Piping device for checking semiconductor rotary joint

Abstract

The utility model relates to the technical field of semiconductor rotary joint production, in particular to a piping device for checking a semiconductor rotary joint. Comprising an assembling frame, a side plate is fixedly arranged on one side of the assembling frame, a manifold is fixedly arranged on the side, away from the assembling frame, of the side plate, and a conveying hose is fixedly connected to one end of the manifold. According to the utility model, when the vacuum pump vacuumizes the interior of the fluid channel of the semiconductor rotary joint, water in air flow is absorbed through the water absorption sponge, so that purified water is prevented from entering the interior of the vacuum pump to damage the vacuum pump, and the service life of the vacuum pump is prolonged; the rotary box drives the water-absorbing sponge to rotate, so that an operator can replace the water-absorbing sponge which is extruded for multiple times conveniently, the water-absorbing and drying effects of the water-absorbing sponge on airflow are guaranteed, and the safety of the vacuum pump during vacuumizing is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor rotary joint manufacturing technology, and more specifically, to a piping device for inspecting semiconductor rotary joints. Background Technology

[0002] Semiconductor rotary joints are indispensable grinding equipment and important functional components in chip exposure and imaging processes during chip manufacturing. In the production of silicon-based chips, with the advancement of wafer size and thinning, wafer thinning grinding requires multiple grinding processes. The processed wafers are then fixed in subsequent exposure and imaging processes, and the necessary supplies of chemicals, grinding slurry, and pure water are provided. The rotary joint rotates at the same speed as the grinding equipment spindle or wafer grinding disc, ensuring the conduction of various liquids, dry air, and vacuum under extremely stringent conditions. It is necessary to verify that the performance of the semiconductor rotary joint meets the stringent requirements to ensure the normal operation of the grinding equipment.

[0003] After production, each fluid flow path of the semiconductor rotary joint needs to be tested individually to ensure that no leakage exceeding the design value occurs when the set fluid is introduced and conducted. Since there are many flow paths and complex fluids in the semiconductor joint, in order to make the testing convenient and quick, a piping device integrating various fluids needs to be designed, which has pressure display, flow regulation and individual flow control functions for various fluids, in order to verify the performance of the semiconductor rotary joint.

[0004] In existing piping systems, pure water is first injected into the fluid channel of the semiconductor rotary joint for sealing performance testing. Then, when a vacuum pump is used to perform a vacuum test on the fluid channel, the vacuum pump will extract the pure water remaining in the fluid channel, causing the pure water to enter the vacuum pump and affecting its normal operation, making it prone to failure. Utility Model Content

[0005] The purpose of this invention is to provide a piping device for inspecting semiconductor rotary joints, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, one objective of this utility model is to provide a piping device for inspecting semiconductor rotary joints, comprising an assembly frame, a side plate fixedly disposed on one side of the assembly frame, a manifold fixedly disposed on the side of the side plate away from the assembly frame, a material conveying hose fixedly connected to one end of the manifold, a vacuum rotating cylinder, a pure water rotating cylinder, and a dry air rotating cylinder fixedly mounted on the side plate, a connecting pipe fixedly connected to one side of each of the vacuum rotating cylinder, the pure water rotating cylinder, and the dry air rotating cylinder, and the other end of each of the three connecting pipes fixedly attached to one side of the manifold, with a valve fixedly disposed on the connecting pipe, a separation tank fixedly disposed inside the assembly frame, a drain pipe fixedly connected to the bottom of the separation tank, and an air outlet pipe and an air extraction pipe fixedly connected to one side of the separation tank, the other end of the air extraction pipe fixedly attached to the vacuum rotating cylinder, a water suction mechanism disposed inside the separation tank, the connection between the air outlet pipe and the separation tank being disposed above the water suction mechanism, and the connection between the air extraction pipe and the separation tank being disposed below the water suction mechanism.

[0007] As a further improvement to this technical solution, the water absorption mechanism includes a box body fixedly installed inside the separation tank. An inner opening is provided on one side of the box body, and an outer opening communicating with the inner opening is provided on one side of the separation tank. A rotating box is rotatably installed at the center inside the box body. A water-absorbing sponge is provided between the side of the rotating box away from the inner opening and the inner wall of the box body. Several ventilation grooves are provided on the upper and lower side walls of the box body. The two sets of ventilation grooves are located on the upper and lower sides of the water-absorbing sponge, respectively.

[0008] As a further improvement to this technical solution, the water absorption mechanism also includes an arc-shaped rack fixedly disposed on the side of the rotating box away from the water-absorbing sponge. The arc-shaped rack and the axis of the box body are on the same straight line. A motor is fixedly installed on one side of the separation tank. A drive gear is coaxially fixedly connected to the output shaft of the motor. The drive gear meshes with the arc-shaped rack.

[0009] As a further improvement to this technical solution, the water absorption mechanism also includes an electric push rod fixedly installed on the side of the rotating box away from the water-absorbing sponge. One end of the piston rod of the electric push rod passes through one side of the rotating box and extends into the interior of the rotating box. Inside the rotating box, a push plate is fixed to the end of the piston rod of the electric push rod. The side of the push plate away from the electric push rod is in contact with the water-absorbing sponge.

[0010] As a further improvement to this technical solution, a top plate is fixedly provided on the upper side wall of the assembly frame, and a vacuum pump is fixedly installed on the upper side of the top plate. The end of the gas outlet pipe away from the separation tank passes through the top plate and is fixed to the vacuum pump.

[0011] As a further improvement to this technical solution, a first regulator and a second regulator are fixedly installed on the side plate. Each of the first regulator and the second regulator has an output pipe fixed on one side. One end of the output pipe of the first regulator is fixedly set on the rotating drum in dry air, and one end of the output pipe of the second regulator is fixedly set on the rotating drum in pure water.

[0012] As a further improvement to this technical solution, a digital display pressure gauge is fixedly installed at the end of the manifold away from the material conveying hose, and the digital display pressure gauge is fixedly installed on the side of the side plate away from the assembly frame.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] 1. This piping device for inspecting semiconductor rotary joints connects one end of a conveying hose to the corresponding fluid channel on the semiconductor rotary joint and opens the valve on the corresponding connecting pipe. This allows the device to deliver the corresponding liquid to each fluid channel of the semiconductor rotary joint and to create a vacuum. The operator records the leakage amount of each fluid in the semiconductor rotary joint per unit time using a digital pressure gauge, enabling efficient testing of the sealing performance of each fluid channel of the semiconductor rotary joint.

[0015] 2. This piping device for inspecting semiconductor rotary joints allows for the absorption of moisture from the airflow by a water-absorbing sponge during vacuum pump operation. This prevents pure water from entering the vacuum pump and damaging it, thus extending its service life. By controlling the push plate to squeeze the water-absorbing sponge when the vacuum pump is idle, the water in the sponge can be squeezed out, restoring its absorbency. The rotating box drives the water-absorbing sponge to rotate, facilitating the replacement of repeatedly squeezed sponges by operators. This ensures the water-absorbing sponge effectively dries the airflow and improves the safety of the vacuum pump during vacuuming. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a cross-sectional view of the overall structure of this utility model;

[0018] Figure 3 This is a schematic diagram of the separation tank of this utility model;

[0019] Figure 4 This is a cross-sectional view of the separation tank of this utility model;

[0020] Figure 5 This is a schematic diagram of the water absorption mechanism of this utility model;

[0021] Figure 6 This is a cross-sectional view of the water absorption mechanism of this utility model;

[0022] Figure 7 This is a partial structural schematic diagram of the water absorption mechanism of this utility model;

[0023] Figure 8 This is a cross-sectional view of the rotating box in the water absorption mechanism of this utility model after it has been rotated.

[0024] The meanings of the labels in the diagram are as follows:

[0025] 1. Assembly frame; 11. Side panels; 12. Top panel;

[0026] 2. Manifold; 21. Feed hose; 22. Digital pressure gauge; 23. Connecting pipe; 24. Valve; 25. Vacuum transfer drum; 26. Pure water transfer drum; 27. Dry air transfer drum; 28. First regulator; 29. ​​Second regulator;

[0027] 3. Separator; 31. Outlet pipe; 32. Vacuum pump; 33. Suction pipe; 34. Drain pipe; 35. External opening; 36. Motor; 37. Drive gear;

[0028] 4. Water absorption mechanism; 41. Box body; 42. Inner opening; 43. Arc-shaped rack; 44. Ventilation groove; 45. Rotating box; 46. Push plate; 47. Water-absorbing sponge; 48. Electric push rod. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Example 1

[0031] Please see Figures 1-8As shown, one of the objectives of this embodiment is to provide a piping device for inspecting semiconductor rotary joints, including an assembly frame 1. The assembly frame 1 is a square frame composed of twelve steel bars. A side plate 11 is fixedly installed on one side of the assembly frame 1. A vacuum transfer cylinder 25, a pure water transfer cylinder 26, and a dry air transfer cylinder 27 are fixedly installed on the side plate 11. The pure water transfer cylinder 26 and the dry air transfer cylinder 27 are used to deliver pure water and dry air to the semiconductor rotary joint, respectively. The vacuum transfer cylinder 25 is used to inspect the internal components of the semiconductor rotary joint. The system is evacuated. Connecting pipes 23 are fixedly connected to one side of each of the vacuum rotating cylinder 25, the pure water rotating cylinder 26, and the dry air rotating cylinder 27. A manifold 2 is fixedly installed on the side plate 11 away from the assembly frame 1. The other ends of the three connecting pipes 23 are fixed to one side of the manifold 2. That is, the vacuum rotating cylinder 25, the pure water rotating cylinder 26, and the dry air rotating cylinder 27 are all connected to the manifold 2 through their respective connecting pipes 23. A valve 24 is fixedly installed on each connecting pipe 23 to control the corresponding connecting pipe 23. In the connected state, one end of the manifold 2 is fixedly connected to a feed hose 21. By connecting the other end of the feed hose 21 to the corresponding fluid channel on the semiconductor rotary joint and opening the corresponding valve 24, the pure water rotating cylinder 26 can deliver pure water to the semiconductor rotary joint through the connecting pipe 23, the manifold 2, and the feed hose 21. Similarly, the dry air rotating cylinder 27 can deliver dry air to the semiconductor rotary joint, and the vacuum rotating cylinder 25 can evacuate the inside of the semiconductor rotary joint. A digital display pressure gauge 22 is fixedly installed at the end of the manifold 2 away from the feed hose 21. The digital display pressure gauge 22 is fixedly installed on the side plate 11 away from the assembly frame 1. The digital display pressure gauge 22 is used to detect the leakage amount of each fluid in the semiconductor rotary joint per unit time. After the device delivers the corresponding liquid to each fluid channel of the semiconductor rotary joint and evacuates the vacuum, the operator records the leakage amount of each fluid in the semiconductor rotary joint per unit time through the digital display pressure gauge 22, thereby testing the sealing performance of the semiconductor rotary joint.

[0032] A first regulator 28 and a second regulator 29 are fixedly mounted on the side plate 11. Each regulator 28 and 29 has an output pipe fixed to one side and an input pipe fixedly connected to the other side. One end of the input pipe of the first regulator 28 is connected to a dry air source, and one end of the output pipe of the first regulator 28 is fixedly mounted on a dry air transfer cylinder 27. When the dry air source supplies dry air into the first regulator 28 through the input pipe, the first regulator 28 supplies air into the dry air transfer cylinder 27 through the output pipe, enabling the dry air transfer cylinder 27 to deliver dry air to the semiconductor rotary joint. During this process, the operator can control the dry air transfer cylinder 27 to supply air to the semiconductor through the first regulator 28. The speed at which dry air is delivered in the rotary joint is controlled by connecting a pure water source to one end of the input pipe of the second regulator 29. One end of the output pipe of the second regulator 29 is fixedly mounted on the pure water rotating drum 26. When the pure water source delivers pure water into the second regulator 29 through the input pipe, the second regulator 29 inputs pure water into the pure water rotating drum 26 through the output pipe, enabling the pure water rotating drum 26 to deliver pure water into the semiconductor rotary joint. During this process, the operator can control the speed at which the pure water rotating drum 26 delivers pure water into the semiconductor rotary joint through the second regulator 29. This allows the operator to deliver a predetermined amount of fluid into the semiconductor rotary joint using this device, and to test the sealing performance of the corresponding fluid channel of the semiconductor rotary joint.

[0033] A separation tank 3 is fixedly installed inside the assembly frame 1. A drain pipe 34 is fixedly connected to the bottom of the separation tank 3, and an air outlet pipe 31 and an air extraction pipe 33 are fixedly connected to one side of the separation tank 3. The other end of the air extraction pipe 33 is fixed to the vacuum transfer cylinder 25. At the same time, a top plate 12 is fixedly installed on the upper side wall of the assembly frame 1. A vacuum pump 32 is fixedly installed on the upper side of the top plate 12. The end of the air outlet pipe 31 away from the separation tank 3 passes through the top plate 12 and is fixed to the vacuum pump 32. After the vacuum pump 32 is started, the air inside the separation tank 3 is extracted through the air outlet pipe 31, so that the vacuum transfer cylinder 25 draws the air in the fluid channel of the semiconductor rotary joint into the interior of the separation tank 3 through the air extraction pipe 33, and then discharges it outward through the air outlet pipe 31, thereby realizing the vacuuming of the fluid channel of the semiconductor rotary joint and testing the sealing performance of the corresponding fluid channel of the semiconductor rotary joint.

[0034] When the device first injects pure water into the fluid channel of the semiconductor rotary joint for sealing performance testing, and then performs a vacuum test inside the fluid channel, the vacuum pump 32 will extract the pure water remaining inside the fluid channel, allowing the pure water to enter the vacuum pump 32. This pure water entering the vacuum pump 32 will affect its normal operation and make it prone to malfunction. To solve this problem, a water suction mechanism 4 is installed inside the separation tank 3. The connection between the air outlet pipe 31 and the separation tank 3 is located on the upper side of the water suction mechanism 4, and the connection between the air extraction pipe 33 and the separation tank 3 is located on the lower side of the water suction mechanism 4. When the air extraction pipe 33 draws the pure water from the semiconductor rotary joint along with air into the separation tank 3, the water suction mechanism 4 absorbs the moisture in the airflow, allowing the dehydrated airflow to be drawn into the vacuum pump 32 through the air outlet pipe 31. This prevents pure water from entering the vacuum pump 32 and damaging it, thus improving the safety of the vacuum pump 32 during vacuuming.

[0035] The structure of the water absorption mechanism 4 is described in detail below, with reference to... Figures 4-7 The water absorption mechanism 4 includes a box 41 fixedly installed inside the separator 3. An inner opening 42 is provided on one side of the box 41, and an outer opening 35 communicating with the inner opening 42 is provided on one side of the separator 3. A rotating box 45 is rotatably installed at the center inside the box 41. A water-absorbing sponge 47 is provided between the side of the rotating box 45 away from the inner opening 42 and the inner wall of the box 41. The water-absorbing sponge 47 is a commercially available PVA water-absorbing sponge 47, which has the ability to absorb moisture from the gas. Several ventilation grooves 44 are provided on both the upper and lower side walls of the box 41. Two sets of ventilation grooves 44... 4 are located on the upper and lower sides of the absorbent sponge 47. When the vacuum pump 32 evacuates the inside of the semiconductor rotary joint, the airflow mixed with pure water will first enter the interior of the rotating box 45 through the vent 44 located on the lower side, and then flow through the mesh of the absorbent sponge 47. During this process, the absorbent sponge 47 will absorb the moisture in the airflow, so that the airflow discharged through the vent 44 located on the upper side is in a dry state. The vacuum pump 32 then draws in the dried airflow, thereby preventing pure water from entering the interior of the vacuum pump 32 and damaging the vacuum pump 32, and improving the safety of the vacuum pump 32 when evacuating.

[0036] When the absorbent sponge 47 absorbs a large amount of water after prolonged use, its absorbency will decrease, preventing it from completely drying the airflow entering the vacuum pump 32 and increasing the likelihood of damage to the vacuum pump 32. To address this issue, the suction mechanism 4 also includes an electric push rod 48 fixedly installed on the side of the rotating box 45 away from the absorbent sponge 47. One end of the piston rod of the electric push rod 48 passes through one side of the rotating box 45 and extends into the interior of the rotating box 45. Inside the rotating box 45, a push plate 46 is fixed to the end of the piston rod of the electric push rod 48. The side of the push plate 46 away from the electric push rod 48 contacts the absorbent sponge 47. When the... When the device does not evacuate the semiconductor rotary joint, the operator activates the electric push rod 48, causing the piston rod of the electric push rod 48 to drive the push plate 46 away from the rotating box 45. The push plate 46, in conjunction with the inner wall of the box 41, squeezes the water-absorbing sponge 47, squeezing out the water absorbed by the water-absorbing sponge 47. The squeezed-out water will collect at the bottom of the separation tank 3 through the ventilation groove 44 located below, and then be discharged from the separation tank 3 through the drain pipe 34. Afterward, the piston rod of the electric push rod 48 drives the push plate 46 to reset, so that the water-absorbing sponge 47 returns to its original shape and continues to absorb and dry the airflow entering the vacuum pump 32, thereby ensuring the water absorption performance of the water-absorbing sponge 47.

[0037] After repeated squeezing, the air content inside the absorbent sponge 47 decreases, thus reducing its pore size. Its absorbency gradually decreases with increasing squeezing frequency. To address this issue, the absorbent mechanism 4 includes an arc-shaped rack 43 fixedly mounted on the side of the rotating box 45 away from the absorbent sponge 47. The axes of the arc-shaped rack 43 and the box body 41 are on the same straight line. A motor 36 is fixedly mounted on one side of the separating tank 3. A drive gear 37 is coaxially fixedly connected to the output shaft of the motor 36. The drive gear 37 meshes with the arc-shaped rack 43. When the output shaft of the motor 36 drives the drive gear 37 to rotate, the meshing transmission between the drive gear 37 and the arc-shaped rack 43 causes the arc-shaped rack 43 to drive the rotating box 45 to rotate around the axis of the box body 41. The rotating box 45 pushes the absorbent sponge 47 to rotate synchronously. Figure 8 When the rotating box 45 rotates 90 degrees, it will push one end of the absorbent sponge 47 into the inner opening 42. The operator will then remove the absorbent sponge 47 from the inside of the separation tank 3 through the inner opening 42 and the outer opening 35, and insert a new absorbent sponge 47 into the box body 41. This will cause the rotating box 45 to rotate and reset the absorbent sponge 47, thus completely restoring the absorbent performance of the absorbent sponge 47 and preventing pure water from entering the vacuum pump 32 and damaging it.

[0038] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A piping device for inspecting semiconductor rotary joints, comprising an assembly frame (1), characterized in that: A side plate (11) is fixedly installed on one side of the assembly frame (1). A manifold (2) is fixedly installed on the side of the side plate (11) away from the assembly frame (1). A conveying hose (21) is fixedly connected to one end of the manifold (2). A vacuum transfer cylinder (25), a pure water transfer cylinder (26), and a dry air transfer cylinder (27) are fixedly installed on the side plate (11). A connecting pipe (23) is fixedly connected to one side of each of the vacuum transfer cylinder (25), the pure water transfer cylinder (26), and the dry air transfer cylinder (27). The other ends of the three connecting pipes (23) are fixed to one side of the manifold (2), and the connecting pipes (23) are connected to the manifold (2). 3) A valve (24) is fixedly installed on the top. A separation tank (3) is fixedly installed inside the assembly frame (1). A drain pipe (34) is fixedly connected to the bottom of the separation tank (3). An air outlet pipe (31) and an air extraction pipe (33) are fixedly connected to one side of the separation tank (3). The other end of the air extraction pipe (33) is fixed on the vacuum transfer cylinder (25). A water suction mechanism (4) is provided inside the separation tank (3). The connection between the air outlet pipe (31) and the separation tank (3) is located on the upper side of the water suction mechanism (4). The connection between the air extraction pipe (33) and the separation tank (3) is located on the lower side of the water suction mechanism (4).

2. The piping device for inspecting semiconductor rotary joints according to claim 1, characterized in that: The water absorption mechanism (4) includes a box (41) fixedly installed inside the separation tank (3). An inner opening (42) is provided on one side of the box (41), and an outer opening (35) communicating with the inner opening (42) is provided on one side of the separation tank (3). A rotating box (45) is rotatably installed at the center inside the box (41). A water-absorbing sponge (47) is provided between the side of the rotating box (45) away from the inner opening (42) and the inner wall of the box (41). Several ventilation grooves (44) are provided on the upper and lower side walls of the box (41). The two sets of ventilation grooves (44) are located on the upper and lower sides of the water-absorbing sponge (47), respectively.

3. The piping device for inspecting semiconductor rotary joints according to claim 2, characterized in that: The water absorption mechanism (4) also includes an arc-shaped rack (43) fixedly disposed on the side of the rotating box (45) away from the water-absorbing sponge (47). The axis of the arc-shaped rack (43) and the box body (41) are on the same straight line. A motor (36) is fixedly installed on one side of the separation tank (3). A drive gear (37) is coaxially fixedly connected to the output shaft of the motor (36). The drive gear (37) meshes with the arc-shaped rack (43).

4. The piping device for inspecting semiconductor rotary joints according to claim 3, characterized in that: The water absorption mechanism (4) further includes an electric push rod (48) fixedly installed on the side of the rotating box (45) away from the water-absorbing sponge (47). One end of the piston rod of the electric push rod (48) passes through one side of the rotating box (45) and extends into the interior of the rotating box (45). Inside the rotating box (45), there is a push plate (46) fixed to the end of the piston rod of the electric push rod (48). The side of the push plate (46) away from the electric push rod (48) is in contact with the water-absorbing sponge (47).

5. The piping device for inspecting semiconductor rotary joints according to claim 1, characterized in that: A top plate (12) is fixedly installed on the upper side wall of the assembly frame (1), and a vacuum pump (32) is fixedly installed on the upper side of the top plate (12). The end of the exhaust pipe (31) away from the separation tank (3) passes through the top plate (12) and is fixed on the vacuum pump (32).

6. The piping apparatus for inspecting semiconductor rotary joints according to claim 1, characterized in that: A first regulator (28) and a second regulator (29) are fixedly installed on the side plate (11). Each of the first regulator (28) and the second regulator (29) has an output pipe fixed on one side. One end of the output pipe of the first regulator (28) is fixedly set on the rotating drum (27) in dry air, and one end of the output pipe of the second regulator (29) is fixedly set on the rotating drum (26) in pure water.

7. The piping apparatus for inspecting semiconductor rotary joints according to claim 1, characterized in that: A digital pressure gauge (22) is fixedly installed at the end of the manifold (2) away from the material conveying hose (21). The digital pressure gauge (22) is fixedly installed on the side of the side plate (11) away from the assembly frame (1).

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