Electronic equipment component heat dissipation device and electronic equipment

Abstract

The utility model discloses an electronic equipment component heat dissipation device and electronic equipment. The electronic equipment component heat dissipation device comprises a shell assembly, a first heat dissipation assembly, a second heat dissipation assembly, a first heat dissipation assembly and a second heat dissipation assembly, the first liquid cooling assembly is located above the shell assembly, the upper surface of the shell assembly is in contact heat transfer fit with the first liquid cooling assembly, the orthographic projection of the shell assembly on the surface of the first liquid cooling assembly is located in the range of the first liquid cooling assembly, and the first liquid cooling assembly is provided with a cooling flow channel allowing a refrigerant to circulate; a refrigerant in the cooling flow channel is in heat transfer fit with the shell assembly; the second liquid cooling assembly is arranged on the side face of the first component and used for being matched with a second component in a heat dissipation mode, the second liquid cooling assembly communicates with the first liquid cooling assembly, and a refrigerant enters the first liquid cooling assembly through the second liquid cooling assembly and is discharged by the second liquid cooling assembly. The problem that the heat dissipation performance of the server memory module in the related technology is poor is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment, in particular to an electronic equipment component heat dissipation device and electronic equipment. BACKGROUND

[0002] In the aspect of server memory modules, the heat dissipation efficiency of the traditional air cooling scheme cannot meet the heat dissipation demand under the condition of continuous high load for memory modules and the like, resulting in the situation that the memory modules and the like overheat and reduce in frequency, which seriously affects the performance release and stability of the server. Some schemes adopt the form of additionally arranging a liquid cooling plate at the modules to assist in heat dissipation, but this way, due to the need to additionally arrange components, the space at the memory position is small, resulting in a too compact structure, which is more unfavorable for heat dissipation, and also has an adverse effect on the heat dissipation of other devices on the board. CONTENT OF THE UTILITY MODEL

[0003] The present application provides an electronic equipment component heat dissipation device and electronic equipment to at least solve the problem of poor heat dissipation performance of server memory modules in the related art.

[0004] The present application provides an electronic equipment component heat dissipation device, comprising: a shell assembly, which is detachably mounted on the outer side of a first component and is in contact and heat transfer cooperation with the first component; a first liquid cooling assembly, which is located above the shell assembly, the upper surface of the shell assembly is in contact and heat transfer cooperation with the first liquid cooling assembly, and the orthographic projection of the shell assembly on the surface of the first liquid cooling assembly is located within the range of the first liquid cooling assembly, the first liquid cooling assembly has a cooling flow channel for the circulation of refrigerant, and the refrigerant in the cooling flow channel is in heat transfer cooperation with the shell assembly; and a second liquid cooling assembly, which is arranged at the side of the first component and is used for heat dissipation cooperation with a second component, the second liquid cooling assembly is arranged in communication with the first liquid cooling assembly, the refrigerant enters the first liquid cooling assembly through the second liquid cooling assembly and is discharged from the second liquid cooling assembly.

[0005] Further, the shell assembly is multiple, at least two shell assemblies are arranged at intervals and form a containing space, and the second liquid cooling assembly is arranged in the containing space.

[0006] Further, the upper surface of the second liquid cooling assembly is lower than the lower surface of the first liquid cooling assembly, and an avoiding area for arranging a pipeline is formed between the first liquid cooling assembly and the second liquid cooling assembly.

[0007] Further, the second liquid cooling assembly comprises: a shell, which is connected with the first liquid cooling assembly; and a toothed structure, which is arranged in the shell and forms an overflow channel for the passage of refrigerant.

[0008] Further, the shell assemblies are arranged transversely, and the shell assemblies are arranged on the outer side of the at least one first component; and the first liquid cooling assemblies are arranged transversely, and at least some of the shell assemblies are arranged in the range of one first liquid cooling assembly and are in heat transfer cooperation with the one first liquid cooling assembly.

[0009] Further, the shell assembly comprises a first shell part, a second shell part, the first shell part and the second shell part are arranged on the opposite sides of the first component and form a clamping area for clamping the first component, the first shell part and / or the second shell part are in contact and heat transfer cooperation with the first liquid cooling assembly; and a clamping member arranged on the outer side of the first shell part and the second shell part and drives the first shell part and the second shell part to move towards each other to clamp the first component.

[0010] Further, the shell assembly further comprises a heat conduction member arranged between the first shell part and the first component and / or between the second shell part and the first component, the first shell part and / or the second shell part are in heat transfer cooperation with the first component through the heat conduction member; a heat conduction layer plated on the surface of the first shell part and / or the second shell part, the heat conduction member is in contact and heat transfer cooperation with the heat conduction layer; and an insulation layer embedded on the side of the first shell part and / or the second shell part away from the clamping area.

[0011] Further, the electronic device component heat dissipation device further comprises a handle assembly arranged above the first liquid cooling assembly and connected with the first liquid cooling assembly, and the handle assembly has an operation part for operation.

[0012] Further, the handle assembly comprises a connecting frame connected with the top of the first liquid cooling assembly, and a handle connected with the connecting frame, the handle has an operation part, and the operation part is arranged to be bent away from the connecting frame.

[0013] The application further provides an electronic device comprising a cabinet, a first component, a second component and the above-mentioned electronic device component heat dissipation device, the first component, the second component and the electronic device component heat dissipation device are arranged in the cabinet, the shell assembly of the electronic device component heat dissipation device is arranged on the outer side of the first component and is in heat transfer cooperation with the first component, and the second liquid cooling assembly of the electronic device component heat dissipation device is in contact and heat transfer cooperation with the second component.

[0014] This application provides a housing assembly on the outside of a first component requiring heat dissipation, and a first liquid cooling assembly on top of it. The first liquid cooling assembly is larger than the housing assembly, allowing it to work in conjunction with the housing assembly. This enables the heat generated by the first component to be transferred to the housing assembly via contact heat transfer, and then stably transferred from the housing assembly to the first liquid cooling assembly, where it exchanges heat with the refrigerant inside. This ensures timely heat dissipation and maintains the heat dissipation effect of the first component. Simultaneously, this embodiment provides a second liquid cooling assembly on the side of the first component. The second liquid cooling assembly not only supplies liquid to the first liquid cooling assembly, enabling the refrigerant to flow between the two assemblies, but also works in conjunction with an external second component. Since refrigerant also flows within the second liquid cooling assembly, it also contributes to heat dissipation, thus enabling the second liquid cooling assembly to effectively dissipate heat from the second component. The above-mentioned arrangement can improve the heat dissipation effect of the first component, enabling it to dissipate heat efficiently and stably, ensuring its stable operation. On the other hand, it redesigns the layout of the heat dissipation device, utilizing the space above and to the side of the first component to maximize space utilization while still ensuring efficient heat dissipation. Attached Figure Description

[0015] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of the heat dissipation device for electronic components provided in the embodiments of this application;

[0017] Figure 2 for Figure 1 Top view;

[0018] Figure 3 for Figure 1 The main view;

[0019] Figure 4 for Figure 1 A schematic diagram of the structure in which the housing assembly mates with the first component;

[0020] Figure 5 An exploded view of a heat dissipation device for electronic components.

[0021] Figure 6 This is an exploded view of the housing assembly;

[0022] Figure 7 An exploded view of the handle assembly.

[0023] Wherein, the above figures include the following reference signs:

[0024] 10, housing assembly; 11, first housing part; 12, second housing part; 13, clamping part; 14, mounting protrusion; 15, heat conduction part; 16, insulation layer; 20, first liquid cooling assembly; 21, liquid cooling plate; 22, pipe body; 30, second liquid cooling assembly; 31, shell; 32, spading tooth structure; 40, handle assembly; 41, connecting frame; 42, handle; 50, first component. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0026] It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. The terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium; it can be the communication inside two elements. The terms "parallel", "perpendicular", "equal" include the described case and the approximate case similar to the described case, and the approximate case is within an acceptable deviation range, wherein the acceptable deviation range is determined by considering the measurement being discussed and the error related to the measurement of the specific quantity (i.e. the limitation of the measurement system) by the ordinary skilled in the art. For example, "parallel" includes absolute parallel and approximate parallel, and the acceptable deviation range of approximate parallel can be, for example, within 5°; "perpendicular" includes absolute perpendicular and approximate perpendicular, and the acceptable deviation range of approximate perpendicular can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, and the acceptable deviation range of approximate equality can be, for example, that the difference between the two equalities is less than or equal to 5% of either. For the ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood in specific cases.

[0027] In order for those skilled in the art to better understand the scheme of the present application, the present application will be further described in detail below in combination with the drawings and specific embodiments.

[0028] In order to solve the problem of poor heat dissipation performance of the server memory module in the related art, the present application provides an electronic equipment component heat dissipation device and an electronic equipment.

[0029] As Figures 1 to 7The electronic device component heat dissipation device shown comprises a shell assembly 10, a first liquid cooling assembly 20 and a second liquid cooling assembly 30. The shell assembly 10 is detachably mounted on the outer side of the first component 50 and is in contact heat transfer cooperation with the first component 50. The first liquid cooling assembly 20 is located above the shell assembly 10, the upper surface of the shell assembly 10 is in contact heat transfer cooperation with the first liquid cooling assembly 20, and the orthographic projection of the shell assembly 10 on the surface of the first liquid cooling assembly 20 is located within the range of the first liquid cooling assembly 20. The first liquid cooling assembly 20 has a cooling flow channel for the circulation of refrigerant, and the refrigerant in the cooling flow channel is in heat transfer cooperation with the shell assembly 10. The second liquid cooling assembly 30 is arranged at the side of the first component 50 and is used for heat dissipation cooperation with the second component. The second liquid cooling assembly 30 is arranged in communication with the first liquid cooling assembly 20. The refrigerant enters the first liquid cooling assembly 20 through the second liquid cooling assembly 30 and is discharged from the second liquid cooling assembly 30.

[0030] In the embodiment, the shell assembly 10 is arranged on the outer side of the first component 50 in need of heat dissipation, and the first liquid cooling assembly 20 is arranged above the shell assembly 10. The size of the first liquid cooling assembly 20 is greater than that of the shell assembly 10, so that the first liquid cooling assembly 20 can cooperate with the shell assembly 10. The heat generated by the first component 50 is transmitted to the shell assembly 10 in the form of contact heat transfer, and then stably transmitted to the first liquid cooling assembly 20 by the shell assembly 10, and exchanged with the refrigerant in the first liquid cooling assembly 20, so that the heat generated by the first component 50 can be timely transmitted and dissipated, and the heat dissipation effect of the first component 50 is ensured. Meanwhile, the second liquid cooling assembly 30 is arranged at the side of the first component 50. The second liquid cooling assembly 30 can not only supply liquid to the first liquid cooling assembly 20 and realize the flow of refrigerant between the first liquid cooling assembly 20 and the second liquid cooling assembly 30, but also cooperate with the external second component. Since the refrigerant also flows in the second liquid cooling assembly 30, the second liquid cooling assembly 30 can also play a role in heat dissipation, so that the second liquid cooling assembly 30 can play a role in heat dissipation for the second component. The above arrangement can improve the heat dissipation effect of the first component 50, so that the first component 50 can efficiently and stably dissipate heat, and ensure that the first component 50 can work stably. On the other hand, the layout of the heat dissipation device is redesigned, the space above and on the side of the first component 50 is utilized, so that the space utilization rate is maximized, and the efficient heat dissipation effect is still ensured.

[0031] The electronic device is taken as an example in the embodiment, and correspondingly, the first component 50 is a memory, and the second component is a processor or the like on a motherboard. Meanwhile, the motherboard is taken as an example in the embodiment, and the memory is inserted into the motherboard and vertically arranged. Of course, the electronic device can also be other devices, such as a router, an artificial intelligence training platform, a base station device, and the like, and correspondingly, the first component 50 and the second component are components in the device.

[0032] As shown in Figure 1 , Figure 3 and Figure 5 , in the embodiment, since the first component 50 is multiple, the shell assembly 10 is also multiple, and the shell assemblies 10 are arranged in sequence along the arrangement direction of the first component 50, and at least two shell assemblies 10 are arranged at intervals, so that the accommodation space is formed therebetween, the accommodation space has a certain size, and the second liquid cooling assembly 30 is arranged in the accommodation space. Taking the transverse arrangement of the first component 50 as an example, the interval distance between two first components 50 is large, so the interval distance between the two shell assemblies 10 is also large, and the accommodation space is formed between the two shell assemblies 10, so that the second liquid cooling assembly 30 can be placed in the part of the accommodation space, the integrated arrangement of the second liquid cooling assembly 30 can be realized, and the space utilization rate can be improved.

[0033] In the embodiment, since the first liquid cooling assembly 20 is arranged above the shell assembly 10, and the second liquid cooling assembly 30 is arranged on the side of the shell assembly 10, the second liquid cooling assembly 30 is preferably arranged below the first liquid cooling assembly 20 in the height direction, that is, the upper surface of the second liquid cooling assembly 30 is lower than the lower surface of the first liquid cooling assembly 20, so that the second liquid cooling assembly 30 and the first liquid cooling assembly 20 are arranged in a staggered manner, and there is a certain distance between the two in the height direction, so that the first liquid cooling assembly 20 and the second liquid cooling assembly 30 form an avoiding area in the height direction, which can be used to install a pipeline or the like connecting the two assemblies, so as to realize effective use of space, and the pipeline can also have a certain heat dissipation effect, so as to reduce the temperature of the environment near the first component 50.

[0034] As shown in Figure 5As shown, in the embodiment, the second liquid cooling assembly 30 comprises a shell 31 and a spade tooth structure 32, the shell 31 adopts a shell structure, the inside of which is hollow, and the shell 31 is connected with the first liquid cooling assembly 20; the spade tooth structure 32 is arranged in the shell 31, and the spade tooth structure 32 forms a flow passage for the refrigerant to pass through. Since there is a certain height difference between the second liquid cooling assembly 30 and the first liquid cooling assembly 20 in the embodiment, a connecting column is arranged between the two, the top end and the bottom end of the connecting column are connected with the bottom of the first liquid cooling assembly 20 and the top of the shell 31 respectively, and a bolt can be arranged on the first liquid cooling assembly 20, the connecting column and the shell 31, so as to connect the second liquid cooling assembly 30 and the first liquid cooling assembly 20 together, so that the heat dissipation device forms a whole component. The spade tooth structure 32 can enhance the heat exchange effect, and the spade tooth structure 32 can adopt the form of a spade tooth microchannel, the refrigerant absorbs heat when flowing through the spade tooth microchannel in the inside of the shell 31, forms a turbulent flow effect to enhance the heat exchange performance, and the liquid after being heated is discharged from the second liquid cooling assembly 30 through the liquid outlet steel plate spade tooth, so as to complete the heat exchange.

[0035] In the embodiment, the shell assemblies 10 are arranged transversely, and the shell assemblies 10 are arranged on the outside of at least one first component 50. In the embodiment, the first components 50 and the shell assemblies 10 are matched one by one, and of course, a plurality of first components 50 can be arranged in one shell assembly 10. The first components 50 and the shell assemblies 10 in the embodiment are arranged in groups, the shell assemblies 10 in the same group are arranged closely, the gap between the shell assemblies 10 in the same group is small, and the shell assemblies 10 in different groups are arranged far apart, so that the shell assemblies 10 in different groups form a containing space.

[0036] Correspondingly, the first liquid cooling assembly 20 of the embodiment is also provided in multiple, and each first liquid cooling assembly 20 is arranged transversely, and at least part of the shell assembly 10 is located in the range of the same first liquid cooling assembly 20 and is in heat transfer cooperation with the same first liquid cooling assembly 20. The number of the first liquid cooling assembly 20 used in the embodiment is the same as the number of the shell assembly 10, so that each group of shell assemblies 10 cooperates with a first liquid cooling assembly 20, and the interval between the first liquid cooling assemblies 20 is located above the accommodation space, so that each group of first components 50 and the shell assembly 10 above is provided with a first liquid cooling assembly 20, so that each group of first components 50 is covered by a first liquid cooling assembly 20 and forms a heat dissipation cooperation form with the first liquid cooling assembly 20, so that the heat dissipation process between each group of first components 50 is relatively independent, and the heat dissipation effect of each group is guaranteed. Of course, in addition to the above setting mode, one first liquid cooling assembly 20 can be arranged above two or more groups of shell assemblies 10, so that at this time, one first liquid cooling assembly 20 simultaneously cooperates with multiple groups of first components 50 for heat dissipation, so that the structure is simpler.

[0037] Optionally, the first liquid cooling assembly 20 and the second liquid cooling assembly 30 can be arranged in series and / or parallel according to needs, and the embodiment adopts a series arrangement form. Specifically, the embodiment is provided with three groups of shell assemblies 10, three first liquid cooling assemblies 20 and two second liquid cooling assemblies 30, and the first liquid cooling assembly 20 and the second liquid cooling assembly 30 are sequentially connected in series to form a series form of one first liquid cooling assembly 20, another first liquid cooling assembly 20, another first liquid cooling assembly 20, one second liquid cooling assembly 30 and another second liquid cooling assembly 30, and the first liquid cooling assembly 20 and the second liquid cooling assembly 30 at the head and tail ends of the series are located at the same end of the heat dissipation device as a whole, and the distance between them is close, so that a flow distributor or the like can be arranged there to realize the docking cooperation with the external liquid supply equipment. Of course, the above connection mode can also adopt a parallel form, or simultaneously adopt a series and parallel form to form a part series and part parallel form.

[0038] As Figure 4As shown, in the present embodiment, the shell assembly 10 comprises a first shell part 11, a second shell part 12 and a clamping member 13, the first shell part 11 and the second shell part 12 are located on opposite sides of the first component 50 and form a clamping area for clamping the first component 50, and the first shell part 11 and / or the second shell part 12 are in contact and heat transfer fit with the first liquid cooling assembly 20. The first shell part 11 and the second shell part 12 each form a half-shell structure, and they can approach and clamp the first component 50 from opposite sides of the first component 50, so as to form a waistcoat structure between them, achieving clamping and heat transfer fit with the first component 50. At the same time, the clamping member 13 is arranged outside the first shell part 11 and the second shell part 12, and the clamping member 13 can adopt the structure of a clamp, which has a certain elastic force, so as to drive the first shell part 11 and the second shell part 12 to move towards each other by the elastic force, and then the first shell part 11 and the second shell part 12 can clamp the first component 50, achieving stable fit with the first component 50.

[0039] In the present embodiment, the first shell part 11 and / or the second shell part 12 has a mounting recess on the side away from the clamping area, and the present embodiment is provided with mounting recesses on both the first shell part 11 and the second shell part 12, and the form of the mounting recess is roughly adapted to the shape of the clamping member 13, so that when the clamping member 13 clamps and presses the shell parts, at least a part of the clamping member 13 can be located in the mounting recess, so that the clamping member 13 and the two shell parts can form a stable and reliable fit extrusion relationship, ensuring the force application effect and avoiding the situation of slipping off.

[0040] The mounting recess of the embodiment has a U-shaped structure, more specifically, a U-shaped groove form, the U-shaped groove is open upward, and the two ends of the U-shaped groove are in communication with the top end surface of the shell part, correspondingly, the clamping piece 13 adopts an inverted U-shaped structure form, so that its shape corresponds to the mounting recess, the two bottom ends of the clamping piece 13 can extend into the U-shaped groove, thereby realizing partial embedding in the shell part, and realizing the close fit between the shell part. Based on the above-mentioned U-shaped groove structure, the mounting protrusion 14 is naturally formed inside the U-shaped groove, that is, the first shell part 11 and / or the second shell part 12 also has a mounting protrusion 14 inside the U-shaped structure, correspondingly, the clamping piece 13 has a avoiding recess, the mounting protrusion 14 is arranged corresponding to the position of the avoiding recess, so that when the clamping piece 13 is located in the mounting recess, the mounting protrusion 14 is located in the avoiding recess, in this way, the mounting protrusion 14 and the side surface of the avoiding recess form a limiting fit relationship, since the clamping piece 13 is embedded in the mounting recess at this time, so that the mounting protrusion 14 can prevent the clamping piece 13 from moving upward and exiting the mounting recess, thereby stably and reliably installing the clamping piece 13 on the first shell part 11 and the second shell part 12, ensuring the clamping force effect on the first shell part 11 and the second shell part 12. When it is necessary to disassemble the clamping piece 13, only need to push the clamping piece 13 horizontally outward, so that the clamping piece 13 is horizontally separated from the mounting recess, the limiting relationship between the mounting protrusion 14 and the avoiding recess is also naturally contacted, so that the clamping piece 13 can be taken out upward, realizing the effect of disassembling the shell assembly 10 from the first component 50.

[0041] In the embodiment, the shell assembly 10 further comprises a heat conduction piece 15, the heat conduction piece 15 can adopt a heat conduction paste, at least one of the positions between the first shell part 11 and the first component 50 and between the second shell part 12 and the first component 50 is provided with the heat conduction piece 15, the embodiment is provided with the heat conduction piece 15 at the above-mentioned two positions, so that the first shell part 11 and the second shell part 12 can realize heat transfer fit with the first component 50 through the heat conduction piece 15, thereby improving the heat dissipation effect of the first component 50, and preventing adsorption for a long time, causing the operation and maintenance parts to fall off or be pasted on the product, causing adverse effects.

[0042] The first shell part 11 and / or the second shell part 12 of the embodiment is plated with a heat conduction layer. Since the first shell part 11 and the second shell part 12 of the embodiment both have the heat conduction effect, the inner surfaces of the first shell part 11 and the second shell part 12 are provided with the heat conduction layer, and the heat conduction layer and the heat conduction piece 15 are in contact and heat conduction cooperation, so that the first shell part 11 and the second shell part 12 realize high-efficiency heat exchange cooperation with the first component 50 through the heat conduction layer and the heat conduction piece 15. The heat conduction layer and the heat conduction piece 15 can effectively fill the micro gaps of the contact surface, reduce the interface thermal resistance by more than 40%, and realize self-adaptive contact pressure distribution.

[0043] The shell assembly 10 of the embodiment further comprises an insulation layer 16 which can be in the form of a Mylar film. The insulation layer 16 is embedded at the side of the first shell part 11 and / or the second shell part 12 away from the clamping area. In this way, the outer side of the first shell part 11 and the second shell part 12 can be isolated and protected, so that the operator can avoid injury when operating the first shell part 11 and the second shell part 12, ensuring safety.

[0044] As shown in Figure 2 , Figure 5 and Figure 7 , the electronic device component heat dissipation device further comprises a handle assembly 40 which is arranged above the first liquid cooling assembly 20 and connected with the first liquid cooling assembly 20. The handle assembly 40 has an operation part for operation. Since the first liquid cooling assembly 20 and the second liquid cooling assembly 30 are connected together in the embodiment, the first liquid cooling assembly 20 and the second liquid cooling assembly 30 can be moved integrally through the handle assembly 40. When in use, the operator first installs the shell assembly 10 on the first component 50, inserts the first component 50 on the mainboard, holds the operation part, lifts and moves the first liquid cooling assembly 20 and the second liquid cooling assembly 30 above the mainboard, and then lowers them to install the first liquid cooling assembly 20 above the shell assembly 10 and the second liquid cooling assembly 30 above the second component. Then, the second liquid cooling assembly 30, the first liquid cooling assembly 20 and the mainboard, case and other components are locked and connected to complete the installation. The whole process is convenient and fast.

[0045] As shown in Figure 7As shown, the handle assembly 40 of the embodiment includes a connecting frame 41 and a handle 42, the connecting frame 41 can adopt the form of a crossbeam, which is connected with the top of the first liquid cooling assembly 20 arranged transversely, so that all the first liquid cooling assemblies 20 are connected to form an integral part capable of synchronous operation. The handle 42 is connected with the top of the connecting frame 41, and the handle 42 has an operating part, which is arranged to be bent away from the connecting frame 41, so that the operating part forms an inverted U-shaped structure. An operator can hold the operating part by reaching into the inverted U-shaped structure, and then lift and operate the first liquid cooling assembly 20 and the second liquid cooling assembly 30 together.

[0046] As Figure 5 shown, in the embodiment, the first liquid cooling assembly 20 includes a liquid cooling plate 21 and a pipe body 22. The liquid cooling plate 21 is located above the first component 50 and is in contact with the top end of the shell assembly 10 for heat transfer. The upper and lower surfaces of the liquid cooling plate 21 can be provided with heat-conducting pads or other components for improving heat transfer efficiency as needed. The pipe body 22 is arranged in the liquid cooling plate 21. The pipe body 22 has a cooling flow channel, and the refrigerant can flow in the pipe body 22. The pipe body 22 extends in a spiral manner in the liquid cooling plate 21 and has an S-shaped structure. In this way, the flow path of the pipe body 22 in the liquid cooling plate 21 is long, which can fully exchange heat with the shell assembly 10, thereby facilitating the heat dissipation effect of the first component 50.

[0047] The embodiment also provides an electronic device, which includes a cabinet, a first component 50, a second component, and the electronic device component heat dissipation device. The first component 50, the second component, and the electronic device component heat dissipation device are arranged in the cabinet. The shell assembly 10 of the electronic device component heat dissipation device is installed outside the first component 50 and is in heat transfer cooperation with the first component 50. The second liquid cooling assembly 30 of the electronic device component heat dissipation device is in heat transfer cooperation with the second component, so as to realize the effect of efficiently dissipating heat of the first component 50 and the second component. The specific cooperation mode between the electronic device component heat dissipation device and the first component 50 and the second component is as described above, and will not be described again.

[0048] It should be noted that the plurality in the above embodiment means at least two.

[0049] From the above description, it can be seen that the above-mentioned embodiments of the utility model realize the following technical effects:

[0050] The shell assembly 10 is arranged outside the first component 50 which needs heat dissipation, and the first liquid cooling assembly 20 is arranged above the shell assembly 10, and the size of the first liquid cooling assembly 20 is larger than that of the shell assembly 10, so that the first liquid cooling assembly 20 can cooperate with the shell assembly 10, so that the heat generated by the first component 50 is transmitted to the shell assembly 10 in the form of contact heat transfer, and then stably transmitted to the first liquid cooling assembly 20 by the shell assembly 10, and heat exchanged with the refrigerant in the first liquid cooling assembly 20, so that the heat generated by the first component 50 can be timely transmitted and dissipated, and the heat dissipation effect of the first component 50 is ensured. At the same time, the second liquid cooling assembly 30 is arranged at the side of the first component 50, which can not only supply liquid for the first liquid cooling assembly 20 and realize the flow of the refrigerant between the first liquid cooling assembly 20 and the second liquid cooling assembly 30, but also cooperate with the second component outside, and also play a role in heat dissipation because of the flow of the refrigerant in the second liquid cooling assembly 30, so that the second liquid cooling assembly 30 can play a role in heat dissipation for the second component. The above arrangement can improve the heat dissipation effect of the first component 50, so that the first component 50 can efficiently and stably dissipate heat, and ensure that the first component 50 can work stably, and on the other hand, the layout of the heat dissipation device is redesigned, and the space above and on the side of the first component 50 is utilized, so that the space utilization rate is maximized, and the efficient heat dissipation effect is still ensured.

[0051] The electronic device component heat dissipation device and the electronic device provided by the application are described in detail above. The principles and implementation modes of the application are described by applying specific examples in this paper, and the above examples are only used to help understand the method and core idea of the application. It should be pointed out that for ordinary skilled persons in the technical field, some improvements and modifications can be made to the application without departing from the principles of the application, and these improvements and modifications also fall within the protection scope of the claims of the application.

Claims

1. An electronic device component heat dissipation device, characterized by, The application relates to a liquid cooling device for a first component, comprising: a plurality of shell assemblies (10) which are arranged transversely between each other, and are mounted on the outer side of at least one first component (50); a plurality of first liquid cooling assemblies (20) which are arranged transversely between each other, and are in contact with the shell assemblies (10) and the first components (50) for heat transfer. The shell assemblies (10) comprise:

2. The electronic device component heat dissipating device of claim 1, wherein, a first shell part (11); 3. The electronic device component heat dissipating device of claim 1, wherein, a second shell part (12) which is located on the opposite side of the first component (50) and forms a clamping area for clamping the first component (50), and the first shell part (11) and / or the second shell part (12) are in contact with the first liquid cooling assemblies (20) for heat transfer.

4. The electronic device component heat dissipating device of claim 1, wherein, The first liquid cooling assemblies (20) comprise: a first liquid cooling assembly (20) which is arranged on the upper surface of the shell assembly (10) and is in contact with the shell assembly (10) for heat transfer, and the upper surface of the first liquid cooling assembly (20) is lower than the lower surface of the second liquid cooling assembly (30), and the first liquid cooling assembly (20) and the second liquid cooling assembly (30) form an avoiding area for installing pipelines. The second liquid cooling assembly (30) comprises:

5. The electronic device component heat dissipating device of claim 1, wherein, an outer shell (31) which is connected with the first liquid cooling assembly (20); 6. The electronic device component heat dissipation apparatus of any one of claims 1 to 5, wherein, a spade tooth structure (32) which is arranged in the outer shell (31) and forms a flow channel for the coolant. ​ ​ A clamping member (13) is arranged outside the first housing part (11) and the second housing part (12) and drives the first housing part (11) and the second housing part (12) to move towards each other to clamp the first component (50).

7. The electronic device component heat dissipating device of claim 6, wherein, The housing assembly (10) further comprises: A heat conducting member (15) is arranged between the first housing part (11) and the first component (50) and / or between the second housing part (12) and the first component (50), and the first housing part (11) and / or the second housing part (12) is in heat transfer cooperation with the first component (50) through the heat conducting member (15); A heat conducting layer is plated on the surface of the first housing part (11) and / or the second housing part (12), and the heat conducting member (15) is in contact with the heat conducting layer for heat transfer cooperation; An insulation layer (16) is embedded on the side of the first housing part (11) and / or the second housing part (12) away from the clamping area.

8. The electronic device component heat dissipation apparatus of any one of claims 1 to 5, wherein, The electronic device component heat dissipation device further comprises a handle assembly (40) arranged above the first liquid cooling assembly (20) and connected with the first liquid cooling assembly (20), and the handle assembly (40) has an operation part for operation.

9. The electronic device component heat dissipating device of claim 8, wherein, The handle assembly (40) comprises: A connecting frame (41) connected with the top of the first liquid cooling assembly (20); A handle (42) connected with the connecting frame (41), wherein the handle (42) has the operation part, and the operation part is arranged to be bent away from the connecting frame (41).

10. An electronic device, comprising: The electronic device component heat dissipation device of any one of claims 1 to 9, wherein the electronic device component heat dissipation device is arranged in a case, and the first component (50), the second component, and the electronic device component heat dissipation device are arranged in the case, and the housing assembly (10) of the electronic device component heat dissipation device is arranged outside the first component (50) and in heat transfer cooperation with the first component (50), and the second liquid cooling assembly (30) of the electronic device component heat dissipation device is in contact with the second component for heat transfer cooperation.

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