PCB (printed circuit board) substrate electroplating product frame

Abstract

The utility model provides a PCB (Printed Circuit Board) substrate electroplating product frame, which comprises a rectangular frame formed by connecting four borders, and a hollow structure penetrating through the thickness direction is arranged in the center of the rectangular frame and is used for reducing the flow resistance of electroplating liquid; the left frame and the right frame are symmetrically arranged, the inner side surfaces of the left frame and the right frame are respectively connected with auxiliary cathodes extending along the vertical direction, and in the transverse direction of the PCB substrate electroplating product frame, most areas in the length direction of the auxiliary cathodes are separated from the left frame or the right frame on the outer side of the auxiliary cathodes; the bottom cross beam is horizontally connected to the bottom ends of the left frame and the right frame, forms a rectangular accommodating space together with the lower frame of the rectangular frame, and is used for accommodating a PCB (Printed Circuit Board) substrate; the surface of the left frame, the surface of the right frame and the surface of the bottom cross beam are all covered with insulating coatings.

Description

Technical Field

[0001] This application belongs to the field of printed circuit board electroplating, and specifically relates to a PCB substrate electroplating product frame. Background Technology

[0002] In the electronics manufacturing industry, PCB (Printed Circuit Board) electroplating is a key technology, primarily used to deposit a uniform layer of copper on the surface of a PCB substrate to enable circuit connections and signal transmission. Traditional PCB electroplating methods typically use titanium plates or titanium meshes as insoluble anodes, while the PCB substrate itself acts as the cathode. During the electroplating process, an electric current is applied, causing oxygen to be generated at the anode, while copper is deposited at the cathode, thus forming the desired electroplated layer on the PCB substrate.

[0003] However, a key technical challenge in the electroplating process lies in controlling the uniformity of the plating layer. As the current travels from the anode to the cathode, the electric field lines diverge, leading to increased plating thickness at the edges of the PCB substrate. To address this issue, a common method is to adjust the spacing between the PCB substrates to approximately 10 millimeters. This spacing allows the diverging electric field lines to be conducted to the other PCB substrate, thus preventing excessively thick plating at the edges.

[0004] However, when the PCB substrate is thin and needs to flow during the electroplating process, a frame must be used for support. This results in an increased spacing between the PCB substrates, making it impossible to adjust to the ideal 10 mm, which in turn leads to a thicker plating layer at the edges of the PCB substrate during electroplating. Currently, such as Figure 1 As shown, a common treatment method is to provide side openings 110 on the electroplated product frame 100 to allow copper to deposit on the frame, thereby mitigating the problem of concentrated edge electric field lines. The frame is typically made of stainless steel and coated with a Teflon coating to prevent surface conductivity.

[0005] While this method of creating openings in the frame can improve the uniformity of electroplating to some extent, it also introduces new problems. The electroplating solution can easily penetrate into the gaps between the Teflon coating and the stainless steel, which can reduce the coating's lifespan and may even lead to coating failure, thus affecting the stability of the electroplating process and the electroplating quality of the PCB substrate.

[0006] Therefore, how to extend the service life of the frame coating while ensuring the uniformity of electroplating has become an urgent problem to be solved in the field of PCB substrate electroplating technology. Utility Model Content

[0007] To overcome or mitigate the shortcomings of the prior art, one objective of this application is to provide a frame for electroplating PCB substrates. By providing auxiliary cathodes on both sides of the frame to absorb electric field lines at the edges, electroplating uniformity is achieved, and the service life of the coating is extended.

[0008] To achieve the above-mentioned objectives, the present application may adopt the following technical solutions.

[0009] This application provides a PCB substrate electroplating product frame, which includes:

[0010] The rectangular frame is formed by connecting four borders, and its center has a hollow structure that runs through the thickness direction to reduce the flow resistance of the electroplating solution.

[0011] The left and right frames are symmetrically arranged; the inner surfaces of the left and right frames are respectively connected to auxiliary cathodes extending in the vertical direction. In the transverse direction of the PCB substrate electroplating product frame, most of the area of ​​the auxiliary cathode in the length direction is separated from the left or right frame on its outer side.

[0012] The bottom crossbeam is horizontally connected to the bottom of the left and right frames, forming a rectangular accommodating space together with the bottom frame of the rectangular frame for placing the PCB substrate.

[0013] The surfaces of the left frame, right frame, and bottom crossbeam are all covered with an insulating coating.

[0014] In at least one embodiment, the left border includes a left inner border and a left outer border, the left inner border being disposed above the left outer border, and the left inner border and the left outer border at least partially overlap.

[0015] The right border includes an inner right border and an outer right border. The inner right border is positioned above the outer right border, and the inner right border and the outer right border at least partially overlap.

[0016] In at least one embodiment, the auxiliary cathode includes a U-shaped stainless steel strip, the open end of which is welded and fixed to the inner side of the left and right outer frames.

[0017] In at least one embodiment, the length of the U-shaped stainless steel strip is greater than or equal to the length of the PCB substrate, the width is 2-20 mm, and the thickness is 1-5 mm.

[0018] In at least one embodiment, the insulating coating is a Teflon coating with a thickness of 0.3 to 0.8 mm; the upper edge of the area covered by the Teflon coating is 5-10 mm above the bottom edge of the rectangular frame.

[0019] In at least one embodiment, a plurality of T-shaped electrical clips are also included, which are equally spaced and mounted on the rectangular frame and the bottom crossbeam by screws for fixing the PCB substrate.

[0020] In at least one embodiment, the left inner frame and the right inner frame are provided with height adjustment holes and are detachably connected to the rectangular frame by bolts to accommodate PCB substrates of different heights.

[0021] In at least one embodiment, a power-gathering component is provided at the top of the rectangular frame. The power-gathering component includes two sets of symmetrically distributed conductive plates, each set of conductive plates having a cathode cable for connecting to an external power source.

[0022] In at least one embodiment, the rectangular frame, left border, right border, auxiliary cathode, and bottom crossbeam are all made of stainless steel.

[0023] In at least one embodiment, in the transverse direction of the PCB substrate electroplating product frame, the distance between the middle area of ​​the auxiliary cathode (excluding the two ends) and its outer left or right frame is 5-10 mm.

[0024] By adopting the above technical solution, this application provides a PCB substrate electroplating product frame. Auxiliary cathodes are provided on both sides of the PCB substrate electroplating product frame. These auxiliary cathodes can absorb electric field lines at the edges, resulting in better electroplating uniformity of the PCB substrate during electroplating, and further extending the service life of the coating on the PCB substrate product frame. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of a PCB substrate electroplating product frame in the prior art;

[0026] Figure 2 This is a schematic diagram of the structure of a PCB substrate electroplating product frame according to an embodiment of this application;

[0027] Figure 3 This is a schematic diagram of the structure of a PCB substrate electroplating product frame using an embodiment of this application;

[0028] Figure 4 This is a top view schematic diagram of the circuit of a PCB substrate electroplating product frame in an embodiment without the use of an auxiliary cathode;

[0029] Figure 5 This is a top view schematic diagram of a PCB substrate electroplating product frame using an embodiment of this application;

[0030] Explanation of reference numerals in the attached figures

[0031] 10. Rectangular frame;

[0032] 11 Power extraction assembly; 12 Cathode cable;

[0033] 20 left border;

[0034] 21. Left inner frame; 210. Adjustment hole; 22. Left outer frame;

[0035] 30. Right side frame;

[0036] 31 Right inner frame; 310 Adjustment hole; 32 Right outer frame;

[0037] 40 Auxiliary cathode;

[0038] 50 Bottom crossbeam;

[0039] 60 Teflon coating;

[0040] 70 T-type electric clamp;

[0041] 80 bolts;

[0042] 100 Electroplated product frame; 110 Side opening;

[0043] 200 Anode;

[0044] 300 cathode Detailed Implementation

[0045] Exemplary embodiments of this application are described below with reference to the accompanying drawings. It should be understood that these specific descriptions are for teaching those skilled in the art how to implement this application only, and are not intended to exhaust all possible methods of this application, nor to limit the scope of this application.

[0046] The present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0047] like Figure 2 As shown, an embodiment of this application provides a PCB substrate electroplating product frame, which may include a rectangular frame 10, a symmetrically arranged left frame 20 and right frame 30, an auxiliary cathode 40 and a bottom crossbeam 50.

[0048] In this embodiment, the rectangular frame 10 can be formed by welding four side edges, and its central area has a hollow structure with a through-thickness to reduce the flow resistance of the electroplating solution.

[0049] The rectangular frame 10 may have a symmetrically arranged left border 20 and right border 30 at its bottom. Furthermore, the lower ends of the left border 20 and right border 30 can be horizontally connected by a bottom crossbeam 50. In this way, the lower border, left border 20, right border 30 and bottom crossbeam 50 of the rectangular frame 10 can together form a rectangular accommodating space, which can be used to place the PCB substrate to be electroplated.

[0050] Furthermore, the rectangular frame 10, left side frame 20, right side frame 30, and bottom crossbeam 50 can all be made of stainless steel. The product frame provided in this application is made of stainless steel because stainless steel has excellent corrosion resistance and high-temperature resistance, ensuring it is not easily damaged during electroplating, and it also has a certain rigidity to withstand large loads, while being easy to clean and maintain.

[0051] Furthermore, the product frame provided in this application is made of stainless steel, which can provide stable support in the electroplating solution, so that the PCB substrate remains stable during the electroplating process, thereby reducing the direct impact and potential damage of the electroplating solution on the PCB substrate.

[0052] Preferably, in this embodiment, the stainless steel used for the product frame can be 304 stainless steel.

[0053] Furthermore, such as Figure 2 As shown, in this embodiment, the left border 20 may include a left inner border 21 and a left outer border 22. The left inner border 21 is disposed above the left outer border 22, and the lower part of the left inner border 21 and the upper part of the left outer border 22 may partially overlap.

[0054] In this embodiment, the right frame 30 may also have the same structure. Specifically, the right frame 30 may include a right inner frame 31 and a right outer frame 32. The right inner frame 31 is located above the right outer frame 32, and the lower part of the right inner frame 31 and the upper part of the right outer frame 32 may partially overlap.

[0055] Furthermore, the left frame 20 and the right frame 30 can be formed by integral machining.

[0056] like Figure 2 As shown, in this embodiment, the left inner frame 21 and the right inner frame 31 may also be provided with height adjustment holes 210 and 310. Simultaneously, the left inner frame 21 and the right inner frame 31 can be detachably connected to the rectangular frame 10 via bolts 80. In this way, the PCB substrate electroplating product frame can adapt to PCB substrates of different heights, making the product frame highly versatile.

[0057] Furthermore, the left frame 20 and the right frame 30 can also use their own weight and, in conjunction with the adjustment device (i.e., bolt 80), to longitudinally stretch the PCB substrate to be electroplated, ensuring the flatness of the PCB substrate surface and preparing it for subsequent electroplating.

[0058] like Figure 2 As shown, in this embodiment, auxiliary cathodes 40 extending vertically are welded to the inner surfaces of the left outer frame 22 and the right outer frame 32, respectively. Specifically, the auxiliary cathode 40 can be strip-shaped, and its length can be greater than or equal to the length of the PCB substrate, and its width (i.e., ...) can be... Figure 2 The left-right direction can be 2-20 mm, and the thickness (i.e., perpendicular to) Figure 2 The direction can be 1-5 millimeters.

[0059] Preferably, in this embodiment, the auxiliary cathode 40 has a length of 617 mm, a width of 2 mm, and a thickness of 3 mm.

[0060] Furthermore, in this embodiment, the auxiliary cathode 40 can be a U-shaped stainless steel strip. The upper and lower ends of the U-shaped stainless steel strip can be fixed to the inner sides of the left outer frame 22 and the right outer frame 32 respectively by welding. That is, the open end of the U-shaped stainless steel strip faces the inner side of the left frame 20 and the right frame 30.

[0061] like Figure 2 As shown, in this embodiment, in the horizontal direction of the PCB substrate electroplating product frame (i.e. Figure 3 Along the left-right direction, most of the length of the auxiliary cathode 40 is separated from its outer left frame 20 or right frame 30. It is understood that there is a certain gap between the U-shaped stainless steel strip and the inner surfaces of the left outer frame 22 and right outer frame 32. This gap helps prevent plating solution residue from remaining in the area where the auxiliary cathode 40 is close to the left outer frame 22 or right outer frame 32, and also facilitates the stripping of copper metal during the electroplating process.

[0062] Furthermore, the distance between the middle area of ​​the U-shaped stainless steel strip, excluding the two ends, and the inner surface of the left outer frame 22 and the right outer frame 32 can be 5-10 mm.

[0063] Preferably, in this embodiment, the distance between the U-shaped stainless steel strip and the inner surface of the left outer frame 22 or the right outer frame 32 is 5 mm.

[0064] Furthermore, such as Figure 2 As shown, the surfaces of the left frame 20, the right frame 30, and the bottom crossbeam 50 can all be provided with an insulating coating, such as a Teflon coating 60. The Teflon coating 60, as an insulating material, can prevent current from flowing across the surface of the PCB substrate electroplating product frame, thereby ensuring that the current is concentrated on the PCB substrate during the electroplating process, thus improving the uniformity of the PCB substrate plating.

[0065] In this embodiment, the upper edge of the area covered by the Teflon coating 60 is 5-10 mm higher than the bottom edge of the rectangular frame 10. It is understood that the left inner frame 21 and the right inner frame 31 can be partially coated with the Teflon coating 60. This is because during electroplating, only the area below the rectangular frame 10 where the PCB substrate is placed is immersed in the electroplating solution; therefore, the upper part of the product frame can be partially covered with the Teflon coating 60.

[0066] Furthermore, in this embodiment, the thickness of the Teflon coating 60 can be 0.3 to 0.8 mm, for example, 0.5 mm.

[0067] like Figure 2 and Figure 3 As shown, the product frame provided in this application may also include multiple T-shaped electrical clips 70 for fixing the PCB substrate, ensuring that the PCB substrate will not move or fall off during the electroplating process, thereby guaranteeing the uniformity and quality of electroplating. Simultaneously, the T-shaped electrical clips 70 can form an electrical connection with the PCB substrate to transmit current. Specifically, the T-shaped electrical clips 70 can be installed at equal intervals on the lower edge and bottom crossbeam 50 of the rectangular frame 10.

[0068] Preferably, in this embodiment, the number of T-shaped electric clamps 70 is 6.

[0069] Furthermore, the T-shaped electric clamp 70 can be fixedly connected to the lower edge of the rectangular frame 10 and the bottom crossbeam 50 by screws.

[0070] like Figure 2 As shown, in this embodiment, the top of the rectangular frame 10 may be provided with a power-collecting component 11, which may include two symmetrically distributed sets of stainless steel sheets. Each set of stainless steel sheets may also be provided with a cathode cable 12 for connecting to an external power source.

[0071] Figure 4 The diagram shows a top view of the circuitry of a PCB substrate electroplating product frame during electroplating when no auxiliary cathode is used. Figure 5 The diagram shows a top view of the circuitry of a PCB substrate electroplating product frame during electroplating when using an auxiliary cathode.

[0072] like Figure 4 As shown, during the electroplating process, the anode 200 can be a titanium mesh, while the cathode 300 is the PCB substrate to be electroplated. The electric field lines (indicated by the dashed arrows in the diagram) are directionally distributed from the anode to the cathode. When no auxiliary cathode is provided, due to the edge effect, a highly dense distribution of electric field lines (i.e., current density significantly higher than in the central region) will form at both ends of the cathode, resulting in an abnormally increased plating thickness at the edge of the PCB substrate.

[0073] like Figure 5 As shown, by welding a U-shaped stainless steel strip to the PCB substrate electroplating product frame to assist the cathode 40, this structure can preferentially adsorb excess electric lines in the edge area, thereby adjusting the current density distribution gradient on the cathode surface, ultimately improving the uniformity of the overall electroplating layer thickness of the PCB substrate, effectively solving the problem of edge thickening in traditional electroplating processes.

[0074] This application provides a PCB substrate electroplating product frame. By welding conductive auxiliary cathodes 40 to both sides of the frame, the electric field lines at the edges are effectively absorbed, thereby achieving uniform electroplating. Compared to the traditional open-hole design, the welding fixing method not only ensures a reliable conductive connection between the auxiliary cathodes 40 and the product frame, but also avoids the risk of coating peeling caused by openings in the Teflon coating 60 surface. In one example, this extends the coating's lifespan from six months to two years, thereby further reducing production costs.

Claims

1. A frame for electroplating products on a PCB substrate, characterized in that, include: The rectangular frame is formed by connecting four borders, and its center has a hollow structure that runs through the thickness direction to reduce the flow resistance of the electroplating solution. A symmetrically arranged left and right frame; the inner surfaces of the left and right frames are respectively connected to auxiliary cathodes extending in the vertical direction. In the transverse direction of the PCB substrate electroplating product frame, most of the area of ​​the auxiliary cathode in the length direction is separated from the left or right frame on its outer side. The bottom crossbeam is horizontally connected to the bottom of the left and right side frames, and together with the bottom frame of the rectangular frame, forms a rectangular accommodating space for placing the PCB substrate. The surfaces of the left frame, the right frame, and the bottom crossbeam are all covered with an insulating coating.

2. The PCB substrate electroplating product frame according to claim 1, characterized in that, The left border includes a left inner border and a left outer border, the left inner border is located above the left outer border, and the left inner border and the left outer border at least partially overlap; The right side frame includes an inner right frame and an outer right frame. The inner right frame is positioned above the outer right frame, and the inner right frame and the outer right frame at least partially overlap.

3. The PCB substrate electroplating product frame according to claim 2, characterized in that, The auxiliary cathode includes a U-shaped stainless steel strip, the open end of which is welded and fixed to the inner side of the left outer frame and the right outer frame.

4. The PCB substrate electroplating product frame according to claim 3, characterized in that, The length of the U-shaped stainless steel strip is greater than or equal to the length of the PCB substrate, the width is 2-20 mm, and the thickness is 1-5 mm.

5. The PCB substrate electroplating product frame according to claim 1, characterized in that, The insulating coating is a Teflon coating with a thickness of 0.3 to 0.8 mm; the upper edge of the area covered by the Teflon coating is 5-10 mm higher than the bottom of the rectangular frame.

6. The PCB substrate electroplating product frame according to claim 1, characterized in that, It also includes multiple T-shaped electrical clips, which are installed at equal intervals on the rectangular frame and the bottom crossbeam by screws to fix the PCB substrate.

7. The PCB substrate electroplating product frame according to claim 2, characterized in that, The left inner frame and the right inner frame are provided with height adjustment holes and can be detachably connected to the rectangular frame by bolts to accommodate PCB substrates of different heights.

8. The PCB substrate electroplating product frame according to claim 1, characterized in that, The top of the rectangular frame is provided with a power-gathering component, which includes two symmetrically distributed sets of conductive plates. Each set of conductive plates is provided with a cathode cable for connecting to an external power source.

9. The PCB substrate electroplating product frame according to any one of claims 1-8, characterized in that: The rectangular frame, left side frame, right side frame, auxiliary cathode, and bottom crossbeam are all made of stainless steel.

10. The PCB substrate electroplating product frame according to any one of claims 1-8, characterized in that: In the transverse direction of the PCB substrate electroplating product frame, the distance between the middle area of ​​the auxiliary cathode (excluding the two ends) and its outer left or right frame is 5-10 mm.

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