High-strength heat-resistant anti-corrosion circuit board

Abstract

The utility model provides a high strength heatproof anticorrosion circuit board comprising a circuit board body, the circuit board body is internally provided with a filling layer, the upper surface of the filling layer is successively provided with a stress reducing layer, a composite structure reinforcing layer and a first anticorrosion layer from bottom to top, a graphene composite epoxy resin layer and a second anti-corrosion layer are sequentially arranged on the lower surface of the filling layer from top to bottom, the composite structure reinforcing layer comprises a carbon fiber plate layer arranged on the lower portion and a bionic honeycomb plate layer arranged on the upper surface of the carbon fiber plate layer, and the stress reducing layer is a glass fiber layer. The strength is high, the anti-pressure capability is strong, and the heat-resistant and anti-corrosion functions are realized.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field especially relates to a high strength heat -resisting anticorrosion circuit board. BACKGROUND

[0002] China authorized announcement number CN219876231U, the authorized announcement day is October 20, 2023, and it discloses high-precision multilayer PCB integrated circuit board, belongs to circuit board technical field, including circuit board main part, heat -resisting layer and first anticorrosion layer, the inside of circuit board main part is provided with filling layer, and the bottom of filling layer is provided with heat -resisting layer, the bottom of heat -resisting layer is provided with first anticorrosion layer, the top of filling layer is provided with first reinforcing layer, and the top of first reinforcing layer is provided with second reinforcing layer, the top of second reinforcing layer is provided with elastic layer, and the top of elastic layer is provided with second anticorrosion layer.The utility model has the beneficial effects that through the interlaced arrangement between first reinforcing rib main part, it is convenient for through first reinforcing rib main part to make the compression resistance of circuit board main part higher, and through the design of elastic plate, it is convenient to make circuit board main part have certain elasticity, to make the compression resistance of circuit board main part higher.The defects of the prior art are that the structure is complex, and the overall structure cannot be lightened.In view of this situation, it is urgent to improve. SUMMARY

[0003] Therefore, the utility model discloses a high strength heat -resisting anticorrosion circuit board, high strength, compression resistance is strong, and has heat -resisting anticorrosion function.

[0004] The utility model provides a high strength heat -resisting anticorrosion circuit board, including circuit board ontology, the inside of circuit board ontology includes filling layer, the upper surface of filling layer is sequentially provided with stress reduction layer, composite structure reinforcing layer and first anticorrosion layer from below to above, the lower surface of filling layer is sequentially provided with graphene composite epoxy resin layer and second anticorrosion layer from above to below, the composite structure reinforcing layer includes the carbon fiber plate layer being arranged below and the bionic honeycomb plate layer being arranged on the upper surface of carbon fiber plate layer, the stress reduction layer is set up as glass fiber layer.

[0005] Preferably, the stress reduction layer is set as a glass fiber layer.

[0006] Preferably, the thickness of the graphene composite epoxy resin layer is set to 0.05-0.10 cm.

[0007] Preferably, the first anticorrosion layer is set as an environmentally friendly three-proof paint layer.

[0008] Preferably, the second anticorrosion layer is set as a diamond carbon film layer.

[0009] The utility model discloses a beneficial effect is: the present structure is by filling layer, stress reduction layer, composite structure reinforcing layer, first anticorrosive layer, graphene composite epoxy resin layer and second anticorrosive layer are composed, and the overall structure of prior art greatly simplifies to realize the demand of light weightization;Set up stress reduction layer, can effectively reduce stress concentration, improve the stability of overall structure;Set up composite structure reinforcing layer, enhance the impact resistance, thereby realize strong compression resistance;Through setting first anticorrosive layer and second anticorrosive layer, make the present structure have good anticorrosive function, through setting graphene composite epoxy resin layer, make the present structure have good thermal conductivity and mechanical properties, improve the heat dissipation efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 It is the cross section view of the utility model.

[0011] The sign is: composite structure reinforcing layer 10, first anticorrosive layer 11, bionic honeycomb board layer 12, carbon fiber plate layer 13, filling layer 14, graphene composite epoxy resin layer 17, second anticorrosive layer 15, stress reduction layer 16. DETAILED DESCRIPTION

[0012] In order to further understand the characteristics, technical means and specific purposes and functions reached by the utility model, the utility model will be described in further detail in combination with specific embodiments and drawings.

[0013] In the utility model, unless there is definite provision and limitation, the terms "mounting", "connection", "connecting", "fixing" and the like should be understood in a broad sense, for example, can be fixed connection, can also be detachable connection, or integrally connected, can be mechanical connection, can also be electrical connection, can be directly connected, can also be indirectly connected through intermediate medium, can be the communication inside two elements. For ordinary skilled in the art, the specific meaning of the above-mentioned terms in the utility model can be understood according to specific circumstances.

[0014] Please refer to Figure 1As shown, the utility model provides a kind of high-strength heat-resistant anticorrosion circuit board, including circuit board body, the inside of circuit board body includes filling layer 14, the upper surface of filling layer 14 is sequentially provided with stress reduction layer 16, composite structure reinforcing layer 10 and first anticorrosion layer 11 from below to above, in this embodiment, stress reduction layer 16 is set as glass fiber layer, the lower surface of filling layer 14 is sequentially provided with graphene composite epoxy resin layer 17 and second anticorrosion layer 15 from above to below, in this embodiment, the thickness of graphene composite epoxy resin layer 17 is set as 0.05-0.10cm, realizes fixed with filling layer 14 using electrodeposition or coating process.Composite structure reinforcing layer 10 includes the carbon fiber plate layer 13 being arranged below and the bionic honeycomb plate layer 12 being arranged on the upper surface of carbon fiber plate layer 13, and composite structure reinforcing layer 10 is fixed with stress reduction layer 16 by the mode of hot pressing;Stress reduction layer 16 is set as glass fiber layer, and is fixed with filling layer 14 by the mode of hot pressing.In this embodiment, first anticorrosion layer 11 is set as environmental protection three-proof paint layer, and is set using the mode of coating, such as KDD MR1715 three-proof paint layer.Second anticorrosion layer 15 is set as diamond carbon film layer, and in actual production process, can be prepared by electrodeposition or chemical vapor deposition process.

[0015] In this embodiment, it is composed of filling layer, stress reduction layer, composite structure reinforcing layer, first anticorrosion layer, graphene composite epoxy resin layer and second anticorrosion layer, greatly simplifies overall structure compared with prior art, also meets the demand of light weight on the basis of simplifying process steps;Stress reduction layer is arranged, can effectively reduce stress concentration, improve the stability of overall structure;Composite structure reinforcing layer is arranged, enhances impact resistance, so as to realize strong compression resistance;First anticorrosion layer and second anticorrosion layer are arranged, so that the structure has good anticorrosion function, graphene composite epoxy resin layer is arranged, so that the structure has good thermal conductivity and mechanical properties, improves heat dissipation efficiency.

[0016] The above-described embodiments only express one embodiment of the utility model, and the description is more specific and detailed, but it cannot be understood as the limitation of the scope of the utility model patent. It should be pointed out that, for ordinary skilled person in the art, without departing from the concept of the utility model, a number of modifications and improvements can be made, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent should be subject to the appended claims.

Claims

1. A high-strength heat-resistant corrosion-resistant circuit board comprising a circuit board body, characterized by: The circuit board body comprises a filling layer (14), an upper surface of the filling layer (14) is sequentially provided with a stress reduction layer (16), a composite structure reinforcing layer (10) and a first corrosion prevention layer (11) from top to bottom, a lower surface of the filling layer (14) is sequentially provided with a graphene composite epoxy resin layer (17) and a second corrosion prevention layer (15) from top to bottom, the composite structure reinforcing layer (10) comprises a carbon fiber plate layer (13) arranged below and a biomimetic honeycomb plate layer (12) arranged on the upper surface of the carbon fiber plate layer (13), and the stress reduction layer (16) is arranged as a glass fiber layer.

2. The high strength heat resistant corrosion resistant circuit board of claim 1, wherein: The stress reduction layer (16) is arranged as a glass fiber layer.

3. The high strength heat resistant corrosion resistant circuit board of claim 1, wherein: The thickness of the graphene composite epoxy resin layer is 0.05-0.10 cm.

4. The high strength heat resistant corrosion resistant circuit board of claim 1, wherein: The first corrosion prevention layer (11) is arranged as an environmentally-friendly three-proof paint layer.

5. The high strength heat resistant corrosion resistant circuit board of claim 1, wherein: The second corrosion prevention layer (15) is arranged as a diamond carbon film layer.

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