Temperature control module and biochemical reaction device

Abstract

The utility model relates to a temperature control module and a biochemical reaction device, the temperature control module comprises a temperature conduction part, a temperature control part and an auxiliary temperature control part, and the temperature control part is connected to the auxiliary temperature control part in a welding manner; the temperature conduction part is connected to the temperature control part in a welding manner; the temperature conduction part is used for approaching or contacting the biochemical reaction module, the temperature control part can regulate and control the temperature of the temperature conduction part so as to enable the biochemical reaction module to reach the required temperature, and the auxiliary temperature control part can assist the temperature control part in regulating and controlling the temperature of the temperature conduction part so as to assist in regulating and controlling the temperature of the biochemical reaction module. The temperature control module is connected and fixed in a welding mode, the connection stability is improved, the heat conduction efficiency of the welding flux is high, the heat conduction efficiency of the temperature control module is improved, the biochemical reaction time is shortened, regular maintenance is not needed, the cost is reduced, and modularization is convenient to assemble.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of biochemical reaction equipment, and in particular to a temperature control module and a biochemical reaction device. BACKGROUND

[0002] In the field of biochemistry, most biochemical reactions need to be carried out at a specific temperature. In commonly used medical equipment and biochemical research equipment, a temperature control module is usually provided to provide the required temperature for biochemical reactions.

[0003] However, the existing temperature control module has low temperature control accuracy and slow temperature rising and falling speed, which affects the speed of biochemical reactions. Moreover, the temperature control module is complex to assemble, needs regular maintenance, and has high cost. CONTENT OF THE INVENTION

[0004] In order to solve at least one of the above defects, it is necessary to provide a temperature control module.

[0005] In addition, the present application also provides a biochemical reaction device using the aforementioned temperature control module.

[0006] In a first aspect, the embodiments of the present application provide a temperature control module, which comprises a temperature conduction component, a temperature control component, and an auxiliary temperature control component, the auxiliary temperature control component comprising a mounting surface; the temperature control component is connected to the mounting surface by welding; the temperature conduction component is connected to the surface of the temperature control component away from the auxiliary temperature control component by welding; wherein the temperature conduction component is used to be close to or contact a biochemical reaction module, the temperature control component can adjust and control the temperature of the temperature conduction component to make the biochemical reaction module reach the required temperature, and the auxiliary temperature control component can assist the temperature control component to adjust and control the temperature of the temperature conduction component to assist in adjusting and controlling the temperature of the biochemical reaction module.

[0007] In some possible embodiments, the temperature control component and the auxiliary temperature control component are connected by a first solder sheet by welding; and / or, the temperature conduction component and the temperature control component are connected by a second solder sheet by welding.

[0008] In some possible embodiments, the material of the first solder sheet is solder material; and / or, the material of the second solder sheet is solder material.

[0009] In some possible embodiments, the thickness of the first solder sheet is 0.15±0.02 mm; and / or, the thickness of the second solder sheet is 0.15±0.02 mm.

[0010] In some possible embodiments, the auxiliary temperature control component has multiple mounting positions on its surface facing the temperature control component, each mounting position is welded to a temperature control component, and each temperature control component is welded to a temperature conduction component.

[0011] In some possible embodiments, the surface of the mounting position is recessed in a direction away from the temperature control component to form a groove, and the first solder sheet is located in the groove.

[0012] In some possible embodiments, the auxiliary temperature control component includes a body and a temperature control channel disposed on the body. The temperature control channel allows the cooled or heated liquid to flow through, thereby assisting in heat dissipation or heating of the biochemical reaction module.

[0013] In some possible embodiments, the temperature control channel is a cavity structure formed within the body portion, or the temperature control channel is a pipe embedded within the body portion.

[0014] In some possible embodiments, the temperature control module further includes a temperature feedback component, the temperature conduction component having a temperature measuring hole, and the temperature feedback component extending into the temperature measuring hole.

[0015] Secondly, embodiments of this application provide a biochemical reaction apparatus, including a temperature control module and a fluid delivery module as described above. The fluid delivery module is in fluid communication with the auxiliary temperature control component to provide the auxiliary temperature control component with cooled or heated fluid.

[0016] The temperature control module provided in this application uses solder to weld the temperature conduction component, temperature control component, and auxiliary temperature control component together, improving connection stability. The solder also has high thermal conductivity, enhancing the temperature control module's heat transfer efficiency and allowing it to maintain low-temperature operation for extended periods. This improves the heating and cooling efficiency of the detection box and shortens the biochemical reaction time. Furthermore, the solder welding method ensures high stability of the weld layer; with prolonged use, the solder will not powder or develop cavities, eliminating the need for regular maintenance and reducing costs. Additionally, the welding connection eliminates the need for additional fixing structures, enabling modularity and facilitating subsequent production and assembly. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a biochemical reaction device according to an embodiment of this application.

[0019] Figure 2 This is a schematic diagram of the structure of a temperature control module according to an embodiment of this application.

[0020] Figure 3 for Figure 2 Exploded view of the medium temperature control module.

[0021] Figure 4 for Figure 2 Cross-sectional view along IV-IV.

[0022] Figure 5 for Figure 3 A schematic diagram of the auxiliary temperature control component.

[0023] Figure 6 for Figure 5 A schematic diagram of the auxiliary temperature control component from another perspective.

[0024] Figure 7 for Figure 3 Cross-sectional view of the medium-temperature conductive component.

[0025] Explanation of main component symbols

[0026]

[0027] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0029] It should be noted that when a component is described as "fixed to" or "mounted to" another component, it can be directly on the other component or may be interspersed with an intermediate component. When a component is described as "set to" another component, it can be directly set on the other component or may be interspersed with an intermediate component. The term "and / or" as used herein includes all and any combination of one or more of the associated listed items.

[0030] Taking a PCR amplification instrument as an example, the temperature control module is one of the key components, mainly used to provide a specific temperature for the amplification reaction. The different components of the temperature control module are connected and fixed using bolts or similar connectors. Besides the complexity of assembly, poor contact between components can occur, affecting heat conduction. To ensure tight contact between components, thermal grease is usually added between them. However, thermal grease has poor thermal stability; with increased frequency or duration of use, it accelerates the powdering process, significantly reducing its thermal conductivity and easily creating cavities, ultimately leading to decreased temperature control accuracy. Furthermore, the thermal conductivity of thermal grease is generally low, failing to achieve the expected heating or cooling effect, resulting in a slow reaction rate. In addition, the thermal grease requires additional fixing when used as a heat transfer medium, increasing design or material costs. Regular maintenance of the temperature control module is also necessary to achieve the desired effect, increasing subsequent maintenance costs.

[0031] Therefore, this application provides a biochemical reaction device with a novel temperature control module, which can effectively improve temperature control accuracy, increase heating and cooling efficiency, and reduce costs. For example, this biochemical reaction device can be a gene sequencing device (such as a PCR amplification instrument), but is not limited to this.

[0032] Please see Figure 1 The diagram shows a schematic of the biochemical reaction device 1000. The biochemical reaction device 1000 may include a temperature control module 100, a fluid delivery module 200, and a control module 300. The temperature control module 100 is positioned near or in contact with the biochemical reaction module 400 to provide the required temperature for the biochemical reaction module 400. Biochemical substances can be contained within the biochemical reaction module 400, allowing them to undergo corresponding biochemical reactions. For example, the biochemical reaction module 400 can be a reaction vessel, providing a reaction site for the biochemical reaction. Specifically, the biochemical reaction module 400 can be a detection chip required for gene sequencing. The fluid delivery module 200 is fluidly connected to the temperature control module 100 and can deliver cooled or heated fluid to the temperature control module 100 to regulate its temperature, thereby assisting in regulating the temperature of the reaction vessel. The control module 300 is signal-connected to the temperature control module 100 and the fluid delivery module 200. It can control the temperature control module 100 to raise or lower the temperature to provide a corresponding temperature for the biochemical reaction module 400. Additionally, it can control the fluid delivery module 200 to deliver cooled or heated fluid to the temperature control module 100 to assist in regulating the temperature of the biochemical reaction module 400. Understandably, the biochemical reaction module 400 may or may not be part of the biochemical reaction apparatus 1000, but may be used as a consumable.

[0033] Please see Figures 2 to 4 As shown, please refer to the following:Figure 1 The temperature control module 100 provided in this application embodiment includes: an auxiliary temperature control component 1, a temperature control component 2, and a temperature conduction component 3. The auxiliary temperature control component 1 includes a mounting surface 11. The temperature control component 2 is connected to the mounting surface 11 by welding. The temperature conduction component 3 is connected to the surface of the temperature control component 2 away from the auxiliary temperature control component 1 by welding, thereby forming a firmly connected integrated structure of the temperature conduction component 3, the temperature control component 2, and the auxiliary temperature control component 1. The temperature conduction component 3 can be used to approach or contact the biochemical reaction module 400. The temperature control component 2 is configured to regulate the temperature of the temperature conduction component 3 so that the biochemical reaction module 400 reaches a preset temperature. The auxiliary temperature control component 1 is configured to assist the temperature control component 2 in regulating the temperature of the temperature conduction component 3, thereby assisting in regulating the temperature of the biochemical reaction module 400. Here, the temperature control component 2 mainly has two functions: one is to heat the temperature conduction component 3, thereby heating the biochemical reaction module 400; the other is to cool the temperature conduction component 3, thereby cooling the biochemical reaction module 400. During the heating or cooling process, the auxiliary temperature control component 1 can assist the temperature control component 2 to improve the heating or cooling efficiency.

[0034] like Figures 4 to 6 As shown, please refer to the following: Figure 1 The auxiliary temperature control component 1 can help remove heat from the temperature control component 2 to achieve heat dissipation, and can also assist in heating the temperature control component 2. In some embodiments, the auxiliary temperature control component 1 can be a liquid circuit module, which can achieve auxiliary cooling or auxiliary heating by introducing a liquid (such as coolant or heated liquid) at a certain temperature into the liquid circuit module. In this case, the fluid delivery module 200 can be a liquid delivery module that is fluidly connected to the auxiliary temperature control component 1, and can deliver coolant or heated liquid to the auxiliary temperature control component 1. Specifically, the auxiliary temperature control component 1 can include a body part 12 and a temperature control channel 13 provided on the body part 12. The body part 12 can be made of metal, such as copper or aluminum alloy, which has a high thermal conductivity, and has the mounting surface 11. The temperature control component 2 is welded to the body part 12. The temperature control channel 13 allows the cooled or heated liquid to flow through, and the fluid delivery module 200 is connected to the temperature control channel 13 to deliver the cooled or heated liquid into the temperature control channel 13. Using liquid-assisted heating or cooling results in higher temperature conduction efficiency, which is beneficial for improving the heating and cooling rate of the temperature control module 100. It is understood that in other embodiments, the auxiliary temperature control component (not shown) can also be a heat sink. In this case, the fluid delivery module 200 can be a fan to provide airflow to the heat sink, assisting in the heat dissipation of the temperature control component 2.

[0035] In some embodiments, the temperature-controlled flow channel 13 includes a flow channel body 14 and an inlet end 15 and an outlet end 16 located at both ends of the flow channel body 14. The fluid delivery module 200 can circulate the liquid within the temperature-controlled flow channel 13. The inlet pipe of the fluid delivery module 200 is connected to the inlet end 15 to supply liquid to the temperature-controlled flow channel 13, and the outlet pipe of the fluid delivery module 200 is connected to the outlet end 16 to recover the liquid flowing out of the temperature-controlled flow channel 13.

[0036] In some embodiments, the cavity-type temperature control channel 13 can be integrally formed within the body portion 12, allowing the liquid to directly contact the body portion 12 and resulting in higher heating and cooling efficiency. It is understood that in other embodiments, the temperature control channel can also be a pipe embedded in the body portion. For example, a groove can be formed on the body portion first, and then the pipe can be embedded within the groove to form the temperature control channel, thus reducing the difficulty of forming the temperature control channel.

[0037] In some embodiments, the temperature control channel 13 can be a curved structure, for example, formed by bending and coiling, which can improve the uniformity of temperature conduction and provide auxiliary temperature control at different positions of the temperature control component 2, thereby further improving the effect of auxiliary temperature control and the efficiency of heating and cooling.

[0038] like Figure 3 As shown, the mounting surface 11 may include multiple mounting positions 17, each mounting position 17 housing a temperature control component 2 and a temperature conduction component 3. Thus, the same auxiliary temperature control component 1 can assist in the heating and cooling of multiple temperature conduction components 3, thereby enabling multiple biochemical reactions to occur simultaneously, resulting in higher biochemical reaction efficiency. In some embodiments, the mounting position 17 is recessed in a direction away from the temperature control component 2 to form a groove structure. When welding the temperature control component 2, solder can be filled into the groove structure, which has a limiting effect on the solder, thereby improving the stability of the welding process.

[0039] like Figure 3 , Figure 4 and Figure 7 As shown, the temperature control component 2 can be a thermoelectric cooler (or a thermoelectric cooler, TEC). TECs are characterized by being noiseless, vibration-free, requiring no refrigerant, small in size, and lightweight. They are also reliable, easy to operate, provide rapid heating and cooling, and offer highly precise temperature control. Furthermore, the heating and cooling actions can be quickly switched depending on the direction of the current flowing into the TEC. In some embodiments, the temperature control component 2 includes a first surface 21 and a second surface 22 disposed opposite to each other. The first surface 21 is located near the temperature conduction component 3, and the second surface 22 is located near the auxiliary temperature control component 1. During heating, the first surface 21 is the hot surface, and the second surface 22 is the cold surface; during cooling, the first surface 21 is the cold surface, and the second surface 22 is the hot surface.

[0040] In some embodiments, the first surface 21 and the second surface 22 of the temperature control component 2 are both planar, which can clamp the temperature control component 2 between the temperature conduction component 3 and the auxiliary temperature control component 1 to improve the heat conduction efficiency.

[0041] like Figure 3 and Figure 4 As shown, the auxiliary temperature control component 1 and the temperature control component 2 are connected by a first solder sheet 4. Besides serving as a connection, the first solder sheet 4 also acts as an excellent heat-conducting medium, improving heat transfer efficiency. The first solder sheet 4 can be a thin sheet structure pre-formed from solder. Pre-forming the solder into a sheet structure facilitates welding, and the sheet-like solder has high thickness uniformity, improving the uniformity of solder between the auxiliary temperature control component 1 and the temperature control component 2, avoiding localized material shortages, and minimizing or even eliminating the possibility of gaps between them. The uniform thickness of the sheet-like solder also improves the overall flatness of the temperature control module 100 after welding, enhancing heat transfer efficiency. Furthermore, compared to thermal grease, the first solder sheet 4 has higher stability and will not powder or develop cavities after use.

[0042] In some embodiments, the first solder sheet 4 can be made of sheet-like solder, which typically has a thermal conductivity of 66 W / (mk). Compared to the single-digit thermal conductivity of thermal grease, the overall heat transfer efficiency of the temperature control module 100 soldered with solder is improved by nearly 10 times. It is understood that the first solder sheet 4 can also be made of other metal solders, not limited to solder.

[0043] In some embodiments, the thickness of the first solder sheet 4 can be 0.15±0.02mm. The thinner thickness of the first solder sheet 4 can improve the heat conduction efficiency between the auxiliary temperature control component 1 and the temperature control component 2 while achieving stable welding between them.

[0044] like Figure 3 , Figure 4 and Figure 7 As shown, please refer to the following: Figure 1The temperature conduction component 3 includes a third surface 31 and a fourth surface 32 disposed opposite to each other, and a side surface 33 connecting the third surface 31 and the fourth surface 32. The third surface 31 is welded to the mounting surface 11 of the auxiliary temperature control component 1 via a first solder sheet 4. The fourth surface 32 can contact or be close to the biochemical reaction module 400 to regulate the temperature of the biochemical reaction module 400. In some embodiments, the temperature conduction component 3 can be made of a metal material, such as copper or aluminum alloy, which has a high thermal conductivity and can quickly cool or heat the biochemical reaction module 400. In some embodiments, both the third surface 31 and the fourth surface 32 are planar.

[0045] The temperature conducting component 3 is also provided with a temperature feedback component (not shown). Specifically, the temperature conducting component 3 has a temperature measuring hole 34, and the temperature feedback component extends into the temperature measuring hole 34, thereby measuring the internal temperature of the temperature conducting component 3. In some embodiments, the temperature measuring hole 34 is formed by a side surface 33 extending toward the interior of the temperature conducting component 3 in a direction parallel to the third surface 31 or the fourth surface 32. For example, the temperature feedback component may be a negative temperature coefficient thermistor (NTC) or a PT100 temperature sensor.

[0046] like Figure 3 As shown, combined Figure 1 A second solder sheet 5 connects the temperature conduction component 3 and the temperature control component 2. Besides serving as a connection, the second solder sheet 5 also acts as an excellent heat-conducting medium, improving the heat transfer efficiency between the two components. Similar in structure to the first solder sheet 4, the second solder sheet 5 can be a thin sheet structure pre-formed from solder. Pre-forming the solder into a sheet facilitates soldering, and the sheet-like solder exhibits high thickness uniformity, improving the uniformity of solder between the temperature control component 2 and the temperature conduction component 3, avoiding localized material shortages, and minimizing or even eliminating the possibility of gaps between them. The uniform thickness of the sheet-like solder also improves the overall flatness of the temperature control module 100 after soldering, ensuring full contact with the biochemical reaction module 400 and enhancing heat transfer efficiency. Furthermore, compared to thermal grease, the second solder sheet 5 offers higher stability and will not powder or develop cavities after use.

[0047] In some embodiments, the material of the second solder sheet 5 may be the same as that of the first solder sheet 4, specifically a sheet of solder, which has the same function as the first solder sheet 4, and will not be described in detail here.

[0048] In some embodiments, the thickness of the second solder sheet 5 can be 0.15±0.02mm. The thinner thickness of the second solder sheet 5 can improve the heat transfer efficiency between the temperature control component 2 and the temperature conduction component 3 while achieving stable welding between them.

[0049] like Figure 1 As shown, the control module 300 is used to control the operation of the temperature control module 100 and the fluid delivery module 200. The control module 300 can be a control motherboard, controller, or processor, etc. For example, the processor can be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or any conventional processor, etc.

[0050] The temperature control module 100 in this application has the following beneficial effects:

[0051] 1. By using solder and welding to fix the temperature conduction component 3, temperature control component 2 and auxiliary temperature control component 1 in pairs, the connection stability is improved. The integrated structure formed by welding helps to reduce the number of maintenance times of the temperature control module 100, and even achieves maintenance-free operation.

[0052] 2. The integrated structure formed by welding improves the temperature control performance of the temperature control module 100, enabling long-term low-temperature maintenance. The solder has high thermal conductivity, more than 10 times that of traditional thermal grease, which can significantly improve the heating and cooling efficiency of the temperature control module 100, improve the biochemical reaction efficiency, and shorten the reaction time.

[0053] 3. Temperature conduction component 3, temperature control component 2 and auxiliary temperature control component 1 are fixed by solder welding. The stability of the weld layer is high. As the service time is extended, the solder will not pulverize or form cavities. No regular maintenance is required, which helps to reduce costs.

[0054] 4. In addition, the integrated temperature control module 100 is fixed by welding, which eliminates the need for additional fixing structures. This modular design facilitates later production and assembly, and enhances installability.

[0055] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A temperature control module, characterized in that, include: Auxiliary temperature control components, including a mounting surface; The temperature control component is connected to the mounting surface by welding. A temperature conduction component is welded to the surface of the temperature control component that is away from the auxiliary temperature control component; The temperature conduction component is used to approach or contact the biochemical reaction module. The temperature control component can adjust the temperature of the temperature conduction component to make the biochemical reaction module reach the required temperature. The auxiliary temperature control component can assist the temperature control component in adjusting the temperature of the temperature conduction component to assist in controlling the temperature of the biochemical reaction module.

2. The temperature control module as described in claim 1, characterized in that, The temperature control component and the auxiliary temperature control component are connected by welding with a first solder sheet; and / or, the temperature conduction component and the temperature control component are connected by welding with a second solder sheet.

3. The temperature control module as described in claim 2, characterized in that, The first solder sheet is made of solder; and / or the second solder sheet is made of solder.

4. The temperature control module as described in claim 2, characterized in that, The thickness of the first solder sheet is 0.15±0.02mm; and / or, the thickness of the second solder sheet is 0.15±0.02mm.

5. The temperature control module as described in claim 2, characterized in that, The auxiliary temperature control component has multiple mounting positions on its surface facing the temperature control component, and each mounting position is welded with one of the temperature control components, and each temperature control component is welded with one of the temperature conduction components.

6. The temperature control module as described in claim 5, characterized in that, The surface of the mounting position is recessed in a direction away from the temperature control component to form a groove, and the first solder sheet is located in the groove.

7. The temperature control module as described in claim 1, characterized in that, The auxiliary temperature control component includes a main body and a temperature control channel disposed on the main body. The temperature control channel allows the cooled or heated liquid to flow through, so as to assist in the heat dissipation or heating of the biochemical reaction module.

8. The temperature control module as described in claim 7, characterized in that, The temperature control channel is a cavity structure formed within the main body, or the temperature control channel is a pipe embedded within the main body.

9. The temperature control module as described in claim 7, characterized in that, The temperature control module also includes a temperature feedback component, the temperature conduction component has a temperature measuring hole, and the temperature feedback component extends into the temperature measuring hole.

10. A biochemical reaction apparatus, characterized in that, The device includes a temperature control module as described in any one of claims 1 to 9 and a fluid delivery module, wherein the fluid delivery module is in fluid communication with the auxiliary temperature control component to provide the auxiliary temperature control component with cooled or heated fluid.

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