Chip packaging structure, camera module and electronic equipment

Abstract

The utility model relates to the technical field of chip packaging, and provides a chip packaging structure, a camera module and electronic equipment, and the chip packaging structure comprises a circuit board; the at least two chips are arranged on one side of the circuit board at intervals and are electrically connected with the circuit board; the supporting assembly is arranged on the side, away from the circuit board, of the chip; the filtering assembly is arranged on the side, away from the circuit board, of the supporting assembly; and the packaging pieces are arranged between two adjacent chips and on the peripheries of all the chips so as to fixedly connect the chips and the circuit board. According to the chip packaging structure, the chips and the circuit board are fixedly connected by arranging the at least two chips on the same circuit board and arranging the packaging pieces between the two adjacent chips and on the peripheries of all the chips, a plurality of chips can be integrated on the circuit board, the resolution ratio of the chip packaging structure is increased, and the chip packaging structure is convenient to use. The detection range of the chip packaging structure is expanded, and miniaturization of electronic equipment provided with the chip packaging structure is facilitated.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip packaging, in particular to a chip packaging structure, a camera module and an electronic device. BACKGROUND

[0002] At present, the chip packaging structure of some cameras mostly adopts a single chip. However, the resolution of such chip packaging structure is limited, and the signal scanning range on the chip packaging structure is small, so that the detection range is small. CONTENT OF THE INVENTION

[0003] In view of the above, it is necessary to provide a chip packaging structure, a camera module and an electronic device to increase the resolution of the chip packaging structure and expand the detection range of the chip packaging structure.

[0004] The first aspect of the embodiment of the present application provides a chip packaging structure, comprising: a circuit board; at least two chips, which are arranged on one side of the circuit board and are electrically connected to the circuit board; a support assembly, which is arranged on the side of the chips away from the circuit board; a filtering assembly, which is arranged on the side of the support assembly away from the circuit board; and a packaging piece, which is arranged between adjacent two chips and around all the chips to fixedly connect the chips and the circuit board.

[0005] In the scheme provided by the embodiment of the present application, at least two chips are arranged on the same circuit board, and the packaging piece is arranged between adjacent two chips and around all the chips to fixedly connect the chips and the circuit board. Therefore, multiple chips can be integrated on the circuit board, the resolution of the chip packaging structure is increased, the detection range of the chip packaging structure is expanded, and the miniaturization of the electronic device installed with the chip packaging structure is facilitated.

[0006] In a possible implementation, the support assembly comprises: at least two support bodies, which correspond to the at least two chips respectively, and each support body is arranged on the side of the corresponding chip away from the circuit board; and the filtering assembly comprises: at least two filtering pieces, which correspond to the at least two support bodies respectively, and each filtering piece is arranged on the side of the corresponding support body away from the circuit board.

[0007] In the scheme provided by the embodiment of the present application, the filtering assembly is arranged as at least two filtering pieces, and each filtering piece is arranged on the side of the corresponding support body away from the circuit board. When one of the filtering pieces is damaged, only the damaged filtering piece needs to be replaced, which is convenient to replace.

[0008] In a possible implementation, the packaging member comprises: a first packaging body arranged between two adjacent chips and fixedly connected with the two chips; and a second packaging body arranged at the outer periphery of all the chips and fixedly connected with the side surfaces of all the chips.

[0009] In the scheme provided by the embodiments of the present application, the first packaging body is arranged between two adjacent chips and fixedly connected with the two chips, and the first packaging body is arranged between two adjacent chips and fixedly connected with the two chips, so that all the chips and the circuit board are fixedly connected together, and the connection stability is high.

[0010] In a possible implementation, one end of the first packaging body is connected with the circuit board, and the other end of the first packaging body extends out of the chip along the optical axis direction and is connected with the filter assembly.

[0011] In the scheme provided by the embodiments of the present application, since the first packaging body is arranged between two adjacent chips, when one end of the first packaging body is connected with the circuit board and the other end of the first packaging body extends out of the chip along the optical axis direction and is connected with the filter assembly, the first packaging body can not only connect two adjacent chips, but also connect two adjacent support bodies and the filter.

[0012] In a possible implementation, one end of the second packaging body is connected with the circuit board, and the other end of the second packaging body extends out of the chip along the optical axis direction and is connected with the filter assembly.

[0013] In the scheme provided by the embodiments of the present application, since the second packaging body is arranged at the outer periphery of all the chips, when one end of the second packaging body is connected with the circuit board and the other end of the second packaging body extends out of the chip and is connected with the filter assembly, the second packaging body can be wrapped at the outer periphery of all the chips, the filter and the support body, so that the circuit board, the chip, the support body and the filter form an integrated structure, and the connection stability is high.

[0014] In a possible implementation, the chip packaging structure further comprises: a conducting member, one end of the conducting member is electrically connected with the chip, and the other end of the conducting member is electrically connected with the circuit board.

[0015] In the scheme provided by the embodiments of the present application, the conducting member can ensure the electrical connection between the chip and the circuit board, so that the signals between the chip and the circuit board are normally transmitted.

[0016] In a possible implementation, the conducting member is arranged in the packaging member.

[0017] In the scheme provided by the embodiment of the present application, the conducting member is arranged in the packaging member, for example, the conducting member can be arranged in the first packaging body or the second packaging body, the packaging member can form protection for the conducting member, preventing the conducting member from being damaged or broken, so as to affect the normal transmission of signals between the chip and the circuit board.

[0018] In a possible implementation, the chip packaging structure further comprises an adhesive member arranged between the chip and the circuit board to fix the chip and the circuit board.

[0019] In the scheme provided by the embodiment of the present application, the adhesive member is arranged to firmly fix the chip and the circuit board together, and the stability is good.

[0020] The second aspect of the embodiment of the present application provides a camera module, comprising a lens and the chip packaging structure as any of the above, and the lens is installed on the side of the chip away from the circuit board.

[0021] In the scheme provided by the embodiment of the present application, at least two chips are arranged on the same circuit board, and the packaging member is arranged between the adjacent two chips and the outer periphery of all the chips to fix and connect the chips and the circuit board, a plurality of chips can be integrated on the circuit board, the resolution of the chip packaging structure is increased, the detection range of the chip packaging structure is expanded, and the miniaturization of the electronic device installed with the chip packaging structure is facilitated.

[0022] The third aspect of the embodiment of the present application provides an electronic device, comprising a shell and the camera module as described above, and the camera module is arranged in the shell.

[0023] In the scheme provided by the embodiment of the present application, at least two chips are arranged on the same circuit board, and the packaging member is arranged between the adjacent two chips and the outer periphery of all the chips to fix and connect the chips and the circuit board, a plurality of chips can be integrated on the circuit board, the resolution of the chip packaging structure is increased, the detection range of the chip packaging structure is expanded, and the miniaturization of the electronic device installed with the chip packaging structure is facilitated. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 is a cross-sectional structure schematic diagram of the chip packaging structure provided by the embodiment of the present application.

[0025] Figure 2 is a cross-sectional structure schematic diagram of the camera module provided by the embodiment of the present application.

[0026] Figure 3 is a three-dimensional structure schematic diagram of the electronic device provided by the embodiment of the present application.

[0027] Main element symbol explanation: chip packaging structure 100, circuit board 10, chip 20, support assembly 30, support body 31, filter assembly 40, filter piece 41, packaging piece 50, first packaging body 51, second packaging body 52, conducting piece 60, adhesive piece 70, lens 200, camera module 300, shell 400, electronic equipment 1000. DETAILED DESCRIPTION

[0028] The embodiments of the present application will be described in detail below, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only, and are used only for explaining the present application, and cannot be understood as a limitation of the present application.

[0029] In the description of the present application, it should be understood that the terms indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as a limitation of the present application. The terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or more features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0030] In the description of the present application, it should be noted that, unless otherwise specifically specified and limited, the term "connection" should be understood broadly, for example, it can be fixedly connected, or detachably connected, or integrally connected; it can be mechanically connected, or electrically connected or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above-mentioned term in the present application can be understood according to the specific circumstances.

[0031] The disclosure below provides many different embodiments or examples for implementing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are only examples and the purpose is not to limit the present application. In addition, the present application can repeatedly refer to numbers and / or letters in different examples, and such repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those skilled in the art can realize the application of other processes and / or the use of other materials.

[0032] The embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0033] Please refer to Figure 1 The first aspect of the embodiments of the present application provides a chip packaging structure 100 for packaging chips 20. Specifically, the chip packaging structure 100 includes a circuit board 10, at least two chips 20, a support assembly 30, a filtering assembly 40, and a packaging member 50.

[0034] The circuit board 10 is a PCB board, which mainly provides electrical connection, mechanical support, and electrical and thermal performance. The at least two chips 20 are arranged on one side of the circuit board 10 and are electrically connected to the circuit board 10. In this embodiment, the number of chips 20 is two, and the chips 20 are used to receive and process light signals reflected by the target. The support assembly 30 is arranged on the side of the chip 20 away from the circuit board 10. The filtering assembly 40 is arranged on the side of the support assembly 30 away from the circuit board 10. The packaging member 50 is arranged between the adjacent two chips 20 and the outer periphery of all chips 20 to fixedly connect the chips 20 and the circuit board 10.

[0035] In the scheme provided by the embodiments of the present application, by arranging at least two chips 20 on the same circuit board 10, and by arranging the packaging member 50 between the adjacent two chips 20 and the outer periphery of all chips 20 to fixedly connect the chips 20 and the circuit board 10, multiple chips 20 can be integrated on the circuit board 10, the resolution of the chip packaging structure 100 is increased, and the detection range of the chip packaging structure 100 is expanded, which is beneficial to miniaturization of the electronic device 1000 in which the chip packaging structure 100 is installed.

[0036] In a possible implementation, the support assembly 30 includes at least two support bodies 31 corresponding to the at least two chips 20 respectively, and each support body 31 is arranged on a side of the corresponding chip 20 away from the circuit board 10; the filter assembly 40 includes at least two filter pieces 41 corresponding to the at least two support bodies 31 respectively, and each filter piece 41 is arranged on a side of the corresponding support body 31 away from the circuit board 10. In this embodiment, each support body 31 is arranged on a non-photosensitive area of the corresponding chip 20 to avoid blocking the light reflected by the target, and the support body 31 is formed by curing GOS (Glass on Sensor) glue, and the support body 31 can be annular structure arranged on the non-photosensitive area of the chip 20 or a plurality of block structures arranged on the non-photosensitive area of the chip 20; and the filter piece 41 is a light filter.

[0037] In the scheme provided in the embodiments of the present application, by arranging the filter assembly 40 as at least two filter pieces 41 and arranging each filter piece 41 on a side of the corresponding support body 31 away from the circuit board 10, when one of the filter pieces 41 is damaged, only the damaged filter piece 41 needs to be replaced, and the replacement is more convenient.

[0038] In a possible implementation, the packaging piece 50 includes a first packaging body 51 and a second packaging body 52, the first packaging body 51 is arranged between two adjacent chips 20 and fixedly connected with the two chips 20; and the second packaging body 52 is arranged on the outer periphery of all the chips 20 and fixedly connected with the side surfaces of all the chips 20. In this embodiment, the first packaging body 51 and the second packaging body 52 are both formed by curing resin.

[0039] In the scheme provided in the embodiments of the present application, by arranging the first packaging body 51 between two adjacent chips 20 and fixedly connecting the first packaging body 51 with the two chips 20, and arranging the first packaging body 51 between two adjacent chips 20 and fixedly connecting the first packaging body 51 with the two chips 20, all the chips 20 and the circuit board 10 can be fixedly connected together, and the connection stability is higher.

[0040] In a possible implementation, one end of the first packaging body 51 is connected with the circuit board 10, and the other end of the first packaging body 51 extends out of the chip 20 along the optical axis direction and is connected with the filter assembly 40.

[0041] In the scheme provided in the embodiments of the present application, since the first packaging body 51 is arranged between two adjacent chips 20, when one end of the first packaging body 51 is connected with the circuit board 10 and the other end of the first packaging body 51 extends out of the chip 20 along the optical axis direction and is connected with the filter assembly 40, the first packaging body 51 can not only connect two adjacent chips 20, but also connect two adjacent support bodies 31 and filter pieces 41.

[0042] In a possible implementation, one end of the second encapsulating body 52 is connected to the circuit board 10, and the other end of the second encapsulating body 52 extends out of the chip 20 along the optical axis direction and is connected to the filtering assembly 40.

[0043] In the scheme provided by the embodiments of the present application, since the second encapsulating body 52 is arranged at the outer periphery of all the chips 20, when one end of the second encapsulating body 52 is connected to the circuit board 10 and the other end of the second encapsulating body 52 extends out of the chip 20 along the optical axis direction and is connected to the filtering assembly 40, the second encapsulating body 52 can cover the outer periphery of all the chips 20, the filtering member 41 and the support body 31, so that the circuit board 10, the chip 20, the support body 31 and the filtering member 41 form an integrated structure, and the connection stability is higher.

[0044] In a possible implementation, the chip packaging structure 100 further includes a conducting member 60, one end of the conducting member 60 is electrically connected to the chip 20, and the other end of the conducting member 60 is electrically connected to the circuit board 10. In the embodiment, the conducting member 60 is a gold wire.

[0045] In the scheme provided by the embodiments of the present application, the conducting member 60 can ensure the electrical connection between the chip 20 and the circuit board 10, so that the signals between the chip 20 and the circuit board 10 are normally transmitted.

[0046] In a possible implementation, the conducting member 60 is arranged in the encapsulating member 50.

[0047] In the scheme provided by the embodiments of the present application, by arranging the conducting member 60 in the encapsulating member 50, for example, the conducting member 60 can be arranged in the first encapsulating body 51 or the second encapsulating body 52, the encapsulating member 50 can form protection for the conducting member 60, so as to prevent the conducting member 60 from being damaged or broken, thereby affecting the normal transmission of the signals between the chip 20 and the circuit board 10.

[0048] In a possible implementation, the chip packaging structure 100 further includes an adhesive member 70, the adhesive member 70 is arranged between the chip 20 and the circuit board 10 to fix the chip 20 and the circuit board 10. In the embodiment, the adhesive member 70 is formed by curing DA (die attach adhesives) glue.

[0049] In the scheme provided by the embodiments of the present application, by arranging the adhesive member 70, the chip 20 and the circuit board 10 can be fixed together firmly, and the stability is better.

[0050] Please refer to Figure 2 The second aspect of the embodiments of the present application provides a camera module 300, which includes the lens 200 and the chip packaging structure 100, and the lens 200 is installed on the side of the chip 20 away from the circuit board 10.

[0051] In the scheme provided by the embodiment of the application, the at least two chips 20 are arranged on the same circuit board 10, and the packaging member 50 is arranged between the adjacent two chips 20 and the outer periphery of all the chips 20 to fixedly connect the chips 20 and the circuit board 10, so that the plurality of chips 20 can be integrated on the circuit board 10, the resolution of the chip packaging structure 100 is increased, the detection range of the chip packaging structure 100 is expanded, and the miniaturization of the electronic device 1000 on which the chip packaging structure 100 is mounted is facilitated.

[0052] Please refer to Figure 3 The third aspect of the embodiment of the application provides an electronic device 1000, which comprises a shell 400 and a camera module 300, and the camera module 300 is arranged in the shell 400. The electronic device 1000 can be but is not limited to a mobile phone, a tablet computer, a notebook computer, a smart watch, a monitor, etc.

[0053] In the scheme provided by the embodiment of the application, the at least two chips 20 are arranged on the same circuit board 10, and the packaging member 50 is arranged between the adjacent two chips 20 and the outer periphery of all the chips 20 to fixedly connect the chips 20 and the circuit board 10, so that the plurality of chips 20 can be integrated on the circuit board 10, the resolution of the chip packaging structure 100 is increased, the detection range of the chip packaging structure 100 is expanded, and the miniaturization of the electronic device 1000 on which the chip packaging structure 100 is mounted is facilitated.

[0054] It is apparent for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, but can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all aspects as illustrative and not restrictive, and the scope of the present application is defined by the appended claims rather than the above description, and all changes falling within the meaning and range of equivalents of the elements of the claims are intended to be embraced therein. Any reference signs in the claims should not be considered as limiting the claims involved. In addition, it is clear that the word "comprise" does not exclude other units or steps, and the singular does not exclude the plural.

[0055] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application rather than limit the present application, and although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced equivalently without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A chip package structure, characterized by, The chip packaging structure comprises: a circuit board; at least two chips, which are arranged on one side of the circuit board and electrically connected to the circuit board; a support assembly, which is arranged on the side of the chips away from the circuit board; a filter assembly, which is arranged on the side of the support assembly away from the circuit board; a packaging member, which is arranged between adjacent two chips and around all the chips to fixedly connect the chips and the circuit board.

2. The chip package structure of claim 1, wherein, The support assembly comprises: at least two support bodies, which correspond to the at least two chips respectively, and each of the support bodies is arranged on the side of the corresponding chip away from the circuit board. The filter assembly comprises: at least two filter members, which correspond to the at least two support bodies respectively, and each of the filter members is arranged on the side of the corresponding support body away from the circuit board.

3. The chip package structure of claim 1, wherein, The packaging member comprises: a first packaging body, which is arranged between adjacent two chips and fixedly connected to the two chips; a second packaging body, which is arranged around all the chips and fixedly connected to the side surfaces of all the chips.

4. The chip package structure of claim 3, wherein, One end of the first packaging body is connected to the circuit board, and the other end of the first packaging body extends out of the chips along the optical axis direction and is connected to the filter assembly.

5. The chip package structure of claim 3, wherein, One end of the second packaging body is connected to the circuit board, and the other end of the second packaging body extends out of the chips along the optical axis direction and is connected to the filter assembly.

6. The chip package structure of claim 1, wherein, The chip packaging structure further comprises: a lead-through member, one end of which is electrically connected to the chips, and the other end of which is electrically connected to the circuit board.

7. The chip package structure of claim 6, wherein, The lead-through member is arranged in the packaging member.

8. The chip package structure of claim 1, wherein, The chip packaging structure further comprises: an adhesive member, which is arranged between the chips and the circuit board to fixedly connect the chips and the circuit board.

9. A camera module, comprising: The camera module comprises a lens and the chip packaging structure according to any one of claims 1 to 8, and the lens is arranged on the side of the chips away from the circuit board.

10. An electronic device, comprising: The camera module is arranged in the shell.

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