Strain gauge pasting device

Abstract

The utility model discloses a strain gauge pasting device which comprises a positioning base and a pasting mechanism, the positioning base is used for being installed on a tested piece and positioning the installation position of a strain gauge, and a through hole is formed in the positioning base; the pasting mechanism is used for being inserted into the through hole and guiding to move in the length direction of the through hole. The pasting mechanism comprises a negative pressure assembly used for adsorbing and releasing the strain gauges through negative pressure, a wire storage assembly used for restraining and releasing wires of the strain gauges and a pressing assembly used for pressing and pasting the strain gauges on the negative pressure assembly to a tested piece, and the negative pressure assembly and the wire storage assembly are both installed on the pressing assembly. According to the device, the strain gauges can be pasted according to the sequence of first positioning and then glue dripping, waiting is not needed after glue dripping, the problem that glue is solidified in advance or slides off is prevented, and the pasting firmness and efficiency of the strain gauges are effectively improved. And the device can be used for collecting wires of the strain gauges, so that the wires are prevented from interfering with pasting operation, and the pasting quality of the strain gauges is improved.

Description

Technical Field

[0001] This utility model relates to the field of strain gauge fixing technology, and in particular, to a strain gauge bonding device. Background Technology

[0002] As a traditional strain measurement element, strain gauges have many advantages such as high measurement sensitivity and accuracy, wide measurement range, good frequency response, and the ability to measure in various complex environments. They are widely used in fields such as national defense, machinery, civil engineering, and automobiles for measurement and analysis. The bonding technology of strain gauges is a key step in ensuring the accuracy of test results.

[0003] In traditional techniques, strain gauge bonding involves an operator pre-marking a line at the center of the test piece's surface, then attaching the strain gauge to the surface using adhesive according to the marked line. Before the adhesive hardens, the strain gauge is manually pressed for a period to ensure bonding quality. However, strain gauges are lightweight and small, making manual positioning difficult, and manual bonding suffers from large positioning errors and low efficiency. Patent CN113513519A describes a strain gauge bonding device, including an adjustment component and a bonding component. The adjustment component includes an adjustment cylinder, a rotating component disposed within the adjustment cylinder, and a pressing column connected to the rotating component. The bonding component includes a connecting end cap connected to one end of the pressing column and a rubber sheet connected to the connecting end cap. While this device improves the bonding efficiency of strain gauges compared to manual pressing and can accurately measure the pressing load using a force measuring device to ensure the pressing effect, its limitations are not fully addressed. However, this patent uses a method of applying adhesive first and then positioning it for the strain gauge, which results in a long positioning time for the adhesive. This can lead to problems such as premature curing or adhesive slippage, causing the strain gauge to not adhere firmly. In addition, the strain gauge wires can interfere with the adhesion process, easily causing damage to the wires and resulting in poor adhesion quality or failure of the strain gauge, affecting the measurement results. Utility Model Content

[0004] This invention provides a strain gauge bonding device to solve the technical problems of strain gauges not being bonded firmly and strain gauge wires interfering with the bonding operation of strain gauges in the prior art.

[0005] According to one aspect of the present invention, a strain gauge bonding device is provided, comprising: a positioning base for mounting on a test specimen and positioning the installation position of the strain gauge, wherein a through hole is provided in the positioning base;

[0006] The adhesive bonding mechanism is used to insert into the through hole and guide its movement along the length of the through hole. The adhesive bonding mechanism includes a negative pressure component for adsorbing and releasing the strain gauge by negative pressure, a wire storage component for constraining and releasing the wire of the strain gauge, and a pressing component for pressing and bonding the strain gauge on the negative pressure component to the test piece. The negative pressure component and the wire storage component are both mounted on the pressing component.

[0007] Furthermore, the positioning base includes a fixing block for fixing to the test piece and a positioning block connected to the fixing block. The positioning block has a receiving groove at one end away from the fixing block that communicates with the through hole and allows the pasting mechanism to rotate.

[0008] The positioning block has a first U-shaped groove on both sides to prevent the pressing component from rotating inside the positioning block and a second U-shaped groove to allow the pressing component to rotate. The first U-shaped groove and the second U-shaped groove extend along the length of the through hole and are connected to each other. The second U-shaped groove is provided in the receiving groove and the first U-shaped groove is provided in the through hole.

[0009] Furthermore, an elastic component for supporting the pressing component is installed in the first U-shaped groove. The elastic component includes a spring arranged along the length of the first U-shaped groove and a slider that is movably inserted in the first U-shaped groove. The spring is used to apply an elastic force to the slider in the direction toward the second U-shaped groove.

[0010] Furthermore, the pressing assembly includes a pressing block that is movably inserted into the through hole of the positioning base, a rotating rod fixed to both ends of the pressing block, and a pressing frame for pressing the pressing block. The rotating rod is movably inserted into the first U-shaped groove or the second U-shaped groove.

[0011] The rotating rod is provided with an anti-rotation groove to limit the rotation of the rotating rod within the first U-shaped groove.

[0012] Furthermore, the pressure frame includes a pressure plate for pressing the pressure block and a push rod fixed to the pressure plate, and a first slot for accommodating the pressure plate is provided in the pressure block.

[0013] Furthermore, the negative pressure assembly includes an airbag mounted on the rotating rod, an adsorption plate mounted on the working surface of the pressure block, and a conduit communicating with the airbag and the adsorption plate. The adsorption plate has an air guide hole communicating with the conduit.

[0014] The conduit is installed inside the rotating rod and / or pressure block.

[0015] Furthermore, the wire storage assembly includes a wire storage box for placing the wires of the strain gauge, a cover plate for closing the wire storage box, a latch plate that is slidably fastened to the cover plate, and a lever for controlling the movement of the latch plate on the cover plate. The wire storage box is mounted on the pressure block, and the end of the cover plate away from the adsorption plate is used to pop open relative to the wire storage box and expose the inner cavity of the wire storage box after being detached from the latch plate.

[0016] The positioning block has a sliding groove, and the lever extends out from the sliding groove and moves in cooperation with the sliding groove.

[0017] Furthermore, the end face of the adsorption plate away from the pressure block is set as an inclined structure, and the thickness of the end of the adsorption plate near the storage wire assembly is greater than the thickness of the end of the adsorption plate away from the storage wire assembly.

[0018] Furthermore, a second slot is provided on the pressure block for accommodating the adsorption plate, and the thickness of the adsorption plate is greater than the depth of the second slot.

[0019] Furthermore, an anti-stick coating is provided on the end face of the adsorption plate away from the pressure block.

[0020] This utility model has the following beneficial effects:

[0021] This utility model discloses a strain gauge bonding device. The device uses a positioning base to locate the strain gauge and fix it to the test piece, significantly reducing positioning time and improving work efficiency. It ensures the positioning base remains in an accurate position throughout the bonding process, achieving precise positioning of the strain gauge's location and direction. This also avoids positioning misalignment caused by rapid pressing after adhesive application, guaranteeing accurate test results. By movably mounting the bonding mechanism within the through-hole of the positioning base and rotatably engaging with it, the bonding mechanism can stably adsorb the strain gauge using a negative pressure component and press it onto the test piece using a pressing component. This allows the strain gauge to be stably pushed to its designated positioning area within the positioning base for accurate bonding. Compared to manual bonding, this method improves bonding efficiency and avoids damage or dropping of the strain gauge caused by handling it manually, effectively enhancing bonding quality and adhesion strength. Meanwhile, the bonding mechanism can retract the wires of the strain gauges adsorbed on the negative pressure component through the wire storage assembly, preventing the wires from interfering with the bonding operation of the strain gauges, avoiding damage to the strain gauges, and ensuring the bonding quality. This device first positions the strain gauges using the positioning base, then adsorbs the strain gauges through the bonding device, applies adhesive to the strain gauges, and presses the adhesive-coated strain gauges onto the test specimen for bonding. This sequence of positioning followed by adhesive application not only ensures accurate strain gauge positioning but also allows for direct pressing and bonding of the adhesive-coated strain gauges without waiting for positioning time, preventing premature adhesive curing or slippage, effectively improving the bonding strength and efficiency. This strain gauge bonding device is simple to operate, saves time and effort, and is highly practical.

[0022] In addition to the objectives, features, and advantages described above, this utility model has other objectives, features, and advantages. The present utility model will now be described in further detail with reference to the figures. Attached Figure Description

[0023] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0024] Figure 1 This is a schematic diagram of the strain gauge bonding device according to a preferred embodiment of the present invention;

[0025] Figure 2 This is a schematic diagram of the positioning base of the strain gauge bonding device according to a preferred embodiment of the present invention;

[0026] Figure 3 This is a cross-sectional view of the positioning base of the strain gauge bonding device according to a preferred embodiment of the present invention. Figure 1 ;

[0027] Figure 4 This is a cross-sectional view of the positioning base of the strain gauge bonding device according to a preferred embodiment of the present invention. Figure 2 ;

[0028] Figure 5 This is a schematic diagram of the bonding mechanism of the strain gauge bonding device according to a preferred embodiment of the present invention;

[0029] Figure 6 This is an exploded view of the bonding mechanism of the strain gauge bonding device according to a preferred embodiment of the present invention;

[0030] Figure 7 This is a cross-sectional view of the bonding mechanism of the strain gauge bonding device according to a preferred embodiment of the present invention.

[0031] Legend:

[0032] 10. Positioning base; 11. Fixing block; 12. Positioning block; 121. Positioning line; 122. First U-shaped groove; 123. Second U-shaped groove; 124. Slide groove; 125. Spring; 126. Slider; 20. Negative pressure assembly; 201. Airbag; 202. Adsorption plate; 2021. Air duct; 203. Conduit; 30. Wire storage assembly; 301. Wire storage box; 302. Cover plate; 303. Buckle plate; 304. Toggle lever; 40. Pressing assembly; 401. Pressure block; 4011. First slot; 4012. Second slot; 402. Rotating rod; 4021. Anti-rotation groove; 4022. Toggle piece; 403. Pressure frame; 4031. Pressure plate; 4032. Push rod. Detailed Implementation

[0033] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, the present invention can be implemented in many different ways as defined and covered below.

[0034] like Figure 1 As shown, the strain gauge bonding device of this embodiment includes a positioning base 10 and a bonding mechanism. The positioning base 10 is used to install on the test piece and position the strain gauge. A through hole is provided in the positioning base 10. The bonding mechanism is inserted into the through hole and guided along the length of the through hole to attract and adhere the strain gauge, pressing and bonding it to the test piece. Positioning the strain gauge using the positioning base 10 significantly reduces positioning time and improves work efficiency compared to manual positioning. It also ensures that the positioning base 10 remains in an accurate position throughout the bonding process, achieving precise positioning of the strain gauge's bonding position and direction. Furthermore, it avoids positioning offset caused by rapid pressing after applying adhesive to the strain gauge, ensuring the accuracy of the test results. Preferably, for magnetically conductive test pieces, the positioning base 10 can be fixed to the test piece via magnetic attraction. Optionally, for non-magnetically conductive test pieces, the positioning base can use a suction cup to fix it to the test piece.

[0035] like Figure 1 As shown, the bonding mechanism includes a negative pressure component 20 for adsorbing and releasing the strain gauge through negative pressure, a wire storage component 30 for accommodating and releasing the wires of the strain gauge, and a pressing component 40 for pressing and bonding the strain gauge on the negative pressure component 20 to the test piece. Both the negative pressure component 20 and the wire storage component 30 are mounted on the pressing component 40, and both are located on the same side of the pressing component 40. The pressing component 40 is movably inserted into the through hole of the positioning base 10 and rotatably engaged with the positioning base 10. Preferably, the pressing component 40 can be guided to move along the length of the through hole and can be flipped within the through hole. Optionally, the pressing component 40 can also be flipped outside the through hole. Therefore, the bonding mechanism can stably adsorb the strain gauge through the negative pressure component 20 and press the strain gauge adsorbed on the negative pressure component 20 onto the test piece through the pressing component 40. This allows the strain gauge to be stably pushed into the positioning area of ​​the strain gauge within the positioning base 10 for accurate bonding. Compared with manual bonding, this improves the bonding efficiency of the strain gauge and avoids damage or dropping of the strain gauge caused by handling it by hand, effectively improving the bonding quality and firmness. At the same time, the bonding mechanism can use the wire storage component 30 to retract the wires of the strain gauge adsorbed on the negative pressure component 20, preventing the wires from interfering with the bonding operation, avoiding damage to the strain gauge, and ensuring the bonding quality of the strain gauge.

[0036] In use, first mark the position where the strain gauge will be pasted on the test piece. Then, align the positioning base 10 with the mark on the test piece and fix the positioning base 10 on the test piece. Next, rotate the pressing component 40 so that the negative pressure component 20 and the wire storage component 30 face outwards from the positioning base. Then, place the strain gauge on the negative pressure component 20 and store the strain gauge wire in the wire storage component 30. Operate the negative pressure component 20 to adsorb the strain gauge through the generated negative pressure. Then, apply adhesive to the surface of the strain gauge that is stably adsorbed on the negative pressure component 20. Rotate the pressing component 40 again so that the strain gauge after applying adhesive faces the test piece. Control the pressing component 40 to move the strain gauge toward the test piece until the strain gauge is pasted at the strain gauge positioning position on the test piece, thus completing the strain gauge pasting. The device first positions the strain gauge using the positioning base 10, then uses an adhesive device to adsorb the strain gauge, applies adhesive to it, and presses the adhesive-coated strain gauge onto the test piece for adhesion. By adhering the strain gauges in the order of positioning followed by adhesive application, the device not only ensures accurate strain gauge positioning but also allows for direct pressing and adhesion of the adhesive-coated strain gauges without waiting for positioning time, preventing premature curing or slippage of the adhesive. This effectively improves the adhesion strength and efficiency of the strain gauges.

[0037] like Figure 1 and Figure 2 As shown, the positioning base 10 includes a fixing block 11 and a positioning block 12 fixed on the fixing block 11. The fixing block 11 is used to contact and fix itself to the test piece. The positioning block 12 is engraved with positioning lines 121 corresponding to the installation positions of strain gauges on the test piece, so as to achieve accurate positioning of the strain gauges at the bonding positions through the positioning lines 121. Optionally, the fixing block 11 is also marked with positioning lines 121. Preferably, in this embodiment, the fixing block 11 is a magnetic body, which magnetically attracts the magnetically conductive test piece through magnetic force. Preferably, the area of ​​the magnetic fixing block 11 is the same as the area of ​​the end face of the positioning block 12 near the fixing block 11, so as to align the positioning lines 121 on the positioning block 12 with the cross marks on the test piece. Optionally, for non-magnetically conductive test pieces, the fixing block 11 can also be a suction cup, which is fixed to the test piece by suction force; optionally, the area of ​​the suction cup is larger than the area of ​​the end face of the positioning block 12 near the suction cup. In use, draw a cross mark at the installation position of the strain gauge on the test piece, attach the fixing block 11 to the surface of the test piece, and align the positioning line 121 on the positioning block 12 with the cross mark on the test piece to complete the positioning of the positioning base 10. Compared with manual positioning, it saves time and effort, is more convenient and faster, and the positioning is more accurate.

[0038] like Figures 1 to 4As shown, a through hole is provided in the fixing block 11, and a receiving groove is provided at the end of the positioning block 12 away from the fixing block 11, which communicates with the through hole and allows the pasting mechanism to rotate. U-shaped grooves with openings facing away from the fixing block 11 are symmetrically provided on both sides of the positioning block 12. The U-shaped grooves include a first U-shaped groove 122 and a second U-shaped groove 123 sequentially opened along the direction away from the fixing block 11. Both the first U-shaped groove 122 and the second U-shaped groove 123 extend along the length of the through hole and are interconnected. The second U-shaped groove 123 corresponds to the receiving groove, and the first U-shaped groove 122 corresponds to the through hole. The pressing component 40 slides along its length through the first U-shaped groove 122 and is limited by the side end of the first U-shaped groove 122, allowing the negative pressure component 20 to adsorb the strain gauge and then slide stably with the pressing component 40 to the test piece for strain gauge pasting. The width of the second U-shaped groove 123 is greater than the width of the first U-shaped groove 122. The receiving groove corresponds to and communicates with the second U-shaped groove 123, so that the pressing component 40 placed in the second U-shaped groove 123 can rotate within the receiving groove, facilitating the negative pressure component 20 to perform strain gauge adsorption. In use, the pressing component 40 is rotated so that the negative pressure component 20 faces the outside of the positioning block 12. Then, the strain gauge is placed on the adsorption surface of the negative pressure component 20, and the strain gauge is adsorbed by negative pressure through the negative pressure component 20. The strain gauge wire is tidied by the wire storage component 30. The pressing component 40 is rotated again so that the negative pressure component 20 faces the direction of the test piece, thereby controlling the pressing component 40 to move along the first U-shaped groove towards the test piece to adhere the strain gauge. Optionally, the pressing component 40 can also be directly removed from the positioning base 10 to the outside of the positioning base 10, and the pressing component 40 can be manually rotated to place and adsorb the strain gauge onto the negative pressure component 20.

[0039] like Figure 2 As shown, an elastic component is installed within the first U-shaped groove 122. This elastic component includes a spring 125 arranged along the length of the first U-shaped groove 122 and a slider 126 movably inserted within the first U-shaped groove 122. The spring 125 applies an elastic force to the slider 126 in the direction toward the second U-shaped groove 123. Specifically, in this embodiment, both ends of the spring 125 are fixedly connected to the positioning block 12 and the slider 126, respectively. The width of the slider 126 is not greater than the width of the first U-shaped groove, allowing it to movably insert within the groove and support the pressing component 40. Thus, the pressing component 40, placed on the slider 126, achieves stable support through the elastic force provided by the spring 125, ensuring stability during pressing and smoothly pushing the strain gauge to the accurate bonding position, effectively improving bonding quality.

[0040] like Figure 1 and Figure 5As shown, the pressing assembly 40 includes a pressing block 401, a rotating rod 402 fixed to both ends of the pressing block 401, and a pressing frame 403 for pressing the pressing block 401. The pressing block 401 is movably inserted into the through hole, and the rotating rod 402 is movably inserted into the first U-shaped groove 122 or the second U-shaped groove 123. Specifically, the rotating rod 402 is a cylinder, and the diameter of the rotating rod 402 is adapted to the width of the second U-shaped groove 123, so that the rotating rod 402 can rotate within the second U-shaped groove 123 to flip the pressing block 401. The diameter of the rotating rod 402 is larger than the width of the first U-shaped groove 122. Anti-rotation grooves 4021 are provided on both sides of the rotating rod 402. The distance between the two anti-rotation grooves 4021 is adapted to the width of the first U-shaped groove 122, so that the rotating rod 402 can be movably locked within the first U-shaped groove 122 through the anti-rotation grooves 4021 and is laterally limited by the first U-shaped groove 122, allowing the rotating rod 402 to slide only along its length within the first U-shaped groove 122. Preferably, the end of the rotating rod 402 away from the pressure block 401 extends from the positioning block 12, and a lever 4022 is fixed to the extended end of the rotating rod 402 for manual manipulation to rotate the rotating rod 402.

[0041] like Figure 1 As shown, the pressure frame 403 includes a pressure plate 4031 and a push rod 4032 fixed on the pressure plate 4031. One end of the pressure block 401 is provided with a first slot 4011. The size and shape of the first slot 4011 are adapted to the pressure plate 4031 so that the pressure plate 4031 can be engaged and limited with the pressure block 401 through the first slot 4011. This allows the pressure plate 4031 to apply a stable and uniform pushing force to the pressure block 401, ensuring that the pressure block 401 moves smoothly within the positioning base 10. This allows the strain gauge on the pressure block 401 to be accurately pressed onto the bonding position on the test piece.

[0042] like Figure 1 , Figure 6 and Figure 7As shown, the negative pressure assembly 20 includes an airbag 201 mounted on the rotating rod 402 and an adsorption plate 202 mounted on the working surface of the pressure block 401. The adsorption plate 202 has an air guide hole 2021, and the air guide hole 2021 and the airbag 201 are connected by a conduit 203, which is installed inside the rotating rod 402 and / or the pressure block 401. Specifically, the working surface is the end face of the pressure block 401 corresponding to the first slot 4011. When the positioning base 10 completes positioning and strain gauges need to be attached, the rotating rod 402 is first moved into the second U-shaped groove 123. The rotating rod 402 is then rotated so that the end of the pressure block 401 with the adsorption plate 202 faces outwards. The strain gauge is then placed on the adsorption plate 202, and the airbag 201 is pinched to generate negative pressure through the air guide hole 2021, thus adsorbing the strain gauge onto the adsorption plate 202. Adhesive is then applied to the surface of the strain gauge. The rotating rod 402 is rotated again... 02. Orient the adsorption plate 202 toward the test piece, then place the pressure plate 4031 into the first slot 4011 of the pressure block 401 and apply force to the pressure plate 4031. At this time, the rotating rod 402 is stably supported by the elastic component in the first U-shaped groove 122 and slides toward the test piece, so that the strain gauge on the pressure block 401 moves to the test piece for adhesion. Then, release the air bag 201 so that the negative pressure on the adsorption plate 202 is removed, and the strain gauge is detached from the adsorption plate 202.

[0043] like Figure 5 and Figure 6As shown, the wire storage assembly 30 includes a wire storage box 301, a cover plate 302, a latching plate 303, and a lever 304. The wire storage box 301 and the adsorption plate 202 are mounted on the same end of the pressure block 401, with the wire storage box 301 located on one side of the adsorption plate 202 to hold the wires of the strain gauges adsorbed on the adsorption plate 202. The end of the cover plate 302 away from the adsorption plate 202 is designed to spring open relative to the wire storage box 301 after being released from the latching plate 303, thus exposing the inner cavity of the wire storage box 301. Slide rails are provided on both sides of the wire storage box 301. The latching plate 303 covers the cover plate 302 and is movably engaged with the slide rails, so that the latching plate 303 can move along the slide rails to control the opening and closing of the cover plate 302. The positioning block 12 has a groove 124. A lever 304 extends from the groove 124 and engages with it to cooperate with the buckle plate 303. After the strain gauge is bonded to the test piece, the buckle plate 303 is moved to open the cover plate 302 and release the strain gauge wire. In use, after the strain gauge is adsorbed onto the adsorption plate 202, the strain gauge wire is placed in the wire storage box 301. Then, the buckle plate 303 can be manually controlled to slide so that the cover plate 302 closes the wire storage box 301, thereby constraining the wire and preventing it from interfering with the bonding of the strain gauge. After the strain gauge is attached to the test piece, the lever 304 is inserted from the groove 124 of the positioning block 12 into the buckle plate 303, and then the lever 304 is moved along the groove 124 to move the buckle plate 303 away from the strain gauge. At this time, the cover plate 302 pops open, the inner cavity of the wire storage box 301 is exposed, the wire is loosened and left on the test piece along with the strain gauge.

[0044] like Figure 6 As shown, a second slot 4012 is provided on the pressure block 401, and the adsorption plate 202 is snapped into the second slot 4012 and fixedly connected to the pressure block 401. Preferably, the adsorption plate 202 is a rubber plate, and the end of the adsorption plate 202 that contacts the pressure block 401 is fixed to the pressure block 401 by tape, double-sided tape, or glue. Optionally, the adsorption plate 202 can also be embedded or snapped into the second slot 4012. The thickness of the adsorption plate 202 is greater than the depth of the second slot 4012, so that the end of the adsorption plate 202 away from the pressure block 401 can protrude from the end face of the pressure block 401, forming an adsorption surface for adsorbing strain gauges.

[0045] like Figure 6As shown, the end face of the adsorption plate 202 away from the pressure block 401 is set as an inclined structure. The thickness of the end of the adsorption plate 202 near the wire storage box 301 is greater than the thickness of the end of the adsorption plate 202 away from the wire storage box 301, so that the end face of the adsorption plate 202 used to adsorb the strain gauge is an inclined plane with a small angle. When the strain gauge is pasted onto the test piece, the end of the adsorption plate 202 away from the wire storage box 301 and the end near the wire storage box 301 are brought into contact with the test piece in sequence. This allows air bubbles to be expelled from the strain gauge on the adsorption plate 202 during the pasting process, achieving complete adhesion with the test piece, improving the pasting quality of the strain gauge, and effectively enhancing the adhesion strength.

[0046] Preferably, the end face of the adsorption plate 202 away from the pressure block 401 is provided with an anti-stick coating. This coating serves two purposes: firstly, it prevents the strain gauge from sticking to the adsorption plate 202, allowing the strain gauge to be smoothly bonded to the test piece using adhesive after the negative pressure component 20 is closed and the strain gauge loses its adsorption force; secondly, the anti-stick coating prevents the adhesive on the strain gauge from overflowing at the edges and sticking to the adsorption plate 202, ensuring that the strain gauge is smoothly pushed from the adsorption plate 202 and adhered to the test piece. Preferably, the anti-stick coating is made of polytetrafluoroethylene (PTFE).

[0047] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A strain gauge bonding device, characterized in that, include: The positioning base (10) is used to install on the test piece and position the strain gauge. The positioning base (10) has a through hole. The adhesive mechanism is used to insert into the through hole and guide it to move along the length of the through hole. The adhesive mechanism includes a negative pressure component (20) for adsorbing and releasing the strain gauge by negative pressure, a wire storage component (30) for constraining and releasing the wire of the strain gauge, and a pressing component (40) for pressing and adhesiveling the strain gauge on the negative pressure component (20) to the test piece. The negative pressure component (20) and the wire storage component (30) are both mounted on the pressing component (40).

2. The strain gauge bonding device according to claim 1, characterized in that, The positioning base (10) includes a fixing block (11) for fixing to the test piece and a positioning block (12) connected to the fixing block (11). The positioning block (12) has a receiving groove at one end away from the fixing block (11) that communicates with the through hole and allows the pasting mechanism to rotate. The positioning block (12) has a first U-shaped groove (122) for preventing the pressing component (40) from rotating within the positioning block (12) and a second U-shaped groove (123) for allowing the pressing component (40) to rotate. The first U-shaped groove (122) and the second U-shaped groove (123) extend along the length of the through hole and are interconnected. The second U-shaped groove (123) corresponds to the receiving groove, and the first U-shaped groove (122) corresponds to the through hole.

3. The strain gauge bonding device according to claim 2, characterized in that, An elastic component for supporting the pressing component (40) is installed in the first U-shaped groove (122). The elastic component includes a spring (125) arranged along the length direction of the first U-shaped groove (122) and a slider (126) movably passing through the first U-shaped groove (122). The spring (125) is used to apply an elastic force to the slider (126) in the direction toward the second U-shaped groove (123).

4. The strain gauge bonding device according to claim 2, characterized in that, The pressing assembly (40) includes a pressing block (401) movably inserted into the through hole, a rotating rod (402) fixed to both ends of the pressing block (401), and a pressing frame (403) for pressing the pressing block (401). The rotating rod (402) is movably inserted into the first U-shaped groove (122) or the second U-shaped groove (123). The rotating rod (402) is provided with an anti-rotation groove (4021) to limit the rotation of the rotating rod (402) within the first U-shaped groove (122).

5. The strain gauge bonding device according to claim 4, characterized in that, The pressure frame (403) includes a pressure plate (4031) for pressing the pressure block (401) and a push rod (4032) fixed on the pressure plate (4031). The pressure block (401) has a first slot (4011) for accommodating the pressure plate (4031).

6. The strain gauge bonding device according to claim 4, characterized in that, The negative pressure assembly (20) includes an airbag (201) mounted on the rotating rod (402), an adsorption plate (202) mounted on the working surface of the pressure block (401), and a conduit (203) communicating with the airbag (201) and the adsorption plate (202). The adsorption plate (202) has an air guide hole (2021) communicating with the conduit (203). The conduit (203) is installed in the rotating rod (402) and / or the pressure block (401).

7. The strain gauge bonding device according to claim 6, characterized in that, The wire storage assembly (30) includes a wire storage box (301) for placing the wires of the strain gauge, a cover plate (302) for closing the wire storage box (301), a latch plate (303) that is slidably fastened to the cover plate (302), and a lever (304) for controlling the movement of the latch plate (303) on the cover plate (302). The wire storage box (301) is mounted on the pressure block (401). One end of the cover plate (302) away from the adsorption plate (202) is used to spring open relative to the wire storage box (301) after being detached from the latch plate (303) and expose the inner cavity of the wire storage box (301). The positioning block (12) has a sliding groove (124), and the lever (304) extends out from the sliding groove (124) and moves in cooperation with the sliding groove (124).

8. The strain gauge bonding device according to claim 6, characterized in that, The pressure block (401) has a second slot (4012) for accommodating the adsorption plate (202), and the thickness of the adsorption plate (202) is greater than the depth of the second slot (4012).

9. The strain gauge bonding device according to claim 6, characterized in that, The end face of the adsorption plate (202) away from the pressure block (401) is set as an inclined structure, and the thickness of the end of the adsorption plate (202) near the wire storage assembly (30) is greater than the thickness of the end of the adsorption plate (202) away from the wire storage assembly (30).

10. The strain gauge bonding device according to claim 6, characterized in that, The adsorption plate (202) has an anti-stick coating on the end face away from the pressure block (401).

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