Circuit board matched with heat dissipation plate

Abstract

The utility model discloses a circuit board matched with a heat dissipation plate, which comprises a circuit board, a first heat dissipation plate and a second heat dissipation plate, and the first heat dissipation plate and the second heat dissipation plate both cover the side surface of the circuit board; power tubes are welded on the first heat dissipation plate and the second heat dissipation plate, and the circuit board is provided with through holes for accommodating the power tubes and pin holes for penetrating pins of the power tubes. According to the utility model, the power tube is installed on the heat dissipation plate and then is welded on the circuit board, heat dissipation can be directly carried out on the power tube, the heat dissipation effect is good, and the service life of the circuit board is long.

Description

TECHNICAL FIELD

[0001] The utility model relates to a circuit board, specifically a circuit board matched with a heat dissipation plate. BACKGROUND

[0002] The existing circuit board heat dissipation adopts the air cooling system or liquid cooling system installed in the controller, but the air cooling or liquid cannot directly act on the circuit board, and there are many components on the circuit board, especially the power tube on the circuit board, and the heat dissipation of the power tube is not timely, which can cause the function of the circuit board to be damaged. SUMMARY

[0003] In order to solve the defects of the prior art, the utility model provides a circuit board matched with a heat dissipation plate, the utility model discloses a power tube is installed on the heat dissipation plate, and is welded to the circuit board, can directly heat dissipation to the power tube, and the heat dissipation effect is good, and the service life of the circuit board is long.

[0004] In order to realize the above technical purpose, the utility model adopts the following technical scheme: a circuit board matched with a heat dissipation plate, including circuit board and first heat dissipation plate, second heat dissipation plate, the first heat dissipation plate, the second heat dissipation plate all covers the side of circuit board;

[0005] The first heat dissipation plate and the second heat dissipation plate are welded with power tubes, the circuit board is provided with a through hole accommodating the power tube, and a pin hole is provided with a pin of the power tube.

[0006] The two sides of the circuit board are respectively provided with the through hole, and the position close to the inner side of the through hole is provided with a first solder pad for welding and connecting the power tube, and the two sides of the circuit board are also provided with the pin hole, and one through hole corresponds to 2-3 pin holes.

[0007] The first heat dissipation plate is provided with a plurality of second solder pads, the second heat dissipation plate is provided with a plurality of third solder pads, the second solder pad and the third solder pad are used for welding and connecting one side of the power tube pad of different power tubes, the other side of the power tube pad is welded and connected with the first solder pad, so that the power tube is located in the through hole, and the pin of the power tube is welded in the pin hole.

[0008] The first heat dissipation plate and the second heat dissipation plate are in contact and cover the working area of the circuit board.

[0009] The first heat dissipation plate and the second heat dissipation plate are both made of aluminum substrate.

[0010] In summary, the utility model has the following technical effects:

[0011] The power tube is welded on the heat dissipation plate in advance, and the through hole is arranged on the circuit board to accommodate the power tube, so that the power tube can be well cooled. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 is a schematic diagram of a circuit board;

[0013] Figure 2 is a schematic diagram of a first heat dissipation plate;

[0014] Figure 3 is a schematic diagram of a second heat dissipation plate;

[0015] Figure 4 is a schematic diagram of a first heat dissipation plate installing a power tube;

[0016] Figure 5 is a schematic diagram of a second heat dissipation plate installing a power tube;

[0017] Figure 6 is a top view after installation;

[0018] Figure 7 is a side view after installation. DETAILED DESCRIPTION

[0019] The utility model will be further described in detail below in combination with the drawings.

[0020] The specific embodiment is only an explanation of the utility model, and it is not a limitation of the utility model, and the person skilled in the art can make a modification without creative contribution according to the need after reading the specification, but as long as it is within the scope of the claims of the utility model, it is protected by the patent law.

[0021] In the description of the utility model, it should be understood that the orientation or positional relationship indicated by the terms 'center', 'longitudinal', 'transverse', 'length', 'width', 'thickness', 'upper', 'lower', 'front','rear', 'left', 'right','vertical', 'horizontal', 'top', 'bottom', 'inner', 'outer', 'clockwise', 'counterclockwise', 'axial', 'radial', 'circumferential' and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and is not indicative or implied that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the utility model.

[0022] In addition, the terms "first", "second" are only used for descriptive purposes and cannot be understood to indicate or imply relative importance or imply the number of the indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the utility model, the meaning of "multiple" is two or more than two, unless otherwise explicitly specified and limited.

[0023] In the utility model, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be broadly understood, for example, it can be fixed connection, or detachable connection, or integrated; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, it can be the communication or interaction relationship of two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0024] In the utility model, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature. The first and second features can be in direct contact, or the first and second features can be indirectly contacted through intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0025] Embodiment:

[0026] A circuit board matched with a heat dissipation plate, comprising a circuit board 1 and a first heat dissipation plate 2 and a second heat dissipation plate 3, the first heat dissipation plate 2 and the second heat dissipation plate 3 are covered on the side of the circuit board 1, the first heat dissipation plate 2 and the second heat dissipation plate 3 are welded with power tubes 4, the circuit board 1 is provided with through holes 101 for accommodating the power tubes 4, and pin holes 103 for penetrating the pins 402 of the power tubes 4.

[0027] The utility model discloses a heat dissipation plate welded with power tubes, which utilizes the large-area heat dissipation plate to dissipate heat, and has good heat dissipation effect.

[0028] Figure 1 It is a circuit board schematic view, the both sides of the circuit board 1 are provided with the through hole 101 respectively, the position close to the inner side of the through hole 101 is provided with the first pad 102 for welding and connecting the power tube 4, and the both sides of the circuit board 1 are also provided with the pin hole 103, and one through hole 101 corresponds to 2-3 pin holes 103.

[0029] The circuit board 1 is provided with a through hole for placing the power tube 4, and a pin hole 103 for penetrating the pin 402, so that the heat dissipation plate completely covers the circuit board and improves the heat dissipation effect.

[0030] Figure 2 Fig. 1 is a schematic view of the first heat dissipation plate, Figure 3 Fig. 2 is a schematic view of the second heat dissipation plate, Figure 4 Fig. 3 is a schematic view of the first heat dissipation plate for installing the power tube, Figure 5 Fig. 4 is a schematic view of the second heat dissipation plate for installing the power tube, Figure 6 Fig. 5 is a top view of the installed device; Figure 7 Fig. 6 is a side view of the installed device; the first heat dissipation plate 2 is provided with a plurality of second pads 201, the second heat dissipation plate 3 is provided with a plurality of third pads 301, the second pads 201 and the third pads 301 are used for welding one side of the power tube pad 401 of different power tubes 4, the other side of the power tube pad 401 is welded to the first pad 102, so that the power tube 4 is located in the through hole 101, and the pin 402 of the power tube 4 is penetrated and welded in the pin hole 103.

[0031] The first heat dissipation plate 2 and the second heat dissipation plate 3 are in contact and cover the working area of the circuit board 1, so as to improve the heat dissipation effect. The first heat dissipation plate 2 and the second heat dissipation plate 3 are both made of aluminum substrate, so that the heat dissipation effect is good.

[0032] The power tube is welded on the heat dissipation plate in advance, the through hole is arranged on the circuit board to accommodate the power tube, and the power tube is well cooled.

[0033] The above is only a preferred embodiment of the present application, and does not limit the present application in any form. Any simple modification, equivalent change and modification according to the technical essence of the present application belong to the scope of the technical scheme of the present application.

Claims

1. A circuit board cooperating with a heat spreader, characterized by: The application relates to a power circuit board, which comprises a circuit board (1) and a first heat dissipation plate (2) and a second heat dissipation plate (3), wherein the first heat dissipation plate (2) and the second heat dissipation plate (3) cover the side surfaces of the circuit board (1); The first heat dissipation plate (2) and the second heat dissipation plate (3) are welded with power tubes (4), the circuit board (1) is provided with through holes (101) for accommodating the power tubes (4) and pin holes (103) for penetrating the pins (402) of the power tubes (4); The circuit board (1) is provided with the through holes (101) on both sides, the first soldering pads (102) are arranged on the positions close to the inner sides of the through holes (101) and are used for welding and connecting the power tubes (4), the pin holes (103) are further arranged on the two side edges of the circuit board (1), and one through hole (101) corresponds to 2-3 pin holes (103); The first heat dissipation plate (2) is provided with a plurality of second soldering pads (201), the second heat dissipation plate (3) is provided with a plurality of third soldering pads (301), the second soldering pads (201) and the third soldering pads (301) are used for welding and connecting one side surface of the power tube soldering pads (401) of different power tubes (4), the other side surface of the power tube soldering pads (401) is welded and connected with the first soldering pads (102), so that the power tubes (4) are arranged in the through holes (101), and the pins (402) of the power tubes (4) penetrate and are welded in the pin holes (103); The first heat dissipation plate (2) and the second heat dissipation plate (3) are in contact and cover the working area of the circuit board (1); The first heat dissipation plate (2) and the second heat dissipation plate (3) are made of aluminum substrates; The first heat dissipation plate (2) and the second heat dissipation plate (3) completely cover the circuit board (1); The power tubes (4) are welded on the first heat dissipation plate (2) and the second heat dissipation plate (3) in advance.

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