Flexible circuit board with double-sided adhesive layer and flexible circuit product

Abstract

The utility model discloses a flexible circuit board with a double-sided adhesive layer and a flexible circuit product, and relates to the field of printed circuit boards, one scheme is that the flexible circuit board comprises the flexible circuit board and the double-sided adhesive layer; one surface of the double-sided adhesive layer is attached to the target surface of the flexible circuit board; the other surface of the double-sided adhesive layer is used for adhering release paper, the release paper is provided with a through release line, the release line divides the release paper into at least two division areas, and the division areas cover a stripping path of the flexible circuit board; and when the flexible circuit board is bent, the release paper is automatically stripped along the stripping path. Through the arrangement, the damage to the flexible circuit board when the release paper on the double-sided adhesive layer is stripped is reduced, the tedious operation in the manual stripping process is avoided, the assembly efficiency is effectively improved, and convenience is provided for the application of the flexible circuit board in a complex assembly scene.

Description

Technical Field

[0001] This utility model relates to the field of printed circuit boards, and in particular to a flexible circuit board with a double-sided adhesive layer and a flexible circuit product. Background Technology

[0002] Flexible printed circuit boards (FPCs), also known as flexible circuit boards or flexographic circuit boards, are widely used in various electronic products due to their advantages such as light weight, thinness, and the ability to be freely bent and folded, especially in applications requiring thinness, flexibility, and efficient installation. In practical applications, to facilitate installation and assembly, a double-sided adhesive layer is usually attached to the surface of the flexible circuit board, using the adhesive properties of the double-sided adhesive layer to fix the flexible circuit board to other components.

[0003] However, because flexible circuit boards are thin and soft, and the double-sided adhesive layer is very sticky, the surface or edges of the flexible circuit board can easily be damaged when the release paper on the double-sided adhesive layer is peeled off. Summary of the Invention

[0004] This invention provides a flexible circuit board with a double-sided adhesive layer and a flexible circuit product to solve the problem that existing flexible circuit boards with double-sided adhesive layers are easily damaged when the release paper on the double-sided adhesive layer is peeled off.

[0005] To solve the above problems, the present invention adopts the following technical solution:

[0006] In a first aspect, a flexible circuit board with a double-sided adhesive layer is provided, comprising:

[0007] Flexible circuit board and double-sided adhesive layer;

[0008] One side of the double-sided adhesive layer is attached to the target surface of the flexible circuit board;

[0009] The other side of the double-sided adhesive layer is used to adhere the release paper. The release paper has a through release line, which divides the release paper into at least two segmented areas. The segmented areas cover the peeling path of the flexible circuit board, so that the release paper peels off automatically along the peeling path when the flexible circuit board is bent.

[0010] Optionally, the release line may be a straight line, a broken line, or a curve.

[0011] Optionally, the release line is formed by linear cutting.

[0012] Optionally, the flexible circuit board includes a single-layer flexible circuit board, a double-layer flexible circuit board, or a multi-layer flexible circuit board.

[0013] Optionally, the width of the release line is - .

[0014] Optionally, the thickness of the double-sided adhesive layer is - .

[0015] Optionally, the thickness of the flexible circuit board is less than .

[0016] Optionally, the distance between the edges of the release paper and the double-sided adhesive layer and the edge of the flexible circuit board is... - .

[0017] In a second aspect, a flexible circuit product is provided, the flexible circuit product comprising release paper and a flexible circuit board with a double-sided adhesive layer as described in the first aspect, the flexible circuit board with the double-sided adhesive layer comprising a flexible circuit board and a double-sided adhesive layer;

[0018] One side of the double-sided adhesive layer is attached to the target surface of the flexible circuit board;

[0019] The other side of the double-sided adhesive layer is attached to the release paper, which has a through release line that divides it into at least two segments. These segments cover the peeling path of the flexible circuit board, so that the release paper peels off automatically along the peeling path when the flexible circuit board is bent.

[0020] Optionally, the double-sided adhesive layer and the release paper form a double-sided tape.

[0021] This utility model provides a solution for a flexible circuit board with a double-sided adhesive layer, comprising a flexible circuit board and a double-sided adhesive layer; one side of the double-sided adhesive layer is attached to the target surface of the flexible circuit board; the other side of the double-sided adhesive layer is used to attach release paper, the release paper having a through release line that divides the release paper into at least two segmented regions, the segmented regions covering the peeling path of the flexible circuit board, so that when the flexible circuit board is bent, the release paper peels off automatically along the peeling path. In this embodiment, by setting a through release line on the release paper attached to the double-sided adhesive layer, the release paper is divided into at least two segmented regions, these segmented regions covering the peeling path of the flexible circuit board. When the flexible circuit board is bent, the release paper can peel off automatically along the peeling path, reducing the pulling force on the flexible circuit board, thereby reducing the damage to the flexible circuit board when peeling the release paper from the double-sided adhesive layer, avoiding the tedious operation of manual peeling, effectively improving assembly efficiency, and providing convenience for the application of flexible circuit boards in complex assembly scenarios. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a cross-sectional view of a flexible circuit board with a double-sided adhesive layer in one embodiment of the present invention;

[0024] Figure 2 This is a schematic diagram of the release paper peeling off a flexible circuit board with a double-sided adhesive layer in one embodiment of this utility model;

[0025] Figure 3 This is a top view of a double-sided adhesive tape according to an embodiment of the present invention;

[0026] Figure 4 This is a cross-sectional view of a double-sided adhesive tape according to an embodiment of the present invention;

[0027] Figure 5 This is a cross-sectional view of the double-sided tape after the release line has been cut in one embodiment of this utility model;

[0028] Figure 6 This is a cross-sectional view of a flexible circuit board after the double-sided adhesive layer and release paper are bonded together in one embodiment of this utility model;

[0029] Figure 7 This is a top view of a flexible circuit board after the double-sided adhesive layer and release paper are bonded together in one embodiment of this utility model;

[0030] Figure 8 This is a top view of a flexible circuit board with a double-sided adhesive layer in one embodiment of the present invention.

[0031] The reference numerals in the attached figures are as follows:

[0032] 1-Flexible circuit board, 2-Double-sided adhesive layer, (3, 3')-Release paper, 4-Release line, 5-Double-sided tape, A-Divider line, B-Alignment line. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0034] In the description of this utility model, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0035] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0036] To fully understand this utility model, please refer to the following: Figures 1 to 8 The following description details the structure and steps to illustrate the technical solution proposed by this utility model. Preferred embodiments of this utility model are described in detail below; however, in addition to these detailed descriptions, this utility model may have other embodiments.

[0037] Firstly, such as Figure 1 and Figure 2 As shown, a flexible circuit board 1 with a double-sided adhesive layer 2 is provided, comprising: a flexible circuit board 1 and a double-sided adhesive layer 2; one side of the double-sided adhesive layer 2 is attached to the target surface of the flexible circuit board 1; the other side of the double-sided adhesive layer 2 is used to attach release paper 3, the release paper 3 is provided with a through release line 4, and the release line 4 divides the release paper 3 into at least two segmented regions, the segmented regions covering the peeling path of the flexible circuit board 1, so that when the flexible circuit board 1 is bent, the release paper 3 peels off automatically along the peeling path.

[0038] As an example, a flexible circuit board 1 with a double-sided adhesive layer 2 includes a flexible circuit board 1 and a double-sided adhesive layer 2. One side of the double-sided adhesive layer 2 is bonded to the target surface of the flexible circuit board 1, for example, one side of the double-sided adhesive layer 2 is bonded to an area on the front or back of the flexible circuit board 1 that requires external connection. The other side of the double-sided adhesive layer 2 is used to bond to a release paper 3 that needs to be peeled off. The release paper 3 has a release line 4 that runs through it and divides the release paper 3 into at least two segmented areas. The segmented areas cover the peeling path of the flexible circuit board 1, so that when the flexible circuit board 1 is bent, the release paper 3 peels off along the peeling path. That is, when the flexible circuit board 1 is held by both sides and pressed down in the opposite direction of the release line 4, due to the tight bonding between the flexible circuit board 1 and the double-sided adhesive layer 2, and the rigidity of the release paper 3 itself, the release paper 3 in other areas, except for the area held by the hand, peels off along the peeling path. Figure 2 The peeling path shown achieves self-peeling, that is, it peels off automatically from the dividing line A to the dividing areas formed on both sides, thereby reducing the pulling force on the flexible circuit board 1, thus reducing the damage to the flexible circuit board 1 when peeling off the release paper 3 on the double-sided adhesive layer 2, and avoiding the tedious operation of manual peeling process, effectively improving assembly efficiency and providing convenience for the application of the flexible circuit board 1 in complex assembly scenarios.

[0039] The double-sided adhesive layer 2 can be made of a material with high adhesion and good flexibility, such as an acrylate polymer or a rubber material, to ensure that the flexible circuit board 1 can maintain a stable fit with the external connecting parts during long-term use, thereby ensuring the stability of the flexible circuit board 1.

[0040] It should be understood that the release paper 3 in the flexible circuit board 1 with double-sided adhesive layer 2 provided in the first aspect of this utility model can be understood as an external component that needs to be peeled off. This positioning of the release paper 3 is intended to illustrate its function and role in the overall product structure, and does not constitute a limitation on this utility model. The release paper 3 can be made of a material with a smooth surface and stable chemical properties, such as glassine paper or PET release paper 3, etc., and is not limited here.

[0041] Optionally, the release line 4 may be a straight line, a broken line, or a curve.

[0042] As an example, the shape of the release line 4 can include a straight line, a broken line, or a curve, etc. The specific shape of the release line 4 can be customized according to the actual application requirements and is not limited here. For example, if it is necessary to peel off the release paper 3 on a rectangular flexible circuit board 1, the release line 4 can be in the form of a straight line. That is, the release line 4 divides the release paper 3 on the rectangular flexible circuit board 1 into segments of the same size (such as two rectangular segments of the same size) to ensure that the peeling path is simple and clear. Through the above settings, the release line 4 can adapt to the peeling requirements of the release paper 3 on various flexible circuit boards 1.

[0043] Optionally, the release line 4 may include one or more.

[0044] As an example, multiple release lines 4 refer to having two or more release lines 4. Specifically, a single release line 4 is suitable for flexible circuit boards 1 with simple structures and a single peeling path, accurately guiding the release paper 3 to peel off, making the operation convenient and efficient. Multiple release lines 4 are suitable for multi-layered or complex flexible circuit boards 1. They can divide different peeling areas, allowing the release paper 3 to peel off along different paths and in different sequences, avoiding interference and ensuring that each part of the release paper 3 separates smoothly from the double-sided adhesive layer 2. It should be understood that the above is only an example, and the number of release lines 4 can be set according to specific needs, and is not limited here.

[0045] Optionally, the release line 4 is formed by linear cutting.

[0046] As an example, the release line 4 can be obtained by cutting the release paper 3 along a predetermined path using a linear cutting device, thereby ensuring that the shape, line width and position of the formed release line 4 fully meet the design requirements, and thus ensuring that the release paper 3 can be naturally peeled off along the set peeling path during peeling.

[0047] Optionally, the flexible circuit board 1 includes a single-layer flexible circuit board 1, a double-layer flexible circuit board 1, or a multi-layer flexible circuit board 1.

[0048] As an example, the flexible circuit board 1 can be one of various types of flexible circuit boards 1, such as a single-layer flexible circuit board 1, a double-layer flexible circuit board 1, or a multi-layer flexible circuit board 1, which does not constitute a limitation on the present invention.

[0049] Optionally, the line width of the release line 4 is - .

[0050] As an example, the line width of release line 4 is - Preferably, the line width of the release line 4 can be , , or This does not constitute a limitation on the present invention. By limiting the range of the release line 4 to a certain value... - This ensures smooth peeling of the release paper 3 while avoiding potential negative impacts from excessively wide or narrow release lines 4. For example, if the release line 4 is too wide (e.g., greater than...), it will cause problems. When the release line 4 is too narrow (e.g., less than 100 mm), the adhesion of the double-sided adhesive layer 2 corresponding to the line width will decrease. This is because the groove formed by the larger line width is prone to accumulating dust and other debris, which not only affects the appearance of the product, but may also cause the double-sided adhesive layer 2 to not adhere tightly to other components during subsequent assembly due to dust obstruction, affecting product performance. When the double-sided adhesive layer 2 softens under certain conditions, it may fill the smaller line width gap, causing the subsequent release paper 3 to be unable to peel off normally.

[0051] Optionally, the thickness of the double-sided adhesive layer 2 is - .

[0052] As an example, the thickness of double-sided adhesive layer 2 is - Preferably, the thickness of the double-sided adhesive layer 2 can be [missing information]. , or This does not constitute a limitation on the present invention. By limiting the thickness range of the double-sided adhesive layer 2 to... - This ensures that the double-sided adhesive layer 2 has sufficient stickiness and adhesion, maintains the thinness of the flexible circuit board 1, does not affect the smoothness of the release paper 3 peeling process, and maintains good adhesion, ensuring that the double-sided adhesive layer 2 can firmly bond the flexible circuit board 1 to other external components.

[0053] Optionally, the thickness of the flexible circuit board 1 is less than .

[0054] As an example, the thickness of flexible circuit board 1 is less than Preferably, the thickness of the flexible circuit board 1 can be [missing information]. , , , , , , or This does not constitute a limitation on the present invention. The thickness range of the flexible circuit board 1 is limited to less than... This allows the flexible circuit board 1 to possess extremely high flexibility and adaptability, while also effectively saving space for its application in miniaturized electronic devices. This improves the integration and thinness of electronic devices, meeting the requirements of modern electronic products for lightweighting and high performance. Especially in consumer electronics products such as wearable devices, mobile phones, and tablets, it provides greater design flexibility and creative space. Furthermore, the thickness of the flexible circuit board 1 is limited to less than... This reduces physical stress during processing, effectively avoids problems such as circuit breakage and delamination of the flexible circuit board 1 caused by stress concentration, improves processing accuracy, and ensures the stability of product quality.

[0055] Optionally, the distance between the edges of the release paper 3 and the double-sided adhesive layer 2 and the edge of the flexible circuit board 1 is... - .

[0056] As an example, the distance between the edges of the release paper 3 and the double-sided adhesive layer 2 and the edge of the flexible circuit board 1 is... - Preferably, the distance between the edges of the release paper 3 and the double-sided adhesive layer 2 and the edge of the flexible circuit board 1 can be [missing information]. , , , , , , or This does not constitute a limitation on the present invention. The distance between the edges of the release paper 3 and the double-sided adhesive layer 2 and the edge of the flexible circuit board 1 is defined as follows: - This ensures that the double-sided adhesive layer 2 provides sufficient adhesion to the flexible circuit board 1, while preventing it from sticking to other unnecessary components due to excessive stretching. It also avoids problems such as excess adhesive and wrinkles in the release paper 3 caused by dimensional deviations, greatly improving the product yield.

[0057] In a second aspect, a flexible circuit product is provided, the flexible circuit product comprising release paper 3 and a flexible circuit board 1 with a double-sided adhesive layer 2 as described in the first aspect, the flexible circuit board 1 with the double-sided adhesive layer 2 comprising a flexible circuit board 1 and a double-sided adhesive layer 2; one side of the double-sided adhesive layer 2 is attached to a target surface of the flexible circuit board 1; the other side of the double-sided adhesive layer 2 is attached to the release paper 3, the release paper 3 is provided with a through release line 4, and the release line 4 divides the release paper 3 into at least two segmented regions, the segmented regions covering the peeling path of the flexible circuit board 1, such that when the flexible circuit board 1 is bent, the release paper 3 peels off automatically along the peeling path.

[0058] It should be noted that the specific limitations of the flexible circuit product provided in the second aspect of this utility model can be referred to the limitations of the flexible circuit board 1 with double-sided adhesive layer 2 described in the first aspect. In order to avoid repetition, it will not be repeated here. The only difference here is that the flexible circuit product includes the feature of release paper 3. The feature of release paper 3 in the flexible circuit board 1 with double-sided adhesive layer 2 is an external feature that needs to be torn off and does not have a limiting effect in the flexible circuit board 1 with double-sided adhesive layer 2.

[0059] Optionally, the double-sided adhesive layer 2 and the release paper 3 form a double-sided adhesive tape 5.

[0060] As an example, the double-sided adhesive layer 2 and the release paper 3 form a double-sided tape 5. It can be understood here that the basic components of the double-sided tape 5 include the double-sided adhesive layer 2 and the release paper 3, but this does not limit the double-sided tape 5 to only these two components. In actual production and application, to meet different performance requirements, other auxiliary components or structural layers may be added to the double-sided tape 5, such as a special coating to enhance adhesion durability, or a reinforcing fiber layer to improve flexibility, etc., which does not constitute a limitation of this utility model. The double-sided tape 5 includes 3M tape or other double-sided tapes 5.

[0061] Thirdly, a method for manufacturing a flexible circuit board 1 with a double-sided adhesive layer 2 is provided, comprising the following steps: First, as... Figure 3 As shown, double-sided tape 5 is selected as the base material, and the double-sided tape 5 includes a double-sided adhesive layer 2 and release paper (3, 3'); secondly, as Figures 3 to 5 As shown, release lines 4, set edges, and alignment lines B are processed on the double-sided adhesive layer 2 and the release paper (3, 3') using linear cutting; then, as... Figures 6 to 7 As shown, peel off the release paper 3', and align and adhere the double-sided adhesive layer 2 and the release paper 3 to the target surface of the flexible circuit board 1 based on the alignment line B; finally, as... Figure 8 As shown, the double-sided adhesive layer 2, the release paper 3, and the flexible circuit board 1 are simultaneously cut using a laser milling device to form the target shape, and waste material is removed to obtain a flexible circuit board 1 or flexible circuit product with double-sided adhesive layer 2. This manufacturing method utilizes pre-processing of the alignment line B, reducing the depth control accuracy requirement of the release line 3, improving processing efficiency, and using linear cutting instead of traditional laser cutting, thus reducing processing costs.

[0062] It should be understood that during the processing, the double-sided adhesive layer 2 is in a semi-cured state and is controlled by pressure to form a secondary fusion, filling the release line 3 on the double-sided adhesive layer 2, so that the finished product only has the release paper 3 with the release line 4.

[0063] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model, and should all be included within the protection scope of this utility model.

Claims

1. A flexible circuit board with double-sided adhesive layer, characterized by, The flexible circuit product comprises a release paper and the double-sided adhesive tape flexible circuit board as claimed in any one of claims 1 to 8, the double-sided adhesive tape flexible circuit board comprising a flexible circuit board and a double-sided adhesive tape; one side of the double-sided adhesive tape is attached to a target surface of the flexible circuit board; the other side of the double-sided adhesive tape is attached to the release paper, the release paper is provided with a through release line, and the release line divides the release paper into at least two divided areas, the divided areas cover a peeling path of the flexible circuit board, so that the release paper peels off along the peeling path when the flexible circuit board is bent. The release line comprises a straight line, a broken line or a curve.

2. The double-sided adhesive flexible circuit board of claim 1, wherein, The release line is formed by linear cutting.

3. The double-sided adhesive flexible circuit board of claim 1, wherein, The flexible circuit board comprises a single-layer flexible circuit board, a double-layer flexible circuit board or a multi-layer flexible circuit board.

4. The double-sided adhesive flexible circuit board of claim 1, wherein, The flexible circuit product comprises a release paper and the double-sided adhesive tape flexible circuit board as claimed in any one of claims 1 to 8, the double-sided adhesive tape flexible circuit board comprising a flexible circuit board and a double-sided adhesive tape; 5. The double-sided adhesive flexible circuit board of claim 1, wherein, The line width of the release line is - .

6. The double-sided adhesive flexible circuit board of claim 1, wherein, The thickness of the double-sided adhesive layer is - .

7. The double-sided adhesive flexible circuit board of claim 1, wherein, The flexible circuit board has a board thickness of less than .

8. The double-sided adhesive flexible circuit board of claim 1, wherein, The distance of the edges of the release paper and the double-sided adhesive layer relative to the edges of the flexible circuit board is - .

9. A flexible circuit product, characterized by one side of the double-sided adhesive tape is attached to a target surface of the flexible circuit board; the other side of the double-sided adhesive tape is attached to the release paper, the release paper is provided with a through release line, and the release line divides the release paper into at least two divided areas, the divided areas cover a peeling path of the flexible circuit board, so that the release paper peels off along the peeling path when the flexible circuit board is bent. The double-sided adhesive tape and the release paper form a double-sided adhesive tape.

10. The flexible circuit product of claim 9, wherein, ​

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