Display panel and display device

Abstract

The utility model relates to a display panel and a display device, the display panel is provided with a display area and a fan-out area located on one side of the display area, the display panel is provided with a cutting channel, the cutting channel is annularly arranged on the periphery of the display area and the fan-out area, the cutting channel is internally provided with a cutting track line used for cutting, and the display panel comprises a substrate and an inorganic layer; the inorganic layer is arranged on one side of the substrate, a partition part is arranged on the inorganic layer, and the partition part at least penetrates through the inorganic layer in the thickness direction of the inorganic layer; wherein the partition parts are located in the cutting channel and at least located on the periphery of the fan-out area, and the partition parts are located between the cutting track line and the outer contour line of the fan-out area and continuously arranged outside the outer contour line of the fan-out area; therefore, even if the inorganic layer cracks when the display panel is cut along the cutting track, the partition part can effectively block the crack propagation path, the cracks are prevented from extending into the fan-out area, and the proportion of poor functionality of the display panel caused by line breakage is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display devices, in particular to a display panel and a display device. BACKGROUND

[0002] Flexible OLED display panels can be divided into three regions, i.e., a display region, a wiring region, and a dummy region, according to functions at different positions. When the production reaches a certain stage, the dummy region is cut off along a cutting path by using a laser. The wiring region forms a corner at the edge of the screen body due to line contraction, and the corresponding cutting path also forms a corner at the corresponding position. Stress is easily concentrated at the corner during the tearing of the protective film in the screen module production process. Generally, the film layer of the wiring region includes a PI layer, an inorganic layer, a metal circuit layer, and an organic layer; the film layer of the cutting path includes a PI layer and an inorganic layer; when the dummy region is cut off along the cutting path by using a high-energy laser, micro-defects are generated at the cutting edge, and the defects at the corner of the wiring region can develop into cracks. Since the inorganic layer has poor toughness, the cracks can further extend in the plane, thereby causing the line to break, and further causing the screen body to have display and touch functional defects. CONTENT OF THE UTILITY MODEL

[0003] The display panel and the display device provided in the embodiments of the present application can effectively block the crack propagation path, avoid the line break in the fan-out region, and further reduce the proportion of functional defects of the display panel caused by the line break.

[0004] To achieve the above-mentioned purpose, according to a first aspect of the present application, a display panel is provided, the display panel has a display region and a fan-out region located on one side of the display region, a cutting path is arranged on the display panel, the cutting path is arranged around the periphery of the display region and the fan-out region, a cutting track line for cutting is arranged in the cutting path, and the display panel comprises:

[0005] a substrate; and

[0006] an inorganic layer, the inorganic layer is arranged on one side of the substrate, and a partition portion is arranged on the inorganic layer, the partition portion at least penetrates the inorganic layer in the thickness direction of the inorganic layer;

[0007] The partition portion is located in the cutting path and at least located at the periphery of the fan-out region, and the partition portion is located between the cutting track line and the outer contour line of the fan-out region and is continuously arranged outside the outer contour line of the fan-out region.

[0008] In an embodiment, a separation groove is arranged on the inorganic layer, the separation groove is located between the cutting track line and the outer contour line of the fan-out area, in the thickness direction of the inorganic layer, a bottom wall of the separation groove penetrates through the inorganic layer and stops at the substrate, and the separation groove extends along the outer contour line of the fan-out area.

[0009] The separation part includes the separation groove.

[0010] In an embodiment, the bottom wall of the separation groove penetrates through the inorganic layer and stops at the substrate, and the width of the separation groove is greater than 20 μm.

[0011] In an embodiment, the distance between the groove edge away from the side of the fan-out area and the cutting track line is greater than 60 μm.

[0012] In an embodiment, a separation track line is arranged in the cutting path, the separation track line is located between the cutting track line and the outer contour line of the fan-out area, and the separation track line extends along the outer contour line of the fan-out area.

[0013] The separation groove extends along the direction in which the separation track line extends, in the thickness direction of the inorganic layer, the bottom wall of the separation groove penetrates through the inorganic layer and the side of the substrate towards the inorganic layer.

[0014] In an embodiment, the distance between the separation track line and the cutting track line in the direction away from the fan-out area is greater than 100 μm.

[0015] In an embodiment, a groove is arranged on the inorganic layer, in the thickness direction of the inorganic layer, the bottom wall of the groove penetrates through the inorganic layer and stops at the substrate, a filling part is arranged in the groove, the thickness of the filling part is the same as the thickness of the inorganic layer, and the filling part is an inorganic filling part or an organic filling part.

[0016] The separation part includes the filling part.

[0017] In an embodiment, the separation part is located between the cutting track line and the outer contour line of the fan-out area.

[0018] The width W1 of the cutting path at the position corresponding to the display area is less than the width W2 of the cutting path at the position corresponding to the fan-out area.

[0019] In an embodiment, in the direction away from the fan-out area, the width of the separation part is set as W3, and the distance between the separation part and the cutting track line is set as H, wherein W2=W1+W3+H.

[0020] According to a second aspect of the present application, a display device is provided, comprising the display panel as described above.

[0021] In the display panel of the embodiments of the present application, the display panel has a display area and a fan-out area located at one side of the display area, and a cutting path is arranged on the display panel, the cutting path is annularly arranged at the periphery of the display area and the fan-out area, and a cutting track line for cutting is arranged in the cutting path. In the production process, the display panel is cut along the cutting track line. The display panel comprises a substrate and an inorganic layer, and a partitioning portion is arranged on the inorganic layer. The partitioning portion at least penetrates the inorganic layer, and is arranged at a position corresponding to the cutting path and located between the cutting track line and an outer contour line of the fan-out area. In this way, even if a crack appears in the inorganic layer when the display panel is cut along the cutting track line, the partitioning portion can effectively block the crack propagation path and prevent the crack from extending into the fan-out area, thereby avoiding the breakage of the circuit in the fan-out area and further reducing the proportion of the display panel with functional defects due to the breakage of the circuit.

[0022] Other features and advantages of the present application will be described in detail in the following detailed description. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0024] In order to more completely understand the present application and its beneficial effects, the following will be described in conjunction with the drawings, wherein the same reference numerals in the following description represent the same parts.

[0025] Figure 1 A film layer diagram of the display panel provided by the prior art (including a cutting line);

[0026] Figure 2 A plan view of the display panel provided by the embodiments of the present application (before cutting);

[0027] Figure 3 A first film layer diagram of the display panel provided by the embodiments of the present application (including a cutting line);

[0028] Figure 4 A second film layer diagram of the display panel provided by the embodiments of the present application (including a cutting line);

[0029] Figure 5 A third film layer diagram of the display panel provided by the embodiments of the present application (including a cutting line);

[0030] Figure 6 AFigure 2 Enlarged view of the local A in Fig. 1. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative effort belong to the protection scope of the present application.

[0032] In a first aspect, the embodiments of the present application provide a display panel 100. Please refer to Figure 2 The display panel 100 has a display area AA and a fan-out area FO located at one side of the display area AA. Specifically, the display panel 100 can include the display area AA and a non-display area NA arranged around the periphery of the display area AA. The display area AA can be used to display a picture image. A plurality of sub-pixels arranged in an array can be arranged in the display area AA. Each sub-pixel can be controlled to emit light independently by a pixel driving circuit. The non-display area NA does not have the function of image display. The non-display areas NA at different positions around the periphery of the display area AA have different functions. Generally, the non-display areas NA on the left and right sides of the display area AA can be used to place gate driving circuits and other signal traces. The non-display area NA located below the display area AA can be used to place source driving circuits, fan-out traces, terminals, and the like, so as to form a trace area below the display area AA.

[0033] It can be known that the display panel 100 described in the present application is cut from a to-be-cut display panel 100. The to-be-cut display panel 100 usually further includes a dummy area DY (Dummy area) arranged around the periphery of the display area AA and the non-display area NA. A cutting path 1 is formed between the dummy area and the display area AA and the non-display area NA. The to-be-cut display panel 100 is cut along the cutting path 1, so as to cut off the dummy area. The trace area is usually also called a fan-out area FO. Please refer to Figure 2 Due to the screen arc angle, in the direction away from the display area AA, the traces of the fan-out area FO are arranged to gradually narrow and then gradually expand. The narrowing and expansion of the lines cause the edges of the fan-out area FO to have corners. Therefore, the cutting path 1 corresponding to the periphery of the fan-out area FO also has corners.

[0034] Please refer to Figure 1The film layers of the display panel 100' in the fan-out area FO' can be simplified as a substrate 2', an inorganic layer 3', a metal circuit layer 5' and an organic layer 6'; the film layers of the display panel 100' in the cutting path 1' can be simplified as the substrate 2' and the inorganic layer 3'; in combination Figure 2 In the prior art, the display panel 100' is usually cut along the cutting path 1' by a high-energy laser, and slight defects are generated at the cutting edge position. Since stress is concentrated at the corner position of the fan-out area FO' in the subsequent module film tearing process, the defects at the corner position develop into cracks. Since the inorganic layer 3' has poor toughness, the cracks are easily further expanded into the fan-out area FO', thereby causing the wire to be disconnected, and further causing the screen body to have display or touch functional defects.

[0035] In the present application, please refer to Figures 3 to 5 Before cutting along the cutting path 1', a partition part 4 is arranged on the inorganic layer 3, and the partition part 4 at least penetrates the inorganic layer 3 in the thickness direction of the inorganic layer 3. Meanwhile, the partition part 4 is arranged at a position corresponding to the cutting path 1' and at least located at the periphery of the fan-out area FO. The partition part 4 is located between the cutting trajectory line 11 and the outer contour line of the fan-out area FO and continuously arranged outside the outer contour line of the fan-out area FO.

[0036] Please refer to Figures 2 to 5 In the process of the display panel 100, when the display panel 100 is cut along the cutting path 1' by a high-energy laser, slight defects are generated at the cutting edge position, and at this time, the inorganic layer 3 also has cracks. By arranging the partition part 4 between the cutting trajectory line 11 and the outer contour line of the fan-out area FO, the crack expansion path can be effectively blocked, the crack is prevented from extending into the fan-out area FO, thereby avoiding the disconnection of the wire in the fan-out area FO, and further reducing the proportion of the display panel 100 having functional defects due to the disconnection of the wire.

[0037] Usually, the film layers of the display panel 100 in the fan-out area FO' can be simplified as a substrate 2', an inorganic layer 3', a metal circuit layer 5' and an organic layer 6'; the film layers of the display panel 100 in the cutting path 1' can be simplified as the substrate 2' and the inorganic layer 3'.

[0038] The form of the partition part 4 is not specifically limited in the present application.

[0039] In an embodiment, the inorganic layer 3 is provided with a partition groove 41, the partition groove 41 is located between the cutting trajectory line 11 and the outer contour line of the fan-out area FO, in the thickness direction of the inorganic layer 3, the bottom wall of the partition groove 41 at least penetrates the inorganic layer 3, and the partition groove 41 extends along the outer contour line of the fan-out area FO; wherein the partition part 4 comprises the partition groove 41.

[0040] In the present embodiment, by providing the partition groove 41 on the inorganic layer 3, the partition groove 41 extends along the outer contour line of the fan-out area FO, and the bottom wall of the partition groove 41 at least penetrates the inorganic layer 3; in this way, the inorganic layer 3 can be cut off, even if the inorganic layer 3 cracks when the display panel 100 is cut along the cutting trajectory line 11, the partition groove 41 can effectively block the crack propagation path, prevent the crack from extending into the fan-out area FO, thereby avoiding the circuit in the fan-out area FO from being broken, and further reducing the proportion of the display panel 100 that is functionally poor due to circuit breakage.

[0041] Please refer to Figure 3 In the first embodiment of the present application, the bottom wall of the partition groove 41 penetrates the inorganic layer 3 and stops at the substrate 2, and the width of the partition groove 41 is greater than 20 μm; in the present embodiment, the inorganic layer 3 is first made on the substrate 2; a photoresist layer is provided on the inorganic layer 3; the photoresist layer is exposed, and then the photoresist layer is sprayed with a developing solution, so as to remove the unexposed or exposed part of the photoresist layer, and the removed part is located between the cutting trajectory line 11 and the outer contour line of the fan-out area FO; the inorganic layer 3 is etched using the patterned photoresist layer as a mask, so as to form the partition groove 41 on the inorganic layer 3, and then the photoresist layer is cleaned.

[0042] Furthermore, when the partition groove 41 is etched by this method, the bottom wall of the partition groove 41 penetrates the inorganic layer 3 and stops at the substrate 2, the thickness of the substrate 2 is usually set to 10 μm, and the thickness of the inorganic layer 3 is usually set to 3 μm, that is, the depth of the partition groove 41 is set to 3 μm, and the width of the partition groove 41 formed by etching by this method is greater than 20 μm.

[0043] In order to avoid that the actual cutting position deviates to the side between the partition groove 41 and the fan-out area FO due to cutting precision when cutting along the cutting trajectory line 11, so that the partition groove 41 cannot have a blocking effect, in the embodiment of the present application, the distance between the groove edge on the side of the partition groove 41 away from the fan-out area FO and the cutting trajectory line 11 is set as H1, the cutting precision when the laser cuts along the cutting trajectory line 11 is usually set as 50 μm, the process precision when etching the partition groove 41 is set as 10 μm, in order to ensure that the actual cutting position is on the side of the partition groove 41 away from the fan-out area FO when cutting, the distance H1 between the groove edge on the side of the partition groove 41 away from the fan-out area FO and the cutting trajectory line 11 is greater than 60 μm.

[0044] Please refer to Figure 4 In the second embodiment of the present application, the cutting path 1 is provided with a partition trajectory line 12, the partition trajectory line 12 is located between the cutting trajectory line 11 and the outer contour line of the fan-out area FO, and the partition trajectory line 12 extends along the outer contour line of the fan-out area FO; the partition groove 41 is provided in the direction extending along the partition trajectory line 12, and in the thickness direction of the inorganic layer 3, the bottom wall of the partition groove 41 penetrates the inorganic layer 3 and the side of the substrate 2 towards the inorganic layer 3.

[0045] In the embodiment, the cutting path 1 is provided with the partition trajectory line 12 and the cutting trajectory line 11, the cutting trajectory line 11 is located on the side of the partition trajectory line 12 away from the outer contour line of the fan-out area FO; the partition groove 41 is made in the direction extending along the partition trajectory line 12, which can ensure that the partition groove 41 can extend according to the preset trajectory when being prepared, so as to ensure that the position of the partition groove 41 is accurate enough, and thus the crack blocking effect of the partition groove 41 is improved.

[0046] In an exemplary embodiment, the low-power high-speed laser is first used to cut along the partition trajectory line 12 for the first time, so as to form the partition groove 41 and cut off the inorganic layer 3, since the low-power high-speed laser can reduce the energy density received by the material in single cutting, therefore, the low-power high-speed laser can reduce the probability of micro-defects when cutting off the inorganic layer 3; after the first cutting by the low-power high-speed laser, the inorganic layer 3 is cut off, and then the high-energy laser is used to cut along the cutting trajectory line 11.

[0047] And, when the inorganic layer 3 is cut by the low-power high-speed laser to form the partition groove 41, in order to ensure that the inorganic layer 3 is completely cut, the cutting depth of the low-power high-speed laser needs to be greater than the thickness of the inorganic layer 3, that is, the low-power high-speed laser can cut the substrate 2, so that the bottom wall of the partition groove 41 penetrates the inorganic layer 3 and the side of the substrate 2 towards the inorganic layer 3, thereby achieving the cutting of the inorganic layer 3; the thickness of the substrate 2 is usually set to 10 μm, the thickness of the inorganic layer 3 is usually set to 3 μm, the cutting depth of the low-power high-speed laser is greater than 3 μm, and the depth of the partition groove 41 is greater than 3 μm.

[0048] It can be known that when cutting by the low-power high-speed laser and the high-energy laser, the actual cutting position will be offset based on the cutting precision; in order to avoid the actual cutting position being offset to between the partition groove 41 and the fan-out area FO due to the cutting precision when cutting by the laser, so that the partition groove 41 cannot have a blocking effect, in the embodiment of the present application, the spacing between the partition track line 12 and the cutting track line 11 is set to H2, the cutting precision when cutting by the laser along the cutting track line 11 is usually set to 50 μm, and the cutting precision when cutting by the laser along the partition track line 12 is usually set to 50 μm; in order to ensure that the actual cutting position is on the side of the partition groove 41 away from the fan-out area FO when cutting, the spacing H2 between the partition track line 12 and the cutting track line 11 needs to be greater than twice the cutting precision, that is, the spacing between the partition track line 12 and the cutting track line 11 is greater than 100 μm.

[0049] Please refer to Figure 5 In the third embodiment of the present application, the inorganic layer 3 is provided with a groove 42, in the thickness direction of the inorganic layer 3, the bottom wall of the groove 42 penetrates the inorganic layer 3 and stops at the substrate 2, and the groove 42 is provided with a filling part 43, the thickness of the filling part 43 is the same as the thickness of the inorganic layer 3, and the filling part 43 is an inorganic filling part or an organic filling part; wherein the partition part 4 comprises the filling part 43.

[0050] The difference between the first embodiment and the third embodiment is that, in the third embodiment, the filling part 43 is arranged on the substrate 2 between the cutting track line 11 and the outer contour line of the fan-out area FO, the whole inorganic layer 3 is arranged on the substrate 2, the filling part 43 is covered by the whole inorganic layer 3, the photoresist layer is arranged on the whole inorganic layer 3, the photoresist layer is exposed, and then the photoresist layer is sprayed with developing solution, so that the unexposed or exposed part of the photoresist layer is removed, and the removed part corresponds to the position of the filling part 43, and the inorganic layer 3 is etched by using the patterned photoresist layer as a mask, so that the groove 42 is formed on the inorganic layer 3 and the filling part 43 is exposed.

[0051] It can be understood that, when the display panel 100 is cut along the cutting track line 11 in the cutting path 1, a crack usually occurs at the position of the fan-out area FO, because the filling part 43 is arranged between the cutting track line 11 and the outer contour line of the fan-out area FO, the crack extends to the position of the filling part 43, and when the crack wants to further expand towards the inside of the fan-out area FO, the crack is stopped at the position of the filling part 43, so that the crack expansion path is effectively blocked, the crack is prevented from extending into the fan-out area FO, the circuit in the fan-out area FO is prevented from being broken, and the proportion of the display panel 100 with functional defects due to the broken circuit is reduced.

[0052] In an embodiment of the present application, please refer to Figure 6 When the display panel 100 is cut along the cutting track line 11 in the cutting path 1, a crack usually occurs at the position of the fan-out area FO, in order to block the further expansion of the crack, the partition part 4 needs to be arranged in the cutting path 1, the partition part 4 is arranged only at the position corresponding to the fan-out area FO, and the partition part 4 is located between the cutting track line 11 and the outer contour line of the fan-out area FO. Because the cutting path 1 needs to be provided with the partition part 4 at the position corresponding to the fan-out area FO, the width W2 of the cutting path 1 at the position of the fan-out area FO is wider than the width W1 of the cutting path 1 at the position of the display area AA, that is, the width W1 of the cutting path 1 at the position corresponding to the display area AA is smaller than the width W2 of the cutting path 1 at the position corresponding to the fan-out area FO.

[0053] And, it can be understood that the partition part 4 itself has a certain width, and when the partition part 4 is arranged, in order to avoid cutting directly on the partition part 4 when cutting along the cutting trajectory line 11, the partition part 4 also needs to be arranged at a distance from the cutting trajectory line 11, that is, the width of the cutting lane 1 at the position corresponding to the fan-out area FO is at least the sum of the width of the partition part 4 and the distance between the partition part 4 and the cutting trajectory line 11; that is, in the direction away from the fan-out area FO, the width of the cutting lane 1 at the position corresponding to the display area AA is set as W1, the width of the cutting lane 1 at the position of the fan-out area FO is set as W2, the width of the partition part 4 is set as W3, and the distance between the partition part 4 and the cutting trajectory line 11 is set as H, wherein W2=W1+W3+H.

[0054] In the first embodiment, the whole inorganic layer 3 is first made on the substrate 2; then the partition groove 41 is etched on the inorganic layer 3; the width W3 of the partition groove 41 is greater than 20 μm; and since the cutting precision S1 of the laser when cutting along the cutting trajectory line 11 is set to 50 μm, and the process precision S2 when etching the partition groove 41 is set to 10 μm, the distance H between the partition part 4 and the cutting trajectory line 11 is equivalent to the distance H1 between the groove edge of the partition groove 41 away from the fan-out area FO and the cutting trajectory line 11, in order to avoid cutting directly on the partition part 4 when cutting along the cutting trajectory line 11, the distance H1 between the groove edge of the partition groove 41 away from the fan-out area FO and the cutting trajectory line 11 is greater than S1+S2, that is, in the first embodiment, the distance H between the partition part 4 and the cutting trajectory line 11 is greater than 60 μm; and as mentioned above, the width W2 of the cutting lane 1 at the position corresponding to the fan-out area FO is W1+W3+H, therefore W2 is greater than W1+80 μm.

[0055] In an exemplary embodiment, the distance H1 between the groove edge of the partition groove 41 away from the fan-out area FO and the cutting trajectory line 11 is greater than or equal to 80 μm, that is, the distance H between the partition part 4 and the cutting trajectory line 11 is greater than or equal to 80 μm, therefore W2 is greater than or equal to W1+100 μm.

[0056] In the second embodiment, the cutting track 1 is provided with the partition trajectory line 12 and the cutting trajectory line 11, the cutting trajectory line 11 is located on the side of the partition trajectory line 12 away from the outer contour line of the fan-out area FO; first, the first cutting along the partition trajectory line 12 is performed by using the low-power high-speed laser, thereby forming the partition groove 41; then, the cutting along the cutting trajectory line 11 is performed by using the high-energy laser; the spacing H between the partition part 4 and the cutting trajectory line 11 is equivalent to the spacing H2 between the partition trajectory line 12 and the cutting trajectory line 11, based on the cutting precision of the low-power high-speed laser, in order to avoid that the partition groove 41 is too close to the cutting trajectory line 11 due to the cutting precision when the partition groove 41 is cut along the partition trajectory line 12, therefore, the spacing H2 between the partition trajectory line 12 and the cutting trajectory line 11 needs to be greater than 100 μm, that is, the spacing H between the partition part 4 and the cutting trajectory line 11 is greater than 100 μm.

[0057] And it can be known that the width W3 of the partition groove 41 cut by the low-power high-speed laser is approximately 0, as mentioned above, the width W2 of the cutting track 1 at the position corresponding to the fan-out area FO is W1+W3+H, therefore, the width W2 of the cutting track 1 at the position corresponding to the fan-out area FO is greater than W1+100 μm.

[0058] In an exemplary embodiment, the spacing H2 between the partition trajectory line 12 and the cutting trajectory line 11 is greater than or equal to 150 μm, that is, the spacing H between the partition part 4 and the cutting trajectory line 11 is greater than or equal to 150 μm, therefore, W2 is greater than or equal to W1+150 μm.

[0059] In the third embodiment, since the groove 42 on the inorganic layer 3 is made in the same way as the separation groove 41 in the first embodiment, the process precision S2 when the groove 42 is etched is set to 10 μm, the cutting precision S1 when the laser cuts along the cutting track line 11 is set to 50 μm, and therefore the distance H between the separation part 4 and the cutting track line 11 is equivalent to the distance H1 between the groove 42 far from the fan-out area FO and the cutting track line 11. In order to avoid cutting the separation part 4 directly when cutting along the cutting track line 11, the distance H1 between the groove 42 far from the fan-out area FO and the cutting track line 11 is greater than S1+S2, that is, in the third embodiment, the distance H between the separation part 4 and the cutting track line 11 is greater than 60 μm; at the same time, the width W3 of the groove 42 formed by etching is greater than 20 μm; and as mentioned above, the width W2 of the cutting path 1 at the position corresponding to the fan-out area FO is W1+W3+H, so W2 is greater than W1+80 μm 。

[0060] In an exemplary embodiment, the distance H1 between the groove 42 far from the fan-out area FO and the cutting track line 11 is greater than or equal to 80 μm, that is, the distance H between the separation part 4 and the cutting track line 11 is greater than or equal to 80 μm, and therefore W2 is greater than or equal to W1+100 μm.

[0061] In a second aspect, the embodiments of the present application provide a display device. The display device comprises a display panel 100; it should be noted that the display panel 100 is provided as the display panel 100 described above, that is, the display panel 100 comprises all the technical features of the display panel 100 described above, and the display device comprises all the embodiments of the display panel 100 described above, and therefore has all the technical effects of the embodiments described above, which will not be described here.

[0062] The display device can be a liquid crystal display screen, a mobile phone, a notebook computer, a watch, a VR device, etc., which will not be specifically limited here.

[0063] In the description of the present application, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" can explicitly or implicitly include one or more features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0064] In the above embodiments, the description of each embodiment has its own focus, and the parts not described in detail in a certain embodiment can be referred to the relevant description of other embodiments.

[0065] The embodiments, implementation manners and related technical features of the present application can be combined or replaced with each other without conflict.

[0066] The above are only the preferred embodiments of the present application, and do not limit the present application in any form. Any simple modification, equivalent change and modification made to the above embodiments without departing from the technical solution content of the present application and in accordance with the technical essence of the present application still belongs to the scope of the technical solution of the present application.

Claims

1. A display panel, characterized by, The display panel has a display area and a fan-out area on one side of the display area, and a cutting channel is arranged on the display panel, the cutting channel is arranged around the periphery of the display area and the fan-out area, a cutting track line for cutting is arranged in the cutting channel, and the display panel comprises: a substrate; and an inorganic layer arranged on one side of the substrate, and a partition portion arranged on the inorganic layer, the partition portion at least penetrates the inorganic layer in the thickness direction of the inorganic layer; wherein the partition portion is located in the cutting channel and at least on the periphery of the fan-out area, the partition portion is located between the cutting track line and the outer contour line of the fan-out area and is continuously arranged outside the outer contour line of the fan-out area.

2. The display panel of claim 1, wherein, A partition groove is arranged on the inorganic layer, the partition groove is located between the cutting track line and the outer contour line of the fan-out area, and the bottom wall of the partition groove at least penetrates the inorganic layer in the thickness direction of the inorganic layer, and the partition groove extends along the outer contour line of the fan-out area; wherein the partition portion comprises the partition groove.

3. The display panel of claim 2, wherein, The bottom wall of the partition groove penetrates the inorganic layer and stops at the substrate, and the width of the partition groove is greater than 20 μm.

4. The display panel of claim 3, wherein, The distance between the groove edge away from the one side of the fan-out area and the cutting track line is greater than 60 μm.

5. The display panel of claim 2, wherein, A partition track line is arranged in the cutting channel, the partition track line is located between the cutting track line and the outer contour line of the fan-out area, and the partition track line extends along the outer contour line of the fan-out area; The partition groove is arranged in the extending direction of the partition track line, and the bottom wall of the partition groove penetrates the inorganic layer and the side of the substrate facing the inorganic layer in the thickness direction of the inorganic layer.

6. The display panel of claim 5, wherein, The interval between the partition track line and the cutting track line in the direction away from the fan-out area is greater than 100 μm.

7. The display panel of claim 1, wherein, A recess is arranged on the inorganic layer, the bottom wall of the recess penetrates the inorganic layer and stops at the substrate in the thickness direction of the inorganic layer, a filling portion is arranged in the recess, the thickness of the filling portion is the same as the thickness of the inorganic layer, and the filling portion is an inorganic filling portion or an organic filling portion; wherein the partition portion comprises the filling portion.

8. The display panel of claim 1, wherein, The partition portion is located between the cutting track line and the outer contour line of the fan-out area; The width W1 of the cutting channel at the position corresponding to the display area is less than the width W2 of the cutting channel at the position corresponding to the fan-out area.

9. The display panel of claim 8, wherein, In the direction away from the fan-out area, the width of the partition portion is W3, and the interval between the partition portion and the cutting track line is H, wherein W2=W1+W3+H.

10. A display device, characterized by comprising: The display panel comprises any one of claims 1 to 9. The display panel comprises any one of claims 1 to 9.

Images