Drawing according to FIG. 3A Image-side perspective view of the optical elements and anti-reflection film in the third embodiment;

[0035] FIG. 3D Drawing according to FIG. 3A A schematic diagram of the optical elements and anti-reflective film in the third embodiment;

[0036] FIG. 4A A schematic diagram of an imaging lens according to the fourth embodiment of this disclosure is shown;

[0037] FIG. 4B Drawing according to FIG. 4A A schematic diagram of the optical elements and anti-reflective film in the fourth embodiment;

[0038] FIG. 5A A schematic diagram of an imaging lens according to the fifth embodiment of this disclosure is shown;

[0039] FIG. 5B Drawing according to FIG. 5A A schematic diagram of the optical elements and anti-reflective film in the fifth embodiment;

[0040] FIG. 6A A schematic diagram illustrating an electronic device according to the sixth embodiment of this disclosure;

[0041] FIG. 6B Drawing according to FIG. 6A Another schematic diagram of the electronic device of the sixth embodiment;

[0042] FIG. 6C Drawing according to FIG. 6A A schematic diagram of an image captured by an electronic device in the sixth embodiment;

[0043] FIG. 6D Drawing according to FIG. 6A Another image captured by the electronic device in the sixth embodiment is illustrated.

[0044] FIG. 6E Drawing according to FIG. 6A Another image captured by the electronic device in the sixth embodiment is illustrated.

[0045] FIG. 7 A schematic diagram illustrating an electronic device according to the seventh embodiment of this disclosure;

[0046] FIG. 8A FIG. 8 shows a schematic diagram of an imaging lens according to an eighth embodiment of the present disclosure applied to a vehicle tool;

[0047] FIG. 8B FIG. 9 shows another schematic diagram of an imaging lens according to the eighth embodiment of the present disclosure applied to a vehicle tool; FIG. 8A FIG. 10 shows another schematic diagram of an imaging lens according to the eighth embodiment of the present disclosure applied to a vehicle tool.

[0048] FIG. 8C FIG. 11 shows another schematic diagram of an imaging lens according to the eighth embodiment of the present disclosure applied to a vehicle tool. FIG. 8A

[0049]

Symbol Description

[0050] 100, 200, 300, 400, 500, 810: imaging lens

[0051] 110, 210, 310, 410, 510: optical element

[0052] 111, 211, 311, 411, 511: injection mark

[0053] 112, 113, 212, 312, 313: light extinction structure

[0054] 112a: protrusion

[0055] 120, 220, 320, 420, 520: anti-reflection film

[0056] 121: nanostructure layer

[0057] 121a: ridge-shaped protrusion

[0058] 122: intermediate layer

[0059] 141, 241, 341, 441, 541: lens element

[0060] 142, 242, 342, 442, 542: lens barrel

[0061] 143, 243: assembly element

[0062] 144, 244, 344, 444, 544: electronic photosensitive element

[0063] 330, 430, 530: adhesive element

[0064] 60, 70: electronic device

[0065] 621: user interface

[0066] 622, 711: ultra-wide-angle imaging lens

[0067] ​623: high-pixel imaging lens

[0068] 624, 713, 714: telephoto imaging lens

[0069] 625: imaging signal processing element

[0070] 712: wide-angle imaging lens

[0071] 715: flash module

[0072] 716: TOF module

[0073] 80: vehicle tool

[0074] IMG: imaging surface

[0075] I1, I2, I3, I4: external space information

[0076] L: imaging light

[0077] θ: viewing angle

[0078] H: vertical height

[0079] h: height of each protrusion DETAILED DESCRIPTION

[0080] The present disclosure provides an imaging lens, which includes an optical element and an anti-reflection film. An imaging light penetrates the optical element, and the optical element has a material injection mark. The anti-reflection film is disposed on at least part of a surface of the optical element, and includes a nanostructure layer and an intermediate layer. The nanostructure layer has a plurality of ridge-shaped protrusions extending in a non-directional manner, wherein a bottom of each ridge-shaped protrusion is closer to the optical element than a top, and each ridge-shaped protrusion tapers from the bottom to the top. The intermediate layer is disposed between the optical element and the nanostructure layer, and includes at least two first dielectric layers and at least one second dielectric layer, wherein a refractive index of the second dielectric layer is different from a refractive index of each first dielectric layer, and the second dielectric layer is disposed between the first dielectric layers. A thickness of each first dielectric layer is LT1, and a thickness of the second dielectric layer is LT2, which satisfy the following conditions: 42 nm < LT1 < 112 nm; and 1 nm < LT2 < 35 nm.

[0081] The above configuration through the intermediate layer helps to improve the structural stability of the anti-reflection film, so as to improve the tolerance of the anti-reflection film to environmental changes, such as temperature, humidity or other chemical interference, so as to maintain the low reflection performance of the anti-reflection film, and the ridge-shaped protrusions help to form a gradient refractive index to reduce the reflectivity.

[0082] Further, the optical element can be a lens element or a prism element, but not limited thereto. Further, the trace of the material of the optical element after being heated and melted can be observed by the injection trace, or the trace of the material after being heated and melted having fluidity to form a specific geometric appearance in a specific geometric space, such as a cutting trace of a flow channel of injection molding, a gate trace, or a runner trace, but not limited thereto, and not limited to the definition of the conventional technical jargons.

[0083] A portion of a top of the interlayer can be in contact with air. Thereby, the degree of change of the gradient refractive index of the nanostructure layer is facilitated to be adjusted.

[0084] The interlayer can further include at least a third dielectric layer, wherein a refractive index of the third dielectric layer is different from a refractive index of the second dielectric layer, and the third dielectric layer is disposed adjacent to the second dielectric layer. A thickness LT3 of the third dielectric layer can satisfy the following condition: 3nm < LT3 < 38nm. Thereby, the third dielectric layer and the second dielectric layer can form a thin film interference, which facilitates to reduce the reflectivity.

[0085] The refractive index of the second dielectric layer can be higher than the refractive index of each of the first dielectric layers and the refractive index of the third dielectric layer.

[0086] The main component of the nanostructure layer can be aluminum oxide.

[0087] The main component of each of the first dielectric layers can be silicon oxide. Thereby, the film stability is facilitated to be improved.

[0088] The main component of the second dielectric layer can be titanium oxide. Thereby, the second dielectric layer can be combined with the first dielectric layer or the third dielectric layer to generate a thin film interference to reduce the reflectivity.

[0089] The main component of the third dielectric layer can be silicon oxide.

[0090] Further, the first dielectric layer, the second dielectric layer, and the third dielectric layer of the interlayer can be combined and stacked by SiO2, MgF2, TiO2, Ta2O5, Cr2O3, HfO2, ZnO, AlN, Al2O3, Y2O3, CaF2, SiC, MgO, ZrO2. The element ratio of the above compounds is not limited to the disclosed values, and can be different due to the difference in process conditions.

[0091] The optical element can include an antireflection structure. The antireflection structure can form a concave-convex surface on a surface of the optical element, and the antireflection structure can be integrally formed with the optical element. The concave-convex surface can help reduce reflection of stray light. In detail, the optical element can be formed with the antireflection structure by a mold design, and the antireflection structure can be disposed in a region outside an optically effective region.

[0092] The antireflection structure can include a plurality of protrusions, and the protrusions can be regularly arranged. In this way, quality management of the antireflection structure can be facilitated.

[0093] The imaging lens can further include an adhesive element configured to fix the optical element. In this way, assembly stability can be facilitated. In detail, the adhesive element can also be mixed with a dark pigment to reduce reflectivity of the adhesive element.

[0094] The thickness of each first dielectric layer can satisfy the following condition: 45 nm < LT1 < 90 nm. In this way, environmental resistance of the antireflection film can be improved.

[0095] The thickness of the second dielectric layer can satisfy the following condition: 3 nm < LT2 < 27 nm.

[0096] The thickness of each first dielectric layer can satisfy the following condition: 2.3 < LT1 / LT3 < 9.6. In this way, environmental resistance and antireflection performance of the antireflection film can be improved.

[0097] The average height of the ridge-shaped protrusions can be greater than 78 nm and less than 308 nm. In detail, the height of each ridge-shaped protrusion can be different, and at least three or more ridge-shaped protrusions can be taken to calculate the average height, and ridge-shaped protrusions that can be recognized as a profile are preferred. Furthermore, the height of the ridge-shaped protrusion can be a vertical height from an absolute bottom (a foot portion) of the ridge-shaped protrusion to a top portion (a top portion) of the ridge-shaped protrusion when observed from a cross-sectional view (destructive measurement).

[0098] The average reflectivity of at least a portion of the surface of the optical element provided with the nanostructure layer corresponding to a wavelength of light of 420 nm to 760 nm can satisfy the following condition: 0% < R4276 < 0.2%. In this way, transmittance can be improved while reducing reflection of stray light. In addition, the following condition can be satisfied: 0% < R4276 < 0.1%.

[0099] The height of each protrusion can be greater than 40 μm and less than 1000 μm. In this way, reflection of stray light to an imaging surface can be blocked. In addition, the height of each protrusion can be greater than 50 μm and less than 500 μm.

[0100] Each technical feature of the imaging lens of the present disclosure described above can be combined to achieve the corresponding effects.

[0101] The present disclosure provides an electronic device comprising the imaging lens.

[0102] According to the above-mentioned embodiments, the following specific examples are proposed in detail with reference to the accompanying drawings.

[0103] <First Embodiment>

[0104] Please refer to FIG. 1A which shows a schematic diagram of an imaging lens 100 according to the first embodiment of the present disclosure. As shown in FIG. 1A , the imaging lens 100 comprises an optical element 110, wherein an imaging light L penetrates the optical element 110, and the optical element 110 is a prism element, but is not limited thereto.

[0105] Further, the imaging lens 100 of the first embodiment is a telephoto imaging lens, and the imaging lens 100 can further comprise a lens element 141, a lens barrel 142, an assembling element 143 and an electronic photosensitive element 144, wherein the lens barrel 142 is used to accommodate the optical element 110 and the lens element 141, the assembling element 143 is used to fix the optical element 110, the electronic photosensitive element 144 is disposed at an imaging surface IMG of the imaging lens 100, and the electronic photosensitive element 144 is used to receive the imaging light L.

[0106] Please refer to FIGS. 1B-1F , wherein FIG. 1B shows a perspective view of the optical element 110 and the anti-reflection film 120 according to the first embodiment of the present disclosure, FIG. 1A shows a cross-sectional view of the optical element 110 and the anti-reflection film 120 according to the first embodiment of the present disclosure, FIG. 1C shows a top view of the optical element 110 and the anti-reflection film 120 according to the first embodiment of the present disclosure, FIG. 1A shows a schematic diagram of the optical element 110 and the anti-reflection film 120 according to the first embodiment of the present disclosure, FIG. 1D shows a sectional view of the optical element 110 and the anti-reflection film 120 according to the first embodiment of the present disclosure. As shown in FIG. 1A , the imaging lens 100 further comprises an anti-reflection film 120, wherein the anti-reflection film 120 is disposed on at least part of the surface of the optical element 110, the anti-reflection film 120 comprises a nano-structure layer 121 and an intermediate layer 122, and the optical element 110 has a sprue mark 111. It must be pointed out that FIG. 1E the dashed line of FIG. 1A is used to represent the range of the anti-reflection film 120. FIG. 1F FIG. 1A FIGS. 1B-1F FIG. 1E

[0107] ​​​​Further, the nanostructure layer 121 has a plurality of ridge-shaped protrusions 121a extending in a non-directional manner, wherein a bottom of each ridge-shaped protrusion 121a is closer to the optical element 110 than a top of the ridge-shaped protrusion 121a, and each ridge-shaped protrusion 121a tapers from the bottom to the top. The intermediate layer 122 is disposed between the optical element 110 and the nanostructure layer 121, and includes at least two first dielectric layers and at least one second dielectric layer, wherein a refractive index of the second dielectric layer is different from a refractive index of each first dielectric layer, and the second dielectric layer is disposed between the first dielectric layers.

[0108] The above configuration with the intermediate layer 122 helps to improve the structural stability of the anti-reflection film 120, so as to improve the tolerance of the anti-reflection film 120 to environmental changes, such as temperature, humidity or other chemical interference, so as to maintain the low reflection performance of the anti-reflection film 120, and the ridge-shaped protrusions 121a help to form a gradient refractive index to reduce the reflectivity.

[0109] In detail, the injection mark 111 can be a trace of the material of the optical element 110 after being heated and melted, or the injection mark 111 can be a trace of the material after being heated and melted having fluidity, forming a specific geometric appearance in a specific geometric space, such as a cutting trace of a flow channel of injection molding. The injection mark 111 can also be referred to as a flow mark, but all of these are not limited, and are not limited by the definition of the conventional technical jargon.

[0110] From the above, FIG. 1C It can be seen that the optical element 110 with the injection mark 111 can be designed to have a more complex shape by the mold, for example, the clear aperture in the element can be partially reduced, and the opportunity of stray light passing through can be reduced.

[0111] The main component of the nanostructure layer 121 can be aluminum oxide, the main component of each first dielectric layer can be silicon oxide, and the main component of the second dielectric layer can be titanium oxide. In this way, the film layer stability can be improved, and the second dielectric layer can be combined with the first dielectric layer to produce film interference to reduce the reflectivity.

[0112] From the above, FIG. 1F It can be seen that the vertical height of each ridge-shaped protrusion 121a is H, wherein the height of each ridge-shaped protrusion 121a can be different, at least three or more ridge-shaped protrusions 121a can be taken to calculate the average height, and the ridge-shaped protrusion 121a that can be identified as the profile is preferred. Further, the height of the ridge-shaped protrusion 121a can be the vertical height H from the absolute bottom (the foot part) of the ridge-shaped protrusion 121a to the top (the top part) of the ridge-shaped protrusion 121a when observed from the cross section (destructive measurement). In the first embodiment, the average height of the ridge-shaped protrusion 121a is 200 nm.

[0113] From the above, FIGS. 1B-1DIt is understood that the optical element 110 may include extinction structures 112 and 113, wherein the extinction structures 112 and 113 respectively form an uneven surface on one side of the optical element 110, and the extinction structures 112 and 113 are integrally formed with the optical element 110. The uneven surface helps to reduce stray light reflection. In detail, the extinction structures 112 and 113 can be formed in the optical element 110 through mold design, and the extinction structures 112 and 113 can be disposed in areas outside the optically effective area.

[0114] Depend on FIG. 1C It can be seen that the extinction structure 113 may have multiple protrusions, and the protrusions are arranged in a regular manner, wherein each protrusion is an arc protrusion and the height of each protrusion is 150μm.

[0115] Depend on FIG. 1D It can be seen that the matting structure 112 may have multiple protrusions 112a, and the protrusions 112a are arranged regularly, wherein each protrusion 112a is a triangular protrusion, and the height of each protrusion 112a is h, and the height h of each protrusion 112a is 100μm. In this way, the protrusions 112a of the matting structure 112 and the protrusions of the matting structure 113 are beneficial to the quality management of the matting structures 112 and 113.

[0116] Depend on FIG. 1F It is known that a portion of the top of the intermediate layer 122 is in contact with air. This helps to regulate the degree of change in the gradient refractive index of the nanostructure layer 121.

[0117] Intermediate layer 122 may further include at least one third dielectric layer, and the main component of the third dielectric layer may be silicon oxide. The refractive index of the third dielectric layer is different from that of the second dielectric layer. The third dielectric layer and the second dielectric layer are disposed adjacent to each other, and the refractive index of the second dielectric layer may be higher than the refractive indices of both the first and third dielectric layers. This allows the third dielectric layer and the second dielectric layer to form thin-film interference, which helps to reduce reflectivity.

[0118] Furthermore, the first, second, and third dielectric layers of the intermediate layer 122 can be composed of stacked combinations of SiO2, MgF2, TiO2, Ta2O5, Cr2O3, HfO2, ZnO, AlN, Al2O3, Y2O3, CaF2, SiC, MgO, and ZrO2. The elemental proportions of these compounds are not limited to the disclosed values ​​and may vary due to differences in process conditions.

[0119] Please refer to Table 1, which lists the composition of the interposer 122 in the first embodiment and the corresponding positions of the nanostructure layer 121 and the optical element 110. The interposer 122 in Table 1 can correspond to... FIG. 1FThe arrangement relationship between the intermediate layer 122, the nanostructure layer 121, and the optical element 110 is shown in Table 1, and the composition and thickness of the first dielectric layer, the second dielectric layer, and the third dielectric layer are further listed in Table 1.

[0120]

[0121]

[0122] Please refer to FIG. 1G Its drawing is based on FIG. 1A The reflectivity of the imaging lens 100 in the first embodiment. (From...) FIG. 1G It is known that the average reflectance of at least a portion of the surface of the optical element 110 with the nanostructure layer 121 corresponding to light wavelengths from 420 nm to 760 nm is R4276, wherein the average reflectance R4276 of the first embodiment is 0.049%.

[0123] <Second Embodiment>

[0124] Please refer to FIG. 2A The diagram illustrates an imaging lens 200 according to the second embodiment of this disclosure. FIG. 2A It is known that the imaging lens 200 includes an optical element 210, wherein an imaging ray L passes through the optical element 210, and the optical element 210 is a prism element, but is not limited thereto.

[0125] Furthermore, the imaging lens 200 of the second embodiment is a telephoto imaging lens, and the imaging lens 200 may further include a lens element 241, a lens barrel 242, an assembly element 243 and an electronic photosensitive element 244, wherein the lens barrel 242 is used to house the optical element 210 and the lens element 241, the assembly element 243 is used to fix the optical element 210, the electronic photosensitive element 244 is disposed on an imaging surface IMG of the imaging lens 200, and the electronic photosensitive element 244 is used to receive imaging light L.

[0126] Please refer to FIG. 2B and FIG. 2C ,in FIG. 2B Drawing according to FIG. 2A A perspective view of the optical element 210 and the anti-reflection film 220 in the second embodiment. FIG. 2C Drawing according to FIG. 2A A schematic diagram of the optical element 210 and the anti-reflective film 220 in the second embodiment. (From...) FIG. 2B and FIG. 2C It is understood that the imaging lens 200 also includes an anti-reflective film 220, wherein the anti-reflective film 220 is disposed on at least a portion of the surface of the optical element 210, the anti-reflective film 220 includes a nanostructure layer and an intermediate layer, and the optical element 210 has an injection mark 211. It must be noted that...FIG. 2C The dashed line is used to indicate the range of the anti-reflective film 220.

[0127] Furthermore, the nanostructure layer has multiple non-directionally extending ridge-like protrusions, wherein the bottom of each ridge-like protrusion is closer to the optical element 210 than its top, and each ridge-like protrusion tapers from bottom to top. An intermediary layer is disposed between the optical element 210 and the nanostructure layer, and includes at least two first dielectric layers and at least one second dielectric layer, wherein the refractive index of the second dielectric layer is different from that of each of the first dielectric layers, and the second dielectric layer is disposed between the first dielectric layers.

[0128] Depend on FIG. 2B It is known that the optical element 210 may include an extinction structure 212, wherein the extinction structure 212 causes a surface of the optical element 210 to form an uneven surface, and the extinction structure 212 is integrally formed with the optical element 210.

[0129] In detail, the extinction structure 212 may have multiple protrusions arranged in a regular pattern, wherein each protrusion is an arc protrusion that extends along an S-shaped path and the height of each protrusion is 300 μm.

[0130] Please refer to Table 2, which lists the composition of the intermediate layer in the second embodiment and the corresponding positions of the nanostructure layer and optical element 210. Table 2 further lists the thicknesses of the first dielectric layer and the second dielectric layer.

[0131]

[0132] <Third Embodiment>

[0133] Please refer to FIG. 3A The diagram illustrates an imaging lens 300 according to the third embodiment of this disclosure. FIG. 3A It is known that the imaging lens 300 includes an optical element 310, wherein an imaging ray L passes through the optical element 310, and the optical element 310 is a lens element, but is not limited thereto.

[0134] Furthermore, the imaging lens 300 in the third embodiment is a telephoto imaging lens, and the imaging lens 300 may also include a lens element 341, a lens barrel 342 and an electronic photosensitive element 344, wherein the lens barrel 342 is used to house the optical element 310 and the lens element 341, the electronic photosensitive element 344 is disposed on an imaging surface IMG of the imaging lens 300, and the electronic photosensitive element 344 is used to receive imaging light L.

[0135] Please refer to FIGS. 3B-3D ,in FIG. 3B Drawing according to FIG. 3A An object-side perspective view of the optical element 310 and the anti-reflection film 320 in the third embodiment.FIG. 3C Drawing according to FIG. 3A Image-side perspective view of optical element 310 and anti-reflection film 320 in the third embodiment. FIG. 3D Drawing according to FIG. 3A A schematic diagram of the optical element 310 and the anti-reflective film 320 in the third embodiment. (From...) FIGS. 3B-3D It is understood that the imaging lens 300 also includes an anti-reflective film 320, wherein the anti-reflective film 320 is disposed on at least a portion of the surface of the optical element 310, the anti-reflective film 320 includes a nanostructure layer and an intermediate layer, and the optical element 310 has an injection mark 311. It must be noted that... FIG. 3D The dashed line is used to indicate the extent of the anti-reflective film 320, which is disposed in the outer peripheral region on the object side and the central region on the image side of the optical element 310.

[0136] The nanostructure layer has multiple non-directionally extending ridge-like protrusions, wherein the bottom of each ridge-like protrusion is closer to the optical element 310 than its top, and each ridge-like protrusion tapers from bottom to top. An intermediary layer is disposed between the optical element 310 and the nanostructure layer, and includes at least two first dielectric layers and at least one second dielectric layer, wherein the refractive index of the second dielectric layer is different from that of the first dielectric layers, and the second dielectric layer is disposed between the first dielectric layers. Further, the intermediary layer may also include at least one third dielectric layer, wherein the refractive index of the third dielectric layer is different from that of the second dielectric layers, the third dielectric layer is disposed adjacent to the second dielectric layers, and the refractive index of the second dielectric layer may be higher than the refractive indices of the first dielectric layers and the third dielectric layer.

[0137] Depend on FIG. 3A It is understood that the imaging lens 300 may also include an adhesive element 330, which is used to fix the optical element 310. This helps to increase assembly stability. In detail, the adhesive element 330 may also be mixed with dark pigment to reduce reflectivity.

[0138] The optical element 310 may include extinction structures 312 and 313, wherein the extinction structures 312 and 313 respectively form unevenness on one surface of the optical element 310, and the extinction structures 312 and 313 are integrally formed with the optical element 310.

[0139] Depend on FIG. 3B It can be seen that the extinction structure 312 may have multiple protrusions, and the protrusions are arranged in a regular manner, wherein each protrusion is triangular and the height of each protrusion is 75μm.

[0140] Depend on FIG. 3C It can be seen that the extinction structure 313 may have multiple protrusions, and the protrusions are arranged in a regular manner, wherein each protrusion is an arc protrusion, the protrusions are arranged in concentric circles, and the height of each protrusion is 50μm.

[0141] Please refer to Table 3, which lists the composition of the intermediate layer in the third embodiment and the corresponding positions of the nanostructure layer and optical element 310. Table 3 further lists the thicknesses of the first dielectric layer, the second dielectric layer and the third dielectric layer.

[0142]

[0143] <Fourth Embodiment>

[0144] Please refer to FIG. 4A The diagram illustrates an imaging lens 400 according to the fourth embodiment of this disclosure. FIG. 4A It is known that the imaging lens 400 includes an optical element 410, wherein an imaging ray L passes through the optical element 410, and the optical element 410 is a lens element, but is not limited thereto.

[0145] Furthermore, the imaging lens 400 of the fourth embodiment is an ultra-wide-angle imaging lens, and the imaging lens 400 may further include a lens element 441, a lens barrel 442 and an electronic photosensitive element 444, wherein the lens barrel 442 is used to house the optical element 410 and the lens element 441, the electronic photosensitive element 444 is disposed on an imaging surface IMG of the imaging lens 400, and the electronic photosensitive element 444 is used to receive imaging light L.

[0146] Please refer to FIG. 4B Its drawing is based on FIG. 4A A schematic diagram of the optical element 410 and the anti-reflective film 420 in the fourth embodiment. FIG. 4B It is understood that the imaging lens 400 also includes an anti-reflective film 420, wherein the anti-reflective film 420 is disposed on at least a portion of the surface of the optical element 410, the anti-reflective film 420 includes a nanostructure layer and an intermediate layer, and the optical element 410 has an injection mark 411. It must be noted that... FIG. 4B The dashed line is used to indicate the range of the anti-reflective film 420.

[0147] Furthermore, the nanostructure layer has multiple non-directionally extending ridge-like protrusions, wherein the bottom of each ridge-like protrusion is closer to the optical element 410 than its top, and each ridge-like protrusion tapers from bottom to top. An intermediary layer is disposed between the optical element 410 and the nanostructure layer, and includes at least two first dielectric layers and at least one second dielectric layer, wherein the refractive index of the second dielectric layer is different from that of each of the first dielectric layers, and the second dielectric layer is disposed between the first dielectric layers.

[0148] Depend on FIG. 4A It is understood that the imaging lens 400 may also include an adhesive element 430, wherein the adhesive element 430 is used to fix the optical element 410.

[0149] < Fifth Embodiment >

[0150] Please refer to FIG. 5A , which shows a schematic view of an imaging lens 500 according to the fifth embodiment of the present disclosure. As shown in FIG. 5A , the imaging lens 500 comprises an optical element 510, wherein an imaging light ray L penetrates the optical element 510, and the optical element 510 is a lens element, but is not limited thereto.

[0151] Further, the imaging lens 500 of the fifth embodiment is a wide-angle imaging lens, and the imaging lens 500 can further comprise a lens element 541, a lens barrel 542, and an electronic photosensitive element 544, wherein the lens barrel 542 is used to accommodate the optical element 510 and the lens element 541, the electronic photosensitive element 544 is disposed on an imaging surface IMG of the imaging lens 500, and the electronic photosensitive element 544 is used to receive the imaging light ray L.

[0152] Please refer to FIG. 5B , which shows a schematic view of the optical element 510 and the anti-reflection film 520 according to the fifth embodiment of the present disclosure. As shown in FIG. 5A , the imaging lens 500 further comprises an anti-reflection film 520, wherein the anti-reflection film 520 is disposed on at least part of the surface of the optical element 510, the anti-reflection film 520 comprises a nanostructure layer and an intermediate layer, and the optical element 510 has a material injection mark 511. It must be pointed out that FIG. 5B the dashed line is used to represent the range of the anti-reflection film 520. FIG. 5B

[0153] Further, the nanostructure layer has a plurality of ridge-shaped protrusions which are not oriented in extension, wherein a bottom of each ridge-shaped protrusion is closer to the optical element 510 than a top, and each ridge-shaped protrusion tapers from the bottom to the top. The intermediate layer is disposed between the optical element 510 and the nanostructure layer, and comprises at least two first dielectric layers and at least one second dielectric layer, wherein the refractive index of the second dielectric layer is different from the refractive index of each first dielectric layer, and the second dielectric layer is disposed between the first dielectric layers.

[0154] As shown in FIG. 5A , the imaging lens 500 can further comprise an adhesive element 530, wherein the adhesive element 530 is used to fix the optical element 510.

[0155] < Sixth Embodiment >

[0156] Please refer to FIG. 6A and FIG. 6B , wherein FIG. 6A a schematic view of an electronic device 60 according to the sixth embodiment of the present disclosure is shown, FIG. 6B a schematic view of the electronic device 60 according to the sixth embodiment of the present disclosure is shown, FIG. 6A ​Another schematic view of the electronic device 60 of the sixth embodiment. As can be seen, FIG. 6A As can be seen, FIG. 6B It is known that the electronic device 60 is a smartphone, and the electronic device 60 comprises imaging lenses. Further, the imaging lenses are ultra-wide imaging lens 622, high-pixel imaging lens 623, and telephoto imaging lens 624, and the user interface 621 is a touch screen, but not limited thereto. Specifically, the imaging lenses can be any of the imaging lenses of the first to fifth embodiments, but the present disclosure is not limited thereto.

[0157] The user interface 621 has a touch function, and the user can enter a shooting mode through the user interface 621, wherein the user interface 621 is used to display a picture, and can be used to manually adjust the shooting angle to switch different imaging lenses. At this time, the imaging lenses converge imaging light on an electronic photosensitive element, and output electronic signals related to the image to an image signal processing element (ISP) 625.

[0158] As can be seen, FIG. 6B It is known that, corresponding to the camera specifications of the electronic device 60, the electronic device 60 can further comprise an optical anti-shake component (not shown), further, the electronic device 60 can further comprise at least one focusing auxiliary module (not shown) and at least one sensing element (not shown). The focusing auxiliary module can be a flash module for compensating color temperature, an infrared ranging element, a laser focusing module, etc., and the sensing element can have the functions of sensing physical momentum and acting energy, such as an accelerometer, a gyroscope, a Hall element, to sense the shaking and shaking applied by the user's hand or the external environment, thereby facilitating the automatic focusing function of the imaging lens configuration in the electronic device 60 and the play of the optical anti-shake component, to obtain good imaging quality, which helps the electronic device 60 according to the present disclosure to have multiple modes of shooting functions, such as optimizing selfie, low light source HDR (High Dynamic Range, high dynamic range imaging), high resolution 4K (4K Resolution) video recording, etc. In addition, the user can directly view the shooting picture of the camera from the user interface 621, and manually operate the framing range on the user interface 621 to achieve the auto-focus function of what you see is what you get.

[0159] Furthermore, the imaging lens, optical image stabilization assembly, sensing element, and focus assist module can be mounted on a flexible printed circuit board (FPC) (not shown), and electrically connected to the imaging signal processing element 625 and other related components via a connector (not shown) to execute the shooting process. Current electronic devices, such as smartphones, tend to be thinner and lighter. Mounting the imaging lens and related components on a flexible printed circuit board, and then using a connector to integrate the circuitry onto the mainboard of the electronic device, can meet the structural design and circuit layout requirements of the limited internal space of the electronic device and provide greater margin. It also allows for more flexible control of the imaging lens's autofocus function through the electronic device's touchscreen. In the sixth embodiment, the electronic device 60 may include multiple sensing elements and multiple focus assist modules. The sensing elements and focus assist modules are mounted on the flexible printed circuit board and at least one other flexible printed circuit board (not shown), and electrically connected to the imaging signal processing element 625 and other related components via corresponding connectors to execute the shooting process. In other embodiments (not shown), the sensing element and auxiliary optical element may also be mounted on the motherboard of the electronic device or other types of carrier boards, depending on the mechanical design and circuit layout requirements.

[0160] Furthermore, the electronic device 60 may further include, but is not limited to, a display unit, a control unit, a storage unit, random access memory (RAM), read-only memory (ROM), or a combination thereof.

[0161] FIG. 6C Drawing according to FIG. 6A A schematic diagram of an image captured by the electronic device 60 in the sixth embodiment. FIG. 6C It can be seen that the ultra-wide-angle imaging lens 622 can capture images of a larger range and has the function of capturing more scenery.

[0162] FIG. 6D Drawing according to FIG. 6A A schematic diagram of another image captured by the electronic device 60 in the sixth embodiment. FIG. 6D It can be seen that the high-pixel imaging lens 623 can capture images within a certain range and also has high pixel count, with high resolution and low distortion.

[0163] FIG. 6E Drawing according to FIG. 6A A schematic diagram of another image captured by the electronic device 60 in the sixth embodiment. FIG. 6E It is known that the telephoto imaging lens 624 has a high magnification function, which can capture images at a distance and magnify them to a high degree.

[0164] Depend on FIGS. 6C-6EIt is known that the zooming function can be realized in the electronic device 60 by using the imaging lenses with different focal lengths and combining with the image processing technology.

[0165] <Seventh Embodiment>

[0166] Please refer to FIG. 7 , which shows a schematic diagram of an electronic device 70 according to the seventh embodiment of the present disclosure. As shown in FIG. 7 , the electronic device 70 is a smart phone, and the electronic device 70 comprises an imaging lens. Further, the imaging lens is a super wide-angle imaging lens 711, a wide-angle imaging lens 712, a telephoto imaging lens 713, 714, and a TOF module (Time-Of-Flight) 716. The TOF module 716 can also be other types of imaging lenses, and is not limited to this configuration. Specifically, the imaging lens can be any of the imaging lenses in the first to fifth embodiments, but the present disclosure is not limited thereto.

[0167] Further, the telephoto imaging lens 714 is used to bend the light path, but the present disclosure is not limited thereto.

[0168] According to the camera specifications of the electronic device 70, the electronic device 70 can further comprise an optical anti-shake component (not shown in the figure), and further, the electronic device 70 can further comprise at least one focusing auxiliary module (not shown in the figure) and at least one sensing element (not shown in the figure). The focusing auxiliary module can be a flash module 715 for compensating color temperature, an infrared ranging element, a laser focusing module, etc., and the sensing element can have the functions of sensing physical momentum and acting energy, such as an accelerometer, a gyroscope, a Hall effect element, to sense the shaking and shaking applied by the user's hand or the external environment, thereby facilitating the automatic focusing function of the imaging lens configuration in the electronic device 70 and the play of the optical anti-shake component, to obtain good imaging quality, which helps the electronic device 70 according to the present disclosure to have multiple modes of shooting functions, such as optimized selfie, low light source HDR (High Dynamic Range), high resolution 4K (4K Resolution) video recording, etc.

[0169] In addition, the structures and configuration relationships of the remaining elements of the seventh embodiment and the sixth embodiment are the same, and will not be described again here.

[0170] <Eighth Embodiment>

[0171] Please refer to FIGS. 8A-8C , wherein FIG. 8A , a schematic diagram of a vehicle tool 80 to which an imaging lens 810 according to the eighth embodiment of the present disclosure is applied is shown, FIG. 8B , a schematic diagram of a vehicle tool 80 to which an imaging lens 810 according to the eighth embodiment of the present disclosure is applied is shown, FIG. 8AAnother schematic view of the vehicle tool 80 with the imaging lenses 810 of the eighth embodiment, FIG. 8C FIG. 1 shows a schematic view of a vehicle tool 80 with the imaging lenses 810 of the first embodiment, FIG. 8A Another schematic view of the vehicle tool 80 with the imaging lenses 810 of the eighth embodiment. As shown in FIG. 8, the imaging lenses 810 are disposed at the lower side of the left and right rearview mirrors of the vehicle tool 80. FIGS. 8A-8C As shown in FIG. 8, the electronic device (not shown) is applied to the vehicle tool 80, and the electronic device includes the imaging lenses 810. In the eighth embodiment, the number of the imaging lenses 810 is six, the imaging lenses 810 are vehicle imaging lenses, and the imaging lenses 810 can be any one of the imaging lenses of the first embodiment to the fifth embodiment, but the present disclosure is not limited thereto.

[0172] As shown in FIG. 8, the imaging lenses 810 are disposed at the lower side of the left and right rearview mirrors of the vehicle tool 80. FIG. 8A As shown in FIG. 8, the imaging lenses 810 are disposed at the lower side of the left and right rearview mirrors of the vehicle tool 80. FIG. 8B As shown in FIG. 8, the imaging lenses 810 are disposed at the lower side of the left and right rearview mirrors of the vehicle tool 80, and are used to capture image information of a view angle θ. Specifically, the view angle θ can satisfy the following condition: 40 degrees < θ < 90 degrees. In this way, image information in the range of the left and right lanes can be captured.

[0173] As shown in FIG. 8, the imaging lenses 810 are disposed at the lower side of the left and right rearview mirrors of the vehicle tool 80. FIG. 8B As shown in FIG. 8, the imaging lenses 810 are disposed at the lower side of the left and right rearview mirrors of the vehicle tool 80. FIG. 8C As shown in FIG. 8, the imaging lenses 810 are disposed at the lower side of the left and right rearview mirrors of the vehicle tool 80, and are used to capture image information of a view angle θ. Specifically, the view angle θ can satisfy the following condition: 40 degrees < θ < 90 degrees. In this way, image information in the range of the left and right lanes can be captured.

[0174] As shown in FIG. 8, the imaging lenses 810 are disposed at the lower side of the left and right rearview mirrors of the vehicle tool 80.

[0175] Although the present disclosure has been disclosed with embodiments and examples as above, it is not intended to limit the present disclosure, and anyone with ordinary knowledge in the art can make some changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the definition of the appended claims.

Claims

1. An imaging lens, characterized in that, The optical element has a filling trace; and The anti-reflection film is disposed on at least part of the surface of the optical element, and comprises: A nano-structure layer having a plurality of ridge-shaped protrusions extending in a non-directional manner, wherein a bottom of each ridge-shaped protrusion is closer to the optical element than a top, and each ridge-shaped protrusion tapers from the bottom to the top; and An intermediate layer disposed between the optical element and the nano-structure layer, and comprising: At least two first dielectric layers; and At least one second dielectric layer having a refractive index different from that of each first dielectric layer, and disposed between the at least two first dielectric layers; Wherein a thickness of each first dielectric layer is LT1, and a thickness of the at least one second dielectric layer is LT2, satisfying the following conditions: 42nm < LT1 < 112nm; and 1nm < LT2 < 35nm. A thickness of each first dielectric layer is LT1, satisfying the following condition:

2. The imaging lens of claim 1, wherein, 45nm < LT1 < 90nm. A thickness of the at least one second dielectric layer is LT2, satisfying the following condition:

3. The imaging lens of claim 1, wherein, 3nm < LT2 < 27nm. The intermediate layer further comprises:

4. The imaging lens of claim 1, wherein, At least one third dielectric layer having a refractive index different from that of the at least one second dielectric layer, and disposed adjacent to the at least one second dielectric layer; Wherein a thickness of the at least one third dielectric layer is LT3, satisfying the following condition: 3nm < LT3 < 38nm. A thickness of each first dielectric layer is LT1, and a thickness of the at least one third dielectric layer is LT3, satisfying the following condition:

5. The imaging lens of claim 4, wherein, 2.3 < LT1 / LT3 < 9.

6. The refractive index of the at least one second dielectric layer is higher than that of each first dielectric layer and that of the at least one third dielectric layer.

6. The imaging lens of claim 4, wherein, A portion of a top of the intermediate layer is in contact with air.

7. The imaging lens of claim 1, wherein, An average height of the plurality of ridge-shaped protrusions is greater than 78nm and less than 308nm.

8. The imaging lens of claim 1, wherein, The nano-structure layer is an aluminum oxide layer.

9. The imaging lens of claim 8, wherein, Each first dielectric layer is a silicon oxide layer.

10. The imaging lens of claim 1, wherein, The at least one second dielectric layer is a titanium oxide layer.

11. The imaging lens of claim 1, wherein, The at least one third dielectric layer is a silicon oxide layer.

12. The imaging lens of claim 4, wherein, An average reflectivity of the at least part of the surface of the optical element provided with the nano-structure layer corresponding to light wavelengths of 420nm to 760nm is R4276, satisfying the following condition:

13. The imaging lens of claim 1, wherein, An average reflectivity of the at least part of the surface of the optical element provided with the nano-structure layer corresponding to light wavelengths of 420nm to 760nm is R4276, satisfying the following condition: 0％<R4276<0.2％。 14. The imaging lens of claim 13, wherein, The optical element comprises: 0％<R4276<0.1％。 15. The imaging lens of claim 1, wherein, An extinction structure forming a concave-convex surface of the optical element, and the extinction structure is integrally formed with the optical element. The extinction structure has a plurality of protrusions arranged in a regular manner.

16. The imaging lens of claim 15, wherein, An average height of each protrusion is greater than 40μm and less than 1000μm.

17. The imaging lens of claim 16, wherein, An average height of each protrusion is greater than 50μm and less than 500μm.

18. The imaging lens of claim 17, wherein, Further comprising:

19. The imaging lens of claim 1, wherein, An adhesive element for fixing the optical element. An imaging lens as claimed in claim 1.

20. An electronic device, comprising: ​ ​

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