Wave-soldering carrier

Abstract

The utility model discloses a wave soldering carrier, which comprises a plurality of tin isolating sheets arranged on a carrier bottom plate, the carrier bottom plate comprises a first groove used for arranging and installing a PCB (Printed Circuit Board) and a second groove arranged within the range of the first groove, and the tin isolating sheets are arranged in the second groove. A plurality of isolation holes which are vertically communicated with the solder through hole are formed in the tin isolation sheets at intervals, the PCB covers the corresponding tin isolation sheets when being installed in the first groove, and a plurality of element pins exposed out of the bottom surface of the PCB are respectively surrounded and separated through the plurality of isolation holes; according to the wave-soldering carrier, connection of wave-soldering flux between two element pins can be isolated through the tin isolating sheet, so that the problem of tin connection short circuit existing between the element pins inserted at close intervals during wave soldering is solved, the repair rate after PCB welding is reduced, the wave-soldering carrier is suitable for the wave-soldering process of the multiple pins at close intervals on the PCB, the production efficiency is improved, and the production cost is reduced. And product welding quality is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board wave peak welding technical field, concretely relates to a wave peak welding carrier. BACKGROUND

[0002] Wave peak welding is to make molten solder form a solder wave peak meeting design requirements, and to place a circuit board pre-installed with components on a wave peak carrier, to realize solder joint through a certain angle chain transmission and a certain immersion depth through the solder wave peak, so as to realize the soft soldering process of mechanical and electrical connection between component pins and circuit board pads. With the development of circuit boards towards high density and high precision, the process design of circuit boards is more and more complex, and the pin pitch of components is smaller and smaller. After wave peak welding, pin tin connection phenomenon is easy to occur, which can easily cause pin short circuit problem. At present, a tin-dragging sheet is arranged at the tail of the component pin in the furnace direction to drag tin when the PCB passes through the tin, although the tin-dragging sheet can reduce a part of the short circuit problem, but for the densely arranged multiple component pins on the PCB, the tin-dragging sheet cannot completely solve the tin connection and short circuit problem. Therefore, manual tin-dragging repair is often needed after wave peak welding, which increases labor cost and causes secondary heating of components. SUMMARY

[0003] Therefore, the technical problem to be solved by the utility model is to overcome the problem of dense pin pitch of components on the circuit board, which can easily cause pin tin connection and short circuit after wave peak welding.

[0004] To solve the above technical problem, the utility model provides a wave peak welding carrier, which comprises:

[0005] A carrier bottom plate comprising a first groove for arranging and installing a PCB, at least one second groove arranged in the range of the first groove, and at least one solder through hole arranged in the carrier bottom plate corresponding to the position of the second groove;

[0006] An isolation structure comprising a tin isolation sheet matched and installed in the second groove, a plurality of isolation holes in the tin isolation sheet being arranged in intervals and being in communication with the solder through hole above and below, and the PCB being installed in the first groove and covering the corresponding tin isolation sheet, so that a plurality of component pins on the PCB are arranged in the plurality of isolation holes and are respectively surrounded and separated by the plurality of isolation holes.

[0007] As a preferred scheme, the depth of the isolation hole is greater than the depth of the component pin penetrating into the isolation hole.

[0008] As a preferred scheme, the tin isolation sheet comprises a plurality of isolation strips formed between the plurality of isolation holes.

[0009] As a preferred solution, the second grooves are spaced along the length of the carrier base plate and are arranged in the first grooves, the solder through holes are strip-shaped hole structures and are arranged on the carrier base plate, and the isolation strip is provided with an arc-shaped protrusion on the side facing the solder through holes.

[0010] As a preferred solution, the isolation holes are arranged on the solder isolation sheet according to the arrangement of the element pins on the PCB, and at least one row of isolation holes are arranged on the solder isolation sheet.

[0011] As a preferred solution, the solder isolation sheet is detachably mounted in the second grooves of the carrier base plate through a connecting structure, the connecting structure comprises fixing holes arranged in the second grooves, connecting holes arranged on the solder isolation sheet and corresponding to the fixing holes, and fixing members fastened in the connecting holes and the fixing holes for fixing the solder isolation sheet in the second grooves.

[0012] As a preferred solution, the carrier base plate comprises a first plane formed in the first grooves around the second grooves, and the solder isolation sheet is fixed in the second grooves and flush with the first plane.

[0013] As a preferred solution, the carrier base plate comprises a second plane arranged around the first grooves, and the second plane is provided with a locking structure for positioning and mounting the PCB in the first grooves.

[0014] As a preferred solution, the locking structure comprises a plurality of locking blocks rotatably arranged on the second plane and arranged on both sides of the first grooves, and the locking blocks are locked and pressed on the PCB.

[0015] The technical scheme of the utility model has the following advantages compared with the prior art:

[0016] 1. In the peak welding carrier, the solder isolation sheet is mounted on the carrier base plate, and the PCB is mounted on the corresponding solder isolation sheet, a plurality of element pins exposed on the bottom surface of the PCB are surrounded and separated by a plurality of isolation holes arranged on the solder isolation sheet according to a plurality of element pins, and the solder isolation sheet can isolate the connection between the two element pins during peak soldering of the PCB with the carrier, thereby effectively solving the problem of tin connection and short circuit between the element pins with close spacing during peak welding, realizing the electrical connection between the element pin and the circuit board pad, and reducing the repair rate of the PCB after welding. The peak welding carrier is suitable for the peak welding process of a plurality of close-spaced pins on the PCB, improves the production efficiency, and improves the product welding quality.

[0017] 2. The peak wave welding carrier provided by the utility model, the tin isolation sheet includes a plurality of isolation strips formed between a plurality of isolation holes, the depth of the isolation hole is greater than the depth of the component pin arranged in the isolation hole, so that the component pin is accommodated in the isolation hole, and the structure is arranged, and when the peak wave welding carrier drives the PCB to pass through the solder wave peak to realize welding of a plurality of component pins, the isolation strip forms a clear isolation position for isolating solder between two isolation holes, and the solder tension is added, so that the connection between the peak wave solder and adjacent two component pins is isolated, the peak wave solder can uniformly enter a plurality of isolation holes and a plurality of component pins to realize welding, the peak wave welding carrier adopting the tin isolation sheet design can reliably realize welding of the welding point of the component pin arranged at a close interval on the PCB, the situation of tin short circuit is avoided, the product quality is ensured, and the peak wave welding carrier is suitable for product batch processing and manufacturing.

[0018] 3. The peak wave welding carrier provided by the utility model, the tin isolation sheet includes a plurality of isolation strips formed between a plurality of isolation holes, the depth of the isolation hole is greater than the depth of the component pin arranged in the isolation hole, so that the component pin is accommodated in the isolation hole, and the structure is arranged, and when the peak wave welding carrier drives the PCB to pass through the solder wave peak to realize welding of a plurality of component pins, the isolation strip forms a clear isolation position for isolating solder between two isolation holes, and the solder tension is added, so that the connection between the peak wave solder and adjacent two component pins is isolated, the peak wave solder can uniformly enter a plurality of isolation holes and a plurality of component pins to realize welding, the peak wave welding carrier adopting the tin isolation sheet design can reliably realize welding of the welding point of the component pin arranged at a close interval on the PCB, the situation of tin short circuit is avoided, the product quality is ensured, and the peak wave welding carrier is suitable for product batch processing and manufacturing.

[0019] 4. The peak wave welding carrier provided by the utility model, the tin isolation sheet includes a plurality of isolation strips formed between a plurality of isolation holes, the depth of the isolation hole is greater than the depth of the component pin arranged in the isolation hole, so that the component pin is accommodated in the isolation hole, and the structure is arranged, and when the peak wave welding carrier drives the PCB to pass through the solder wave peak to realize welding of a plurality of component pins, the isolation strip forms a clear isolation position for isolating solder between two isolation holes, and the solder tension is added, so that the connection between the peak wave solder and adjacent two component pins is isolated, the peak wave solder can uniformly enter a plurality of isolation holes and a plurality of component pins to realize welding, the peak wave welding carrier adopting the tin isolation sheet design can reliably realize welding of the welding point of the component pin arranged at a close interval on the PCB, the situation of tin short circuit is avoided, the product quality is ensured, and the peak wave welding carrier is suitable for product batch processing and manufacturing. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the specific embodiments of the utility model or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or the prior art description, and obviously, the drawings in the following description are some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0021] Figure 1 The structure schematic diagram of the peak wave welding carrier provided by the utility model is shown in the figure.

[0022] Figure 2 The installation schematic diagram of the tin isolation sheet of the utility model in the peak wave welding carrier is shown in the figure.

[0023] Figure 3 The partial enlarged structure schematic diagram of the direction of the bottom of the peak wave welding carrier shown in the figure is shown in the figure. Figure 2

[0024] Figure 4 Figure 2 ​​A partially enlarged schematic diagram of the tin separator shown;

[0025] Figure 5 This is a schematic diagram of the structure of the tin separator of this utility model;

[0026] Figure 6 This is a schematic diagram of another variation of the tin separator of this utility model.

[0027] Explanation of reference numerals in the attached drawings: 1. Carrier base plate; 11. First plane; 12. Second plane; 2. First groove; 3. Second groove; 4. Solder separator; 41. Isolation hole; 42. Isolation strip; 43. Connecting hole; 44. Arc-shaped protrusion; 5. Fixing hole; 6. Solder through hole; 7. Locking block; 8. PCB board. Detailed Implementation

[0028] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0029] In the description of this utility model, it should be noted that the terms "first", "second" and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0030] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0031] Example

[0032] The following is a detailed description of this embodiment with reference to the accompanying drawings:

[0033] This embodiment provides, as follows: Figures 1-6 The wave soldering carrier shown includes:

[0034] The carrier base plate 1 includes a first groove 2 for arranging and mounting PCB boards 8, at least one second groove 3 disposed within the range of the first groove 2, and at least one solder through hole 6 disposed through the carrier base plate 1 corresponding to the position of the second groove 3.

[0035] The isolation structure comprises a tin isolation sheet 4 matchedly installed in the second groove 3, a plurality of isolation holes 41 are arranged on the tin isolation sheet 4 and communicate with the upper and lower solder through holes 6, and the PCB 8 is installed on the corresponding tin isolation sheet 4 to cover the tin isolation sheet 4, so that a plurality of element pins on the PCB 8 are correspondingly arranged in the plurality of isolation holes 41, and the plurality of element pins exposed on the bottom surface of the PCB 8 are respectively surrounded and separated by the plurality of isolation holes 41.

[0036] The above embodiment is the core technical scheme of the present embodiment, the tin isolation sheet 4 is first installed on the carrier bottom plate 1, then the PCB 8 is installed on the carrier bottom plate 1 to cover the corresponding tin isolation sheet 4, a plurality of isolation holes 41 are arranged on the tin isolation sheet 4 corresponding to a plurality of element pins, the plurality of element pins exposed on the bottom surface of the PCB 8 are respectively surrounded and separated by the plurality of isolation holes 41, and the PCB is connected to the carrier for wave soldering, the tin isolation sheet 4 can isolate the connection of the wave solder between two element pins, thereby effectively solving the problem of tin short circuit between the element pins with close spacing during wave soldering, realizing the electrical connection between the element pin and the circuit board pad, thereby reducing the repair rate of the PCB after soldering, and the wave soldering carrier is suitable for wave soldering process of a plurality of element pins with close spacing on the PCB, improves the production efficiency and improves the product soldering quality.

[0037] The following will be described in detail Figures 2-6 The specific setting mode of the tin isolation sheet will be described in detail

[0038] The tin isolation sheet 4 comprises a plurality of isolation strips 42 formed between the plurality of isolation holes 41, and the depth of the isolation hole 41 is greater than the depth of the element pin penetrating into the isolation hole 41, so that the element pin is accommodated in the isolation hole 41. During the process of the wave soldering carrier driving the PCB to pass through the solder wave to realize the soldering of the plurality of element pins, the isolation strip 42 forms a clear isolation position between two isolation holes 41 for isolating the solder, and the solder itself has a tension effect, thereby isolating the connection of the wave solder between the adjacent two element pins, so that the wave solder can be in contact with the plurality of element pins in the plurality of isolation holes 41 to realize the soldering. The wave soldering carrier designed with the tin isolation sheet can ensure that the element pins with close spacing on the PCB can be reliably soldered, avoid the occurrence of tin short circuit, ensure the product quality, and is suitable for batch processing of products.

[0039] Further preferably, the second groove 3 is spaced and distributed in the first groove 2 along the length direction of the carrier bottom plate 1, and the solder through hole 6 is in a strip hole structure and corresponds to be provided with a plurality of solder through holes on the carrier bottom plate 1. This design can satisfy the wave soldering requirements of multiple PCBs or multiple groups of components on the PCB at one time. The isolation hole 41 is arranged on the solder isolation sheet 4 according to the arrangement form of the element pins on the PCB, and at least one row of isolation holes 41 is arranged on the solder isolation sheet 4. In this way, it can be ensured that the element pins on the PCB are inserted into the isolation holes 41 of the solder isolation sheet 4, so as to avoid the phenomenon of tin connection of the closely spaced element pins on the PCB during wave soldering. In order to further improve the tin isolation effect between the closely spaced element pins, as a deformation mode of the solder isolation sheet, the arc-shaped protrusion 44 is arranged on one side of the isolation strip 42 facing the solder through hole 6, so as to increase the isolation height of the isolation strip 42 between the adjacent two isolation holes 41, so that the tin material cannot stay on the isolation strip, and the wave solder can be better isolated and disconnected between the two element pins, thereby improving the isolation soldering effect. Figure 6

[0040] As shown in Figures 2-4 The solder isolation sheet 4 is fixedly installed in the first groove 2 of the carrier bottom plate 1 through a connecting structure. The connecting structure includes a fixing hole 5 arranged in the second groove 3, a connecting hole 43 arranged on the isolation sheet and corresponding to the fixing hole 5, and a fixing member tightly connected in the connecting hole 43 and the fixing hole 5 for fixing the solder isolation sheet 4 in the second groove 3. The fixing hole 5 can be a threaded hole, and the fixing member is preferably a screw, that is, the solder isolation sheet 4 is installed on the carrier bottom plate 1 in a screw fixing mode. This installation structure is simple and convenient to replace and install the solder isolation sheet 4, and can be selected according to different types of PCBs. It has good applicability. Of course, the solder isolation sheet 4 can also be installed on the carrier bottom plate in a rivet or buckle mode.

[0041] As a preferred embodiment, the carrier bottom plate 1 includes a first plane 11 arranged around the second groove 3. The solder isolation sheet 4 is fixed in the second groove 3 and flush with the first plane 11. One or more PCBs can be installed on the carrier bottom plate 1. This design can ensure that the PCBs are installed and arranged on the solder isolation sheet 4 when the PCBs are installed in the first groove, so as to ensure the flatness and stability of the installation and contact between the PCBs and the solder isolation sheet, thereby ensuring the reliability of subsequent wave soldering.

[0042] Further preferably, as shown in Figures 1-2 ​As shown, the carrier bottom plate 1 comprises a second plane 12 formed on the top of the carrier bottom plate around the first groove 2, and a locking structure is arranged on the second plane 12 for positioning and mounting the PCB 8 in the first groove 2. Specifically, the locking structure comprises a plurality of locking blocks 7 arranged on the second plane 12 and separately arranged on both sides of the first groove 2, and the locking blocks 7 are locked and pressed on the PCB. In this structure, the PCB is mounted into the first groove 2 of the carrier bottom plate 1, and then the locking blocks 7 are rotated and pressed on the PCB to lock. The locking blocks 7 play a positioning and mounting role on the PCB placed on the carrier bottom plate 1, so as to prevent the PCB from shaking in position during the wave soldering process, thereby ensuring the stability and reliability of the PCB soldering.

[0043] Obviously, the above embodiments are only examples for clearly illustrating the present application, and are not intended to limit the embodiments. Based on the above description, other different forms of changes or variations can be made by those skilled in the art. Here, it is not necessary and impossible to enumerate all the embodiments. The obvious changes or variations derived therefrom are still within the protection scope of the present application.

Claims

1. A wave soldering carrier, characterized in that The utility model relates to a kind of carrier baseplate (1), including the first recess (2) for arranging the installation PCB board (8) being equipped with, and at least one second recess (3) being arranged in the scope of the first recess (2), and at least one solder via (6) being arranged in the carrier baseplate (1) is passed through corresponding second recess (3) position; Isolation structure includes tin isolation sheet (4) matched in second recess (3), a plurality of isolation holes (41) are arranged on the tin isolation sheet (4) and are communicated with solder via (6) up and down, PCB board (8) is installed in first recess (2) and covers corresponding tin isolation sheet (4), so that a plurality of element pins on PCB board (8) are passed through a plurality of isolation holes (41), and a plurality of element pins exposed on the bottom surface of PCB board are respectively surrounded and separated by a plurality of isolation holes (41). The depth of the isolation hole (41) is greater than the depth of the element pin penetrating into the isolation hole (41).

2. A wave-solder carrier according to claim 1, characterized in that: The tin isolation sheet (4) includes a plurality of isolation strips (42) formed between a plurality of isolation holes (41).

3. A wave-solder carrier according to claim 2, wherein: The second recess (3) is spaced along the length of the carrier baseplate (1) and is arranged in the first recess (2), the solder via (6) is a strip-shaped hole structure and is arranged in a plurality of positions on the carrier baseplate (1), and the isolation strip (42) is provided with an arc-shaped protrusion (44) on the side facing the solder via (6).

4. A wave-solder carrier according to claim 3, wherein: A plurality of isolation holes (41) are arranged on the tin isolation sheet (4) according to the arrangement of a plurality of element pins on the PCB, and at least one row is arranged on the tin isolation sheet (4).

5. A wave-solder carrier according to claim 4, wherein: The tin isolation sheet (4) is fixedly installed in the second recess (3) of the carrier baseplate (1) through a connecting structure, the connecting structure includes a fixing hole (5) arranged in the second recess (3), a connecting hole (43) arranged on the isolation sheet and corresponding to the fixing hole (5), and a fixing member tightly connected in the connecting hole (43) and the fixing hole (5) for fixing the tin isolation sheet (4) in the second recess (3).

6. A wave-solder carrier according to any one of claims 1-5, characterized in that: The carrier baseplate (1) includes a first plane (11) formed in the first recess (2) around the second recess (3), and the tin isolation sheet (4) is fixed in the second recess (3) and flush with the first plane (11).

7. A wave-solder carrier according to claim 6, wherein: The carrier baseplate (1) includes a second plane (12) arranged around the first recess (2), and the second plane (12) is provided with a locking structure for positioning and installing the PCB board (8) in the first recess (2).

8. A wave-solder carrier according to claim 7, wherein: The locking structure includes a plurality of locking blocks (7) rotatably arranged on the second plane (12) and arranged on both sides of the first recess (2), and the locking blocks (7) are locked and pressed on the PCB board (8).

9. A wave-solder carrier according to claim 8, wherein: ​

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