Pressure head mechanism and testing and sorting equipment
By designing turbulence protrusions and a direct heat exchange structure on the flow channel plate, the thermal resistance problem between the flow channel plate, the refrigerant, and the chip is solved, achieving a more efficient temperature control effect.
Patent Information
- Application Number
- CN202520166590.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-24
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2035-01-24
AI Technical Summary
The existing pressure head mechanism has a small effective contact area between the flow channel plate and the refrigerant, resulting in weak heat exchange capacity. The thermal resistance between the flow channel plate and the chip is large, which affects the temperature control effect.
A flow channel plate with turbulence protrusions was designed, forming multiple turbulence protrusions on the inner wall of the cooling flow channel to increase the effective contact area between the refrigerant and the inner wall of the cooling flow channel. The streamlined design reduces flow resistance, and the flow channel plate directly exchanges heat with the pressure block to reduce thermal resistance.
It significantly improves the heat exchange efficiency between the refrigerant and the flow channel plate, reduces the overshoot of the chip temperature, and improves the temperature control effect.
Smart Images
Figure CN223862327U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor testing technology, and in particular to a pressure head mechanism and a testing and sorting device. Background Technology
[0002] The pressure head mechanism of testing and sorting equipment typically utilizes cooling and heating countermeasures to achieve temperature control of the pressed chips. A common pressure head mechanism includes a flow channel plate, an adapter plate, a compensating heat source, and the pressure head. The refrigerant flowing through the flow channel plate exchanges heat with the pressure head via the adapter plate. However, the effective contact area between the conventional flow channel plate and the refrigerant is relatively small, resulting in weak heat exchange capacity between the flow channel plate and the pressure head. Furthermore, the considerable distance between the flow channel plate and the pressed chip leads to a relatively high thermal resistance. This negatively impacts the temperature control effect of the pressure head mechanism on the chip. Utility Model Content
[0003] Therefore, it is necessary to provide a pressure head mechanism and testing and sorting equipment that can significantly improve the temperature control effect on chips in order to address the above problems.
[0004] A pressure head mechanism includes a flow channel plate, a heating element, and a pressing block; the flow channel plate forms a cooling flow channel, a refrigerant inlet and a refrigerant outlet communicating with the cooling flow channel, and the inner wall of the cooling flow channel forms a plurality of turbulence protrusions; each turbulence protrusion has a first end near the refrigerant inlet and a second end near the refrigerant outlet, the outer surface of the turbulence protrusion is a smooth curved surface, and the turbulence protrusion gradually narrows from the first end to the second end; the pressing block is installed on one side of the flow channel plate, and the heating element is disposed between the pressing block and the flow channel plate.
[0005] In one embodiment, the cooling channel includes a plurality of parallel branch channels, and each branch channel is provided with a guide plate extending along the length direction of the branch channel to divide each branch channel into a plurality of sub-channels.
[0006] In one embodiment, each of the branch channels has two bends to make the branch channel Z-shaped.
[0007] In one embodiment, the flow channel plate is rectangular, and the refrigerant inlet and the refrigerant outlet are located at two opposite apex corners of the flow channel plate.
[0008] In one embodiment, the head portion of the turbulence protrusion near the first end is formed by rotating an elliptical parabola around its principal axis, and the tail portion of the turbulence protrusion near the second end is formed by rotating a parabola around its guideline.
[0009] In one embodiment, the plurality of the turbulence protrusions are arranged in multiple rows, and each row of the turbulence protrusions extends along the length of the cooling channel; wherein adjacent rows of the turbulence protrusions are aligned with each other.
[0010] In one embodiment, the plurality of the turbulence protrusions are arranged in multiple rows, and each row of the turbulence protrusions extends along the length of the cooling channel; wherein, adjacent rows of the turbulence protrusions are staggered.
[0011] In one embodiment, the pressing block has a recessed groove formed on the side facing the flow channel plate, and the flow channel plate is partially embedded in the recessed groove.
[0012] In one embodiment, a receiving groove is formed at the bottom of the sinking trough, and the heating element is sheet-shaped and housed within the receiving groove.
[0013] A testing and sorting device includes a pressure head mechanism as described in any of the preferred embodiments above.
[0014] In the aforementioned pressure head mechanism and testing and sorting equipment, the chip under test is held by a pressure block. The flow channel plate and heating element exchange heat with the chip through the pressure block, thereby achieving temperature control. The turbulence protrusions increase the effective contact area between the refrigerant and the inner wall of the cooling channel, and their streamlined design also guides flow, reducing the flow resistance of the refrigerant within the cooling channel and allowing it to flow rapidly along the channel. Therefore, the heat exchange efficiency between the refrigerant and the flow channel plate is significantly improved. Furthermore, the flow channel plate can directly exchange heat with the pressure block, thus significantly reducing the thermal resistance between the flow channel plate and the chip. Therefore, the aforementioned pressure head mechanism and testing and sorting equipment can both increase the chip pressing power and reduce the chip temperature overshoot, thereby significantly improving the temperature control effect for the chip. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0016] Figure 1 This is a schematic diagram of the pressure head mechanism in one embodiment of the present invention;
[0017] Figure 2 for Figure 1 Exploded view of the pressure head mechanism shown;
[0018] Figure 3 for Figure 1 A cross-sectional view of the pressure head mechanism shown;
[0019] Figure 4 This is a schematic diagram of the distribution of turbulence protrusions in one embodiment;
[0020] Figure 5 This is a schematic diagram of the distribution of the turbulence protrusions in another embodiment;
[0021] Figure 6 for Figure 1 The diagram shows the structure of the turbulence protrusion in the pressure head mechanism. Detailed Implementation
[0022] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.
[0023] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0025] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0026] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0027] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0028] Please see Figure 1 This utility model provides a pressure head mechanism 10. Furthermore, this utility model also provides a testing and sorting device.
[0029] The aforementioned testing and sorting equipment is used to perform performance tests on electronic components and classify them based on the test results. Specifically, the aforementioned electronic components can be chips; the following description will use chip testing as an example to illustrate this application in more detail. The aforementioned testing and sorting equipment includes a pressure head mechanism 10. The pressure head mechanism 10 is used to hold the chip under test during the testing process and controls the chip's temperature through a combination of cooling and heating.
[0030] Please refer to the following: Figure 2 and Figure 3 In one embodiment of the present invention, the pressure head mechanism 10 includes a flow channel plate 100, a heating element 200, and a pressing block 300.
[0031] The flow channel plate 100 has a cooling flow channel 101, a refrigerant inlet 102 communicating with the cooling flow channel 101, and a refrigerant outlet 103. The refrigerant in the cooling system can enter the cooling flow channel 101 through the refrigerant inlet 102, flow through the cooling flow channel 101 to the refrigerant outlet 103, and then flow out, thus achieving circulation. A pressure block 300 is installed on one side of the flow channel plate 100, and a heating element 200 is disposed between the pressure block 300 and the flow channel plate 100. The side of the pressure block 300 facing away from the flow channel plate 100 is the pressure surface, used to contact the chip under test. Thus, the refrigerant flowing through the cooling flow channel 101 can exchange heat with the flow channel plate 100 to lower the temperature of the flow channel plate 100, thereby cooling the chip through the pressure block 300; while the heating element 200 can heat the chip through the pressure block 300. Therefore, the temperature control of the chip can be achieved through the counteracting effects of cooling and heating.
[0032] Because the adapter plate is omitted compared to existing technologies, the flow channel plate 100 is directly connected to the pressing block 300, thus reducing the distance between the flow channel plate 100 and the chip being pressed. Furthermore, the number of assembly contact surfaces within the pressing head mechanism 10 is also reduced. Therefore, the thermal resistance between the flow channel plate 100 and the chip is significantly reduced. Theoretically, under the same conditions, the smaller the thermal resistance between the flow channel plate 100 and the chip, the smaller the chip temperature overshoot. It is evident that the pressing head mechanism 10 can significantly reduce the chip temperature overshoot.
[0033] The crimping block 300 has high mechanical strength and thermal conductivity, and is generally formed from metal materials such as copper. The crimping block 300 and the flow channel plate 100 can be connected by means of threaded fastening, bonding, or welding. Specifically, in this embodiment, a recessed groove 310 is formed on the side of the crimping block 300 facing the flow channel plate 100, and part of the flow channel plate 100 is embedded in the recessed groove 310.
[0034] The pressing block 300 is nested with the recessed groove 310, which increases the contact area between them and thus improves heat exchange efficiency. Furthermore, since the pressing block 300 and the flow channel plate 100 share a portion of the space along the thickness direction, the thickness of the pressing head mechanism 10 can be reduced. On the one hand, the thinner pressing head mechanism 10 facilitates installation in the confined space of the testing and sorting equipment; on the other hand, the distance between the pressing block 300 and the chip can be further reduced, thereby further lowering the thermal resistance between the flow channel plate 100 and the chip.
[0035] The heating element 200 can be a heating rod, heating plate, or similar structure. Specifically, in this embodiment, a receiving groove 320 is formed at the bottom of the sink trough 310, and the heating element 200 is sheet-shaped and housed within the receiving groove 320. Similarly, since the heating element 200 and the pressing block 300 share a portion of the space along the thickness direction, the thickness of the pressing head mechanism 10 can be further reduced. Moreover, the sheet-shaped heating element 200 can fit well against the inner wall of the receiving groove 320, resulting in a larger contact area, thereby improving the heat exchange efficiency between the heating element 200 and the pressing block 300.
[0036] Please refer to it again. Figure 3 In this embodiment, the cooling channel 101 includes a plurality of parallel branch channels 1011, and each branch channel 1011 is provided with a guide plate 120 extending along the length direction of the branch channel 1011 to divide each branch channel 1011 into a plurality of sub-channels 1011a.
[0037] Each sub-channel 1011a can accommodate refrigerant flow, thus forming multiple flow paths after the refrigerant enters the cooling channel 101. This ensures uniform refrigerant distribution within the channel plate 100, resulting in uniform heat exchange throughout the channel plate 100 and improving the uniformity of temperature control. Specifically, a sub-channel 1011a can be formed between two adjacent guide plates 120, or between a guide plate 120 and the sidewall of a branch channel 1011. For example, as shown in the diagram, there are three branch channels 1011, and each branch channel 1011 contains two guide plates 120, resulting in a total of nine sub-channels 1011a.
[0038] Furthermore, the guide plate 120 can increase the relative surface area inside the cooling channel 101, thereby increasing the effective contact area between the refrigerant and the channel plate 100, and thus improving the heat exchange efficiency between the refrigerant and the channel plate 100 to a certain extent. Therefore, under the same conditions, the heat exchange between the refrigerant and the channel plate 100 will increase, which can effectively cool chips with large heat generation, thus increasing the chip pressing power of the pressure head mechanism 10.
[0039] Furthermore, in this embodiment, each branch channel 1011 has two bends, making the branch channel 1011 Z-shaped. The Z-shaped branch channel 1011 has fewer bends, thus reducing flow resistance and allowing the refrigerant to flow quickly along the branch channel 1011. In this way, while ensuring the uniformity of refrigerant distribution, the heat exchange efficiency between the refrigerant and the flow channel plate 100 can be further improved.
[0040] Furthermore, in this embodiment, the flow channel plate 100 is rectangular, with the refrigerant inlet 102 and refrigerant outlet 103 located at opposite apex corners of the flow channel plate 100. This allows the refrigerant flowing through the cooling channel 101 to follow the longest possible path, thereby further improving the heat exchange efficiency between the refrigerant and the flow channel plate 100.
[0041] More importantly, the inner wall of the cooling channel 101 is formed with a plurality of turbulence protrusions 110. The turbulence protrusions 110 have a first end near the refrigerant inlet 102 and a second end near the refrigerant outlet 103. That is, the refrigerant flowing through the cooling channel 101 passes through the turbulence protrusions 110 in the direction from the first end to the second end.
[0042] The turbulence protrusion 110 increases the effective contact area between the refrigerant and the inner wall of the cooling channel 101, thus significantly improving the heat exchange efficiency between the refrigerant and the channel plate 100. Therefore, under the same conditions, the heat exchange between the refrigerant and the channel plate 100 is also significantly increased, which can effectively cool chips with greater heat generation, thus significantly improving the chip pressing power of the aforementioned pressure head mechanism 10.
[0043] Furthermore, the outer surface of the turbulence protrusion 110 is a smooth curved surface, and the turbulence protrusion 110 gradually narrows from the first end to the second end. It can be seen that the turbulence protrusion 110 has a streamlined design, and this streamlined design also has a guiding effect, reducing the flow resistance of the refrigerant within the cooling channel 101 so that the refrigerant can flow rapidly along the cooling channel 101. Even under low-temperature conditions (such as -55℃), the refrigerant flow rate will not decrease significantly, therefore the turbulence protrusion 110 will not increase the flow resistance, ensuring that the heat exchange efficiency under low-temperature conditions is not significantly reduced compared to high-temperature conditions.
[0044] The cooling channel 101 can be formed using an etching process, and the turbulence protrusions 110 can be simultaneously formed during the forming process of the cooling channel 101. Multiple turbulence protrusions 110 are typically evenly distributed within the cooling channel 101 to ensure uniform flow of the refrigerant. Specifically, in this embodiment, the multiple turbulence protrusions 110 are arranged in multiple rows, and each row of turbulence protrusions 110 extends along the length of the cooling channel 101. Adjacent rows of turbulence protrusions 110 are aligned with each other (see...). Figure 5 It can also be set in a staggered manner (see...). Figure 4 ).
[0045] Please refer to it again. Figure 3 Each sub-channel 1011a has at least one row of turbulence protrusions 110. The distance between two adjacent rows of turbulence protrusions 110, as well as the spacing between adjacent turbulence protrusions 110 within the same row, can be set according to actual needs. The turbulence protrusions 110 can be in the shape of a teardrop, a spindle, or other smooth, streamlined shapes.
[0046] Specifically, in this embodiment, the head of the turbulence protrusion 110 near the first end is formed by rotating an elliptical parabola around its principal axis, and the tail of the turbulence protrusion 110 near the second end is formed by rotating a parabola around its guideline. Thus, the turbulence protrusion 110 is approximately teardrop-shaped.
[0047] The specific shape of the disturbance protrusion 110, i.e., the coordinates of various points on its surface, can be obtained through fitting. More specifically, such as... Figure 6 As shown, the coordinates of each point on the head of the turbulence protrusion 110 can be obtained by fitting the following equation:
[0048]
[0049] Where b is the maximum radius, Lf is the distance from the first end to the maximum radius, and n f The first part is an index of fatness / leanness, all of which are constants; y f X is the dependent variable, representing the distance between a point on the front surface and the axis of the spoiler protrusion 110, while X... f The independent variable is denoted by , which represents the distance from a point on the head surface to the maximum radius.
[0050] The coordinates of each point at the tail of the turbulence protrusion 110 can be obtained by fitting the following equation:
[0051]
[0052] Where b is the maximum radius, La is the distance from the second end to the maximum radius, and a n The fatness or thinness index of the tail is a constant; y a X is the dependent variable, representing the distance between a point on the tail surface and the axis of the spoiler protrusion 110, while X... a The independent variable is denoted as , which represents the distance from a point on the tail surface to the maximum radius.
[0053] Of course, the specific shape of the turbulence protrusion 110 is not limited to being determined in the above manner, as long as the surface of the turbulence protrusion 110 is streamlined and does not increase flow resistance.
[0054] In the aforementioned pressure head mechanism 10 and testing and sorting equipment, the chip under test is held by the pressure block 300. The flow channel plate 100 and the heating element 200 exchange heat with the chip through the pressure block 300, thereby achieving temperature control. The turbulence protrusion 110 increases the effective contact area between the refrigerant and the inner wall of the cooling flow channel 101, and the streamlined design of the turbulence protrusion 110 also has a guiding effect, thereby reducing the flow resistance of the refrigerant in the cooling flow channel so that the refrigerant can flow rapidly along the cooling flow channel. Therefore, the heat exchange efficiency between the refrigerant and the flow channel plate 100 is significantly improved. Moreover, the flow channel plate 100 can directly exchange heat with the pressure block 300, so the thermal resistance between the flow channel plate 100 and the chip is also significantly reduced. Therefore, the aforementioned pressure head mechanism 10 and testing and sorting equipment can both increase the chip pressing power and reduce the chip temperature overshoot, thereby significantly improving the temperature control effect for the chip.
[0055] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0056] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. A pressure head mechanism, characterized in that, The device includes a flow channel plate, a heating element, and a pressing block. The flow channel plate forms a cooling channel, a refrigerant inlet and a refrigerant outlet communicating with the cooling channel. The inner wall of the cooling channel has multiple turbulence protrusions. Each turbulence protrusion has a first end near the refrigerant inlet and a second end near the refrigerant outlet. The outer surface of each turbulence protrusion is a smooth curved surface, and the turbulence protrusion gradually narrows from the first end to the second end. The pressing block is installed on one side of the flow channel plate, and the heating element is disposed between the pressing block and the flow channel plate.
2. The pressure head mechanism according to claim 1, characterized in that, The cooling channel includes multiple parallel branch channels, and each branch channel is provided with a guide plate extending along the length of the branch channel to divide each branch channel into multiple sub-channels.
3. The pressure head mechanism according to claim 2, characterized in that, Each of the branch channels has two bends to make the branch channel Z-shaped.
4. The pressure head mechanism according to claim 3, characterized in that, The flow channel plate is rectangular, and the refrigerant inlet and the refrigerant outlet are located at two opposite apex corners of the flow channel plate.
5. The pressure head mechanism according to claim 1, characterized in that, The head of the turbulence protrusion near the first end is formed by rotating an elliptical parabola around its principal axis, and the tail of the turbulence protrusion near the second end is formed by rotating a parabola around its directrix.
6. The pressure head mechanism according to claim 1, characterized in that, The plurality of the aforementioned turbulence protrusions are arranged in multiple rows, and each row of the turbulence protrusions extends along the length of the cooling channel; wherein, adjacent rows of the turbulence protrusions are aligned with each other.
7. The pressure head mechanism according to claim 1, characterized in that, The multiple turbulence protrusions are arranged in multiple rows, and each row of turbulence protrusions extends along the length of the cooling channel; wherein, adjacent rows of turbulence protrusions are staggered.
8. The pressure head mechanism according to any one of claims 1 to 7, characterized in that, The pressing block has a recessed groove on the side facing the flow channel plate, and the flow channel plate is partially embedded in the recessed groove.
9. The pressure head mechanism according to claim 8, characterized in that, The bottom of the sinking trough has a receiving groove, and the heating element is sheet-shaped and housed in the receiving groove.
10. A testing and sorting device, characterized in that, Includes the pressure head mechanism as described in any one of claims 1 to 9 above.