Integrated circuit packaging excessive glue removing equipment

Abstract

The utility model discloses an integrated circuit packaging excessive glue removing device, and relates to the technical field of integrated circuits. The integrated circuit packaging excessive glue removing equipment comprises a bottom plate, and a fixing mechanism and a cleaning mechanism are arranged above the bottom plate; the cleaning mechanism is located above the fixing mechanism. The fixing mechanism comprises a fixing part and a positioning part; the fixed part comprises two clamping frames and a movable plate; the positioning part comprises two groups of positioning plates, two dampers and two extension springs; the integrated circuit board fixing device has the technical effects that the fixing mechanism is matched with the first threaded rod through a nut, so that the moving plate can move, the moving blocks and the clamping frame are driven by the connecting rod and the connecting plate to quickly clamp and fix the integrated circuit board, the operation is simple and convenient, and the efficiency is high; and meanwhile, the extension spring and the damper enable the positioning plate to accurately position the circuit board through the control rod and the control frame, so that the stability during cleaning is ensured, adverse effects caused by deviation are avoided, and the cleaning precision and the yield are improved.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit technology, specifically to an integrated circuit packaging adhesive overflow removal device. Background Technology

[0002] An integrated circuit is a circuit that integrates many electronic components (such as transistors, capacitors, resistors, etc.) onto a semiconductor chip. It has greatly promoted the development of electronic technology, making electronic devices smaller, lighter, faster, and more reliable.

[0003] During the packaging of integrated circuits, cleaning equipment is needed to remove any excess adhesive residue to ensure the stability of the integrated circuits during use.

[0004] Existing adhesive overflow removal devices have shortcomings in fixing and positioning integrated circuit boards. When fixing integrated circuit boards, these devices have difficulty accurately positioning them in the appropriate position, making it difficult to effectively improve the accuracy of adhesive overflow removal. Therefore, an integrated circuit packaging adhesive overflow removal device is proposed. Utility Model Content

[0005] (a) Technical problems to be solved

[0006] To address the shortcomings of existing technologies, this utility model provides an integrated circuit packaging adhesive overflow removal device, which solves the problem that it is difficult to accurately position the integrated circuit board in the appropriate position when fixing the integrated circuit board, making it difficult to effectively improve the accuracy of adhesive overflow removal.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, this utility model is implemented through the following technical solution: it includes a base plate, and a fixing mechanism and a cleaning mechanism are provided on the top of the base plate;

[0009] The cleaning mechanism is located above the fixing mechanism;

[0010] The fixing mechanism includes a fixing part and a positioning part;

[0011] The fixing part includes two clamping frames and a moving plate, and the positioning part includes two sets of positioning plates, two dampers and two extension springs;

[0012] Two movable blocks are slidably arranged on the inner side of the base plate. The top surfaces of the two movable blocks are fixedly connected to the bottom surfaces of the two clamping frames respectively. The inner sides of the two clamping frames are slidably connected to the outer walls of the two sets of positioning plates respectively. Two sliding grooves are opened on the outer walls of the two clamping frames respectively. Two sets of control frames are slidably arranged on the inner walls of the two sliding grooves respectively. The side of the two sets of control frames near the two sets of positioning plates is fixedly connected to the outer walls of the two sets of positioning plates respectively.

[0013] Preferably, the cleaning mechanism includes a cleaning blade, a fixed frame is fixedly installed on the outer wall of the base plate, a lifting frame is slidably installed on the inner side of the fixed frame, a second threaded rod is rotatably installed on the inner side of the lifting frame through a bearing seat, a control block is threadedly sleeved on the outer wall of the second threaded rod, the bottom surface of the control block is connected to the top surface of the cleaning blade by bolts, a motor is fixedly installed on the outer wall of the lifting frame, and the output end of the motor passes through the outer wall of the lifting frame and is fixedly connected to the outer wall of the second threaded rod.

[0014] Preferably, a guide rail is fixedly provided on the bottom surface of the base plate, a movable plate is slidably sleeved on the outer wall of the guide rail, two connecting rods are hinged to the outer wall of the movable plate, two connecting plates are fixedly provided on the bottom surface of the two movable blocks respectively, and the side of the two connecting plates near the two connecting rods is hinged to the outer wall of the two connecting plates respectively.

[0015] Preferably, a fixing frame is fixedly provided on the outer wall of the base plate, and a first threaded rod is fixedly provided on one side of the movable plate near the fixing frame. The first threaded rod extends through the inner side of the fixing frame to the outer side of the fixing frame on one side near the fixing frame. A nut is rotatably provided on the outer wall of the fixing frame through a bearing seat, and the inner side of the nut is threadedly connected to the outer wall of the first threaded rod.

[0016] Preferably, the outer walls of the two clamping frames are fixedly connected to the sides of the two extension springs and the two dampers respectively, and two pressing blocks are fixedly provided on the sides of the two extension springs and the two dampers respectively. The outer walls of the two pressing blocks are respectively hinged with two sets of control rods, and the outer walls of the two sets of control rods are respectively hinged to the outer walls of the two sets of control frames.

[0017] Preferably, an electric telescopic rod is fixedly installed on the top surface of the fixed frame, the bottom surface of the output end of the electric telescopic rod extends through the top surface of the fixed frame to the inner side of the fixed frame, the bottom surface of the output end of the electric telescopic rod is fixedly connected to the top surface of the lifting frame, a wedge-shaped groove is opened on the inner side of the fixed frame, a wedge-shaped block is slidably installed on the inner wall of the wedge-shaped groove, and the side of the wedge block near the lifting frame is fixedly connected to the outer wall of the lifting frame.

[0018] (III) Beneficial Effects

[0019] This invention provides a device for removing excess adhesive from integrated circuit packaging. It has the following advantages:

[0020] (i) The integrated circuit packaging overflow adhesive removal equipment has a fixing mechanism that uses a nut to cooperate with a first threaded rod to move a movable plate. The movable block and clamping frame are driven by the connecting rod and the connecting plate to quickly clamp and fix the integrated circuit board. The operation is simple and efficient. At the same time, the extension spring and damper are used to make the positioning plate accurately position the circuit board through the control rod and the control frame, ensuring stability during removal, avoiding adverse effects caused by deviation, and improving the removal accuracy and yield.

[0021] (II) The integrated circuit packaging adhesive removal equipment has an electric telescopic rod in the cleaning mechanism that can flexibly adjust the height of the lifting frame and the cleaning blade, which can adapt to integrated circuit boards of different thicknesses and meet the adhesive removal needs of various product specifications; the motor drives the second threaded rod to rotate, so that the cleaning blade moves stably and efficiently above the circuit board, quickly and evenly scraping off the adhesive, ensuring the consistency and stability of the removal effect, and improving the appearance quality and performance of the product. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0023] Figure 2 This is a schematic diagram of the fixing mechanism of this utility model;

[0024] Figure 3 This is a schematic diagram of the movable plate in the fixing mechanism of this utility model;

[0025] Figure 4 This is a schematic diagram of the cleaning mechanism of this utility model;

[0026] Figure 5 This utility model Figure 2 A magnified structural diagram of region A in the middle.

[0027] In the diagram: 1. Base plate; 2. Fixing mechanism; 21. Moving block; 22. Clamping frame; 23. Fixing frame; 24. First threaded rod; 25. Nut; 26. Connecting plate; 27. Connecting rod; 28. Moving plate; 29. ​​Guide rail; 210. Positioning plate; 211. Damper; 212. Control frame; 213. Control rod; 214. Extrusion block; 215. Extension spring; 3. Cleaning mechanism; 31. Fixing frame; 32. Electric telescopic rod; 33. Wedge block; 34. Second threaded rod; 35. Control block; 36. Cleaning knife; 37. Lifting frame; 38. Motor. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] Please see Figure 1-5 The present invention provides a technical solution: including a base plate 1, and a fixing mechanism 2 and a cleaning mechanism 3 are provided on the top of the base plate 1;

[0030] Cleaning mechanism 3 is located above fixing mechanism 2;

[0031] The fixing mechanism 2 includes a fixing part and a positioning part;

[0032] The fixing part includes two clamping frames 22 and a moving plate 28, and the positioning part includes two sets of positioning plates 210, two dampers 211 and two extension springs 215.

[0033] Two movable blocks 21 are slidably arranged on the inner side of the base plate 1. The top surfaces of the two movable blocks 21 are fixedly connected to the bottom surfaces of two clamping frames 22, respectively. The inner sides of the two clamping frames 22 are slidably connected to the outer walls of two sets of positioning plates 210, respectively. Two sliding grooves are opened on the outer walls of the two clamping frames 22, and two sets of control frames 212 are slidably arranged on the inner walls of the two sliding grooves, respectively. The sides of the two sets of control frames 212 near the two sets of positioning plates 210 are fixedly connected to the outer walls of the two sets of positioning plates 210, respectively. A guide rail 29 is fixedly arranged on the bottom surface of the base plate 1. A movable plate 28 is slidably sleeved on the outer wall of the guide rail 29. Two connecting rods 27 are hinged to the outer wall of the movable plate 28. Two connecting plates 26 are fixedly arranged on the bottom surfaces of the two movable blocks 21, respectively. The sides of the two connecting plates 26 near the two connecting rods 27 are hinged to the outer walls of the two connecting plates 26, respectively. Next, a fixed frame 23 is fixedly installed on the outer wall of the base plate 1. A first threaded rod 24 is fixedly installed on the side of the movable plate 28 near the fixed frame 23. The first threaded rod 24 extends through the inner side of the fixed frame 23 to the outer side of the fixed frame 23. A nut 25 is rotatably installed on the outer wall of the fixed frame 23 through the bearing seat 2. The inner side of the nut 25 is threadedly connected to the outer wall of the first threaded rod 24. The outer walls of the two clamping frames 22 are fixedly connected to the sides of the two extension springs 215 and the two dampers 211 respectively. Two pressing blocks 214 are fixedly installed on the sides of the two extension springs 215 and the two dampers 211 respectively. Two sets of control rods 213 are hinged to the outer walls of the two pressing blocks 214 respectively. The outer walls of the two sets of control rods 213 are hinged to the outer walls of the two sets of control frames 212 respectively.

[0034] The cleaning mechanism 3 includes a cleaning blade 36. A fixed frame 31 is fixedly installed on the outer wall of the base plate 1. A lifting frame 37 is slidably installed on the inner side of the fixed frame 31. A second threaded rod 34 is rotatably installed on the inner side of the lifting frame 37 through a bearing seat. A control block 35 is threadedly fitted on the outer wall of the second threaded rod 34. The bottom surface of the control block 35 is bolted to the top surface of the cleaning blade 36. A motor 38 is fixedly installed on the outer wall of the lifting frame 37. The output end of the motor 38 passes through the outer wall of the lifting frame 37 and is fixedly connected to the outer wall of the second threaded rod 34. An electric telescopic rod 32 is fixedly installed on the top surface of the fixed frame 31. The bottom surface of the output end of the electric telescopic rod 32 passes through the top surface of the fixed frame 31 and extends to the inner side of the fixed frame 31. The bottom surface of the output end of the electric telescopic rod 32 is fixedly connected to the top surface of the lifting frame 37. A wedge-shaped groove is opened on the inner side of the fixed frame 31. A wedge-shaped block 33 is slidably installed on the inner wall of the wedge groove. The side of the wedge-shaped block 33 near the lifting frame 37 is fixedly connected to the outer wall of the lifting frame 37.

[0035] In use, the integrated circuit board that needs to be cleaned of excess adhesive is placed inside the two clamping frames 22. At this time, the nut 25 is manually rotated. When the nut 25 rotates, the moving plate 28 can be moved through the first threaded rod 24. During the movement of the moving plate 28, the two moving blocks 21 can be brought closer to each other through the two connecting rods 27 and the two connecting plates 26. When the two moving blocks 21 are brought closer to each other, the two clamping frames 22 can be brought closer to each other. When the two clamping frames 22 are brought closer to each other, the integrated circuit board can be clamped and fixed. During the fixing process, the two extrusion springs 215 and the two dampers 211 can generate a pushing force on the two pressing blocks 214. When the two pressing blocks 214 generate a pushing force, the two sets of positioning plates 210 can be brought closer to each other through the two sets of control rods 213 and the two sets of control frames 212. When the two positioning plates 210 are brought closer to each other, the integrated circuit board can be positioned between the two clamping frames 22.

[0036] After the fixing is completed, the electric telescopic rod 32 is opened. After the electric telescopic rod 32 is opened, the lifting frame 37 can move up and down. When the lifting frame 37 moves up and down, it can drive the cleaning blade 36 to move synchronously. When the cleaning blade 36 moves downward, it can fit against the outer wall of the integrated circuit board. At this time, the motor 38 is turned on. After the motor 38 is turned on, it can drive the second threaded rod 34 to rotate. During the rotation of the second threaded rod 34, it can drive the cleaning blade 36 to move above the integrated circuit board, thereby scraping off the excess glue above.

[0037] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0038] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An integrated circuit packaging adhesive overflow removal device, comprising a base plate (1), characterized in that: A fixing mechanism (2) and a cleaning mechanism (3) are provided above the base plate (1); The cleaning mechanism (3) is located above the fixing mechanism (2); The fixing mechanism (2) includes a fixing part and a positioning part; The fixing part includes two clamps (22) and a moving plate (28), and the positioning part includes two sets of positioning plates (210), two dampers (211) and two extension springs (215); Two movable blocks (21) are slidably arranged on the inner side of the base plate (1). The top surfaces of the two movable blocks (21) are fixedly connected to the bottom surfaces of the two clamping frames (22). The inner sides of the two clamping frames (22) are slidably connected to the outer walls of the two sets of positioning plates (210). The outer walls of the two clamping frames (22) are respectively provided with two sliding grooves. The inner walls of the two sliding grooves are respectively provided with two sets of control frames (212). The side of the two sets of control frames (212) close to the two sets of positioning plates (210) is fixedly connected to the outer walls of the two sets of positioning plates (210).

2. The integrated circuit packaging adhesive overflow removal device according to claim 1, characterized in that: The cleaning mechanism (3) includes a cleaning blade (36). A fixed frame (31) is fixedly installed on the outer wall of the base plate (1). A lifting frame (37) is slidably installed on the inner side of the fixed frame (31). A second threaded rod (34) is rotatably installed on the inner side of the lifting frame (37) through a bearing seat. A control block (35) is threadedly fitted on the outer wall of the second threaded rod (34). The bottom surface of the control block (35) is connected to the top surface of the cleaning blade (36) by bolts. A motor (38) is fixedly installed on the outer wall of the lifting frame (37). The output end of the motor (38) passes through the outer wall of the lifting frame (37) and is fixedly connected to the outer wall of the second threaded rod (34).

3. The integrated circuit packaging adhesive overflow removal device according to claim 1, characterized in that: The bottom surface of the base plate (1) is fixedly provided with a guide rail (29), and a movable plate (28) is slidably sleeved on the outer wall of the guide rail (29). Two connecting rods (27) are hinged to the outer wall of the movable plate (28). Two connecting plates (26) are fixedly provided on the bottom surface of the two movable blocks (21). The side of the two connecting plates (26) close to the two connecting rods (27) is hinged to the outer wall of the two connecting plates (26).

4. The integrated circuit packaging adhesive overflow removal device according to claim 3, characterized in that: A fixed frame (23) is fixedly installed on the outer wall of the base plate (1). A first threaded rod (24) is fixedly installed on one side of the movable plate (28) near the fixed frame (23). The first threaded rod (24) extends through the inner side of the fixed frame (23) to the outer side of the fixed frame (23). A nut (25) is rotatably installed on the outer wall of the fixed frame (23) through a bearing seat. The inner side of the nut (25) is threadedly connected to the outer wall of the first threaded rod (24).

5. The integrated circuit packaging adhesive overflow removal device according to claim 1, characterized in that: The outer walls of the two clamping frames (22) are fixedly connected to the side of the two extension springs (215) and the two dampers (211) respectively. Two pressing blocks (214) are fixedly provided on the side of the two extension springs (215) and the two dampers (211) respectively. Two sets of control rods (213) are hinged to the outer walls of the two pressing blocks (214). The outer walls of the two sets of control rods (213) are hinged to the outer walls of the two sets of control frames (212) respectively.

6. The integrated circuit packaging adhesive overflow removal device according to claim 2, characterized in that: An electric telescopic rod (32) is fixedly installed on the top surface of the fixed frame (31). The bottom surface of the output end of the electric telescopic rod (32) extends through the top surface of the fixed frame (31) to the inside of the fixed frame (31). The bottom surface of the output end of the electric telescopic rod (32) is fixedly connected to the top surface of the lifting frame (37). A wedge-shaped groove is opened on the inner side of the fixed frame (31). A wedge-shaped block (33) is slidably installed on the inner wall of the wedge-shaped groove. The side of the wedge-shaped block (33) near the lifting frame (37) is fixedly connected to the outer wall of the lifting frame (37).

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