Heat pump device and combined heat supply system

By introducing an auxiliary heat exchanger and bypass pipeline into the heat pump unit, selective heat exchange is achieved based on the temperature of the heat exchange medium, which solves the problem of low heat utilization rate of existing heat pump units and improves the thermal efficiency and safety of the combined heating system.

CN223869313UActive Publication Date: 2026-02-03GUANGDONG VANWARD ELECTRIC
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Patent Information

Application Number
CN202423313421.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-31
Publication Date
2026-02-03
Estimated Expiration
2034-12-31

AI Technical Summary

Technical Problem

In existing combined heating systems of heat pump devices and underfloor heating devices, the heat pump device has a low heat utilization rate of the heat exchange medium, resulting in insufficient overall thermal efficiency and safety.

Method used

A heat pump device is employed, comprising an inner tank, a heat pump assembly, and a heat exchange assembly. By installing an auxiliary heat exchanger and a bypass pipeline outside the inner tank, heat exchange is selectively performed according to the temperature of the heat exchange medium, thereby improving heat utilization efficiency. The heat exchange process is optimized by controlling valves and temperature sensing elements.

Benefits of technology

It improves the thermal efficiency of heat pump devices, enhances the safety and reliability of combined heating systems, reduces energy consumption, and extends the service life of heat pump devices.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model belongs to the technical field of heat supply, and particularly discloses a heat pump device and a combined heat supply system. The heat pump device comprises an inner container, a heat pump assembly and a heat exchange assembly. The heat pump assembly comprises a compressor, a main heat exchanger and a throttling device which are sequentially connected. The heat exchange assembly comprises a heat exchange inlet pipeline, an auxiliary heat exchanger, a communicating pipeline and a heat exchanger which are sequentially connected in the flowing direction of the heat exchange medium, the heat exchanger is located outside the inner container, and a first heat exchange channel of the heat exchanger is connected with the communicating pipeline; a second heat exchange channel of the heat exchanger is connected between an outlet of the throttling device and an inlet of the compressor in series. The auxiliary heat exchanger is located in the water storage cavity or surrounds the outer wall of the inner container, a bypass pipe is connected between the heat exchange inlet pipeline and the communicating pipeline, and the heat exchange inlet pipeline selectively communicates with the bypass pipe or the auxiliary heat exchanger. The heat utilization rate of the heat pump device and the combined heat supply system can be improved.
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Description

Technical Field

[0001] This utility model relates to the field of heating technology, and in particular to a heat pump device and a combined heating system. Background Technology

[0002] Hot water equipment is a common device that uses electricity, gas combustion heat, solar energy or other energy sources to heat water and supply it to the user. Based on the heating method, it is generally divided into electric water heaters, gas water heaters, solar water heaters or heat pump water heaters, etc.

[0003] The prior art provides a combined heating system, which includes a heat pump unit, a floor heating system, and a heat exchange component. The heat pump unit includes a water tank liner and a heat pump component. The heat pump component includes a compressor, a condenser, and a throttling device connected in sequence. The heat exchange component includes an inlet pipe, a plate heat exchanger, and an outlet pipe connected in series. The inlet pipe is connected to the supply pipe of the floor heating system, and the outlet pipe is connected to the return pipe of the heating system. Another heat exchange channel of the plate heat exchanger is connected in series between the inlet of the compressor and the throttling device.

[0004] Existing technologies provide combined heating systems for heat pumps and underfloor heating, which can heat the refrigerant returning to the compressor by exchanging heat between the underfloor heating water and the refrigerant at a plate heat exchanger. However, in existing combined heating systems, the heat pump component and the underfloor heating device only exchange heat at the plate heat exchanger, which limits the heat utilization rate of the underfloor heating water in the underfloor heating device and is not conducive to improving the overall thermal efficiency of the combined heating system. Utility Model Content

[0005] One of the technical problems solved by this utility model is to provide a heat pump device that can effectively solve the problem of low heat utilization rate of heat exchange medium in existing heat pump devices, and improve the heat utilization rate of heat pump devices.

[0006] The second technical problem solved by this utility model is to provide a combined heating system that can effectively solve the problem of low heat utilization rate of heat pump devices in existing combined heating systems, improve the heat utilization rate of the combined heating system, and enhance the safety and reliability of the combined heating system.

[0007] The first technical problem mentioned above is solved by the following technical solution:

[0008] A heat pump device, comprising:

[0009] The inner liner has a water storage cavity, a water inlet communicating with the water storage cavity, and a water outlet communicating with the water storage cavity;

[0010] A heat pump assembly includes a compressor, a main heat exchanger, and a throttling device connected in sequence, wherein the main heat exchanger is used to exchange heat with water in the water storage chamber;

[0011] The heat exchange assembly includes a heat exchange inlet pipe, an auxiliary heat exchanger, a connecting pipe, and a heat exchanger connected in sequence along the flow direction of the heat exchange medium. The heat exchanger is located outside the inner tank, and the first heat exchange channel of the heat exchanger is connected to the connecting pipe. The second heat exchange channel of the heat exchanger is connected in series between the outlet of the throttling device and the inlet of the compressor.

[0012] The auxiliary heat exchanger is located inside the water storage cavity or surrounds the outer wall of the inner tank. A bypass pipe is connected between the heat exchange inlet pipe and the connecting pipe. The bypass pipe is located on the outside of the inner tank. The heat exchange inlet pipe is selectively connected to the bypass pipe or the auxiliary heat exchanger.

[0013] Compared with the prior art, the control method of the heat pump device described in this utility model has the following advantages: When the heat pump device is used in a floor heating system, when the temperature of the floor heating water (heat exchange medium) is lower than or equal to the temperature of the water in the inner tank, the heat exchange inlet pipe is connected to the bypass pipe, and the floor heating water directly exchanges heat with the refrigerant through the heat exchanger; when the temperature of the floor heating water (heat exchange medium) is higher than the temperature of the water in the inner tank, the heat exchange inlet pipe is connected to the auxiliary heat exchanger, and the floor heating water can first enter the auxiliary heat exchanger and exchange heat with the water in the storage chamber through the auxiliary heat exchanger, so that the water in the storage chamber is heated, and then exchanges heat with the refrigerant through the heat exchanger, thereby better utilizing the heat of the heat exchange medium and improving the thermal efficiency of the heat pump device.

[0014] In one embodiment, the heat pump device further includes a three-way valve located outside the inner tank, with a first port connected to the heat exchange inlet pipe, a second port connected to the auxiliary heat exchanger, and a third port connected to the bypass pipe, wherein the first port is controlled to be connected to either the second or the third port.

[0015] In one embodiment, a first control valve is provided on the heat exchange inlet pipe. The first control valve is located between the junction of the bypass pipe and the heat exchange inlet pipe and the auxiliary heat exchanger. The first control valve is located outside the inner tank. The first control valve controls the on / off state of the heat exchange inlet pipe to the auxiliary heat exchanger.

[0016] A second control valve is provided on the bypass pipe, and the second control valve controls the opening and closing of the bypass pipe.

[0017] In one embodiment, the heat exchange assembly further includes a first filter, which is installed in the heat exchange inlet pipe or the connecting pipe.

[0018] In one embodiment, the heat pump assembly includes a second filter installed in the heat pump line and located upstream of the throttling device.

[0019] In one embodiment, the heat exchange inlet pipe is equipped with an inlet temperature detection element.

[0020] In one embodiment, the outlet end of the first heat exchange channel is connected to a heat exchange outlet pipe, and an outlet temperature detection element is provided on the heat exchange outlet pipe;

[0021] And / or, the outlet end of the first heat exchange channel is connected to a heat exchange outlet pipe, and a water pump is installed in the heat exchange outlet pipe or the heat exchange inlet pipe.

[0022] In one embodiment, the main heat exchanger is a microchannel heat exchanger coiled around the inner liner.

[0023] In one embodiment, an electric heating element is installed inside the inner liner.

[0024] The second technical problem mentioned above is solved by the following technical solution:

[0025] A combined heating system includes an underfloor heating device and a heat pump device as described above, wherein the inlet end of the heat exchange inlet pipe and the outlet end of the first heat exchange channel are respectively connected to the underfloor heating device.

[0026] Compared with the prior art, the combined heating system of this utility model has the following advantages: by adopting the above-mentioned heat pump device, the heat utilization rate of the combined heating system for underfloor heating can be improved, and the safety and reliability of the combined heating system can be improved. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the structure of a heat pump device provided in an embodiment of the present invention.

[0028] Label Explanation:

[0029] 1. Inner liner; 2. Compressor; 3. Main heat exchanger; 4. Throttling device; 5. Heat exchanger; 6. Water pump; 7. Auxiliary heat exchanger; 8. Three-way valve; 9. Switch valve; 10. Heating element; 20. Anode rod; 30. First filter; 40. Second filter; 50. Housing; 60. Controller; 70. Display screen; 80. Exhaust valve; 90. Pressure switch;

[0030] 101. Evaporation temperature sensor; 102. Inlet temperature sensor; 103. Outlet temperature sensor; 104. Exhaust temperature sensor; 105. Water tank temperature sensor;

[0031] 201. Heat pump piping; 202. Heat exchanger inlet piping; 203. Heat exchanger outlet piping; 204. Connecting piping; 205. Bypass piping; 206. Water tank inlet pipe; 207. Water tank outlet pipe. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0034] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0035] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0036] Example 1

[0037] like Figure 1 As shown, this embodiment provides a heat pump device that can be coupled with an external heating device to heat the water in the inner tank 1, thereby improving the reliability and service life of the heat pump device.

[0038] In this embodiment, the heat pump device includes an inner tank 1, a heat pump assembly, and a heat exchange assembly. The inner tank 1 has a water storage chamber, a cold water inlet communicating with the water storage chamber, and a hot water outlet communicating with the water storage chamber. The heat pump assembly includes a compressor 2, a main heat exchanger 3, and a throttling device 4 connected sequentially in a heat pump pipeline 201. The main heat exchanger 3 is used to heat the water in the water storage chamber. The heat exchange assembly includes a heat exchange inlet pipeline 202, an auxiliary heat exchanger 7, a connecting pipeline 204, and a heat exchanger 5 connected sequentially along the flow direction of the heat exchange medium. The heat exchanger 5 is located outside the inner tank 1. Furthermore, the first heat exchange channel of the heat exchanger 5 is connected to the connecting pipe 204, and the second heat exchange channel of the heat exchanger 5 is connected in series to the heat pump pipe 201 and located between the outlet of the throttling device 4 and the inlet of the compressor 2; the auxiliary heat exchanger 7 is located inside the water storage cavity or surrounds the outer wall of the inner tank 1, and a bypass pipe 205 is connected between the heat exchange inlet pipe 202 and the connecting pipe 204. The bypass pipe 205 is located on the outside of the inner tank 1, and the heat exchange inlet pipe 202 is selectively connected to the bypass pipe 205 or the auxiliary heat exchanger 7.

[0039] The heat pump device provided in this embodiment allows the heat exchange medium entering through the heat exchange inlet pipe 202 to first enter the auxiliary heat exchanger 7 when the temperature of the heat exchange medium is higher than the temperature of the water in the inner tank 1. The auxiliary heat exchanger 7 exchanges heat with the water in the water storage chamber, so that the water in the water storage chamber is heated while the heat exchange medium is cooled. This can better utilize the heat of the heat exchange medium and improve the thermal efficiency of the heat pump device.

[0040] It is understood that because the heat exchange medium undergoes a temperature drop at the auxiliary heat exchanger 7, the temperature of the heat exchange medium in the first heat exchange channel will not be too high. This helps to control the heat absorption of the refrigerant at the heat exchanger 5 and the heat exchange medium, avoiding the problem of excessive heat absorption by the refrigerant at the second heat exchange channel, which would cause the refrigerant temperature to be too high when returning to the compressor 2. This reduces the risk of compressor 2 overload, improves the safety and reliability of compressor 2 and the heat pump unit, and extends the service life of the heat pump unit. When the heat exchange inlet temperature is lower than the temperature of the water in the inner tank 1, the heat exchange inlet pipe 202 can be connected to the bypass pipe 205. This prevents the heat exchange medium from flowing to the auxiliary heat exchanger 7 to exchange heat with the water in the water storage chamber. Instead, it flows directly to the first heat exchange channel through the bypass pipe 205 for heat exchange. This avoids the problem of ineffective heat exchange between the heat exchange medium and the water in the water storage chamber due to the low temperature of the heat exchange medium entering the heat pump unit or the high temperature of the water in the water storage chamber. This reduces the energy consumption of the heat pump unit and ensures the operating efficiency of the heat pump unit.

[0041] In one embodiment, the auxiliary heat exchanger 7 is located inside the water storage chamber.

[0042] In one embodiment, the main heat exchanger 3 preferably adopts a microchannel heat exchanger to reduce the overall footprint of the main heat exchanger 3, thereby reducing the overall size of the heat pump device and lowering its cost while ensuring the water storage volume of the water storage chamber. The specific structure of the microchannel heat exchanger and its installation structure on the inner tank 1 can be set with reference to the prior art, which is not the focus of this utility model and will not be described in detail here.

[0043] The auxiliary heat exchanger 7 is preferably a coil heat exchanger, and the heat exchanger 5 is preferably a plate heat exchanger.

[0044] In one embodiment, the heat pump device includes a three-way valve 8. The first and second ports of the three-way valve 8 are connected in series to the heat exchange inlet pipe 202, and the inlet end of the bypass pipe 205 is connected to the third port of the three-way valve 8. The first port is selectively connected to either the second or third port. Thus, the three-way valve 8 controls the connection between the heat exchange inlet pipe 202 and the auxiliary heat exchanger 7 or the bypass pipe 205. Further, the three-way valve 8 is located outside the inner tank 1.

[0045] In other embodiments, a first control valve can be installed on the heat exchange inlet pipe 202, and a second control valve can be installed on the bypass pipe 205. The first control valve is located downstream of the junction of the bypass pipe 205 and the heat exchange inlet pipe 202, and is located outside the inner liner 1. The first control valve controls the on / off connection between the heat exchange inlet pipe 202 and the auxiliary heat exchanger 7, and the second control valve controls the on / off connection of the bypass pipe 205. Thus, the on / off connection between the heat exchange inlet pipe 202 and the auxiliary heat exchanger 7 or the bypass pipe 205 is controlled by the first and second control valves.

[0046] In one embodiment, the outlet end of the first heat exchange channel is connected to a heat exchange outlet pipe 203, that is, the heat exchange outlet pipe 203, the connecting pipe 205, and the heat exchange outlet pipe 203 are connected in series to form a heat exchange pipeline. A water pump 6 is installed on the heat exchange inlet pipe 202 or the heat exchange outlet pipe 203 to drive the heat exchange medium to flow along the heat exchange pipeline, and to facilitate the control of the flow rate of the heat exchange medium in the heat exchange pipeline. In other embodiments, the heat exchange medium may also flow along the heat exchange pipeline under water pressure or other influences.

[0047] To control the operation of the three-way valve 8, the heat pump assembly and the water pump 6, the heat pump device includes a controller 60. The compressor 2, the water pump 6, the throttling device 4 and the three-way valve 8 are all connected to the controller 60 in communication, so that the controller 60 controls the operation of the compressor 2, the water pump 6 and the throttling device 4.

[0048] To monitor the inlet temperature of the heat exchange medium, an inlet temperature sensor 102 is installed on the heat exchange inlet pipe 202. This sensor detects the inlet temperature of the heat exchange medium flowing into the heat exchange inlet pipe 202 and is communicatively connected to the controller 60. To monitor the temperature inside the inner tank 1, a water tank temperature sensor 105 is installed inside the inner tank 1 and is communicatively connected to the controller 60.

[0049] A switch valve 9 is also installed on the heat exchanger inlet pipe 202 to control the opening and closing of the heat exchanger inlet pipe 202. The switch valve 9 is preferably located downstream of the inlet temperature sensing element 102. The switch valve 9 is communicatively connected to the controller 60.

[0050] In one embodiment, an outlet temperature sensor 103 is provided on the heat exchange outlet pipe 203 to detect the temperature at the heat exchange outlet, thereby preventing the risk of icing due to the excessively low temperature of the heat exchange medium flowing out of the heat exchange outlet pipe 203 after heat exchange. The outlet temperature sensor 103 is communicatively connected to the controller 60.

[0051] To further improve the operational safety and reliability of the heat pump device, in one embodiment, an evaporation temperature detection element 101 is installed on the heat pump pipeline 201. The evaporation temperature detection element 101 is located between the throttling device 4 and the second heat exchange channel to detect the temperature of the refrigerant flowing into the second heat exchange channel, thereby determining the amount of heat exchange between the refrigerant and the heat exchange medium at the heat exchanger 5. This avoids the risk of refrigerant freezing due to insufficient heat absorption at the second heat exchange channel caused by the refrigerant evaporating at a low temperature when it exits the throttling device 4. It also avoids the problem of excessively high refrigerant temperature returning to the compressor 2 due to the refrigerant evaporating at a high temperature and excessive heat absorption at the second heat exchange channel. In addition to preventing refrigerant freezing, this also reduces the probability of compressor 2 overload.

[0052] The evaporation temperature sensor 101 is communicatively connected to the controller 60. The controller 60 can adjust the frequency of the water pump 6 to regulate the flow rate of the heat exchange medium in the heat exchange channel based on the refrigerant evaporation temperature detected by the evaporation temperature sensor 101 and the heat exchange outlet temperature detected by the outlet temperature sensor 103. And / or, it can adjust the opening degree of the throttling device 4 to adjust the return gas temperature and exhaust temperature of the refrigerant in the compressor 2. The throttling device 4 is preferably an electronic expansion valve.

[0053] To detect the exhaust temperature of compressor 2, an exhaust temperature sensor 104 is installed on the heat pump line 201. The exhaust temperature sensor 104 is located between compressor 2 and main heat exchanger 3, and is positioned near the outlet of compressor 2. The exhaust temperature sensor 104 is communicatively connected to controller 60.

[0054] In one embodiment, the heat pump device includes a first filter 30, which is disposed on the heat pump pipeline 201 and located upstream of the inlet end of the throttling device 4 to filter impurities in the refrigerant flowing to the throttling device 4, thereby preventing impurities from clogging the throttling device 4 and improving the operational safety of the heat pump components and the heat pump device.

[0055] To further improve the operational safety of the heat pump device, in one embodiment, the heat pump device further includes an exhaust valve 80, which is located at the high point of the heat exchange pipeline to exhaust the gas in the heat exchange pipeline.

[0056] In one embodiment, the heat pump device further includes a second filter 40 located upstream of the first heat exchange channel to filter the heat exchange medium flowing into the first heat exchange channel, thereby preventing impurities in the first heat exchange channel from clogging the first heat exchange channel.

[0057] In one embodiment, a pressure switch 90 is also provided on the heat pump pipeline 201. The pressure switch 90 is located between the compressor 2 and the main heat exchanger 3, and the pressure switch 90 is located close to the compressor 2.

[0058] In one embodiment, the heat pump device further includes a housing 50, with the inner tank 1, heat pump assembly, and heat exchange assembly all disposed inside the housing 50. The heat pump assembly is located between the housing 50 and the inner tank 1, and the heat exchange inlet pipe 202, heat exchange outlet pipe 203, and heat exchanger 5 are located between the housing 50 and the inner tank 1. The water inlet end of the heat exchange inlet pipe 202 and the water outlet end of the heat exchange outlet pipe 203 both extend outside the housing 50 to connect to an external heating system.

[0059] The heat pump device also includes a water tank outlet pipe 207 and a water tank inlet pipe 206. One end of the water tank inlet pipe 206 and the water tank outlet pipe 207 are located outside the shell 50, and the other end is installed and inserted into the inner tank 1 so that the heat pump device can be connected to the external water-using equipment.

[0060] The heat pump unit also includes a display screen 70, which is communicatively connected to the controller 60 and is mounted on the housing 50. The display screen 70 is used to display the operating parameters of the heat pump unit, such as the water temperature in the storage chamber, so that the user can view the operating status of the heat pump unit.

[0061] To reduce the cost of the heat pump device, water is used as the heat exchange medium. The first heat exchange channel can be connected to a floor heating system, meaning the heat exchange medium flowing into the first heat exchange channel is floor heating water. In other embodiments, the first heat exchange channel can also be connected to other types of external heating systems, such as solar heating systems or other types of heating systems.

[0062] In one embodiment, the heat pump device further includes an electric heating element 10, which is installed inside the inner tank 1 to heat the water in the inner tank 1 by means of electricity. This serves as an auxiliary heating method for the heat pump device, ensuring the outlet water temperature of the heat pump device even when the heat pump components malfunction and fail to heat the inner tank 1 or the water in the inner tank 1 is insufficiently heated, thereby improving the reliability of the heat pump device. The electric heating element 10 is communicatively connected to the controller 60.

[0063] Furthermore, an anode rod 20 is also provided inside the inner tank 1 to reduce the probability of scaling and corrosion inside the inner tank 1, improve the operational safety of the heat pump device, and extend the service life of the heat pump device.

[0064] This embodiment provides a combined heating system, including a floor heating system and a heat pump device from any of the above embodiments. The inlet end of the heat exchange inlet pipe 202 and the outlet end of the first heat exchange channel are respectively connected to the floor heating system. The combined heating system provided in this embodiment, by employing the aforementioned heat pump device, can improve the safety and reliability of the combined heating system.

[0065] Specifically, the underfloor heating system has a water supply pipe and a water return pipe. The inlet end of the auxiliary heat exchanger 7 is connected to the water supply pipe, and the outlet end of the first heat exchange channel is connected to the water return pipe; or, the inlet end of the auxiliary heat exchanger 7 and the outlet end of the first heat exchange channel are both connected to the water return pipe, and the position where the auxiliary heat exchanger 7 is connected to the water return pipe is upstream of the position where the first heat exchange channel is connected to the water return pipe.

[0066] In the specific implementation of the above embodiments, the technical features can be combined in any non-contradictory way. For the sake of brevity, not all possible combinations of the above technical features are described. However, as long as the combination of these technical features is not contradictory, it should be considered to be within the scope of this specification.

[0067] The specific embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A heat pump device, characterized in that, include: The inner liner (1) has a water storage cavity, an inlet communicating with the water storage cavity, and an outlet communicating with the water storage cavity; The heat pump assembly includes a compressor (2), a main heat exchanger (3) and a throttling device (4) connected in sequence, wherein the main heat exchanger (3) is used to exchange heat with the water in the water storage chamber; The heat exchange assembly includes a heat exchange inlet pipe (202), an auxiliary heat exchanger (7), a connecting pipe (204), and a heat exchanger (5) connected in sequence along the flow direction of the heat exchange medium. The heat exchanger (5) is located outside the inner liner (1), and the first heat exchange channel of the heat exchanger (5) is connected to the connecting pipe (204). The second heat exchange channel of the heat exchanger (5) is connected in series between the outlet of the throttling device (4) and the inlet of the compressor (2). The auxiliary heat exchanger (7) is located inside the water storage cavity or surrounds the outer wall of the inner liner (1). A bypass pipe (205) is connected between the heat exchange inlet pipe (202) and the connecting pipe (204). The bypass pipe (205) is located outside the inner liner (1). The heat exchange inlet pipe (202) is selectively connected to the bypass pipe (205) or the auxiliary heat exchanger (7).

2. The heat pump device according to claim 1, characterized in that, The heat pump device also includes a three-way valve (8), which is located outside the inner tank (1). The first port of the three-way valve (8) is connected to the heat exchange inlet pipe (202), the second port of the three-way valve (8) is connected to the auxiliary heat exchanger (7), and the third port of the three-way valve (8) is connected to the bypass pipe (205). The first port is controlled to be connected to the second port or the third port.

3. The heat pump device according to claim 1, characterized in that, A first control valve is provided on the heat exchange inlet pipe (202). The first control valve is located between the junction of the bypass pipe (205) and the heat exchange inlet pipe (202) and the auxiliary heat exchanger (7). The first control valve is located outside the inner liner (1). The first control valve controls the opening and closing of the heat exchange inlet pipe (202) to the auxiliary heat exchanger (7). A second control valve is provided on the bypass pipe (205), and the second control valve controls the opening and closing of the bypass pipe (205).

4. The heat pump device according to claim 1, characterized in that, The heat exchange assembly further includes a first filter (30), which is installed in the heat exchange inlet pipe (202) or the connecting pipe (204).

5. The heat pump device according to claim 1, characterized in that, The heat pump assembly includes a second filter (40) which is installed upstream of the throttling device (4).

6. The heat pump device according to claim 1, characterized in that, The heat exchange inlet pipe (202) is equipped with an inlet temperature detection element (102).

7. The heat pump device according to claim 1, characterized in that, The outlet end of the first heat exchange channel is connected to a heat exchange outlet pipe (203), and an outlet temperature detection element (103) is provided on the heat exchange outlet pipe (203). And / or, the outlet end of the first heat exchange channel is connected to a heat exchange outlet pipe (203), and a water pump (6) is installed in the heat exchange outlet pipe (203) or the heat exchange inlet pipe (202).

8. The heat pump device according to claim 1, characterized in that, The main heat exchanger (3) is a microchannel heat exchanger arranged around the inner liner (1).

9. The heat pump device according to any one of claims 1-8, characterized in that, The inner liner (1) is equipped with an electric heating element (10).

10. A combined heating system, comprising a floor heating system, characterized in that, It also includes a heat pump device as described in any one of claims 1-9, wherein the inlet end of the heat exchange inlet pipe (202) and the liquid outlet end of the first heat exchange channel are respectively connected to the floor heating device.