Heat-conducting silicone grease smearing device of calorimeter

Abstract

The utility model provides a heat-conducting silicone grease smearing device of a calorimeter. The heat-conducting silicone grease smearing device comprises a cold water tank, a semiconductor chilling plate is installed at the top end of the cold water tank, a heat dissipation block is installed at the top end of the semiconductor chilling plate, a first heat-conducting silicone layer is arranged between the cold water tank and the semiconductor chilling plate, and a second heat-conducting silicone layer is arranged between the semiconductor chilling plate and the heat dissipation block. According to the utility model, the consistency of the coating amount of the heat-conducting silicone grease in each semiconductor chilling plate can be ensured, manual positioning errors are reduced, the cleanliness of operation is improved, the assembly precision repeatability is improved, the service life of the heat-conducting silicone grease is prolonged, and finally, the temperature control consistency of the cold water tank is stabilized.

Description

Technical Field

[0001] This utility model relates to the field of thermal grease application tooling technology, and in particular to a thermal grease application device for a calorimeter. Background Technology

[0002] An oxygen bomb calorimeter is an instrument used to measure the heat released or absorbed during the combustion or reaction of a substance. Its core component is the oxygen bomb, a sealed combustion chamber filled with oxygen. The basic testing principle of the calorimeter is to place the test object in a reaction vessel filled with oxygen, then ignite the sample to begin combustion. The experiment ends when the sample is completely burned. By measuring the temperature rise, the heat of combustion or heat of reaction of the sample is calculated.

[0003] The cold water tank is a crucial component of the calorimeter. The measurement of the calorific value of a sample primarily relies on comparing the temperature rise of the water in the cold water tank with the temperature rise of the same water during the combustion of a standard substance. The cold water tank typically also includes a thermoelectric cooler and a heat sink to accelerate the cooling process. The thermoelectric cooler, capable of both cooling and heating, operates primarily on the Peltier effect, a phenomenon where heat is absorbed or released when an electric current passes through the interface of two different conductors.

[0004] Thermal grease is typically applied between the cold water tank and the thermoelectric cooler, and between the thermoelectric cooler and the heat sink. Thermal grease mainly consists of silicone oil and thermally conductive fillers. The silicone oil provides good wetting and flowability, ensuring it can fully fill the tiny gaps between the heat-generating elements and the heat sink; while the thermally conductive fillers are key to achieving efficient heat conduction. Common thermally conductive fillers include alumina and boron nitride. By filling interfacial gaps and reducing the presence of air, thermal grease lowers thermal resistance, allowing heat to be transferred more quickly and smoothly. Therefore, ensuring good and reliable contact between the thermoelectric cooler and the water tank / heat sink is fundamental to ensuring stable water temperature control.

[0005] In the current technology, the application of thermal grease to the cold water tank, semiconductor cooling chip, and heat sink in the production process of calorimeters requires manual application throughout the entire process. This traditional manual application method has poor consistency and uniformity, and there are also many errors caused by human error, such as positioning errors. The operation also results in a lot of dirt, making it impractical. Utility Model Content

[0006] The purpose of this invention is to solve the problems existing in the prior art and to propose a thermal grease application device for a calorimeter.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] A thermal grease application device for a calorimeter includes a cold water tank, a plurality of thermoelectric coolers are mounted on the top of the cold water tank, a heat sink is mounted on the top of the thermoelectric coolers, a first thermally conductive silicone layer is provided between the cold water tank and the thermoelectric coolers, and a second thermally conductive silicone layer is provided between the thermoelectric coolers and the heat sink.

[0009] Before installing the semiconductor cooling chip, a first coating plate is placed on the top of the cold water tank. The side of the first coating plate is detachably connected to the side of the cold water tank. A number of first thermally conductive silicone grease coating grooves corresponding one-to-one with the semiconductor cooling chip are provided through the first coating plate. Each of the first thermally conductive silicone grease coating grooves is filled with thermally conductive silicone grease to form a first thermally conductive silicone layer.

[0010] Before the heat sink is installed on the top of the plurality of semiconductor cooling chips, a second coating plate that is exactly the same as the first coating plate is placed. The side of the second coating plate is detachably connected to the side of the cold water tank. The second coating plate is provided with a plurality of second thermal grease coating grooves that correspond one-to-one with the semiconductor cooling chips. Each second thermal grease coating groove is filled with thermal grease to form a second thermal silicone layer.

[0011] Preferably, the number of the thermoelectric coolers is an even number, and the even number of thermoelectric coolers are distributed in two rows at equal intervals at the top of the cold water tank. The number of the first thermal grease application groove and the number of the second thermal grease application groove are consistent with the number of the thermoelectric coolers.

[0012] Preferably, the number of the semiconductor cooling chips is eight.

[0013] Preferably, both the first and second thermal grease application grooves are M-shaped structures consisting of three parallel transverse grooves and four parallel vertical grooves connected together.

[0014] Preferably, the plurality of first thermal grease application grooves are symmetrically distributed in two rows with equal spacing on the first coating plate, and the second thermal grease application grooves are symmetrically distributed in two rows with equal spacing on the second coating plate.

[0015] Preferably, the sides of the first coating plate and the second coating plate are each evenly distributed with a number of clamping blocks for clamping the sides of the cold water tank.

[0016] Preferably, a suction cup for attaching the thermoelectric cooler to the upper surface of the cold water tank is placed at the top of the thermoelectric cooler before the heat sink is installed. A vacuum generator is installed at the top of the suction cup, and the vacuum generator is connected to a gas path branch, which is connected to a gas path switch.

[0017] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0018] This invention can ensure the consistency of thermal grease application in each thermoelectric cooler, reduce manual positioning errors and improve the cleanliness of the operation, enhance assembly accuracy repeatability and the service life of thermal grease, and ultimately stabilize the temperature control consistency of the cold water tank. Attached Figure Description

[0019] Figure 1 A perspective view of a thermal grease application device for a calorimeter is provided for this utility model.

[0020] Figure 2 A side sectional view of the cold water tank of a thermal grease application device for a calorimeter is provided in this utility model.

[0021] Figure 3 A schematic diagram of the first coating plate of a thermal grease application device for a calorimeter is provided for this utility model.

[0022] Figure 4 This invention provides a schematic diagram of the second coating plate of a thermal grease application device for a calorimeter.

[0023] Figure 5 This invention presents an exploded view of the gas circuit switch of a thermal grease application device for a calorimeter.

[0024] Legend: 1. Cold water tank; 2. Semiconductor cooling chip; 3. Heat sink; 4. Gas circuit switch; 5. Gas circuit branch; 6. Vacuum generator; 7. Suction cup; 8. First coating plate; 9. Second coating plate; 10. Clamping block; 11. First thermal grease coating groove; 12. Second thermal grease coating groove. Detailed Implementation

[0025] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0026] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0027] Example 1, such as Figure 1-2As shown, this utility model provides a thermal grease application device for a calorimeter, including a cold water tank 1, a plurality of semiconductor cooling chips 2 are installed on the top of the cold water tank 1, a heat sink 3 is installed on the top of the plurality of semiconductor cooling chips 2, a first thermally conductive silicone layer is provided between the cold water tank 1 and the semiconductor cooling chips 2, and a second thermally conductive silicone layer is provided between the semiconductor cooling chips 2 and the heat sink 3.

[0028] like Figure 3 As shown, a first coating plate 8 is placed at the top of the cold water tank 1 before the semiconductor cooling chip 2 is installed. The side of the first coating plate 8 is detachably connected to the side of the cold water tank 1. A number of first thermally conductive silicone grease coating grooves 11 corresponding one-to-one with the semiconductor cooling chip 2 are provided through the first coating plate 8. Each first thermally conductive silicone grease coating groove 11 is filled with thermally conductive silicone grease to form a first thermally conductive silicone layer.

[0029] like Figure 4 As shown, a second coating plate 9, which is completely identical to the first coating plate 8, is placed before the heat sink 3 is installed on the top of several semiconductor cooling chips 2. The side of the second coating plate 9 is detachably connected to the side of the cold water tank 1. Several second thermal grease coating grooves 12, which correspond one-to-one with the semiconductor cooling chips 2, are provided through the second coating plate 9. Each second thermal grease coating groove 12 is filled with thermal grease to form a second thermal silicone layer.

[0030] Here, the number of thermoelectric coolers 2 is even, and these even-numbered thermoelectric coolers 2 are distributed in two equidistant rows at the top of the cold water tank 1. The number of first thermal grease application grooves 11 and second thermal grease application grooves 12 are consistent with the number of thermoelectric coolers 2. The first coating plate 8 and the second coating plate 9 are completely identical in size and structure. Several first thermal grease application grooves are symmetrically distributed in two equidistant rows on the first coating plate 8, and the second thermal grease application grooves are symmetrically distributed in two equidistant rows on the second coating plate 9. The number of thermoelectric coolers 2, first thermal grease application grooves 11, and second thermal grease application grooves 12 can be selected and set according to actual needs. Figure 2-4 There are eight in each of them.

[0031] Both the first thermal grease application groove 11 and the second thermal grease application groove 12 are M-shaped structures formed by three parallel transverse grooves and four parallel vertical grooves connected together. Based on long-term experience, this invention has determined the thickness of the thermal grease application and calculated the application volume. This volume is then incorporated into the first application plate 8 / second application plate 9. The dimensions and structure of the first thermal grease application groove 11 and the second thermal grease application groove 12 are designed to achieve the best application effect.

[0032] The working principle is as follows: First, clean the cold water tank 1, the semiconductor cooling chip 2, the first coating plate 8, and the second coating plate 9. Alcohol and a lint-free cloth can be used for cleaning to ensure a clean surface free of foreign matter and dust. Place the first coating plate 8 on the upper surface of the cold water tank 1 where the thermal grease is to be applied and clamp it tightly to the cold water tank 1. Apply thermal grease to the M-shaped first thermal grease application groove 11 on the first coating plate 8. After application, use an external scraper to remove excess thermal grease to form the first thermally conductive silicone layer. Remove the first coating plate... Apply the first thermal grease layer to the upper surface of the cooling tank 1 using the smear plate 8. Place the second smear plate 9 on the cooling tank 2 and clamp it to the cooling tank 1. Apply thermal grease to the M-shaped second thermal grease application groove 12 on the second smear plate 9. After application, scrape off the excess thermal grease with an external scraper to form the second thermal silicone layer. Remove the second smear plate 9 and install the heat sink 3 onto the side of the cooling tank 2 that is coated with the second thermal silicone layer to complete the installation.

[0033] Example 2, as Figure 5 As shown, a suction cup 7 is placed at the top of the semiconductor cooling chip 2 before the heat sink 3 is installed. A vacuum generator 6 is installed at the top of the suction cup 7. The air circuit switch 4 and the air circuit branch 5 are connected through the air circuit. The air circuit branch 5 and the vacuum generator 6 are connected through the air circuit.

[0034] The effect achieved by the entire embodiment 2 is as follows: when the gas circuit switch 4 is turned on, gas flows into the gas circuit branch 5, the gas circuit branch 5 introduces the gas into the vacuum generator 6, the vacuum generator 6 generates a vacuum, and several semiconductor cooling chips 2 are placed into the groove of the suction cup 7 as required. At this time, the semiconductor cooling chips 2 will be attracted and positioned. The suction cup 7 is placed on the upper surface of the cold water tank 1 coated with the first thermally conductive silicone grease layer and pressed, so that the semiconductor cooling chips 2 are tightly attached to the cold water tank 1.

[0035] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A thermal grease application device for a calorimeter, characterized in that: Includes a cold water tank (1), with a plurality of semiconductor cooling chips (2) installed on the top of the cold water tank (1), and a heat sink (3) installed on the top of the plurality of semiconductor cooling chips (2). A first thermally conductive silicone layer is provided between the cold water tank (1) and the semiconductor cooling chips (2), and a second thermally conductive silicone layer is provided between the semiconductor cooling chips (2) and the heat sink (3). Before installing the semiconductor cooling chip (2), a first smearing plate (8) is placed on the top of the cold water tank (1). The side of the first smearing plate (8) is detachably connected to the side of the cold water tank (1). A plurality of first thermal grease smearing grooves (11) corresponding one-to-one with the semiconductor cooling chip (2) are provided on the first smearing plate (8). Each first thermal grease smearing groove (11) is filled with thermal grease to form a first thermal silicone layer. The top of each of the several semiconductor cooling chips (2) is equipped with a heat sink (3). Before that, a second coating plate (9) that is completely identical to the first coating plate (8) is placed. The side of the second coating plate (9) is detachably connected to the side of the cold water tank (1). The second coating plate (9) is provided with several second thermal grease coating grooves (12) that correspond one-to-one with the semiconductor cooling chips (2). Each of the second thermal grease coating grooves (12) is filled with thermal grease to form a second thermal silicone layer.

2. The thermal grease application device for a calorimeter according to claim 1, characterized in that: The number of the semiconductor cooling chips (2) is an even number. The even number of semiconductor cooling chips (2) are distributed in two rows at equal intervals at the top of the cold water tank (1). The number of the first thermal grease application groove (11) and the second thermal grease application groove (12) are consistent with the number of semiconductor cooling chips (2).

3. The thermal grease application device for a calorimeter according to claim 2, characterized in that: The number of semiconductor cooling chips (2) is eight.

4. The thermal grease application device for a calorimeter according to claim 2, characterized in that: The first thermal grease application groove (11) and the second thermal grease application groove (12) are both M-shaped structures formed by three parallel transverse grooves and four parallel vertical grooves connected together.

5. The thermal grease application device for a calorimeter according to claim 4, characterized in that: The plurality of first thermal grease application grooves (11) are symmetrically distributed in two rows with equal spacing on the first coating plate (8), and the second thermal grease application grooves (12) are symmetrically distributed in two rows with equal spacing on the second coating plate (9).

6. The thermal grease application device for a calorimeter according to claim 1, characterized in that: The first coating plate (8) and the second coating plate (9) each have a number of clamping blocks (10) evenly distributed on their sides for clamping the sides of the cold water tank (1).

7. A thermal grease application device for a calorimeter according to any one of claims 1 to 6, characterized in that: The top of the semiconductor cooling chip (2) is placed before the heat sink (3) is installed with a suction cup (7) for attaching the semiconductor cooling chip (2) to the upper surface of the cold water tank (1). A vacuum generator (6) is installed on the top of the suction cup (7). The vacuum generator (6) is connected to a gas path branch (5). The gas path branch (5) is connected to a gas path switch (4).

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