Device for improving heat dissipation efficiency of server

Abstract

The utility model relates to the technical field of heat dissipation equipment, and discloses a device for improving the heat dissipation efficiency of a server, which comprises two first side fixing frames, two second side fixing frames fixedly connected between the two first side fixing frames, and a plurality of cooling pipes fixedly connected between the two second side fixing frames, cooling fins are fixedly connected between the two cooling pipes, and cooling fans are fixedly installed on the two first side fixing frames. A plurality of cooling pipes and cooling fins are arranged between the two first side fixing frames and the second side fixing frame and can be matched with a cooling fan to rapidly conduct heat dissipation treatment, and a heat conduction mechanism is arranged at the lower ends of the first side fixing frames and the second side fixing frame and composed of a connecting cover, a heat conduction box, a flow guide pipe and other structures. And the inner side of the heat conduction box is provided with the slow pressing plate, the flow guide plate and the heat conduction sheet, so that the cooling medium can be automatically shunted and circulated among the heat conduction box, the flow guide pipe, the connecting cover and the heat dissipation sheet according to the flow resistance principle.

Description

TECHNICAL FIELD

[0001] The utility model relates to a heat dissipation equipment technical field, especially in improving the device of server heat dissipation efficiency. BACKGROUND

[0002] With the rapid development of information technology, the performance of server is continuously improved, and the heat generated in the running process is also increasing, and the efficient heat dissipation system becomes the key factor of guaranteeing the stable operation of server, prolonging the service life of equipment and improving the data processing efficiency, if the server is not cooled in time, the high temperature will cause the performance of electronic components to decline, even cause failure, cause data loss and service interruption, and bring huge loss to enterprises and users,

[0003] At present, the common server cooling mode mainly includes air cooling and liquid cooling, the air cooling relies on the fan forced convection to take away the heat, but with the improvement of server integration, its heat dissipation capacity is gradually limited, and it is difficult to meet the increasing heat dissipation demand, although the liquid cooling has high heat dissipation efficiency, the system is complex, the cost is high, and there is a risk of liquid leakage, and the maintenance difficulty is large, in addition, the existing heat dissipation structure often cannot fully utilize the cooling medium, and the flow rate of the cooling medium is slow in the circulation process, so that the heat dissipation effect cannot reach the best state. UTILITARIAN CONTENT

[0004] The utility model aims at providing a kind of device for improving the heat dissipation efficiency of server, cooling pipe, fin and fan are equipped between two side fixed frames to realize rapid heat dissipation, heat conduction mechanism containing connecting cover is equipped at lower end, cooling medium circulation speed is raised by flow resistance, heat dissipation is strengthened, and the problems in the background art can be effectively solved.

[0005] To achieve the above object, the technical scheme adopted by the utility model is as follows:

[0006] A kind of device for improving the heat dissipation efficiency of server, including two first side fixed frame, two first side fixed frame are fixedly connected with two second side fixed frame between, multiple cooling pipes are fixedly connected between two second side fixed frame, and fin is fixedly connected between two cooling pipes, and heat dissipation fan is fixedly installed on two first side fixed frame, the heat dissipation fan is electrically connected with server internal wiring port by connecting line, and heat conduction mechanism is also fixedly installed at the lower place of two first side fixed frame and second side fixed frame, the heat conduction mechanism includes two connecting cover and a heat conduction box, and multiple flow guide pipes are fixedly connected between the heat conduction box and two connecting cover.

[0007] As a further preferred scheme of the utility model, the fin is disc-shaped structure, the fin is set to disc-shaped structure and placed between two cooling pipes, the heat of medium in cooling pipe can be quickly exported, and it is discharged quickly in cooperation with heat dissipation fan.

[0008] As a further preferred scheme of the utility model, two first side fixed frames and second side fixed frames are further fixedly connected with sealing covers.

[0009] As a further preferred scheme of the utility model, two connecting covers are fixedly installed in one of the sealing covers respectively, and one of the connecting covers is fixedly installed with a water injection nozzle, and the setting of the two connecting covers can make the cooling medium circulate in the radiating fins, connecting covers, flow guide pipes and heat conducting boxes.

[0010] As a further preferred scheme of the utility model, a pressure relief plate is fixedly installed on one side of the top of the heat conducting box, the pressure relief plate is arranged obliquely, and a flow guide plate is fixedly installed at the lower end of the pressure relief plate.

[0011] As a further preferred scheme of the utility model, a plurality of heat conducting fins are fixedly installed on the bottom of the heat conducting box, and the heat conducting fins are located between the two flow guide pipes, and the other end of the heat conducting fins is fixedly connected with the pressure relief plate and the flow guide plate, and the setting of the pressure relief plate can make the heated medium in the heat conducting box enter the connecting cover through the plurality of flow guide pipes away from the pressure relief plate and be distributed to the plurality of cooling pipes, and then the resistance and pressure difference of the medium flow make the cooled medium enter the heat conducting box through the plurality of flow guide pipes close to the pressure relief plate and accelerate the medium flow rate by cooperating with the narrowed channel, so that the heated medium in the heat conducting box is quickly pushed into the connecting cover and the cooling pipe.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] In the utility model, a plurality of cooling pipes and radiating fins are arranged between the two first side fixed frames and second side fixed frames, which can cooperate with the radiating fan to quickly perform the heat dissipation treatment, the heat conducting mechanism is arranged at the lower end of the first side fixed frame and the second side fixed frame, the heat conducting mechanism is composed of the connecting cover, the heat conducting box, the flow guide pipe and the like, and the pressure relief plate, the flow guide plate and the heat conducting fin are arranged on the inner side of the heat conducting box, the cooling medium can be automatically distributed and circulated between the heat conducting box, the flow guide pipe, the connecting cover and the radiating fin by the principle of flow resistance, and the cooling medium flow rate is accelerated, and the cooling effect is further improved. ACCOUT OF DRAWINGS

[0014] Figure 1 It is the main body structure schematic view of the utility model;

[0015] Figure 2 It is the main body structure split schematic view of the utility model;

[0016] Figure 3 It is Figure 2 The enlarged view of A in the middle;

[0017] Figure 4The utility model discloses a heat conduction box and flow guide pipe section view.

[0018] In the figure: 1, first side fixed frame, 2, second side fixed frame, 3, cooling pipe, 4, cooling fin, 5, cooling fan, 6, heat conduction mechanism, 7, connecting cover, 8, heat conduction box, 9, flow guide pipe, 10, sealing cover, 11, water injection nozzle, 12, pressure relief plate, 13, flow guide plate, 14, heat conduction fin. DETAILED DESCRIPTION

[0019] In order to make the technical means, creation features, purposes and effects of the utility model easy to understand, the utility model is further described below in combination with specific embodiments.

[0020] As Figures 1-4 The utility model provides a device for improving server heat dissipation efficiency, including two first side fixed frame 1, two first side fixed frame 1 between fixed connection have two second side fixed frame 2, two second side fixed frame 2 between fixed connection have a plurality of cooling pipe 3, and two cooling pipe 3 between fixed connection have cooling fin 4, two first side fixed frame 1 on fixed mounting has cooling fan 5, and cooling fan 5 passes through connecting line and server internal wiring port electric connection, two first side fixed frame 1 with second side fixed frame 2 below still fixed mounting has heat conduction mechanism 6, and heat conduction mechanism 6 includes two connecting cover 7 with a heat conduction box 8, and heat conduction box 8 with two connecting cover 7 between fixed connection have a plurality of flow guide pipe 9.

[0021] As Figures 2-3 Cooling fin 4 is disc structure, and cooling fin 4 is set to disc structure and is placed between two cooling pipe 3, can realize the quick export of the medium heat in cooling pipe 3, and cooperates cooling fan 5 and exports quickly, and two first side fixed frame 1 with second side fixed frame 2 between still fixed connection have sealing cover 10, and two connecting cover 7 one side respectively fixed mounting in one sealing cover 10, and one connecting cover 7 on fixed mounting has water injection nozzle 11, by the setting of two connecting cover 7, can make that cooling medium is in cooling fin 4, connecting cover 7, flow guide pipe 9, heat conduction box 8 between confluence and shunt circulation.

[0022] As Figures 2-4As shown, the heat conduction box 8 is fixedly installed with a buffer plate 12 on one side of the top, the buffer plate 12 is arranged obliquely, the buffer plate 12 is fixedly installed with a flow guide plate 13 at the lower end, a plurality of heat conduction fins 14 are fixedly installed on the bottom of the heat conduction box 8, and the heat conduction fins 14 are located between the two flow guide pipes 9, and the other end of the heat conduction fins 14 is fixedly connected with the buffer plate 12 and the flow guide plate 13. Through the setting of the buffer plate 12, the heated medium in the heat conduction box 8 can enter the connecting cover 7 through the plurality of flow guide pipes 9 away from the buffer plate 12 and be distributed to the plurality of cooling pipes 3, and then the resistance and pressure difference of the medium flow can make the cooled medium enter the heat conduction box 8 through the plurality of flow guide pipes 9 close to the buffer plate 12 and cooperate with the reduced channel to accelerate the medium flow rate, so that the heated medium in the heat conduction box 8 is quickly pushed into the connecting cover 7 and the cooling pipe 3.

[0023] It should be noted that the utility model is a device for improving the heat dissipation efficiency of a server. Before use, the lower end surface of the heat conduction box 8 is smeared with heat-conducting silicone grease, and the lower end of the two first side fixed frames 1 is fixedly installed on the mainboard through screws, so that the lower end surface of the heat conduction box 8 is tightly attached to the corresponding chip on the mainboard, and the upper end surface of the heat dissipation fan 5 is inserted into the channel of the top shell of the server. When the chip is running and generates heat, the heat generated by the chip is conducted to the cooling medium in the heat conduction box 8 through the heat conduction box 8 and the heat conduction fins 14, so that the cooling medium in the heat conduction box 8 is heated. Due to the buffer plate 12 arranged on one side of the heat conduction box 8, the flow direction of the medium is guided, so that the heated cooling medium conducts heat to the cooling medium in the plurality of cooling pipes 3 through the flow guide pipe 9 and the connecting cover 7, and then the heat is conducted again through the plurality of heat dissipation fins 4 and the heat dissipation fan 5. At the same time, since the cooling pipe 3, the connecting cover 7, the flow guide pipe 9 and the heat conduction box 8 form a closed circulation structure, the heated cooling medium in the heat conduction box 8 also enters the corresponding connecting cover 7 through the plurality of flow guide pipes 9 away from the buffer plate 12 and is distributed to the plurality of cooling pipes 3, so that the cooled medium is pushed into another connecting cover 7 by the subsequent medium pressure and reenters the buffer plate 12 through the corresponding flow guide pipe 9. The buffer plate 12 reduces the channel of the cooling medium flowing into the heat conduction box 8, so that the cooling medium enters the heat conduction box 8 at a high speed and impacts the cooling medium at the bottom of the heat conduction box 8, thereby improving the heat conduction efficiency of the heat conduction box 8 and the cooling medium on the chip.

[0024] The basic principle and main features of the present application and the advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited by the above examples, and the above examples and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A device for improving server heat dissipation efficiency, characterized in that: The utility model provides a server cooling device, including two first side fixed frame (1), two first side fixed frame (1) between fixed connection have two second side fixed frame (2), two second side fixed frame (2) between fixed connection have a plurality of cooling pipe (3), and two cooling pipe (3) between fixed connection have fin (4), two first side fixed frame (1) on fixed mounting have radiating fan (5), radiating fan (5) pass through connecting wire and server internal wiring port electric connection, two first side fixed frame (1) with second side fixed frame (2) below still fixed mounting have heat conduction mechanism (6), heat conduction mechanism (6) including two connecting cover (7) with a heat conduction box (8), heat conduction box (8) with two connecting cover (7) between fixed connection have a plurality of flow guide pipe (9).

2. The device for improving the heat dissipation efficiency of a server according to claim 1, characterized in that: The fin (4) is in a disc shape.

3. The device for improving the heat dissipation efficiency of a server according to claim 1, characterized in that: Two first side fixed frame (1) and second side fixed frame (2) between fixed connection still have sealing cover (10).

4. The device for improving the heat dissipation efficiency of a server according to claim 3, characterized in that: Two connecting cover (7) one side is fixedly installed in one sealing cover (10) respectively, and one connecting cover (7) is fixedly installed with water injection nozzle (11) on.

5. The device for improving the heat dissipation efficiency of a server according to claim 1, characterized in that: The heat conduction box (8) is internally provided with a pressure relief plate (12) fixedly installed on one side of the top portion, the pressure relief plate (12) is arranged obliquely, and the lower end of the pressure relief plate (12) is fixedly installed with a flow guide plate (13).

6. The device for improving the heat dissipation efficiency of a server according to claim 5, characterized in that: The heat conduction box (8) is internally provided with a plurality of heat conduction fins (14) fixedly installed on the bottom portion, the heat conduction fins (14) are located between two flow guide pipes (9), and the other ends of the heat conduction fins (14) are fixedly connected with the pressure relief plate (12) and the flow guide plate (13). The heat conduction box (8) is internally provided with a plurality of heat conduction fins (14) fixedly installed on the bottom portion, the heat conduction fins (14) are located between two flow guide pipes (9), and the other ends of the heat conduction fins (14) are fixedly connected with the pressure relief plate (12) and the flow guide plate (13).

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