Mask plate and laser sintering device

Abstract

The utility model relates to a mask plate and a laser sintering device, the mask plate is used in the laser sintering device, the laser sintering device is used for sintering a to-be-sintered part, the mask plate is provided with a through light hole in the thickness direction of the mask plate, and the light hole is used for allowing laser to penetrate through. The laser is irradiated on the to-be-sintered part, and a target pattern is formed; wherein the aperture of the light-transmitting hole is in a trend of decreasing along the direction close to the to-be-sintered part, and the aperture of the end part, close to the to-be-sintered part, of the light-transmitting hole is equal to the outer diameter of the to-be-sintered part. According to the laser sintering device provided with the mask plate, energy distribution of light beams and light spots formed by laser can be more uniform, the laser in the peripheral area of the to-be-sintered part can be shielded, and the sintering quality of the to-be-sintered part is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser sintering, in particular to a mask plate and a laser sintering device. BACKGROUND

[0002] The laser forms a high-energy-density and small-size light spot on the workbench through a focusing lens and the like, which can sinter the conductive paste on the workbench to form the final required product.

[0003] In the related art, for a silver paste conductor circuit with a production line width less than 150 microns, a direct sintering method is generally used, that is, the laser forms a focused light spot with a spot diameter less than 150 microns at the focal point, which directly sinters the conductive silver paste on the flexible substrate to obtain the silver paste conductor circuit.

[0004] However, in the above-mentioned method, the energy distribution of the laser is in a Gaussian distribution, the center energy of the light spot is strong, and the edge energy is weak, which easily causes uneven sintering of the silver paste conductor circuit, reduces the conductivity and reliability of the silver paste conductor circuit. Moreover, the energy generated by the laser at the focused light spot causes the flexible substrate to overheat, resulting in melting, scorching or carbonization of the flexible substrate, which directly affects the sintering quality. CONTENT OF THE INVENTION

[0005] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides a mask plate and a laser sintering device, the setting of the mask plate can make the energy distribution of the laser more uniform, and can shield the laser of the peripheral area of the sintered part, thereby improving the sintering quality.

[0006] In a first aspect, the present application provides a mask plate, which is used in a laser sintering device for sintering a sintered part, and the mask plate is provided with a through light-transmitting hole along the thickness direction of the mask plate, the light-transmitting hole is used for the laser to pass through so that the laser irradiates on the sintered part and forms a target pattern.

[0007] In the present application, the aperture of the light-transmitting hole presents a decreasing trend along the direction close to the sintered part, and the aperture of the end of the light-transmitting hole close to the sintered part is equal to the outer diameter of the sintered part.

[0008] According to the mask plate of the first aspect of the present application, at least the following beneficial effects are achieved:

[0009] The photomask of this application uses a laser beam that, after passing through a light-transmitting aperture, forms a beam spot that irradiates and covers the workpiece to be sintered. The beam spot does not irradiate or cover the surrounding structure of the workpiece, and the energy distribution of the beam spot is uniform. This allows for more uniform and rapid sintering of the workpiece to form the target pattern without damaging the surrounding structure, thus improving sintering quality. Furthermore, since the laser beam output from the light source assembly has a certain divergence angle, this application sets the aperture of the light-transmitting aperture to decrease in diameter towards the workpiece. This allows more laser beam to enter the aperture first, then concentrate through the end hole near the sintering platform, reducing the amount of laser beam reflected back due to blockage by the sidewalls of the aperture, increasing the energy of the beam spot, and thereby improving the sintering quality of the workpiece.

[0010] In some embodiments, the light-transmitting aperture is configured as a tapered aperture, and the tapered angle of the light-transmitting aperture is greater than the divergence angle of the laser.

[0011] In some embodiments, the depth H of the light-transmitting hole satisfies: 0.5mm≤H≤2mm; and / or, the cone angle α of the light-transmitting hole satisfies: α=45°; and / or, the end diameter D1 of the light-transmitting hole near the sintering part satisfies: D1≤150μm.

[0012] In some embodiments, there are multiple light-transmitting holes, and all of the light-transmitting holes are arranged in an array on the mask plate.

[0013] In some embodiments, the mask plate is configured as an alumina ceramic structural plate.

[0014] Secondly, this application provides a laser sintering apparatus, comprising:

[0015] A sintering platform is used to support the parts to be sintered.

[0016] A light source assembly is disposed at a distance from the sintering platform along a first direction and is used to emit laser light toward the workpiece to be sintered along the first direction;

[0017] The aforementioned photomask is disposed at intervals between the sintering platform and the light source assembly along the first direction;

[0018] Wherein, the first direction is the thickness direction of the mask plate.

[0019] The laser sintering apparatus according to the second aspect of this application has at least the following beneficial effects:

[0020] The laser sintering apparatus of this application can make the energy distribution of the laser beam spot more uniform and can block the laser in the surrounding area of ​​the workpiece to be sintered, thereby improving the sintering quality of the workpiece.

[0021] In some embodiments, in the first direction, the distance h between the mask plate and the sintering platform satisfies: 0.1mm ≤ h ≤ 0.5mm; and / or, in the first direction, the distance between the workpiece to be sintered and the focal point of the laser is 15mm to 30mm.

[0022] In some embodiments, the mask plate is movably disposed along the first direction and / or the second direction and / or the third direction, and the first direction, the second direction and the third direction intersect each other.

[0023] In some embodiments, the mask plate is rotatably disposed about the first direction and / or the second direction and / or the third direction.

[0024] In some embodiments, the light source assembly includes a laser generator, a scanning galvanometer, and a focusing field lens, wherein the scanning galvanometer is disposed between the laser generator and the focusing field lens.

[0025] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0026] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0027] Figure 1 This is a schematic diagram of the structure of the laser sintering platform according to an embodiment of this application.

[0028] Figure 2 This is a top view of the mask plate according to an embodiment of this application.

[0029] Figure 3 This is a bottom view of the mask plate according to an embodiment of this application.

[0030] Figure 4 for Figure 3 A magnified view of point A in the image.

[0031] Figure 5 This is an axial cross-sectional view of the light-transmitting hole in an embodiment of this application.

[0032] Figure reference numerals: mask plate 100; light-transmitting hole 110; first end hole 111; second end hole 112; sintering platform 200; light source assembly 300; laser generator 310; scanning galvanometer 320; focusing field lens 330; part to be sintered 400; flexible display product 40; first direction Z; second direction X; third direction Y. Detailed Implementation

[0033] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0034] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0035] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0036] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0037] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0038] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0039] The laser forms a high-energy-density, small-sized spot on the worktable through a focusing lens and other structures. This spot can sinter the conductive paste on the worktable to form the final product.

[0040] In related technologies, for silver paste wire circuits with a production line width of less than 150μm (micrometers), the existing general method is to use a direct sintering method, that is, a laser forms a focused spot with a spot diameter of less than 150μm (micrometers) at the focal point, and the focused spot directly sintersects the conductive silver paste on the flexible substrate to obtain the silver paste wire circuit.

[0041] However, in the above methods, the laser energy distribution is Gaussian, with strong energy at the center of the spot and weak energy at the edges. This can easily lead to uneven sintering of the silver paste wire circuit, reducing its conductivity and reliability. Moreover, the energy generated by the laser at the focused spot can cause the flexible substrate to overheat, resulting in melting, charring, or carbonization, directly affecting the sintering quality.

[0042] Based on this, see Figures 1 to 5 One or more embodiments of this application provide a mask 100, which is used in a laser sintering apparatus for sintering a workpiece 400 to be sintered.

[0043] See Figure 1 and Figure 5The mask plate 100 has a through-hole 110 along its thickness direction, which allows the laser to pass through so that the laser irradiates the workpiece 400 to form a target pattern. The diameter of the through-hole 110 decreases towards the workpiece 400, and the diameter of the end of the through-hole 110 near the workpiece 400 is equal to the outer diameter of the workpiece 400.

[0044] The laser sintering apparatus includes a sintering platform 200, a light source assembly 300, and the aforementioned mask 100. The sintering platform 200 supports the workpiece 400 to be sintered. The light source assembly 300 is spaced apart from the sintering platform 200 along a first direction Z, and emits laser light towards the workpiece 400 along the first direction Z. The mask 100 is spaced apart between the sintering platform 200 and the light source assembly 300 along the first direction Z. The first direction Z is the thickness direction of the mask 100.

[0045] It should be noted that, in this application, see [reference 1] Figure 1 The sintering platform 200 refers to a structure that can place the workpiece 400 to be sintered. The sintering platform 200 can be set as a rectangular structure, with its upper surface corresponding to the bearing surface. The workpiece 400 to be sintered is placed directly or indirectly on the bearing surface of the sintering platform 200 for laser sintering treatment.

[0046] See also in this application. Figure 1 The light source assembly 300 can emit laser light and irradiate the workpiece 400 to be sintered along a preset path, so that the workpiece 400 to be sintered forms a target pattern.

[0047] See also in this application. Figure 1 The mask 100 refers to a plate-shaped structure that can block laser light. It can be, but is not limited to, a rectangular plate, a circular plate, or a polygonal plate. The light-transmitting hole 110 on the mask 100 allows the laser light to pass through. The outer structure of the light-transmitting hole 110 on the mask 100 (the area on the mask 100 where the light-transmitting hole 110 is not opened) can block the laser light.

[0048] The light-transmitting hole 110 can be a tapered hole, a stepped hole, etc., so that the diameter of the light-transmitting hole 110 tends to decrease along the direction close to the part to be sintered 400.

[0049] See also in this application. Figure 1The component to be sintered 400 may be, but is not limited to, conductive silver paste coated on the flexible display product 40. The flexible display product 40 may be a flexible substrate. In this case, the component to be sintered 400 is conductive silver paste coated on the surface of the flexible substrate, and the component to be sintered 400 is supported on the sintering platform 200 by the flexible substrate. The laser output from the light source assembly 300 passes through the light-transmitting hole 110 on the mask plate 100 and irradiates the conductive silver paste on the surface of the flexible substrate. The laser energy sintersects the conductive silver paste to form a silver paste wire circuit. In this embodiment, the silver paste wire circuit is the target pattern sintered onto the surface of the flexible substrate.

[0050] It should also be noted that, in this application, the outer diameter of the part to be sintered 400 refers to the width of the part to be sintered 400. For example, if the part to be sintered 400 is conductive silver paste, the conductive silver paste is applied to the surface of the flexible substrate according to a preset extension trajectory (e.g. Figure 1 The “F” in the figure refers to the conductive silver paste being sintered to form a silver paste wire circuit. The line width of the silver paste wire circuit corresponds to the outer diameter of the conductive silver paste, which is also the outer diameter of the aforementioned part to be sintered 400.

[0051] In other embodiments, the part to be sintered 400 may also be a circular conductive silver paste, the diameter of which is equal to the end aperture of the light-transmitting hole 110 near the part to be sintered 400.

[0052] The following combination Figure 1 and Figure 5 Briefly describe the working principle of the laser sintering device:

[0053] The light source assembly 300, the mask plate 100, and the sintering platform 200 are arranged sequentially at intervals along the first direction Z, with the laser output end of the light source assembly 300 facing the light-transmitting hole 110 of the mask plate 100. At the same time, the light-transmitting hole 110 of the mask plate 100 faces the workpiece 400 to be sintered on the sintering platform 200.

[0054] During sintering, the light source assembly 300 outputs a laser beam toward the mask plate 100. After the laser beam is concentrated through the light-transmitting hole 110 on the mask plate 100, it forms a laser beam with relatively uniform energy distribution. The diameter of the laser beam spot formed on the sintering platform 200 is exactly equal to the end diameter of the light-transmitting hole 110 near the sintering platform 200. Since the end diameter of the light-transmitting hole 110 near the sintering platform 200 is equal to the outer diameter of the part to be sintered 400, the laser beam spot formed after passing through the light-transmitting hole 110 irradiates and covers the part to be sintered 400, and the laser beam spot does not irradiate or cover the surrounding area structure of the part to be sintered 400. The energy distribution of the laser beam spot is uniform, thereby sintering the part to be sintered 400 into the target pattern more uniformly and quickly, without damaging the surrounding area structure of the part to be sintered 400, thus improving the sintering quality.

[0055] Furthermore, since the laser beam output by the light source component 300 has a certain divergence angle, this application sets the aperture of the light-transmitting hole 110 to decrease in the direction close to the workpiece 400 to be sintered. This allows more laser beams to enter the light-transmitting hole 110 first, and then concentrate through the end hole of the light-transmitting hole 110 near the sintering platform 200. This reduces the amount of laser beams reflected back by being blocked by the side wall of the light-transmitting hole 110, increases the energy of the beam spot, and thus improves the sintering quality of the workpiece 400 to be sintered.

[0056] It is easy to understand that the mask plate 100 of this application and the laser sintering device equipped with the mask plate 100 can not only make the energy distribution of the laser beam spot more uniform, but also block the laser in the surrounding area of ​​the workpiece 400 to be sintered, thereby improving the sintering quality of the workpiece 400.

[0057] See also some embodiments of this application. Figure 5 The light-transmitting aperture 110 is constructed as a tapered aperture, and the tapered angle of the light-transmitting aperture 110 is greater than the divergence angle of the laser.

[0058] Specifically, when the light-transmitting hole 110 is constructed as a conical hole, the axial cross-section of the light-transmitting hole 110 is a frustum cross-section, and the cone angle of the light-transmitting hole 110 refers to the included angle between the two generatrices of the frustum cross-section.

[0059] The divergence angle of a laser refers to the angle at which the laser beam spreads laterally after the light source assembly 300 emits the laser beam toward the light-transmitting hole 110.

[0060] By constructing the light-transmitting hole 110 as a conical hole, and making the cone angle of the conical hole larger than the divergence angle of the laser, not only can the laser beam spot formed after passing through the light-transmitting hole 110 uniformly irradiate the workpiece 400 to be sintered, but also the entrance range of the light-transmitting hole 110 is larger than the divergence angle range of the laser, allowing more laser beams to enter the light-transmitting hole 110 and irradiate the workpiece 400 to be sintered. This further reduces the amount of laser beam reflected back due to being blocked by the sidewall of the light-transmitting hole 110, increases the energy of the beam spot, and thus further improves the sintering quality of the workpiece 400 to be sintered.

[0061] Further, see Figure 5 The depth H of the light-transmitting hole 110 satisfies: 0.5 mm ≤ H ≤ 2 mm. The cone angle α of the light-transmitting hole 110 satisfies: α = 90°. The diameter D1 of the end of the light-transmitting hole 110 near the part to be sintered 400 satisfies: D1 ≤ 150 μm.

[0062] Specifically, see Figure 2 , Figure 3 , Figure 4 and Figure 5The end of the light-transmitting hole 110 near the sintering platform 200 and the end away from the sintering platform 200 are defined as the first end hole 111 and the second end hole 112, respectively. The aperture D1 of the end of the light-transmitting hole 110 near the sintering platform 200 refers to the aperture of the first end hole 111. The depth H of the light-transmitting hole 110 is also the distance between the first end hole 111 and the second end hole 112.

[0063] Since the axial cross-section of the light-transmitting hole 110 is frustum-shaped, when the cone angle α of the light-transmitting hole 110 is 90°, 0.5mm≤H≤2mm, and D1≤150μm, the diameter of the second end hole 112 is defined as D2. Then D2=2*H+D1, and D2 is much larger than D1. That is, the diameter of the second end hole 112 is much larger than the diameter of the first end hole 111.

[0064] This configuration allows the entrance of the light-transmitting hole 110 to be much larger than its exit, enabling more laser beams to enter the light-transmitting hole 110 and irradiate the workpiece 400 to be sintered. This further reduces the amount of laser beams reflected back due to being blocked by the sidewalls of the light-transmitting hole 110, increases the energy of the beam spot, and thus further improves the sintering quality of the workpiece 400 to be sintered.

[0065] It should also be noted that in this application, the depth H of the light-transmitting hole 110 is equal to the thickness of the mask plate 100. In order to make the mask plate 100 easier to process, the thickness of the mask plate 100 can be further controlled within the range of 0.3mm to 1mm. Correspondingly, at this time, the depth H of the light-transmitting hole 110 satisfies: 0.3mm≤H≤1mm.

[0066] In some embodiments of this application, see Figure 2 and Figure 3 There are multiple light-transmitting holes 110, and all the light-transmitting holes 110 are arranged in an array on the mask plate 100.

[0067] Specifically, all the light-transmitting holes 110 can be constructed to the same size or to different sizes, depending on actual needs.

[0068] It should be noted that when the light-transmitting hole 110 is periodically or for a long time irradiated by the laser, the light-transmitting hole 110 will reach the end of its service life. The light-transmitting hole 110 will become larger in diameter and the edge sidewalls will become uneven, causing the light-transmitting hole 110 to become unusable.

[0069] Based on this, this application provides multiple arrayed light-transmitting holes 110 on the mask plate 100. When one of the light-transmitting holes 110 reaches the end of its service life, another light-transmitting hole 110 can be used directly without replacing the entire mask plate 100, thus saving corresponding costs.

[0070] In some embodiments of this application, the mask plate 100 is configured as an alumina ceramic structural plate.

[0071] Alumina ceramics have the characteristics of high melting point, high temperature resistance, high thermal conductivity and easy processing, which makes the mask 100 easy to process and can extend the service life of the mask 100. Moreover, it can completely block the laser in the area of ​​the mask 100 except for the light-transmitting hole 110, ensuring that the light-transmitting hole 110 transmits light independently.

[0072] In some embodiments of this application, see Figure 1 In the first direction Z, the distance h between the mask plate 100 and the sintering platform 200 satisfies: 0.1mm≤h≤0.5mm.

[0073] Specifically, the distance h between the mask plate 100 and the sintering platform 200 is controlled within the range of 0.1mm to 0.5mm in the vertical direction, and the mask plate 100 is suspended in the air. By visual alignment, the light-transmitting hole 110 on the mask plate 100 is aligned vertically with the workpiece 400 to be sintered. Then, the workpiece 400 on the sintering platform 200 is uniformly sintered by the laser beam emitted by the light source assembly 300.

[0074] By setting the distance between the mask plate 100 and the sintering platform 200 within the above range, the laser beam can pass through the light-transmitting hole 110 and uniformly sinter the workpiece 400 to be sintered to form the target pattern, thereby improving the sintering accuracy.

[0075] In some embodiments of this application, see Figure 1 In the first direction Z, the distance between the part to be sintered 400 and the focal point of the laser is 15mm to 30mm.

[0076] It should be noted that the distance between the sintering part 400 and the focal point of the laser is the defocusing amount of the sintering part 400. By setting the defocusing amount of the sintering part 400 in the range of 15mm to 30mm, on the basis of good focusing of the light source assembly 300, the laser beam emitted by the light source assembly 300 forms a larger spot range on the sintering platform 200, which can make the spot more uniformly cover the sintering part 400, thereby uniformly sintering the sintering part 400 to form the target pattern, improving the sintering quality and efficiency.

[0077] In some embodiments of this application, see Figure 1 The mask plate 100 is movably disposed along a first direction Z and / or a second direction X and / or a third direction Y, and the first direction Z, the second direction X and the third direction Y intersect each other.

[0078] Specifically, when the first direction Z is set to the vertical direction, that is, when the thickness direction of the mask plate 100 is vertical, the second direction X and the third direction Y are both set along the horizontal plane, and the second direction X and the third direction Y are perpendicular to each other, that is, the first direction Z, the second direction X and the third direction Y are perpendicular to each other.

[0079] The mask 100 can be moved in three directions via a support, or via a robotic arm or other structure. Movement of the mask 100 in the first direction Z, the second direction X, and the third direction Y allows for better adjustment of its position, ensuring precise alignment of the light-transmitting holes 110 on the mask 100 with the workpiece 400 to be sintered, thus improving sintering accuracy.

[0080] In some embodiments of this application, see Figure 1 The mask plate 100 is rotatably disposed about a first direction Z and / or a second direction X and / or a third direction Y.

[0081] Specifically, the mask plate 100 can be suspended by a bracket and can rotate relative to the bracket around the first direction a, the second direction b and the third direction c respectively, so that the light-transmitting hole 110 on the mask plate 100 is precisely aligned with the workpiece 400 to be sintered, thereby improving the sintering accuracy.

[0082] In some embodiments of this application, see Figure 1 The light source assembly 300 is movably disposed in a plane intersecting the first direction Z.

[0083] Specifically, the light source assembly 300 can move in the horizontal plane. By adjusting the position of the light source assembly 300, the laser beam can pass through the light-transmitting hole 110 and be precisely aligned with the workpiece 400 to be sintered.

[0084] In some embodiments of this application, see Figure 1 The light source assembly 300 includes a laser generator 310, a scanning galvanometer 320, and a focusing field lens 330, with the scanning galvanometer 320 disposed between the laser generator 310 and the focusing field lens 330.

[0085] Specifically, the laser generator 310 can emit a laser beam, which then passes through the scanning galvanometer 320 and the focusing field lens 330 in sequence. After passing through the light-transmitting hole 110, the laser beam finally irradiates the workpiece 400 to be sintered, forming the target pattern.

[0086] Furthermore, when the light source assembly 300 is movable, the scanning galvanometer 320 and the focusing field lens 330 actually move in the horizontal plane so that the laser beam can pass through the light-transmitting hole 110 and then be aligned with the workpiece 400 to be sintered.

[0087] In some embodiments, the laser sintering apparatus further includes a control component (not shown in the figure), which is communicatively connected to the mask 100 and the light source assembly 300, and is used to control the mask 100 and / or the light source assembly 300 to move in a plane intersecting the first direction Z.

[0088] Specifically, the control component can be configured as a PLC-based controller. The controller is communicatively connected to the mask 100, the scanning galvanometer 320, and the focusing field lens 330. Thus, the controller can issue commands to control the mask 100 to move along a specified path in the horizontal plane and to control the scanning galvanometer 320 and the focusing field lens 330 to move synchronously along a specified path in the horizontal plane. This causes the light-transmitting aperture 110 to move along the extension trajectory of the part to be sintered 400, so as to align with various parts of the part to be sintered 400. Finally, the part to be sintered 400 is sintered to form the target pattern, completing the laser sintering operation.

[0089] Of course, in other embodiments, the sintering platform 20 is movably disposed in a plane intersecting the first direction Z. Specifically, a control component is communicatively connected to the sintering platform 200 to control the sintering platform 200 to move along a specified path in the horizontal plane.

[0090] During the sintering process, the control component controls the sintering platform 200 to move along the extension trajectory of the workpiece 400 to be sintered, so that the laser beam passes through the light-transmitting hole 110 on the mask plate 100 and sintersects the workpiece 200 to form the target pattern, thus completing the laser sintering operation.

[0091] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0092] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A photomask, said photomask being used in a laser sintering apparatus, said laser sintering apparatus being used to sinter a workpiece, characterized in that, The mask plate has a through-hole along its thickness direction, which allows the laser to pass through so that the laser can irradiate the workpiece to be sintered and form a target pattern. The aperture of the light-transmitting hole decreases in diameter as it approaches the part to be sintered, and the aperture diameter of the end of the light-transmitting hole near the part to be sintered is equal to the outer diameter of the part to be sintered.

2. The mask plate according to claim 1, characterized in that, The light-transmitting hole is constructed as a tapered hole, and the tapered angle of the light-transmitting hole is greater than the divergence angle of the laser.

3. The mask plate according to claim 2, characterized in that, The depth H of the light-transmitting hole satisfies: 0.5mm≤H≤2mm; and / or, the cone angle α of the light-transmitting hole satisfies: α=90°; and / or, the end diameter D1 of the light-transmitting hole near the sintering part satisfies: D1≤150μm.

4. The mask plate according to claim 1, characterized in that, The light-transmitting holes are multiple, and all of the light-transmitting holes are arranged in an array on the mask plate.

5. The mask plate according to any one of claims 1 to 4, characterized in that, The mask plate is constructed as an alumina ceramic structural plate.

6. A laser sintering apparatus, characterized in that, include A sintering platform is used to support the parts to be sintered. A light source assembly is disposed at a distance from the sintering platform along a first direction and is used to emit laser light toward the workpiece to be sintered along the first direction; The mask as described in any one of claims 1 to 5, wherein the mask is disposed at a distance between the sintering platform and the light source assembly along the first direction; Wherein, the first direction is the thickness direction of the mask plate.

7. The laser sintering apparatus according to claim 6, characterized in that, In the first direction, the distance h between the mask plate and the sintering platform satisfies: 0.1mm≤h≤0.5mm; and / or, in the first direction, the distance between the workpiece to be sintered and the focal point of the laser is 15mm~30mm.

8. The laser sintering apparatus according to claim 6, characterized in that, The mask plate is movably disposed along the first direction and / or the second direction and / or the third direction, and the first direction, the second direction and the third direction intersect each other.

9. The laser sintering apparatus according to claim 6, characterized in that, The mask plate is rotatably disposed about the first direction and / or the second direction and / or the third direction.

10. The laser sintering apparatus according to claim 6, characterized in that, The light source assembly includes a laser generator, a scanning galvanometer, and a focusing field lens, with the scanning galvanometer disposed between the laser generator and the focusing field lens.

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